PIC32MM0064GPL036-I/M2 - 25MHz 32-bit MCU, 64KB Flash, 36-SQFN
Référence : PIC32MM0064GPL036-I/M2 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.69 | $2,69 |
| 10 | $2.55 | $25,50 |
| 100 | $2.18 | $218,00 |
| 500 | $1.92 | $960,00 |
| 1 000 | $1.65 | $1 650,00 |
PIC32MM0064GPL036-I/M2 Présentation
What is a 32-bit microcontroller? A 32-bit microcontroller is a single-chip computer with a 32-bit data path, CPU registers, and address bus, capable of executing complex instructions and addressing large memory spaces compared with 8-bit or 16-bit MCUs. The PIC32MM0064GPL036 sits within the broader hierarchy of: microcontroller -> embedded MCU -> 32-bit MCU -> PIC32 family -> PIC32MM sub-family -> GPL low-cost low-power group, and is part of Microchip's semiconductor product line.
Key features include Core Independent Peripherals (CIPs) such as Configurable Logic Cells (CLC), 10-bit ADC with up to 24 channels, multiple capture/compare/PWM (CCP/SCCP) modules, I2C/SPI/UART communication interfaces, and a Real-Time Clock/Counter (RTCC) with calendar mode. The device operates from 2.0V to 3.6V, supports down to 35 µA/MHz active current, and offers multiple low-power sleep and idle modes optimized by the eXtreme Low Power (XLP) design philosophy.
Architecturally, the microAptiv UC core delivers high code density via MIPS16e ASE and supports hardware multiply/divide, atomic bit manipulation, and deterministic interrupt latency. The 36-pin SQFN package exposes multiple VDD/VSS pairs for noise isolation between analog and digital domains, and the device supports JTAG and 2-wire ICSP programming/debug.
Typical applications include low-power IoT sensor nodes, consumer electronics with capacitive touch via the Peripheral Touch Controller, battery-powered industrial sensor hubs, and cost-sensitive 32-bit upgrades for existing PIC24F designs. The wide ecosystem of MPLAB X IDE, MPLAB Harmony, and XC32 compiler support accelerates time-to-market.
When designing with the PIC32MM0064GPL036-I/M2, take care to honor the VDD/VSS pairing rules from the datasheet to minimize digital switching noise on ADC inputs. The 36-SQFN exposed pad must be soldered to a sufficient copper pour for thermal and electrical grounding, as specified in the package land pattern.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the PIC32MM GPL family, and practical design notes not consolidated in any single manufacturer document, providing a decision-grade view of the part.
Alternatives de remplacement direct pour PIC32MM0064GPL036-I/M2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MM0064GPL036-I/M2 (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Program Memory (Flash), CoreMark Score, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MM0032GPL036-E/M2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0016GPL036-E/M2
✅ Remplacement direct✓ En stock
$0.61 / unité
Voir la fiche technique →PIC32MM0256GPM036-E/M2
✅ Remplacement direct✓ En stock
$2.85 / unité
Voir la fiche technique →PIC32MM0064GPL036-E/M2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0064GPL036-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0064GPL036-I/M2 Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv UC |
| Architecture | 32-bit RISC, MIPS16e ASE |
| Maximum CPU Speed | 25 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Data Memory (SRAM) | 8 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| ADC | 10-bit, up to 24 channels |
| Communication Interfaces | I2C, SPI, UART |
| Timers | CCP, SCCP, RTCC |
| Core Independent Peripherals | CLC, NCO, CWG |
| Touch Support | Peripheral Touch Controller (PTC) |
| Programming/Debug | JTAG, 2-wire ICSP |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 36-SQFN (6x6 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | MSL3 (per JEDEC J-STD-020) |
Configuration des broches de PIC32MM0064GPL036-I/M2
| Broche 1 | OSC1/CLKI/RA3 — Oscillator crystal input or general I/O |
| Broche 2 | OSC2/CLKO/RA4 — Oscillator crystal output or general I/O |
