PIC32MX775F256LT-80V/BG - 80MHz 32-bit MCU with ETH/USB/CAN | Microchip
Référence : PIC32MX775F256LT-80V/BG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.48 | $114,80 |
| 100 | $9.95 | $995,00 |
| 500 | $8.62 | $4 310,00 |
| 1 000 | $7.48 | $7 480,00 |
PIC32MX775F256LT-80V/BG Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals such as timers, communication interfaces, and analog blocks. The PIC32MX family belongs to the broader 32-bit MCU taxonomy: 32-bit microcontroller -> MIPS32 M4K core -> Microchip PIC32 -> Microchip Connectivity Line, sitting under the wider category of microcontrollers (semiconductor -> IC -> microcontroller). The '5/6/7' series specifically targets connected-embedded applications with on-chip Ethernet, USB, and CAN.
Key features of the PIC32MX775F256LT-80V/BG include: 256 KB Flash (256K x 8) for code storage, 64 KB SRAM for runtime data, 80 MHz maximum operating frequency delivering 105 DMIPS, integrated 10/100 Ethernet MAC with MII/RMII interface, USB 2.0 Full-Speed OTG controller, two independent CAN 2.0B modules, sixteen 10-bit ADC inputs, five 16-bit timers/counters, and a wide operating voltage of 2.3 V to 3.6 V. The 'T' suffix indicates tape-and-reel packaging, 'V' denotes the -40C to +105C industrial-grade temperature range, and 'BG' identifies the 121-pin TFBGA package.
Architecturally, the device uses a 5-stage pipelined MIPS32 M4K core with hardware multiply/divide, separate program Flash bus and SRAM bus (Harvard architecture), and a peripheral bus that supports DMA for high-throughput Ethernet and USB transfers. Code execution is in-place from Flash via an instruction cache, allowing zero-wait-state performance at 80 MHz.
Typical applications include industrial Ethernet gateways, USB-OTG device controllers, CAN-based automotive body controllers, point-of-sale terminals, and connected medical devices. The integrated triple-connectivity (Ethernet + USB + CAN) makes the part especially well suited for protocol-bridging nodes that must translate between factory, automotive, and IT networks.
When designing with this part, pay attention to the 121-ball TFBGA layout (0.8 mm pitch): it requires via-in-pad PCB fabrication and 4-layer routing for clean Ethernet signal integrity. Also confirm the 'V' temperature grade matches your end-environment, and use MPLAB Harmony or MPLAB XC32 for firmware development with the integrated peripheral libraries.
This page synthesizes distributor pricing across DigiKey/Mouser/Octopart, Microchip-recommended drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing engineering decision support beyond the basic parametric page.
Alternatives de remplacement direct pour PIC32MX775F256LT-80V/BG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX775F256LT-80V/BG (même facteur de forme et même empreinte) — différant par Package, Timers, USB, ADC, CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX775F256L-80V/BG
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →PIC32MX775F256LT-80I/BG
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →PIC32MX775F256L-80V/PF
✅ Remplacement direct✓ En stock
$5.55 / unité
Voir la fiche technique →PIC32MX764F128LT-I/BG
✅ Remplacement direct✓ En stock
$5.42 / unité
Voir la fiche technique →PIC32MX764F128L-I/BG
✅ Remplacement direct✓ En stock
$6.8 / unité
