PIC32MX230F128H-50I/MR - 50MHz MIPS32 M4K MCU 128KB Flash | Microchip
N.º da peça: PIC32MX230F128H-50I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.12 | $5,12 |
| 10 | $4.61 | $46,10 |
| 100 | $4.1 | $410,00 |
| 500 | $3.69 | $1.845,00 |
| 1.000 | $3.28 | $3.280,00 |
PIC32MX230F128H-50I/MR Visão geral
What is a 32-bit MCU? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program flash, data RAM, and peripheral set. The PIC32 family uses the MIPS32 M4K core, a true 32-bit RISC architecture that delivers higher DMIPS/MHz than 8/16-bit legacy cores. Within the broader taxonomy, a 32-bit MCU sits between 16-bit MCUs (such as PIC24) and 64-bit application processors, occupying the sweet spot for embedded control, USB peripherals, and graphics HMI.
Key features highlight build that 128 KB self-Flash with 16 KB RAM supports moderately complex embedded applications, while PPS allows remapping of digital peripherals to most I/O pins. The PMP with dual buffers enables direct interfacing to graphical TFT/STN displays without an external controller. A 50 MHz core clock with 83 DMIPS equates to roughly 1.66 DMIPS/MHz, sufficient for USB stacks, audio codecs, and modest TCP/IP workloads.
Typical applications include USB HID/CDC devices, low-cost audio playback with I2S codecs, graphics HMIs with PMP-driven LCDs, industrial sensor hubs, and IoT edge nodes. The wide peripheral Pin Select also simplifies PCB routing for mixed-signal designs.
A key design consideration is that the -50I/MR suffix denotes a 50 MHz speed grade in the industrial temperature range; the part shares a pinout with the -I/MR 40 MHz variant, so engineers may compare silicon revision and current draw before scaling to the higher clock.
This page synthesizes drop-in alternatives, real-time distributor pricing, and practical design notes not found in the manufacturer datasheet. Engineers can use the comparison table and design notes to make faster source decisions.
Alternativas drop-in para PIC32MX230F128H-50I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX230F128H-50I/MR (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature, Parallel Master Port (PMP), Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX230F128H-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX230F128H-V/MR
✅ Drop-In✓ Em estoque
$4.95 / unidade
Ver ficha técnica →PIC32MX150F256H-50I/MR
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX130F128H-50I/MR
✅ Drop-In✓ Em estoque
$2.75 / unidade
Ver ficha técnica →PIC32MX150F128H-50I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX170F512H-50I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC32MX230F128H-50I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Flash | 128 KB |
| Data RAM | 16 KB |
| Operating Voltage | 2.5 V / 3.3 V (2.3V - 3.6V range) |
| USB | USB 2.0 Full-Speed OTG |
| SPI Modules | 3 |
| I2S Modules | 2 |
| UART Modules | 4 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit, up to 28 channels |
| DMA Channels | Up to 4 |
| Timers | Up to 7 |
| Analog Comparators | 3 |
| Encapsulamento | 64-pin QFN (9x9 mm) |
| Temperatura de operação | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MX230F128H-50I/MR
| Pino 1 | RA0 — GPIO / analog input / PPS remappable |
| Pino 2 | RA1 — GPIO / analog input / PPS remappable |
| Pino 3 | RA2 — GPIO / analog input / PPS remappable |
| Pino 4 | RA3 — GPIO / analog input / PPS remappable |
| Pino 5 | RA4 — GPIO / analog input / PPS remappable |
| Pino 6 | RA5 — GPIO / analog input / PPS remappable |
| Pino 7 | RA6 — GPIO / analog input / PPS remappable |
| Pino 8 | RA7 — GPIO / analog input / PPS remappable |
| Pino 9 | RB0 — GPIO / PMP data / PPS remappable |
| Pino 10 | RB1 — GPIO / PMP data / PPS remappable |
