PIC32MX250F256H-50I/MR - 50MHz 32-bit MCU 256KB Flash 64-QFN
Référence : PIC32MX250F256H-50I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.82 | $4,82 |
| 10 | $4.35 | $43,50 |
| 100 | $3.92 | $392,00 |
| 500 | $3.45 | $1 725,00 |
| 1 000 | $3.05 | $3 050,00 |
PIC32MX250F256H-50I/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals. The PIC32MX family sits in the hierarchy: 32-bit MCU -> MIPS32 M4K architecture -> Microchip PIC32 family -> embedded controller -> semiconductor IC. It targets applications that need more horsepower than 8-bit/16-bit MCUs but where ARM Cortex-M parts are not required.
Key features include up to 50 MHz/83 DMIPS core performance, two I2S and four SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible pin mapping, and a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces. The device operates from 2.3 V to 3.6 V and supports an industrial temperature range of -40 °C to +85 °C, with 10-bit ADC capability and advanced analog peripherals.
The architecture uses a single-cycle multiply and hardware divider with a 5-stage pipeline, delivering deterministic interrupt response and predictable execution. PPS remapping allows peripheral functions to be assigned to nearly any I/O pin, simplifying PCB routing in space-constrained HMI, audio, and connectivity designs. USB, CAN, and 10-bit ADC peripherals are also available on the device.
Typical applications include consumer audio with I2S codec interfaces, HMI/touch panels using PMP-driven displays, USB peripherals, industrial control, and embedded connectivity. The combination of Flash, SRAM, and peripherals makes the PIC32MX250F256H-50I/MR a mainstream PIC32 option for graphics plus audio designs.
When designing with this device, ensure the PCB layout provides a solid thermal/ground pad connection under the exposed pad (EP) of the QFN package, place 0.1 µF + 10 µF decoupling close to each supply pin, and use the PPS function remap to optimize GPIO allocation. Confirm regulator sizing for active and idle modes.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference.
Alternatives de remplacement direct pour PIC32MX250F256H-50I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX250F256H-50I/MR (même facteur de forme et même empreinte) — différant par Package, ADC, Parallel Master Port (PMP), SPI Modules, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX230F256H-50I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX250F256HT-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX130F256H-50I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX250F128H-50I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX150F256H-50I/MR
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX170F256H-50I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX250F256H-50I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage (Vdd) | 2.3 V to 3.6 V |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | 64-pin QFN (9x9 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| I2S Modules | 2 |
| SPI Modules | 4 |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit (per datasheet) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX250F256H-50I/MR
| Broche 1 | RA0 — I/O port A bit 0 / AN0 / CVREF+ |
| Broche 2 | RA1 — I/O port A bit 1 / AN1 |
| Broche 3 | RA2 — I/O port A bit 2 / AN2 |
| Broche 4 | RA3 — I/O port A bit 3 / AN3 |
| Broche 5 | RA4 — I/O port A bit 4 / AN4 |
| Broche 6 | RA5 — I/O port A bit 5 / AN5 |
| Broche 7 | RA6 — I/O port A bit 6 / AN6 |
| Broche 8 | RA7 — I/O port A bit 7 / AN7 |
| Broche 9 | RB0 — I/O port B bit 0 / AN8 / PGED1 |
| Broche 10 | RB1 — I/O port B bit 1 / AN9 / PGEC1 |
| Broche 11 | RB2 — I/O port B bit 2 / AN10 / PGED2 |
| Broche 12 | RB3 — I/O port B bit 3 / AN11 / PGEC2 |
| Broche 13 | RB4 — I/O port B bit 4 / AN12 |
| Broche 14 | RB5 — I/O port B bit 5 / AN13 |
| Broche 15 | RB6 — I/O port B bit 6 / AN14 / ICDCLK |
| Broche 16 | RB7 — I/O port B bit 7 / AN15 / ICDDATA |
| Broche 17 | RC0 — I/O port C bit 0 |
| Broche 18 | RC1 — I/O port C bit 1 |
| Broche 19 | RC2 — I/O port C bit 2 |
| Broche 20 | RC3 — I/O port C bit 3 |
| Broche 21 | RC4 — I/O port C bit 4 |
| Broche 22 | RC5 — I/O port C bit 5 |
| Broche 23 | RC6 — I/O port C bit 6 |
| Broche 24 | RC7 — I/O port C bit 7 |
| Broche 25 | RD0 — I/O port D bit 0 |
| Broche 26 | RD1 — I/O port D bit 1 |
| Broche 27 | RD2 — I/O port D bit 2 |
| Broche 28 | RD3 — I/O port D bit 3 |
| Broche 29 | RD4 — I/O port D bit 4 |
| Broche 30 | RD5 — I/O port D bit 5 |
