PIC32MX230F128H-50I/MR - 50MHz MIPS32 M4K MCU 128KB Flash | Microchip
Référence : PIC32MX230F128H-50I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.12 | $5,12 |
| 10 | $4.61 | $46,10 |
| 100 | $4.1 | $410,00 |
| 500 | $3.69 | $1 845,00 |
| 1 000 | $3.28 | $3 280,00 |
PIC32MX230F128H-50I/MR Présentation
What is a 32-bit MCU? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program flash, data RAM, and peripheral set. The PIC32 family uses the MIPS32 M4K core, a true 32-bit RISC architecture that delivers higher DMIPS/MHz than 8/16-bit legacy cores. Within the broader taxonomy, a 32-bit MCU sits between 16-bit MCUs (such as PIC24) and 64-bit application processors, occupying the sweet spot for embedded control, USB peripherals, and graphics HMI.
Key features highlight build that 128 KB self-Flash with 16 KB RAM supports moderately complex embedded applications, while PPS allows remapping of digital peripherals to most I/O pins. The PMP with dual buffers enables direct interfacing to graphical TFT/STN displays without an external controller. A 50 MHz core clock with 83 DMIPS equates to roughly 1.66 DMIPS/MHz, sufficient for USB stacks, audio codecs, and modest TCP/IP workloads.
Typical applications include USB HID/CDC devices, low-cost audio playback with I2S codecs, graphics HMIs with PMP-driven LCDs, industrial sensor hubs, and IoT edge nodes. The wide peripheral Pin Select also simplifies PCB routing for mixed-signal designs.
A key design consideration is that the -50I/MR suffix denotes a 50 MHz speed grade in the industrial temperature range; the part shares a pinout with the -I/MR 40 MHz variant, so engineers may compare silicon revision and current draw before scaling to the higher clock.
This page synthesizes drop-in alternatives, real-time distributor pricing, and practical design notes not found in the manufacturer datasheet. Engineers can use the comparison table and design notes to make faster source decisions.
Alternatives de remplacement direct pour PIC32MX230F128H-50I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX230F128H-50I/MR (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Parallel Master Port (PMP), Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX230F128H-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX230F128H-V/MR
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →PIC32MX150F256H-50I/MR
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX130F128H-50I/MR
✅ Remplacement direct✓ En stock
$2.75 / unité
Voir la fiche technique →PIC32MX150F128H-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX170F512H-50I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX230F128H-50I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Flash | 128 KB |
| Data RAM | 16 KB |
| Operating Voltage | 2.5 V / 3.3 V (2.3V - 3.6V range) |
| USB | USB 2.0 Full-Speed OTG |
| SPI Modules | 3 |
| I2S Modules | 2 |
| UART Modules | 4 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit, up to 28 channels |
| DMA Channels | Up to 4 |
| Timers | Up to 7 |
| Analog Comparators | 3 |
| Boîtier | 64-pin QFN (9x9 mm) |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX230F128H-50I/MR
| Broche 1 | RA0 — GPIO / analog input / PPS remappable |
| Broche 2 | RA1 — GPIO / analog input / PPS remappable |
| Broche 3 | RA2 — GPIO / analog input / PPS remappable |
| Broche 4 | RA3 — GPIO / analog input / PPS remappable |
| Broche 5 | RA4 — GPIO / analog input / PPS remappable |
| Broche 6 | RA5 — GPIO / analog input / PPS remappable |
| Broche 7 | RA6 — GPIO / analog input / PPS remappable |
| Broche 8 | RA7 — GPIO / analog input / PPS remappable |
| Broche 9 | RB0 — GPIO / PMP data / PPS remappable |
| Broche 10 | RB1 — GPIO / PMP data / PPS remappable |
| Broche 11 | RB2 — GPIO / PMP data / PPS remappable |
