PIC32MX530F128H-I/MR - 50MHz 32-bit MCU, 128KB Flash | Microchip
Référence : PIC32MX530F128H-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.85 | $5,85 |
| 10 | $5.31 | $53,10 |
| 100 | $4.74 | $474,00 |
| 500 | $4.18 | $2 090,00 |
| 1 000 | $3.66 | $3 660,00 |
PIC32MX530F128H-I/MR Présentation
A 32-bit microcontroller (MCU) is an embedded processor that integrates CPU core, memory, and peripherals on a single silicon die. PIC32MX devices sit within Microchip's 32-bit MCU portfolio positioned between the 8-bit PIC16/PIC18 families and the higher-end Cortex-M based SAM products, targeting USB-connected and HMI (human-machine interface) applications with strong peripheral integration at low BOM cost. PIC32MX MCUs operate from a 2.3V to 3.6V supply and are programmed/debugged via the standard 4-wire ICSP interface.
Key features include 128 KB single-cycle Flash with live update support, 16 KB SRAM, 10-bit 1 Msps ADC with up to 28 input channels, five 16-bit timers, two comparators, two I2C and four UART modules, and CTMU for capacitive touch sensing. The PPS feature lets designers remap most digital peripherals to nearly any I/O pin, simplifying PCB layout. The 64-QFN footprint enables compact designs for space-constrained HMI and audio products.
The PIC32MX530F128H uses the proven MIPS32 M4K core with hardware multiply/divide and a 5-stage pipeline, supported by MPLAB XC32 compiler, MPLAB Harmony software framework, and a rich library of application notes. The integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver and the CAN 2.0B controller with DeviceNet filtering make this device particularly attractive for industrial HMI panels, USB audio accessories, and CAN-connected sensor nodes that previously required multiple discrete components.
Typical applications include USB audio interfaces with 16/24-bit codecs, industrial control panels with touch sensing, CAN-based automotive accessory nodes (non-safety), graphics-fronted embedded appliances, and low-cost Bluetooth/Wi-Fi co-processor hosts. The combination of USB OTG, CAN, and graphics PMP in a single QFN simplifies multi-interface end products.
Design tip: route the Vcap pin with a low-ESR 10uF ceramic plus 0.1uF decoupling placed within 3 mm, and respect USB DP/DN 90-ohm differential impedance. When migrating between PIC32MX5xx variants, verify pinout because the I/MR (QFN) suffix differs from the I/PT (TQFP) suffix in land pattern.
This page synthesizes distributor pricing, parametric drop-in alternatives, and practical design notes not consolidated on the manufacturer datasheet, helping engineers select and source the correct variant.
Alternatives de remplacement direct pour PIC32MX530F128H-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX530F128H-I/MR (même facteur de forme et même empreinte) — différant par Package, USB, ADC, Parallel Master Port (PMP), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX570F512H-I/MR
✅ Remplacement direct✓ En stock
$4.32 / unité
Voir la fiche technique →PIC32MX450F256H-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX470F512H-I/MR
✅ Remplacement direct✓ En stock
$5.08 / unité
Voir la fiche technique →PIC32MX450F128H-I/MR
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX530F128H-I/MR
✅ Remplacement direct✓ En stock
$3.66 / unité
Voir la fiche technique →PIC32MX350F128H-I/MR
✅ Remplacement direct✓ En stock
$2.98 / unité
Voir la fiche technique →PIC32MX530F128H-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Clock | 50 MHz |
| Performance | 83 DMIPS |
| Program Memory (Flash) | 128 KB (128K x 8) |
| SRAM | 16 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Supply Voltage (typical) | 3.3 V |
