PIC32MX470F512H-I/MR - 32-bit 100MHz MCU 512KB Flash 64-QFN | Microchip
Référence : PIC32MX470F512H-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.95 | $7,95 |
| 10 | $7.16 | $71,60 |
| 100 | $6.36 | $636,00 |
| 500 | $5.72 | $2 860,00 |
| 1 000 | $5.08 | $5 080,00 |
PIC32MX470F512H-I/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable peripherals. The PIC32MX470 belongs to the broader 32-bit MCU category (32-bit -> microcontroller -> embedded processor -> semiconductor), built on the MIPS32 M4K core architecture. This family balances high performance (120 MHz / 150 DMIPS capable on the -120 speed grade) with low cost, targeting consumer, industrial, and USB-enabled embedded designs.
Key features include 120 MHz maximum CPU clock on the -120 speed grade, hardware multiplier/divider, a Charge Time Measurement Unit (CTMU) for touch sensing, a Real-Time Clock Calendar (RTCC), five 16-bit timers/counters, and operation from 2.3V to 3.6V across the industrial -40°C to +105°C temperature range. The 64-QFN MR package provides a low-profile 9x9 mm footprint suitable for compact USB and HMI boards.
Typical applications include USB Audio/Class-D devices, color TFT HMI panels with PMP-driven LCDs, capacitive touch sensing using CTMU, USB HID peripherals such as keyboards and game controllers, industrial control with USB-CDC bridge, and low-cost graphics terminals. The combination of 512 KB Flash and USB OTG makes it well-suited to firmware-upgradable USB products.
When designing with this device, ensure the USB VBUS pin is correctly conditioned per USB 2.0 specification and that PPS remapping is validated against the chosen pinout. Use MPLAB Harmony or MPLAB X IDE with the XC32 compiler for firmware development. Decoupling should include 100 nF on each VDD/VSS pair plus a bulk 4.7 µF near the regulator.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MX470F512H-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX470F512H-I/MR (même facteur de forme et même empreinte) — différant par Package, ADC, USB, DMA Channels, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX470F512H-120/MR
✅ Remplacement direct✓ En stock
$4.2 / unité
Voir la fiche technique →PIC32MX470F512H-V/MR
✅ Remplacement direct✓ En stock
$6.74 / unité
Voir la fiche technique →PIC32MX470F512HT-I/MR
✅ Remplacement direct✓ En stock
$6.85 / unité
Voir la fiche technique →PIC32MX470F512H-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX450F256H-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX470F512L-I/PT
✅ Remplacement direct✓ En stock
$6.32 / unité
Voir la fiche technique →PIC32MX470F512H-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| CPU Bit Width | 32-bit |
| Maximum CPU Frequency | 100 MHz (120 MHz on -120 speed grade) |
| DMIPS Performance | 150 DMIPS (at 120 MHz) |
| Program Memory (Flash) | 512 KB |
| Data Memory (SRAM) | 128 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40 °C to +105 °C (Industrial) |
| ADC Channels | 28 channels |
| USB Interface | USB 2.0 Full-Speed OTG |
| I2S/SPI Modules | 2 |
| I2C Modules | 2 |
| UART Modules | Up to 5 |
| PWM Channels | Up to 9 (peripherals vary) |
| Boîtier | 64-pin QFN (MR) 9x9 mm with exposed pad |
| Type de montage | Surface Mount |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Charge Time Measurement Unit) | Yes |
| RTCC (Real-Time Clock Calendar) | Yes |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX470F512H-I/MR
| Broche 1 | RB0 — Port B bit 0 / PGED1 (programming) |
| Broche 2 | RB1 — Port B bit 1 / PGEC1 (programming) |
| Broche 3 | RB2 — Port B bit 2 |
| Broche 4 | RB3 — Port B bit 3 |
| Broche 5 | VSS — Ground |
| Broche 6 | RB4 — Port B bit 4 |
| Broche 7 | RB5 — Port B bit 5 |
| Broche 8 | RB6 — Port B bit 6 |
| Broche 9 | RB7 — Port B bit 7 |
| Broche 10 | RB8 — Port B bit 8 |
| Broche 11 | RB9 — Port B bit 9 |
| Broche 12 | RB10 — Port B bit 10 |
| Broche 13 | RB11 — Port B bit 11 |
| Broche 14 | RB12 — Port B bit 12 |
| Broche 15 | RB13 — Port B bit 13 |
| Broche 16 | RB14 — Port B bit 14 |
