PIC32MX170F256D-I/PT - 32-bit MCU, 256KB Flash, 64KB RAM, 40MHz | Microchip
Référence : PIC32MX170F256D-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.5 | $5,50 |
| 10 | $4.95 | $49,50 |
| 100 | $4.4 | $440,00 |
| 500 | $3.95 | $1 975,00 |
| 1 000 | $3.55 | $3 550,00 |
PIC32MX170F256D-I/PT Présentation
A 32-bit microcontroller (MCU) is an integrated processing core with on-chip memory and peripherals that executes firmware to control electronic systems. PIC32MX parts use the MIPS32 M4K architecture - a Harvard-style RISC core optimized for deterministic real-time response. Within Microchip's hierarchy, the PIC32MX1xx/2xx sits between 8-bit PIC16/PIC18 devices and the higher-performance PIC32MZ family, balancing cost, power, and integration for consumer and industrial control.
Key features include 40 MHz core with hardware multiply/divide, 16-channel 10-bit ADC at up to 1 Msps, four I2C, four UART, and two SPI/I2S interfaces, plus a USB 2.0 full-speed On-The-Go transceiver. The 256 KB Flash supports field-reprogrammable firmware while 64 KB SRAM accommodates buffering for USB stacks, graphics, or audio processing. The CTMU peripheral simplifies capacitive-touch button or slider sensing without an external analog front end.
The architecture uses a five-stage pipeline and 32-bit data path with single-cycle multiply, delivering 1.56 DMIPS/MHz. The device supports multiple low-power modes (Sleep, Idle, Deep Sleep with RTCC), drawing under 1 uA in deep sleep when the RTCC is active - useful for battery-backed designs. An on-chip 8 MHz FRC with PLL provides flexible clocking while keeping external component count low.
Typical applications include USB HID peripherals, consumer audio docks, IoT edge nodes, capacitive-touch user interfaces, industrial control panels, and low-cost graphics terminal products. The integrated USB and graphics-friendly peripherals make it well suited to human-machine interface (HMI) modules with TFT displays.
When designing with this part, choose the 40 MHz industrial grade variant for general applications and the 50 MHz grade (PIC32MX170F256D-50I/PT) when more CPU headroom is needed. Verify the USB VBUS voltage (5 V) versus internal 3.3 V regulator requirements before PCB layout.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from Microchip's PIC32MX1xx family, and practical design notes that go beyond the manufacturer datasheet summary.
Alternatives de remplacement direct pour PIC32MX170F256D-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX170F256D-I/PT (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX170F256D-50I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX170F256D-I/ML
✅ Remplacement direct✓ En stock
$3.45 / unité
Voir la fiche technique →PIC32MX170F256D-V/PT
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX150F256D-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX130F256D-I/PT
✅ Remplacement direct✓ En stock
$3.3 / unité
Voir la fiche technique →PIC32MX170F256DT-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX170F256D-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| CPU Width | 32-bit |
| Max CPU Frequency | 40 MHz |
| Performance | 1.56 DMIPS/MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Boîtier | 44-TQFP (10x10 mm) |
| Nombre de broches | 44 |
| Tension d'alimentation | 2.3 V to 3.6 V |
| ADC | 10-bit, 1 Msps, 16 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| UART | 4 |
| SPI / I2S | 2 |
| I2C | 4 |
| CTMU (Capacitive Touch) | Yes |
| Température de fonctionnement | -40 C to +85 C (Industrial grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX170F256D-I/PT
| Broche 1 | RD0 — I/O port D bit 0 |
| Broche 2 | RD1 — I/O port D bit 1 |
| Broche 3 | RD2 — I/O port D bit 2 |
| Broche 4 | RD3 — I/O port D bit 3 |
| Broche 5 | RC14 — I/O port C bit 14 / SOSCO |
| Broche 6 | RC15 — I/O port C bit 15 / SOSCI |
| Broche 7 | RC13 — I/O port C bit 13 |
| Broche 8 | RC12 — I/O port C bit 12 |
| Broche 9 | RA0 — I/O port A bit 0 |
| Broche 10 | RA1 — I/O port A bit 1 |
| Broche 11 | RA2 — I/O port A bit 2 |