| Broche 12 | RB3 — GPIO / PMP data / PPS remappable |
| Broche 13 | RB4 — GPIO / PMP data / PPS remappable |
| Broche 14 | RB5 — GPIO / PMP data / PPS remappable |
| Broche 15 | RB6 — GPIO / PMP data / PPS remappable |
| Broche 16 | RB7 — GPIO / PMP data / PPS remappable |
| Broche 17 | RC0 — GPIO / PPS remappable |
| Broche 18 | RC1 — GPIO / PPS remappable |
| Broche 19 | RC2 — GPIO / PPS remappable |
| Broche 20 | RC3 — GPIO / PPS remappable |
| Broche 21 | RC4 — GPIO / PPS remappable |
| Broche 22 | RC5 — GPIO / PPS remappable |
| Broche 23 | RC6 — GPIO / PPS remappable |
| Broche 24 | RC7 — GPIO / PPS remappable |
| Broche 25 | RC8 — GPIO / PPS remappable |
| Broche 26 | RC9 — GPIO / PPS remappable |
| Broche 27 | RD0 — GPIO / PMP control / PPS remappable |
| Broche 28 | RD1 — GPIO / PMP control / PPS remappable |
| Broche 29 | RD2 — GPIO / PMP control / PPS remappable |
| Broche 30 | RD3 — GPIO / PMP control / PPS remappable |
| Broche 31 | RD4 — GPIO / PMP control / PPS remappable |
| Broche 32 | RD5 — GPIO / PMP control / PPS remappable |
| Broche 33 | RD6 — GPIO / PMP control / PPS remappable |
| Broche 34 | RD7 — GPIO / PMP control / PPS remappable |
| Broche 35 | RD8 — GPIO / PMP control / PPS remappable |
| Broche 36 | RD9 — GPIO / PMP control / PPS remappable |
| Broche 37 | RD10 — GPIO / PMP control / PPS remappable |
| Broche 38 | RD11 — GPIO / PMP control / PPS remappable |
| Broche 39 | VSS — Ground |
| Broche 40 | VDD — Core power supply 2.3-3.6V |
| Broche 41 | RF0 — GPIO / USB VBUS detect |
| Broche 42 | RF1 — GPIO / USB D- |
| Broche 43 | RF2 — GPIO / USB D+ |
| Broche 44 | RF3 — GPIO / USB ID |
| Broche 45 | RF4 — GPIO / USB VBUS |
| Broche 46 | RF5 — GPIO / PPS remappable |
| Broche 47 | RF6 — GPIO / PPS remappable |
| Broche 48 | RG0 — GPIO / PPS remappable |
| Broche 49 | RG1 — GPIO / PPS remappable |
| Broche 50 | RG2 — GPIO / PPS remappable |
| Broche 51 | RG3 — GPIO / PPS remappable |
| Broche 52 | RG6 — GPIO / PPS remappable |
| Broche 53 | RG7 — GPIO / PPS remappable |
| Broche 54 | RG8 — GPIO / PPS remappable |
| Broche 55 | RG9 — GPIO / PPS remappable |
| Broche 56 | VDD — I/O power supply |
| Broche 57 | VSS — Ground |
| Broche 58 | MCLR — Master Clear reset input |
| Broche 59 | OSC1 — Crystal oscillator input |
| Broche 60 | OSC2 — Crystal oscillator output |
| Broche 61 | SOSCI — Secondary oscillator input |
| Broche 62 | SOSCO — Secondary oscillator output |
| Broche 63 | VDD — Core power supply |
| Broche 64 | VSS — Ground (EP) |
Applications typiques
PIC32MX230F128H-50I/MR convient pour 6 applications: USB HID / CDC Peripherals, Low-Cost Audio Playback with I2S Codec, Graphics HMI with Parallel Master Port, Industrial Sensor Hub, IoT Edge Node with USB-C Power, Motor Control and PWM Generation.
USB HID / CDC Peripherals
The PIC32MX230F128H-50I/MR integrates a USB 2.0 Full-Speed OTG controller that natively supports HID, CDC, MSC, and vendor-class USB device stacks. Its 50 MHz / 83 DMIPS MIPS32 M4K core executes the Microchip USB stack with sufficient headroom for composite devices combining HID + CDC + audio. The 128 KB Flash fits the full USB stack plus application code; 16 KB RAM handles EP buffers. Place a 48 MHz crystal or feed the PLL from the USB SOF to maintain clock accuracy.
Recommandé
Low-Cost Audio Playback with I2S Codec
Two I2S modules and PPS-mapped I/O allow direct interfacing to external audio DACs/ADCs (e.g. SGTL5000, CS4344). The 50 MHz core runs software MP3/AAC decoding at modest sample rates, while the 10-bit ADC handles auxiliary analog monitoring. Place a low-jitter crystal on the REFCLKI pin and route I2S clocks as length-matched pairs to maintain audio fidelity. Suitable for doorbells, kiosks, and consumer audio docks.