| Broche 17 | RB15 — Port B bit 15 |
| Broche 18 | VDD — Digital supply voltage (2.3-3.6 V) |
| Broche 19 | VSS — Ground |
| Broche 20 | RC1 — Port C bit 1 |
| Broche 21 | RC2 — Port C bit 2 |
| Broche 22 | RC3 — Port C bit 3 |
| Broche 23 | RC4 — Port C bit 4 |
| Broche 24 | RD0 — Port D bit 0 / PMP data |
| Broche 25 | RD1 — Port D bit 1 / PMP data |
| Broche 26 | RD2 — Port D bit 2 / PMP data |
| Broche 27 | RD3 — Port D bit 3 / PMP data |
| Broche 28 | RD4 — Port D bit 4 / PMP data |
| Broche 29 | RD5 — Port D bit 5 / PMP data |
| Broche 30 | RD6 — Port D bit 6 / PMP data |
| Broche 31 | RD7 — Port D bit 7 / PMP data |
| Broche 32 | RD8 — Port D bit 8 / PMP data |
| Broche 33 | RD9 — Port D bit 9 / PMP data |
| Broche 34 | RD10 — Port D bit 10 / PMP data |
| Broche 35 | RD11 — Port D bit 11 / PMP data |
| Broche 36 | VSS — Ground |
| Broche 37 | VDD — Digital supply voltage |
| Broche 38 | RD12 — Port D bit 12 |
| Broche 39 | RD13 — Port D bit 13 |
| Broche 40 | RD14 — Port D bit 14 |
| Broche 41 | RD15 — Port D bit 15 |
| Broche 42 | RE0 — Port E bit 0 / PMPRD |
| Broche 43 | RE1 — Port E bit 1 / PMPWR |
| Broche 44 | RE2 — Port E bit 2 |
| Broche 45 | RE3 — Port E bit 3 |
| Broche 46 | RE4 — Port E bit 4 |
| Broche 47 | RE5 — Port E bit 5 |
| Broche 48 | RE6 — Port E bit 6 |
| Broche 49 | RE7 — Port E bit 7 |
| Broche 50 | RF0 — Port F bit 0 |
| Broche 51 | RF1 — Port F bit 1 |
| Broche 52 | RF2 — Port F bit 2 |
| Broche 53 | RF3 — Port F bit 3 |
| Broche 54 | RF4 — Port F bit 4 |
| Broche 55 | RF5 — Port F bit 5 |
| Broche 56 | RF6 — Port F bit 6 |
| Broche 57 | RG0 — Port G bit 0 |
| Broche 58 | RG1 — Port G bit 1 |
| Broche 59 | RG2 — Port G bit 2 / D+ or D- |
| Broche 60 | RG3 — Port G bit 3 / D+ or D- |
| Broche 61 | RG6 — Port G bit 6 / VBUS sense |
| Broche 62 | RG7 — Port G bit 7 |
| Broche 63 | RG8 — Port G bit 8 |
| Broche 64 | RG9 — Port G bit 9 |
Applications typiques
PIC32MX470F512H-I/MR convient pour 7 applications: USB Audio Class Device, Color TFT HMI Panel with PMP, Capacitive Touch Sensing Panel, USB HID Peripheral (Keyboard/Mouse/Game Controller), USB-to-UART / Industrial Bridge Converter, Low-Cost Graphics Terminal, Data Logging and Sensor Hub.
USB Audio Class Device
The PIC32MX470F512H-I/MR is well-suited for USB Audio Class 1.0/2.0 DACs and headsets. Its USB 2.0 Full-Speed OTG controller streams 24-bit/96 kHz audio, while the two I2S/SPI modules interface directly to DAC chips such as the PCM5102A. With 128 KB SRAM buffering, the MCU handles USB isochronous packets without dropouts. Compared to using a separate USB audio codec IC, integrating on PIC32MX470 reduces BOM and board area.
Recommandé
Color TFT HMI Panel with PMP
The Parallel Master Port (PMP) of the PIC32MX470F512H-I/MR drives color TFT LCDs in 8-bit or 16-bit parallel mode at high frame rates. Combined with 512 KB Flash for storing graphics assets and 128 KB SRAM as a framebuffer for small panels, the MCU eliminates the need for an external graphics controller. The PPS feature frees up enough I/O for touch sensing via the CTMU on the same PCB without extra pins.
Recommandé
Capacitive Touch Sensing Panel
The Charge Time Measurement Unit (CTMU) integrated in PIC32MX470F512H-I/MR provides hardware-assisted capacitive touch measurement, supporting buttons, sliders, and wheels. Combined with the 28-channel ADC, the MCU handles 10+ touch buttons without external scan ICs. The 100 MHz CPU runs MPLAB Harmony Touch library with sub-10 ms response time, making it suitable for appliance, automotive interior, and industrial control panels.
Recommandé
USB HID Peripheral (Keyboard/Mouse/Game Controller)
The PIC32MX470F512H-I/MR's USB Full-Speed OTG and 100 MHz core handle USB HID class with low interrupt latency. With 512 KB Flash, designers can store multiple HID profiles (keyboard, mouse, gamepad) plus a USB bootloader for field firmware updates. The PMP and PPS allow flexible PCB routing for mechanical matrix scanning or analog joystick inputs in custom gaming peripherals.