| Pino 11 | RB2 — GPIO / PMP data / PPS remappable |
| Pino 12 | RB3 — GPIO / PMP data / PPS remappable |
| Pino 13 | RB4 — GPIO / PMP data / PPS remappable |
| Pino 14 | RB5 — GPIO / PMP data / PPS remappable |
| Pino 15 | RB6 — GPIO / PMP data / PPS remappable |
| Pino 16 | RB7 — GPIO / PMP data / PPS remappable |
| Pino 17 | RC0 — GPIO / PPS remappable |
| Pino 18 | RC1 — GPIO / PPS remappable |
| Pino 19 | RC2 — GPIO / PPS remappable |
| Pino 20 | RC3 — GPIO / PPS remappable |
| Pino 21 | RC4 — GPIO / PPS remappable |
| Pino 22 | RC5 — GPIO / PPS remappable |
| Pino 23 | RC6 — GPIO / PPS remappable |
| Pino 24 | RC7 — GPIO / PPS remappable |
| Pino 25 | RC8 — GPIO / PPS remappable |
| Pino 26 | RC9 — GPIO / PPS remappable |
| Pino 27 | RD0 — GPIO / PMP control / PPS remappable |
| Pino 28 | RD1 — GPIO / PMP control / PPS remappable |
| Pino 29 | RD2 — GPIO / PMP control / PPS remappable |
| Pino 30 | RD3 — GPIO / PMP control / PPS remappable |
| Pino 31 | RD4 — GPIO / PMP control / PPS remappable |
| Pino 32 | RD5 — GPIO / PMP control / PPS remappable |
| Pino 33 | RD6 — GPIO / PMP control / PPS remappable |
| Pino 34 | RD7 — GPIO / PMP control / PPS remappable |
| Pino 35 | RD8 — GPIO / PMP control / PPS remappable |
| Pino 36 | RD9 — GPIO / PMP control / PPS remappable |
| Pino 37 | RD10 — GPIO / PMP control / PPS remappable |
| Pino 38 | RD11 — GPIO / PMP control / PPS remappable |
| Pino 39 | VSS — Ground |
| Pino 40 | VDD — Core power supply 2.3-3.6V |
| Pino 41 | RF0 — GPIO / USB VBUS detect |
| Pino 42 | RF1 — GPIO / USB D- |
| Pino 43 | RF2 — GPIO / USB D+ |
| Pino 44 | RF3 — GPIO / USB ID |
| Pino 45 | RF4 — GPIO / USB VBUS |
| Pino 46 | RF5 — GPIO / PPS remappable |
| Pino 47 | RF6 — GPIO / PPS remappable |
| Pino 48 | RG0 — GPIO / PPS remappable |
| Pino 49 | RG1 — GPIO / PPS remappable |
| Pino 50 | RG2 — GPIO / PPS remappable |
| Pino 51 | RG3 — GPIO / PPS remappable |
| Pino 52 | RG6 — GPIO / PPS remappable |
| Pino 53 | RG7 — GPIO / PPS remappable |
| Pino 54 | RG8 — GPIO / PPS remappable |
| Pino 55 | RG9 — GPIO / PPS remappable |
| Pino 56 | VDD — I/O power supply |
| Pino 57 | VSS — Ground |
| Pino 58 | MCLR — Master Clear reset input |
| Pino 59 | OSC1 — Crystal oscillator input |
| Pino 60 | OSC2 — Crystal oscillator output |
| Pino 61 | SOSCI — Secondary oscillator input |
| Pino 62 | SOSCO — Secondary oscillator output |
| Pino 63 | VDD — Core power supply |
| Pino 64 | VSS — Ground (EP) |
Aplicações típicas
PIC32MX230F128H-50I/MR é adequado para 6 aplicaçãos: USB HID / CDC Peripherals, Low-Cost Audio Playback with I2S Codec, Graphics HMI with Parallel Master Port, Industrial Sensor Hub, IoT Edge Node with USB-C Power, Motor Control and PWM Generation.
USB HID / CDC Peripherals
The PIC32MX230F128H-50I/MR integrates a USB 2.0 Full-Speed OTG controller that natively supports HID, CDC, MSC, and vendor-class USB device stacks. Its 50 MHz / 83 DMIPS MIPS32 M4K core executes the Microchip USB stack with sufficient headroom for composite devices combining HID + CDC + audio. The 128 KB Flash fits the full USB stack plus application code; 16 KB RAM handles EP buffers. Place a 48 MHz crystal or feed the PLL from the USB SOF to maintain clock accuracy.
Recomendado
Low-Cost Audio Playback with I2S Codec
Two I2S modules and PPS-mapped I/O allow direct interfacing to external audio DACs/ADCs (e.g. SGTL5000, CS4344). The 50 MHz core runs software MP3/AAC decoding at modest sample rates, while the 10-bit ADC handles auxiliary analog monitoring. Place a low-jitter crystal on the REFCLKI pin and route I2S clocks as length-matched pairs to maintain audio fidelity. Suitable for doorbells, kiosks, and consumer audio docks.