Voir la fiche technique →PIC32MX575F512LT-80I/BG
✅ Remplacement direct✓ En stock
$6.25 / unité
Voir la fiche technique →PIC32MX775F256LT-80V/BG Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K (32-bit RISC, 5-stage pipeline) |
| Maximum Operating Frequency | 80 MHz |
| Performance | 105 DMIPS |
| Flash Program Memory | 256 KB (256K x 8) |
| SRAM Data Memory | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Ethernet | 10/100 Mbit MAC with MII/RMII interface |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | 2x CAN 2.0B modules |
| ADC | 16-channel 10-bit ADC |
| Timers | 5x 16-bit timers/counters |
| Plage de température de fonctionnement | -40C to +105C (industrial, V grade) |
| Boîtier | 121-pin TFBGA (10x10 mm) |
| Package Code | BG (JESD-30 code S-PBGA-B121) |
| Ball Pitch | 0.8 mm |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Instruction Cache | Yes (Flash in-place execution) |
| DMA Channels | Yes (peripheral bus DMA) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX775F256LT-80V/BG
| Broche A1 | VSS — Ground |
| Broche A2 | OSC1/CLKI/RC13 — Crystal oscillator input or external clock |
| Broche A3 | RC14/SOSCO — I/O port / secondary oscillator output |
| Broche A4 | VSS — Ground |
| Broche A5 | PMD0/RE0 — Parallel master data / I/O port |
| Broche A6 | PMD2/RE2 — Parallel master data / I/O port |
| Broche A7 | PMD5/RE5 — Parallel master data / I/O port |
| Broche A8 | PMD7/RE7 — Parallel master data / I/O port |
| Broche A9 | PMA0/RF0 — Parallel master address / I/O port |
| Broche A10 | PMA2/RF2 — Parallel master address / I/O port |
| Broche A11 | PMA5/RF5 — Parallel master address / I/O port |
| Broche B1 | VDD — Power supply (2.3 V to 3.6 V) |
| Broche B2 | OSC2/CLKO/RC15 — Crystal oscillator output or system clock out |
| Broche B3 | VDD — Power supply |
| Broche B4 | SOSCI/CN1/RC13 — Secondary oscillator / change notification |
| Broche B5 | PMD1/RE1 — Parallel master data / I/O port |
| Broche B6 | PMD3/RE3 — Parallel master data / I/O port |
| Broche B7 | PMD6/RE6 — Parallel master data / I/O port |
| Broche B8 | PMA10/RF10 — Parallel master address / I/O port |
| Broche B9 | PMA1/RF1 — Parallel master address / I/O port |
| Broche B10 | PMA3/RF3 — Parallel master address / I/O port |
| Broche B11 | PMA8/RF8 — Parallel master address / I/O port |
| Broche C1 | AVDD — Analog power supply |
| Broche C2 | CVREF-/AN1/C1IN-/RA1 — Comparator reference / analog input |
| Broche C3 | VREF+/AN3/C1IN+/RA3 — Voltage reference + / analog input |
| Broche C4 | AN5/RB5 — Analog input / I/O port |
| Broche C5 | AN8/RB8 — Analog input / I/O port |
| Broche C6 | AN12/RB12 — Analog input / I/O port |
| Broche C7 | AN15/RB15 — Analog input / I/O port |
| Broche C8 | PMA11/RG0 — Parallel master address / I/O port |
| Broche C9 | PMA6/RF6 — Parallel master address / I/O port |
| Broche C10 | PMA4/RF4 — Parallel master address / I/O port |
| Broche C11 | PMA9/RF9 — Parallel master address / I/O port |
| Broche D1 | AVSS — Analog ground |
| Broche D2 | CVREF+/AN0/C1IN+/RA0 — Comparator reference + / analog input |
| Broche D3 | AN2/C2IN-/RA2 — Analog input / comparator input |
| Broche D4 | AN4/C1OUT/RB4 — Analog input / comparator output |
| Broche D5 | AN7/RB7 — Analog input / I/O port |
| Broche D6 | AN11/RB11 — Analog input / I/O port |
| Broche D7 | AN14/RB14 — Analog input / I/O port |