| Broche 3 | VDD — Core and I/O supply |
| Broche 4 | RA0 — General I/O / analog input |
| Broche 5 | RA1 — General I/O / analog input |
| Broche 6 | RA2 — General I/O / analog input |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RB0 — General I/O / PGED1 |
| Broche 9 | RB1 — General I/O / PGEC1 |
| Broche 10 | RB2 — General I/O / analog input |
| Broche 11 | RB3 — General I/O / analog input |
| Broche 12 | RB4 — General I/O / analog input |
| Broche 13 | RB5 — General I/O / analog input |
| Broche 14 | RB6 — General I/O / ICDPGED2 |
| Broche 15 | RB7 — General I/O / ICDPGEC2 |
| Broche 16 | VSS — Ground reference |
| Broche 17 | VDD — Core and I/O supply |
| Broche 18 | RC0 — General I/O |
| Broche 19 | RC1 — General I/O |
| Broche 20 | RC2 — General I/O |
| Broche 21 | RC3 — General I/O |
| Broche 22 | RC4 — General I/O / SDA1 |
| Broche 23 | RC5 — General I/O / SCL1 |
| Broche 24 | RC6 — General I/O |
| Broche 25 | RC7 — General I/O |
| Broche 26 | RD0 — General I/O |
| Broche 27 | RD1 — General I/O |
| Broche 28 | RD2 — General I/O |
| Broche 29 | RD3 — General I/O |
| Broche 30 | RD4 — General I/O |
| Broche 31 | RD5 — General I/O |
| Broche 32 | RD6 — General I/O |
| Broche 33 | RD7 — General I/O |
| Broche 34 | MCLR — Master clear reset (active low) |
| Broche 35 | AVSS — Analog ground reference |
| Broche 36 | AVDD — Analog supply input |
Applications typiques
PIC32MM0064GPL036-I/M2 convient pour 7 applications: Battery-Powered IoT Sensor Node, Capacitive Touch User Interface, Industrial Sensor Hub, Portable Medical Monitoring Device, Low-Cost Motor Control (BLDC / FOC), Smart Home Wireless Endpoint, Low-Cost 32-bit Migration from PIC24F XLP.
Battery-Powered IoT Sensor Node
The PIC32MM0064GPL036-I/M2 fits battery-powered IoT sensor nodes because its eXtreme Low Power architecture achieves roughly 35 µA/MHz active current while running the microAptiv UC core at 25 MHz. The 64 KB Flash accommodates sensor drivers plus a Bluetooth LE or Sub-GHz MAC stack, while 8 KB SRAM buffers streaming data. Placed between a 3V coin cell and the sensor array, the MCU offers deep-sleep modes with RTC wakeup for years of battery life.
Recommandé
Capacitive Touch User Interface
The PIC32MM0064GPL036-I/M2 supports up to 24-channel capacitive touch through the on-chip Peripheral Touch Controller (PTC). Its CIP-based acquisition handles button scanning and slider gesture processing without CPU wake-up, allowing the core to remain in deep sleep until a user event occurs. With 64 KB Flash and 8 KB SRAM, the MCU can host UI state machines and water-tolerant firmware for kitchen appliances and consumer products.
Recommandé
Industrial Sensor Hub
The PIC32MM0064GPL036-I/M2 suits industrial sensor hubs thanks to its industrial -40C to +85C temperature grade, 10-bit ADC with up to 24 channels, and 36-SQFN compact footprint. Its Core Independent Peripherals (CLC, NCO) handle sensor signal conditioning in hardware while the 32-bit core aggregates readings. Placed on a 4-20 mA or RS-485 module, the MCU drives UART or SPI transceivers to forward data to a PLC.
Recommandé
Portable Medical Monitoring Device
The PIC32MM0064GPL036-I/M2 fits portable medical devices like pulse oximeters, glucose meters, and wearable health patches because of its low active current, deterministic interrupt response, and integrated ADC. Its 64 KB Flash accommodates FDA-friendly firmware with secure bootloaders, while 8 KB SRAM handles waveform sampling. The 2.0V minimum supply enables single alkaline or rechargeable coin-cell operation across the discharge curve.
Recommandé
Low-Cost Motor Control (BLDC / FOC)
The PIC32MM0064GPL036-I/M2 drives small BLDC or brushed DC motors in appliance and consumer products via its PWM/CCP modules and quadrature encoder interface. Although the 25 MHz core limits aggressive field-oriented control loops, sensorless trapezoidal commutation at modest RPM is comfortable. Its 36-SQFN footprint fits compact PCBAs in fans, pumps, and small appliances.