Recomendado
Graphics HMI with Parallel Master Port
The Parallel Master Port (PMP) with dual read/write buffers drives graphical TFT or STN LCDs directly without an external controller, reducing BOM cost for HMI panels. The 50 MHz core refreshes QVGA panels smoothly while leaving CPU bandwidth for touch handling and protocol stacks. Use PPS to map PMP data lines to convenient GPIO groupings. The 64-pin QFN (9x9) footprint leaves sufficient I/O for buttons, LEDs, and a resistive touch ADC front-end.
Recomendado
Industrial Sensor Hub
With up to 28 channels of 10-bit ADC, four UART, two I2C, and three SPI, the PIC32MX230F128H-50I/MR aggregates multiple sensor buses into a single Modbus or CAN-edge node. The 83 DMIPS core runs digital filtering (FIR/IIR) on raw ADC samples before forwarding. The industrial -40C to +85C temperature rating suits factory floor deployment. Place bulk decoupling (10uF + 100nF) near each VDD pin and isolate analog/digital grounds for ADC accuracy.
Recomendado
IoT Edge Node with USB-C Power
USB 2.0 OTG allows the PIC32MX230F128H-50I/MR to negotiate USB-C power roles while simultaneously running TCP/IP stacks via SPI-connected Wi-Fi or Ethernet controllers. The 16 KB RAM fits lightweight MQTT/CoAP clients; the 128 KB Flash stores Wi-Fi firmware blobs plus application logic. Engineers should use USB-C CC controllers (e.g. FUSB302) for role detection and ensure D+/D- traces maintain 90-ohm differential impedance per USB spec.
Recomendado
Motor Control and PWM Generation
Up to seven timers with PPS-mapped output compare/PWM channels drive BLDC, brushed DC, or servo motors. The 50 MHz core runs FOC algorithms at high PWM frequencies (20-40 kHz) without saturating CPU cycles. Three analog comparators support overcurrent protection and back-EMF sensing. The 64-pin QFN footprint allows routing of three-phase PWM signals to gate drivers. Confirm motor drive current ratings against package thermal limits at 50 MHz full load.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX230F128H-50I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX230F128H-I/MR | PIC32MX230F128H-V/MR | PIC32MX150F256H-50I/MR | PIC32MX130F128H-50I/MR | PIC32MX170F512H-50I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Maximum CPU Frequency | 50 MHz | 40 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Program Flash | 128 KB | 128 KB | 128 KB | 256 KB | 64 KB | 512 KB |
| Data RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 64 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| DMIPS | 83 DMIPS | 66 DMIPS | 83 DMIPS | 83 DMIPS | 83 DMIPS | 83 DMIPS |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- More 16 KB on-chip RAM for USB stack and I2S buffers (vs PIC32MX130F128H-50I/MR)
- Higher Flash (128 KB vs 64 KB) for richer application code (vs PIC32MX130F128H-50I/MR)
- 50 MHz speed grade over 40 MHz grade at same package (vs PIC32MX230F128H-I/MR)
- Industrial temperature range matches datasheet specs (vs PIC32MX230F128H-V/MR)
Notas de projeto
Decouple each VDD pin with a 100nF ceramic capacitor placed within 3 mm of the pin, and add a single 10uF bulk capacitor near the package. The PIC32MX230F128H-50I/MR draws roughly 30-40 mA active at 50 MHz; size the 3.3V LDO for at least 1.5x headroom to handle inrush during USB enumeration and peripheral activation.
USB D+ and D- traces must maintain 90-ohm differential impedance and be length-matched within 150 mils. Place the USB series ferrite beads and ESD protection array (e.g. USBLC6-2SC6) close to the connector. The D+/D- pins are RF2/RF3 and are NOT 5V tolerant; adding external pull-ups above 3.6V will damage the device.
The exposed thermal pad (EP) of the 64-QFN must be soldered to a continuous ground pour with at least 8 thermal vias to the inner ground plane. This reduces theta-JA by 30-40 percent and is required for reliable operation at 50 MHz full load. Avoid routing signal traces across the EP to maintain ground plane continuity.
Keep the 48 MHz crystal traces short (under 5 mm), symmetric, and surrounded by a ground guard trace to minimise EMI. The PIC32MX230F128H-50I/MR PLL multiplies the crystal or FRC frequency up to 50 MHz; poor PCB layout on the crystal will cause jitter that propagates into USB and I2S timing.
Informações de conformidade
RoHS compliant per Microchip product page. Lead-free and halogen-free per Microchip environmental certification. AEC-Q100 not applicable for general-purpose MCU; AEC-Q100 variants exist in PIC32MX grade extensions.