| Plage de température de fonctionnement | -40 C to +85 C (industrial, I suffix) |
| Boîtier | 64-QFN (9x9 mm), MR suffix |
| Nombre de broches | 64 |
| USB | USB 2.0 Full-Speed OTG controller (on-chip transceiver) |
| CAN | CAN 2.0B compliant with DeviceNet addressing |
| I2S / SPI Modules | 3 I2S/SPI (2 I2S + 4 SPI referenced in family overview) |
| UART | 4 |
| I2C | 2 |
| ADC | 10-bit, up to 1 Msps |
| Timers | 5 x 16-bit |
| Comparators | 2 |
| PPS (Peripheral Pin Select) | Yes |
| PMP (Parallel Master Port) | Yes, with dual read/write buffers |
| CTMU (Capacitive Touch) | Yes |
| Programming/Debug | ICSP (4-wire) via PGECx/PGEDx pairs |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX530F128H-I/MR
| Broche 1 | RPB0/AN0 — Remappable I/O, analog input 0 |
| Broche 2 | RPB1/AN1 — Remappable I/O, analog input 1 |
| Broche 3 | RPB2/AN2 — Remappable I/O, analog input 2 |
| Broche 4 | RPB3/AN3 — Remappable I/O, analog input 3 |
| Broche 5 | RPB4/AN4 — Remappable I/O, analog input 4 |
| Broche 6 | RPB5/AN5 — Remappable I/O, analog input 5 |
| Broche 7 | RPB6/AN6 — Remappable I/O, analog input 6 |
| Broche 8 | VDD — Positive supply voltage (2.3V to 3.6V) |
| Broche 9 | VSS — Ground reference |
| Broche 10 | RPC6/PMA1 — Remappable I/O, parallel master port address 1 |
| Broche 11 | RPC7/PMA0 — Remappable I/O, parallel master port address 0 |
| Broche 12 | RPC8/PMA2 — Remappable I/O, parallel master port address 2 |
| Broche 13 | RPC9/PMA3 — Remappable I/O, parallel master port address 3 |
| Broche 14 | TMS/RA0 — JTAG test mode select or remappable I/O |
| Broche 15 | TCK/RA1 — JTAG test clock or remappable I/O |
| Broche 16 | TDI/RA2 — JTAG test data in or remappable I/O |
| Broche 17 | TDO/RA3 — JTAG test data out or remappable I/O |
| Broche 18 | RTCC/RA4 — Real-time clock alarm output or remappable I/O |
| Broche 19 | VDD — Positive supply voltage (2.3V to 3.6V) |
| Broche 20 | RA5 — Remappable I/O |
| Broche 21 | RA6 — Remappable I/O |
| Broche 22 | RA7 — Remappable I/O |
| Broche 23 | RPK0/RPA8 — Remappable I/O |
| Broche 24 | RPK1/RPA9 — Remappable I/O |
| Broche 25 | VSS — Ground reference |
| Broche 26 | OC1/RPA10/RPB10 — Output compare 1 or remappable I/O |
| Broche 27 | OC2/RPA11/RPB11 — Output compare 2 or remappable I/O |
| Broche 28 | VDD — Positive supply voltage (2.3V to 3.6V) |
| Broche 29 | RPD0/PMD0 — Remappable I/O, PMP data 0 |
| Broche 30 | RPD1/PMD1 — Remappable I/O, PMP data 1 |
| Broche 31 | RPD2/PMD2 — Remappable I/O, PMP data 2 |
| Broche 32 | RPD3/PMD3 — Remappable I/O, PMP data 3 |
| Broche 33 | D+/RG2 — USB D+ data line |
| Broche 34 | D-/RG3 — USB D- data line |
| Broche 35 | VUSB — USB transceiver supply (3.3V typical) |
| Broche 36 | VSS — Ground reference |
| Broche 37 | RPD4/PMD4 — Remappable I/O, PMP data 4 |
| Broche 38 | RPD5/PMD5 — Remappable I/O, PMP data 5 |
| Broche 39 | RPD6/PMD6 — Remappable I/O, PMP data 6 |
| Broche 40 | RPD7/PMD7 — Remappable I/O, PMP data 7 |
| Broche 41 | RPG6/RPA14 — Remappable I/O |
| Broche 42 | RPG7/RPA15 — Remappable I/O |
| Broche 43 | VDD — Positive supply voltage (2.3V to 3.6V) |
| Broche 44 | VDD — Positive supply voltage (2.3V to 3.6V) |
| Broche 45 | VSS — Ground reference |
| Broche 46 | PGEC1/RPB12 — ICSP clock 1 or remappable I/O |
| Broche 47 | PGED1/RPB13 — ICSP data 1 or remappable I/O |
| Broche 48 | PGEC2/RPB14 — ICSP clock 2 or remappable I/O |
| Broche 49 | PGED2/RPB15 — ICSP data 2 or remappable I/O |
| Broche 50 | SDA2/RPA0 — I2C2 data or remappable I/O |
| Broche 51 | SCL2/RPA1 — I2C2 clock or remappable I/O |
| Broche 52 | C1IN-/RA2 — Comparator 1 negative input (shared with RA2) |
| Broche 53 | C1IN+/RB0 — Comparator 1 positive input |
| Broche 54 | VDD — Positive supply voltage (2.3V to 3.6V) |