Recommandé
USB-to-UART / Industrial Bridge Converter
The PIC32MX470F512H-I/MR can act as a USB-CDC to UART/I2C/SPI bridge, replacing the popular MCP2200/MCP2221 with far more headroom. The 5 UART channels support RS-232/RS-485 bridge applications, and the industrial -40 °C to +105 °C temperature rating suits factory automation. Field upgrades are simple via the on-chip USB bootloader without an external programmer.
Recommandé
Low-Cost Graphics Terminal
The PIC32MX470F512H-I/MR is ideal for compact low-cost graphics terminals used in vending machines, kiosks, and access control. With PMP driving a small TFT, 512 KB Flash storing multilingual fonts and menus, and USB OTG enabling host-mode connectivity to printers or keypads, the MCU replaces systems that previously required an SBC. Compared to a Raspberry Pi-based design, PIC32MX470 offers real-time deterministic response and lower BOM cost.
Recommandé
Data Logging and Sensor Hub
The PIC32MX470F512H-I/MR integrates USB device mode for data export, I2C/SPI for sensor interfacing, and 28 ADC channels for analog measurement. With 512 KB Flash and 128 KB SRAM, it can buffer significant sensor logs locally before USB transfer. The RTCC enables accurate timestamping for unattended industrial monitoring stations across the -40 °C to +105 °C industrial range.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX470F512H-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX470F512H-120/MR | PIC32MX470F512H-V/MR | PIC32MX470F512HT-I/MR | PIC32MX470F512H-I/PT | PIC32MX450F256H-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm | 64-TQFP (PT) 10x10 mm | 64-QFN (MR) 9x9 mm |
| Maximum CPU Frequency | 100 MHz | 120 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB |
| USB OTG | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) |
| Operating Temperature | -40 °C to +105 °C (Industrial) | -40 °C to +85 °C (per -120 grade) | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
Principaux différenciateurs
- Highest memory density in PIC32MX3/4 family (vs PIC32MX450F256H-I/MR)
- Peripheral Pin Select (PPS) for flexible routing (vs PIC32MX450F256H-I/MR)
- Industrial temperature grade as standard (vs PIC32MX470F512H-120/MR)
Notes de conception
Use a 3.3V LDO such as MCP1700 or AP2112K-3.3 within 25 mm of the VDD pins. Place one 100 nF X7R 0402 or 0603 ceramic decoupling capacitor on each VDD/VSS pair (multiple pins across the package). Add a bulk 4.7 µF X5R tantalum or ceramic capacitor near the regulator output. The AVDD pin (if present in this variant) should be filtered with a ferrite bead from VDD and decoupled with its own 100 nF + 10 µF pair to reduce ADC noise. Per Microchip datasheet, total VDD ramp time should be <100 ms to ensure proper Power-on Reset behavior.
Do not confuse the PIC32MX470F512H-I/MR (100 MHz, industrial) with PIC32MX470F512H-120/MR (120 MHz). The speed grade is a Microchip ordering code suffix, not a hardware feature, but firmware timing loops and USB clock divisor calculations differ. The MCLR pin must be pulled high through a 10 kΩ resistor; leaving MCLR floating causes intermittent boot failures. JTAG/ICSP pins RB0/PGED1 and RB1/PGEC1 must not be remapped via PPS in production firmware, or programming will be blocked. The exposed thermal pad of the QFN must be soldered to the PCB ground plane for thermal dissipation.
For the 64-QFN MR package, route all four sides before placing internal components. The exposed pad (EP) must connect to a continuous ground pour with thermal vias (at least 9 vias in a 3x3 array, 0.3 mm drill, 0.5 mm pitch) to keep junction temperature below 125 °C. Keep USB D+/D- traces matched to 90 Ω differential impedance, length-matched within 150 mils, and free of vias where possible. Maintain 4x trace-width clearance between analog signals (ADC inputs) and digital switching nodes to minimize coupling.
Place the 12 MHz primary oscillator (or use the internal 8 MHz FRCDIV with PLL) within 5 mm of the OSC1/OSC2 pins. Keep crystal traces short and guarded with a ground ring to avoid EMI radiation that can disrupt USB signaling. When using the USB OTG feature, ensure VBUS sense pin (RG6 or RG7 depending on PPS) connects to USB VBUS through a resistive divider compatible with 5 V tolerance, and place a 1 µF bulk capacitor on VBUS near the connector. PPS remapping should be configured in software early in init code to lock down pin assignments before any peripheral driver opens.
Informations de conformité
RoHS compliant per Microchip product page. Halogen-free per Microchip environmental certification. Not AEC-Q100 qualified - choose automotive-qualified PIC32MK or PIC32MX1xx/2xx variants for AEC-Q100 needs.