| Broche 31 | RD6 — I/O port D bit 6 |
| Broche 32 | RD7 — I/O port D bit 7 |
| Broche 33 | RE0 — I/O port E bit 0 |
| Broche 34 | RE1 — I/O port E bit 1 |
| Broche 35 | RE2 — I/O port E bit 2 |
| Broche 36 | RE3 — I/O port E bit 3 |
| Broche 37 | RE4 — I/O port E bit 4 |
| Broche 38 | RE5 — I/O port E bit 5 |
| Broche 39 | RE6 — I/O port E bit 6 |
| Broche 40 | RE7 — I/O port E bit 7 |
| Broche 41 | RF0 — I/O port F bit 0 |
| Broche 42 | RF1 — I/O port F bit 1 |
| Broche 43 | RF2 — I/O port F bit 2 / SDA2 |
| Broche 44 | RF3 — I/O port F bit 3 / SCL2 |
| Broche 45 | RF4 — I/O port F bit 4 / USBID |
| Broche 46 | RF5 — I/O port F bit 5 / VBUS |
| Broche 47 | RF6 — I/O port F bit 6 / SCK1 |
| Broche 48 | RF7 — I/O port F bit 7 / SDI1 |
| Broche 49 | RG0 — I/O port G bit 0 |
| Broche 50 | RG1 — I/O port G bit 1 |
| Broche 51 | RG2 — I/O port G bit 2 / D+ |
| Broche 52 | RG3 — I/O port G bit 3 / D- |
| Broche 53 | RG6 — I/O port G bit 6 |
| Broche 54 | RG7 — I/O port G bit 7 |
| Broche 55 | RG8 — I/O port G bit 8 |
| Broche 56 | RG9 — I/O port G bit 9 |
| Broche 57 | MCLR — Master Clear reset input |
| Broche 58 | VDD — Positive supply 2.3-3.6 V |
| Broche 59 | VSS — Ground reference |
| Broche 60 | VDD — Positive supply 2.3-3.6 V |
| Broche 61 | VSS — Ground reference |
| Broche 62 | OSC1 — Crystal oscillator input |
| Broche 63 | OSC2 — Crystal oscillator output |
| Broche 64 | EP — Exposed pad (thermal/ground, must be soldered) |
Applications typiques
PIC32MX250F256H-50I/MR convient pour 6 applications: Consumer Audio with I2S Codec, HMI Touch Panel with Graphics LCD, USB HID / CDC Peripherals, CAN-based Industrial Control Nodes, Wireless IoT Sensor Hub, Educational / Maker Development Platform.
Consumer Audio with I2S Codec
The PIC32MX250F256H-50I/MR drives I2S audio codecs directly through its two dedicated I2S modules, streaming 16-/24-bit PCM at 44.1 kHz or 48 kHz sample rates while the 50 MHz MIPS core runs MP3/AAC decode, volume control, and tone-shaping algorithms. Its 32 KB SRAM accommodates 100 ms of stereo audio buffer plus descriptor tables, eliminating external memory. The four SPI peripherals handle SD-card file I/O for offline playback, while PPS remaps I2S word-or-frame clock lines to removable blocks to optimize PCB routing around audio jacks and speaker drivers. Compared to 8-bit MCUs that require a dedicated audio DSP, this single-chip solution reduces BOM cost and PCB area for Bluetooth speakers, headphone amplifiers, and portable DAP designs.
Recommandé
HMI Touch Panel with Graphics LCD
The PIC32MX250F256H-50I/MR's Parallel Master Port (PMP) with dual read/write buffers drives TFT LCD panels up to 480x272 resolution at 30 fps without external bus controllers. Combined with the integrated CTMU for touch sensing and the 10-bit ADC for proximity detection, it implements a complete HMI solution. The 256 KB Flash stores font tables, bitmap assets, and UI state machines, while 32 KB SRAM holds double frame buffers, eliminating external SDRAM and lower cost. PPS allows the data bus, control signals, and touch interrupt to be reassigned to any GPIO, simplifying routing on 4-layer PCBs behind glass overlays.
Recommandé
USB HID / CDC Peripherals
The PIC32MX250F256H-50I/MR integrates a USB 2.0 full-speed controller with on-chip transceiver, supporting HID, CDC, MSD, and custom vendor classes without external PHY. The 50 MHz core handles USB protocol stack plus application logic, while 256 KB Flash stores descriptors, class drivers, and firmware upgrade images. PPS routes D+/D- to package-back GPIOs adjacent to the USB connector, simplifying PCB stack-up. The 10-bit ADC and CTMU enable combined data-acquisition plus USB streaming in industrial sensors, programmers, and diagnostic tools. Compared to MCUs requiring external USB chips, this reduces BOM by $0.50-$1.00 per board.
Recommandé
CAN-based Industrial Control Nodes
The PIC32MX250F256H-50I/MR integrates a CAN 2.0B controller, making it ideal for industrial sensor and actuator nodes on CANopen or DeviceNet networks. The 50 MHz core runs CANopen stack plus application code, while the 10-bit ADC and analog comparators measure process variables. The industrial temperature grade of -40 °C to +85 °C handles factory-floor environments. 256 KB Flash supports OTA firmware upgrades via CAN, and the dual I2S modules are repurposed for digital audio feedback in HMI panels. Compared to MCUs needing external CAN transceivers, the 250-series reduces node cost while maintaining EMC robustness.