Recommandé
Graphics HMI with Parallel Master Port
The Parallel Master Port (PMP) with dual read/write buffers drives graphical TFT or STN LCDs directly without an external controller, reducing BOM cost for HMI panels. The 50 MHz core refreshes QVGA panels smoothly while leaving CPU bandwidth for touch handling and protocol stacks. Use PPS to map PMP data lines to convenient GPIO groupings. The 64-pin QFN (9x9) footprint leaves sufficient I/O for buttons, LEDs, and a resistive touch ADC front-end.
Recommandé
Industrial Sensor Hub
With up to 28 channels of 10-bit ADC, four UART, two I2C, and three SPI, the PIC32MX230F128H-50I/MR aggregates multiple sensor buses into a single Modbus or CAN-edge node. The 83 DMIPS core runs digital filtering (FIR/IIR) on raw ADC samples before forwarding. The industrial -40C to +85C temperature rating suits factory floor deployment. Place bulk decoupling (10uF + 100nF) near each VDD pin and isolate analog/digital grounds for ADC accuracy.
Recommandé
IoT Edge Node with USB-C Power
USB 2.0 OTG allows the PIC32MX230F128H-50I/MR to negotiate USB-C power roles while simultaneously running TCP/IP stacks via SPI-connected Wi-Fi or Ethernet controllers. The 16 KB RAM fits lightweight MQTT/CoAP clients; the 128 KB Flash stores Wi-Fi firmware blobs plus application logic. Engineers should use USB-C CC controllers (e.g. FUSB302) for role detection and ensure D+/D- traces maintain 90-ohm differential impedance per USB spec.
Recommandé
Motor Control and PWM Generation
Up to seven timers with PPS-mapped output compare/PWM channels drive BLDC, brushed DC, or servo motors. The 50 MHz core runs FOC algorithms at high PWM frequencies (20-40 kHz) without saturating CPU cycles. Three analog comparators support overcurrent protection and back-EMF sensing. The 64-pin QFN footprint allows routing of three-phase PWM signals to gate drivers. Confirm motor drive current ratings against package thermal limits at 50 MHz full load.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX230F128H-50I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX230F128H-I/MR | PIC32MX230F128H-V/MR | PIC32MX150F256H-50I/MR | PIC32MX130F128H-50I/MR | PIC32MX170F512H-50I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Maximum CPU Frequency | 50 MHz | 40 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Program Flash | 128 KB | 128 KB | 128 KB | 256 KB | 64 KB | 512 KB |
| Data RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 64 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| DMIPS | 83 DMIPS | 66 DMIPS | 83 DMIPS | 83 DMIPS | 83 DMIPS | 83 DMIPS |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- More 16 KB on-chip RAM for USB stack and I2S buffers (vs PIC32MX130F128H-50I/MR)
- Higher Flash (128 KB vs 64 KB) for richer application code (vs PIC32MX130F128H-50I/MR)
- 50 MHz speed grade over 40 MHz grade at same package (vs PIC32MX230F128H-I/MR)
- Industrial temperature range matches datasheet specs (vs PIC32MX230F128H-V/MR)
Notes de conception
Decouple each VDD pin with a 100nF ceramic capacitor placed within 3 mm of the pin, and add a single 10uF bulk capacitor near the package. The PIC32MX230F128H-50I/MR draws roughly 30-40 mA active at 50 MHz; size the 3.3V LDO for at least 1.5x headroom to handle inrush during USB enumeration and peripheral activation.
USB D+ and D- traces must maintain 90-ohm differential impedance and be length-matched within 150 mils. Place the USB series ferrite beads and ESD protection array (e.g. USBLC6-2SC6) close to the connector. The D+/D- pins are RF2/RF3 and are NOT 5V tolerant; adding external pull-ups above 3.6V will damage the device.
The exposed thermal pad (EP) of the 64-QFN must be soldered to a continuous ground pour with at least 8 thermal vias to the inner ground plane. This reduces theta-JA by 30-40 percent and is required for reliable operation at 50 MHz full load. Avoid routing signal traces across the EP to maintain ground plane continuity.
Keep the 48 MHz crystal traces short (under 5 mm), symmetric, and surrounded by a ground guard trace to minimise EMI. The PIC32MX230F128H-50I/MR PLL multiplies the crystal or FRC frequency up to 50 MHz; poor PCB layout on the crystal will cause jitter that propagates into USB and I2S timing.
Informations de conformité
RoHS compliant per Microchip product page. Lead-free and halogen-free per Microchip environmental certification. AEC-Q100 not applicable for general-purpose MCU; AEC-Q100 variants exist in PIC32MX grade extensions.