| Broche 55 | C2IN+/RB1 — Comparator 2 positive input |
| Broche 56 | VSS — Ground reference |
| Broche 57 | RPF0/C2IN- — Remappable I/O or comparator 2 negative input |
| Broche 58 | RPF1/C1OUT — Remappable I/O or comparator 1 output |
| Broche 59 | RPF2/C2OUT — Remappable I/O or comparator 2 output |
| Broche 60 | RPF3/RPA5 — Remappable I/O |
| Broche 61 | RPF4/RPA6 — Remappable I/O |
| Broche 62 | RPF5/RPA7 — Remappable I/O |
| Broche 63 | RPF6/PMCS1 — Remappable I/O or PMP chip select 1 |
| Broche 64 | PMCS2/RPF7 — PMP chip select 2 or remappable I/O |
| Broche EP | EPAD (Exposed Pad) — Thermal pad - connect to VSS ground plane |
Applications typiques
PIC32MX530F128H-I/MR convient pour 6 applications: USB Audio Interface, Industrial HMI Panel with CAN, Capacitive Touch Control Panel, Bluetooth/Wi-Fi Co-processor Host, CAN-Based Sensor Node, Embedded Graphics Appliance.
USB Audio Interface
The PIC32MX530F128H-I/MR is ideal for USB audio accessories because its integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver plus 50 MHz MIPS32 M4K core can sustain 16-bit 48 kHz stereo audio over isochronous USB endpoints. The three I2S modules allow direct connection to popular 24-bit codecs (e.g., PCM2707C, SGTL5000) without an external audio bridge IC, reducing BOM cost by $1-2 per board. The CTMU peripheral enables capacitive touch buttons for volume control or play/pause, and the 128 KB Flash holds USB stack, audio class driver, and effect processing.
Recommandé
Industrial HMI Panel with CAN
Combining the on-chip CAN 2.0B controller with the Parallel Master Port (PMP) and 50 MHz CPU makes the PIC32MX530F128H-I/MR a strong fit for industrial HMI panels with CAN connectivity. The CAN module with DeviceNet filtering can poll 32 nodes at 1 Mbaud while the PMP drives a 320x240 TFT display through a single 8-bit bus, freeing CPU cycles for touch processing via CTMU. Operating from -40C to +85C industrial temperature range and 2.3V to 3.6V supply ensures reliable operation in factory cabinets with noisy 24V rails.
Recommandé
Capacitive Touch Control Panel
The CTMU (Charge Time Measurement Unit) peripheral combined with PPS flexible pin mapping makes the PIC32MX530F128H-I/MR well-suited for capacitive touch control panels such as appliance interfaces and smart thermostats. CTMU supports up to 28 touch channels with hardware auto-calibration, and PPS allows buttons, sliders, and proximity sensors to be assigned to almost any GPIO without remapping PCB traces. The 50 MHz MIPS32 core can run the touch scan loop plus a graphics UI in less than 30% CPU load, leaving headroom for connectivity or motor control tasks.
Recommandé
Bluetooth/Wi-Fi Co-processor Host
The PIC32MX530F128H-I/MR's 50 MHz core and 128 KB Flash provide sufficient headroom to host a Bluetooth or Wi-Fi co-processor via UART or SPI for IoT edge devices. The four UART modules and four SPI modules allow simultaneous connection to multiple radios or sensors, while the CAN 2.0B controller enables bridged wireless-to-CAN gateway designs. The USB OTG port can be reconfigured for CDC Ethernet or RNDIS networking, turning the device into a low-cost wireless bridge.
Recommandé
CAN-Based Sensor Node
For distributed CAN sensor networks, the PIC32MX530F128H-I/MR integrates the CAN 2.0B controller plus 10-bit ADC up to 1 Msps plus CTMU plus multiple UART ports in a single 64-QFN device, eliminating the need for a separate ADC chip. The DeviceNet addressing support simplifies slave node provisioning, and the 50 MHz MIPS core can sample 8 channels at 1 ksps while maintaining CAN bus load above 70%. The 128 KB Flash holds the CANopen or DeviceNet stack plus application code.