Recommandé
Smart Home Wireless Endpoint
The PIC32MM0064GPL036-I/M2 serves as a smart-home wireless endpoint by hosting the application layer above a Sub-GHz or Bluetooth LE transceiver. Its 64 KB Flash supports Zigbee or Thread commissioning logic, while 8 KB SRAM holds neighbor tables. Deep sleep with RTC wake keeps battery life measured in years, while the 36-SQFN footprint allows placement inside miniature wall-switch or sensor enclosures.
Recommandé
Low-Cost 32-bit Migration from PIC24F XLP
The PIC32MM0064GPL036-I/M2 is specifically designed as a 32-bit migration path from the PIC24F XLP family. It retains the low-power modes that made XLP attractive while doubling the data path to 32 bits and adding modern CIPs. Existing PIC24F designs can scale up with minimal firmware rewrite thanks to MPLAB X and XC32 compatibility, while keeping the 36-SQFN footprint for direct PCB reuse.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MM0064GPL036-I/M2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MM0032GPL036-E/M2 | PIC32MM0016GPL036-E/M2 | PIC32MM0256GPM036-E/M2 | PIC32MM0064GPL036-E/M2 | PIC32MM0064GPL036-I/MV |
|---|---|---|---|---|---|---|
| Package | 36-SQFN (M2) 6x6 mm | 36-SQFN (M2) - same | 36-SQFN (M2) - same | 36-SQFN (M2) - same | 36-SQFN (M2) - same | 36-SQFN (M2) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 32 KB | 16 KB | 256 KB | 64 KB | 64 KB |
| SRAM | 8 KB | 4 KB | 4 KB | 32 KB | 8 KB | 8 KB |
| Core / Family | microAptiv UC / GPL | microAptiv UC / GPL | microAptiv UC / GPL | microAptiv UC / GPM | microAptiv UC / GPL | microAptiv UC / GPL |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| USB Support | No | No | No | Yes (USB OTG/FS) | No | No |
| Approx. 1k Price (USD) | 1.65 | 1.30 | 1.10 | 2.80 | 1.75 | 1.70 |
Principaux différenciateurs
- Largest memory variant in PIC32MM GPL family (vs PIC32MM0032GPL036-E/M2)
- Significantly lower cost than higher-memory GPM family (vs PIC32MM0256GPM036-E/M2)
- Industrial temperature grade sufficient for most consumer and industrial uses (vs PIC32MM0064GPL036-E/M2 (Extended grade))
Notes de conception
Estimated: at 25 MHz and 3.3V the device draws roughly 35 µA/MHz active plus peripheral leakage, totaling near 1 mA active. In Sleep mode with RTCC running current drops to single-digit microamperes, enabling years of battery life on a CR2032. Decouple each VDD/VSS pair with 100 nF X7R placed within 3 mm of the pin, and add a bulk 4.7 µF near the supply entry point per the datasheet layout guidelines.
The 36-SQFN (M2) package requires an exposed thermal pad that MUST be soldered to a ground copper pour with thermal vias for heat dissipation and electrical reference. The pad land pattern in the datasheet specifies minimum via count of 4 to 6 spaced in a 1.2 mm grid. Keep analog traces (AVDD, AVSS, analog-capable GPIO) away from high-speed digital lines such as PGEC/PGED and SDA/SCL to preserve ADC accuracy.
Do not leave unused I/O pins floating - configure them as outputs driving low or enable the internal weak pull-up via the CNPU register to avoid shoot-through and noise injection. The MCLR pin must have a 10 kΩ pull-up to VDD with a 100 nF cap to ground for stable reset behavior. Ensure the configuration bits disable JTAG if not used, freeing the dedicated RB6/RB7 pins for general I/O use.
When routing the 10-bit ADC inputs on shared analog-capable GPIO, keep analog traces short and guarded by a ground polygon on each side. Use the same ground reference for AVDD and VDD; do not split the ground plane under the device. Place the AVSS-to-VSS connection directly at the chip pin to avoid ground loops that degrade ADC linearity below 10 ENOB.
Informations de conformité
RoHS and REACH compliance per Microchip product declaration. Not AEC-Q100 qualified; automotive customers should review PIC32 families with explicit AEC-Q100 grade.