| Broche 12 | RA3 — I/O port A bit 3 |
| Broche 13 | VSS — Ground reference |
| Broche 14 | RA4 — I/O port A bit 4 |
| Broche 15 | RA5 — I/O port A bit 5 |
| Broche 16 | VREF+ — ADC reference voltage positive |
| Broche 17 | VREF- — ADC reference voltage negative |
| Broche 18 | AVDD — Analog VDD supply |
| Broche 19 | AVSS — Analog VSS ground |
| Broche 20 | RB5 — I/O port B bit 5 |
| Broche 21 | RB4 — I/O port B bit 4 |
| Broche 22 | RB3 — I/O port B bit 3 |
| Broche 23 | RB2 — I/O port B bit 2 |
| Broche 24 | RB1 — I/O port B bit 1 |
| Broche 25 | RB0 — I/O port B bit 0 |
| Broche 26 | RB6 — I/O port B bit 6 / PGEC |
| Broche 27 | RB7 — I/O port B bit 7 / PGED |
| Broche 28 | VUSB — USB 3.3V LDO output |
| Broche 29 | VBUS — USB VBUS detect |
| Broche 30 | D- — USB data minus |
| Broche 31 | D+ — USB data plus |
| Broche 32 | VDD — Digital VDD supply |
| Broche 33 | OSC1 — Crystal oscillator input |
| Broche 34 | OSC2 — Crystal oscillator output |
| Broche 35 | RC16 — I/O port C bit 16 |
| Broche 36 | RC15 — I/O port C bit 15 |
| Broche 37 | RC14 — I/O port C bit 14 |
| Broche 38 | RC13 — I/O port C bit 13 |
| Broche 39 | RC12 — I/O port C bit 12 |
| Broche 40 | RD11 — I/O port D bit 11 |
| Broche 41 | RD10 — I/O port D bit 10 |
| Broche 42 | RD9 — I/O port D bit 9 |
| Broche 43 | RD8 — I/O port D bit 8 |
| Broche 44 | RD7 — I/O port D bit 7 |
Applications typiques
PIC32MX170F256D-I/PT convient pour 6 applications: USB HID Peripherals, Capacitive-Touch User Interfaces, Industrial Control Panels, Consumer Audio Docks, IoT Edge Sensor Nodes, Low-Cost Graphics Terminals.
USB HID Peripherals
The PIC32MX170F256D-I/PT's integrated USB 2.0 full-speed device/host/OTG transceiver and 256 KB Flash make it ideal for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. The 40 MHz MIPS M4K core delivers 1.56 DMIPS/MHz, more than enough for HID polling and feature-report processing. With 64 KB SRAM, USB descriptors and buffer memory fit comfortably without external memory. Designers benefit from Microchip's USB stack shipped in MPLAB Harmony v3, which provides ready-made HID class drivers. Use a 10 uF capacitor on VUSB per the datasheet, and route DP/DM as a 90-ohm differential pair for USB certification.
Recommandé
Capacitive-Touch User Interfaces
The PIC32MX170F256D-I/PT's CTMU peripheral enables cost-effective capacitive touch sensing for buttons, sliders, and proximity detection without an external analog front end. Combined with 256 KB Flash for button mapping firmware and 64 KB SRAM for debounce/scan memory, it fits 32-key touch pads and small HMI panels. The 10-bit ADC at 1 Msps provides reliable CTMU charge-time measurement, with microchip's CTMU library handling calibration. For best performance, the datasheet recommends guarded traces and adequate ground flooding under touch electrodes to suppress false triggers.
Recommandé
Industrial Control Panels
With 16-channel 10-bit ADC at 1 Msps, four UART/SPI/I2C interfaces, and the -40 C to +85 C industrial temperature range, the PIC32MX170F256D-I/PT fits compact industrial control panels, sensor aggregators, and protocol converters. The 40 MHz MIPS M4K core runs Modbus RTU stacks and PID loops in real time, while 256 KB Flash accommodates large bootloaders for field updates. The 64 KB SRAM enables data buffering for bursty sensor traffic without external memory. Industrial designers pair it with isolated RS-485 transceivers and CAN peripherals to build robust control nodes.
Recommandé
Consumer Audio Docks
The PIC32MX170F256D-I/PT's two I2S channels and 256 KB Flash suit consumer audio docks that decode USB audio or accept Bluetooth/I2S input from external modules. 64 KB SRAM accommodates multi-channel audio buffering at 48 kHz, and the 40 MHz core runs basic DSP and sample-rate conversion. The integrated USB device port accepts direct audio streaming from a host PC or smartphone. Combined with an external Class-D amplifier, this MCU powers low-cost speaker docks and headphone amplifiers. The I2S output can be routed to an external DAC or DSP for higher-fidelity designs.