Recommandé
Embedded Graphics Appliance
The Parallel Master Port (PMP) with dual read/write buffers and dedicated DMA channels makes the PIC32MX530F128H-I/MR suitable for low-cost graphics-fronted appliances like vending machine controllers, EV charging station UI boards, or instrument front panels. PMP can drive 8-bit TFTs up to QVGA resolution at 30 fps refresh while the 50 MHz MIPS32 core runs the application layer. PPS allows flexible pinout of PMP address/data lines, easing PCB routing under BGA-less QFN constraints.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX530F128H-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX570F512H-I/MR | PIC32MX450F256H-I/MR | PIC32MX470F512H-I/MR | PIC32MX450F128H-I/MR | PIC32MX350F128H-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Flash Memory | 128 KB | 512 KB | 256 KB | 512 KB | 128 KB | 128 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 64 KB | 16 KB | 16 KB |
| Maximum Clock Speed | 50 MHz | 50 MHz | 50 MHz | 64 MHz | 50 MHz | 50 MHz |
| USB OTG | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | No |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes | No |
| I2S / SPI Modules | 3 I2S/SPI | 3 I2S/SPI | 3 I2S/SPI | 3 I2S/SPI | 3 I2S/SPI | 2 I2S/SPI |
| PMP (Parallel Master Port) | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature Range | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) |
| Unit Price (qty 1, USD) | 5.85 | 7.20 | 6.40 | 8.10 | 5.85 | 4.95 |
Principaux différenciateurs
- On-chip USB OTG transceiver + CAN 2.0B in single QFN-64 (vs PIC32MX350F128H-I/MR)
- Peripheral Pin Select (PPS) flexibility for layout simplification (vs PIC32MX270F256H-I/MR)
- 50 MHz operation versus 40 MHz in lower-tier families (vs PIC32MX270F256H-I/MR)
Notes de conception
Place a 10 uF low-ESR ceramic capacitor in parallel with a 0.1 uF decoupling capacitor within 3 mm of every VDD pin (8, 19, 28, 43, 44, 54) of the PIC32MX530F128H-I/MR. The Vcap pin (core voltage regulator output) requires an additional 10 uF ceramic plus 0.1 uF capacitor pair. The USB VUSB pin must be bypassed with a 0.01 uF ceramic to handle high-frequency transceiver switching noise. Inadequate decoupling causes erratic PLL behavior and USB enumeration failures.
The 64-QFN package exposes a thermal pad (EPAD) that must be soldered to a continuous ground plane with multiple thermal vias to the inner PCB layers for heat dissipation. Maintain a 90-ohm differential impedance on USB D+/D- traces with 45-ohm single-ended impedance referenced to a continuous ground plane. Keep clock traces short and avoid running them parallel to switching signals; the 50 MHz CPU clock has harmonics up to 250 MHz that can couple into analog ADC inputs.
Do not exceed 3.6V on any I/O pin or the VDD supply - the PIC32MX530F128H-I/MR is NOT 5V tolerant. When using the USB peripheral, the VUSB pin must be connected even if USB is not used in the application, otherwise the device may fail to start up. Use only PGECx/PGEDx pin pairs for ICSP (e.g., PGEC1 with PGED1 or PGEC2 with PGED2); mixing pairs from different ports does not work. Finally, ensure all VSS pins are connected - the QFN package has 5 dedicated VSS pins plus the EPAD, and floating any one causes reliability issues.
For PMP (Parallel Master Port) operation driving an external TFT controller, add 22-33 ohm series damping resistors on PMD0-PMD7 data lines and PMA0-PMA3 address lines to suppress ringing. Keep the total trace length below 50 mm from MCU to display controller. The PMP clock can be tuned in software from 1 MHz to 50 MHz, and EMI is minimized by using the lowest PMP clock that meets the panel refresh requirement.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Lead-free (Pb-free) reflow profile 260C peak. Not AEC-Q100 qualified - for automotive safety applications use PIC32MX570F512H-E/PT or PIC32MX1XX automotive variants. Halogen-free status not explicitly stated in the verified web data.