Recommandé
Wireless IoT Sensor Hub
Paired with an SPI-connected Wi-Fi or LoRa module, the PIC32MX250F256H-50I/MR serves as a low-power IoT gateway aggregating data from multiple sensors over UART, I2C, and SPI. The four SPI peripherals enable concurrent connections to wireless modules, flash storage, and sensor front-ends. PPS flexibility lets designers place shared peripherals to reduce board area. 256 KB Flash supports embedded TLS stacks plus sensor-processing firmware, while the 32 KB SRAM buffers network packets during radio TX/RX transitions. Compared to Cortex-M0+ parts, the 50 MHz MIPS core delivers roughly 2x the DMIPS per mW for battery-powered edge nodes.
Recommandé
Educational / Maker Development Platform
The PIC32MX250F256H-50I/MR is widely supported by MPLAB X IDE, Harmony framework, and the chipKIT platform, making it a robust choice for educational boards and hobbyist projects. The 50 MHz MIPS core provides headroom for teaching RTOS concepts, USB stacks, and graphics programming. PPS simplifies student lab exercises by allowing peripheral reassignment without board rework. Industrial temperature rating supports classroom and lab environments, while 256 KB Flash stores multiple example projects. Compared to lower-pin-count PIC16/PIC24, the 250 delivers 64 MB Flash plus USB in a familiar Arduino-style footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX250F256H-50I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX230F256H-50I/MR | PIC32MX250F256HT-50I/MR | PIC32MX130F256H-50I/MR | PIC32MX250F128H-50I/MR | PIC32MX150F256H-50I/MR | PIC32MX170F256H-50I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9) with EP | 64-QFN (9x9) with EP - same | 64-QFN (9x9) with EP - same | 64-QFN (9x9) with EP - same | 64-QFN (9x9) with EP - same | 64-QFN (9x9) with EP - same | 64-QFN (9x9) with EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 128 KB (-50%) | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB | USB 2.0 full-speed | None | USB 2.0 full-speed | USB 2.0 full-speed | USB 2.0 full-speed | None | USB 2.0 full-speed |
| CAN | CAN 2.0B | None | CAN 2.0B | None | CAN 2.0B | None | None |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| I2S Modules | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Principaux différenciateurs
- Integrated USB 2.0 and CAN 2.0B in single MCU (vs PIC32MX230F256H-50I/MR)
- 256 KB Flash for complex firmware stacks (vs PIC32MX130F256H-50I/MR)
- Same pinout as 150/170 family (vs PIC32MX150F256H-50I/MR)
Notes de conception
The 64-QFN package exposes the die through the bottom EP pad, which must be soldered to a PCB thermal pad connected to the ground plane with multiple thermal vias (typically 9-16 vias in a 3x3 to 4x4 grid). At 50 MHz full operation the PIC32MX250F256H-50I/MR dissipates well under 100 mW, so thermal management is rarely a concern. However, in enclosed industrial enclosures with no airflow, derate ambient by 5-10 °C if the EP is not properly stitched to inner copper layers. Estimated: at 3.3 V x 50 mA core + 20 mA peripherals = ~230 mW max dissipation, well within QFN-64 capabilities.
Place 0.1 µF ceramic decoupling capacitors as close as possible to every VDD pin (pins 58 and 60), with a 10 µF bulk tantalum or ceramic on the supply rail within 5 mm of the IC. The exposed pad (pin 64) must be soldered to a PCB thermal pad for mechanical reliability and electrical grounding. PPS peripheral mapping lets you reassign oscillator, debug, and timer functions to alternate pins, which simplifies layout when routing around tall components or RF sections. Maintain a continuous ground plane under the IC for return current management.
Do not confuse '-50I/' (speed 50 MHz, industrial) vs '-V/-E/' suffixes in cross-stock pin order - the 50I/MR on PIC32MX250 is 50 MHz industrial grade. When migrating code from PIC32MX1xx/2xx/3xx/4xx families, check that PPS input/output mapping registers match the target device's I/O count. Programming voltage on MCLR must observe Vih/Vil thresholds per datasheet; use a 10 kΩ pull-up to VDD. Avoid routing high-frequency signals (SPI clk, I2S BCLK) across the exposed pad region without ground stitching to prevent noise coupling.
Crystal oscillator traces (OSC1/OSC2, pins 62-63) should be as short as possible and surrounded by a ground guard ring to minimize EMI pickup. Keep USB D+/D- traces (RG-50 and RG-52 with 2 m to m) matched at 90 ohm differential impedance, and route them away from switching regulators and clock traces. The Parallel Master Port data/control bus (RD0-RD7 + RE0-RE7) should be length-matched within 5 mm if the panel supports DCLK > 20 MHz. Per Microchip TB094 layout note, isolate analog AVSS/AVDD pins from digital switching returns.
Informations de conformité
RoHS3 compliant per mcu-supplier.com listing. Industrial temperature grade -40 to +85 °C. Not AEC-Q100 qualified - choose PIC32MX1xx automotive variants for automotive use cases.