Recommandé
IoT Edge Sensor Nodes
Battery-powered IoT edge sensor nodes benefit from the PIC32MX170F256D-I/PT's deep-sleep mode with RTCC drawing under 1 uA, plus 256 KB Flash for Over-The-Air update payloads and 64 KB SRAM for sensor buffers. The 10-bit ADC reads temperature, humidity, and gas sensors directly, while four I2C channels interface to multiple sensors simultaneously. The 40 MHz core wakes periodically to process measurements and transmit via UART, SPI, or USB. Combined with an external LoRa, BLE, or sub-GHz radio module, this MCU forms a self-contained edge node.
Recommandé
Low-Cost Graphics Terminals
The PIC32MX170F256D-I/PT supports small TFT LCD graphics terminals at QVGA resolutions when paired with external display controllers over SPI. The 256 KB Flash holds font tables and menu structures, while 64 KB SRAM provides framebuffer memory for 320x240x16 color displays. The 40 MHz MIPS M4K core drives text rendering, button debouncing, and serial command parsing in real time. Designers use the parallel master port (PMP) or SPI to interface LCD controllers, with CTMU handling touch input via resistive overlays. This makes the MCU ideal for industrial HMI terminals, medical device menus, and small appliance control panels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX170F256D-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX170F256D-50I/PT | PIC32MX170F256D-I/ML | PIC32MX170F256D-V/PT | PIC32MX150F256D-I/PT | PIC32MX130F256D-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same |
| Max CPU Frequency | 40 MHz | 50 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 16 KB |
| USB 2.0 OTG | Yes | Yes | Yes | Yes | Yes | No |
| CTMU Capacitive Touch | Yes | Yes | Yes | Yes | No | No |
| Operating Temperature | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Unit Price @ qty 100 (USD) | 4.40 | 4.80 | 4.40 | 4.85 | 3.85 | 3.40 |
Principaux différenciateurs
- Higher CPU speed within same package (vs PIC32MX170F256D-50I/PT)
- Extended temperature grade (vs PIC32MX170F256D-V/PT)
- Higher SRAM and full peripheral set (vs PIC32MX150F256D-I/PT)
- More SRAM than 130-series with USB/OTG (vs PIC32MX130F256D-I/PT)
Notes de conception
The PIC32MX170F256D-I/PT requires a 2.3 V to 3.6 V supply on VDD/AVDD with a 0.1 uF decoupling capacitor within 5 mm of each VDD pin and a bulk 10 uF tantalum or ceramic capacitor at the regulator output. For USB applications, place a 10 uF capacitor on VUSB (pin 28) per the datasheet to supply the USB transceiver during enumeration; without it, USB bus-reset events can cause dropout. The internal 3.3 V LDO cannot power external loads - use an external regulator for peripherals drawing more than 50 mA.
The 44-TQFP at 0.8 mm pitch requires careful PCB layout. Route DP/DM as a 90 ohm differential pair with length matching within 150 mil per the USB 2.0 specification. Place a common-mode choke (or ferrite bead) on VBUS to suppress EMI, and provide a guard ring around the analog pins (RA0-RA5) tied to AVSS for ADC noise immunity. Estimated: at 40 MHz, signal traces longer than 50 mm should be terminated to avoid ringing; keep oscillator traces within 10 mm of the MCU and surround them with a grounded keep-out zone.
Do not program the JTAG/SWD pins (RB6/RB7) as GPIO unless debugging is disabled in configuration bits; doing so locks the device. Ensure PGEC1/PGED1 are not pulled low during reset or the bootloader enters programming mode unexpectedly. For CTMU designs, leave the analog reference pins (VREF+/VREF-) floating only when using the internal reference; for high-accuracy ADC, add external 10 nF bypass caps. The 5 V tolerance on most digital I/O simplifies mixed-voltage designs but is not universal - check the datasheet pin description for each GPIO before connecting to 5 V logic.
At 40 MHz with all peripherals active, the PIC32MX170F256D-I/PT typically draws 30-40 mA. The 44-TQFP package thermal resistance theta_JA is approximately 50 C/W, so the junction rises only 2 C above ambient at typical load - no heatsink needed. Estimated: at 85 C ambient maximum, junction stays well below the 125 C limit. For USB-bus-powered designs, inrush current during enumeration may briefly exceed 100 mA; ensure the upstream regulator can source this without dropout.
Informations de conformité
RoHS compliant per Microchip product page as of 2026-10-01. Industrial grade -40C to +85C; AEC-Q100 automotive variants are not available for this specific MPN. Use PIC32MX170F256B-V (vehicle temp) for automotive-relevant applications.