| Broche D8 | PMA12/RG1 — Parallel master address / I/O port |
| Broche D9 | PMA13/SDA2/RG2 — Parallel master address / I2C SDA |
| Broche D10 | PMA7/RF7 — Parallel master address / I/O port |
| Broche D11 | PMCS1/RG12 — Parallel master chip select |
| Broche E1 | TCK/RA8 — JTAG test clock / I/O port |
| Broche E2 | CVREF/AN6/RB6 — Comparator voltage reference / analog input |
| Broche E3 | AVSS — Analog ground |
| Broche E4 | AN9/RB9 — Analog input / I/O port |
| Broche E5 | AN10/RB10 — Analog input / I/O port |
| Broche E6 | AN13/RB13 — Analog input / I/O port |
| Broche E7 | PMA14/SCL2/RG3 — Parallel master address / I2C SCL |
| Broche E8 | PMA15/CVREF2/RG4 — Parallel master address / comparator reference |
| Broche E9 | TRCLK/RG6 — Trace clock / I/O port |
| Broche E10 | TRD0/RG7 — Trace data 0 / I/O port |
| Broche E11 | TRD1/RG8 — Trace data 1 / I/O port |
| Broche F1 | TDI/RA9 — JTAG test data in / I/O port |
| Broche F2 | TDO/RA10 — JTAG test data out / I/O port |
| Broche F3 | TMS/RA0 — JTAG test mode select / I/O port (shared) |
| Broche F4 | TRST/RA4 — JTAG test reset / I/O port |
| Broche F5 | INT0/RE8 — External interrupt 0 / I/O port |
| Broche F6 | PMD8/RG9 — Parallel master data / I/O port |
| Broche F7 | PMD9/RG10 — Parallel master data / I/O port |
| Broche F8 | PMD10/RG11 — Parallel master data / I/O port |
| Broche F9 | PMD11/RG13 — Parallel master data / I/O port |
| Broche F10 | PMD12/RG14 — Parallel master data / I/O port |
| Broche F11 | PMD13/RG15 — Parallel master data / I/O port |
| Broche G1 | RTCC/RC1 — Real-time clock calendar / I/O port |
| Broche G2 | U1TX/RC4 — UART1 transmit / I/O port |
| Broche G3 | U1RX/RC5 — UART1 receive / I/O port |
| Broche G4 | U2TX/RC6 — UART2 transmit / I/O port |
| Broche G5 | U2RX/RC7 — UART2 receive / I/O port |
| Broche G6 | PMD14/RH0 — Parallel master data / I/O port |
| Broche G7 | PMD15/RH1 — Parallel master data / I/O port |
| Broche G8 | PMWR/RH2 — Parallel master write / I/O port |
| Broche G9 | PMRD/RH3 — Parallel master read / I/O port |
| Broche G10 | SDA1/RC9 — I2C1 SDA / I/O port |
| Broche G11 | SCL1/RC10 — I2C1 SCL / I/O port |
| Broche H1 | C1RX/RC2 — CAN1 RX / I/O port |
| Broche H2 | C1TX/RC3 — CAN1 TX / I/O port |
| Broche H3 | C2RX/RC8 — CAN2 RX / I/O port |
| Broche H4 | C2TX/RC11 — CAN2 TX / I/O port |
| Broche H5 | PMCS2/RH4 — Parallel master chip select 2 / I/O port |
| Broche H6 | PMCS1/RH5 — Parallel master chip select 1 (alt) / I/O port |
| Broche H7 | PMALH/RH6 — Parallel master address latch high |
| Broche H8 | PMALL/RH7 — Parallel master address latch low |
| Broche H9 | OC1/RD0 — Output compare 1 / I/O port |
| Broche H10 | OC2/RD1 — Output compare 2 / I/O port |
| Broche H11 | OC3/RD2 — Output compare 3 / I/O port |
| Broche J1 | ERXD1/AERXD1/RJ8 — Ethernet RX data 1 / I/O port |
| Broche J2 | ERXD0/AERXD0/RJ9 — Ethernet RX data 0 / I/O port |
| Broche J3 | ETXD1/RJ11 — Ethernet TX data 1 / I/O port |
| Broche J4 | ETXD0/RJ12 — Ethernet TX data 0 / I/O port |
| Broche J5 | ERXERR/RJ10 — Ethernet RX error / I/O port |
| Broche J6 | ETXEN/RJ13 — Ethernet TX enable / I/O port |
| Broche J7 | EMDC/RJ14 — Ethernet management data clock |
| Broche J8 | EMDIO/RJ15 — Ethernet management data I/O |
| Broche J9 | OC4/RD3 — Output compare 4 / I/O port |
| Broche J10 | IC1/RD8 — Input capture 1 / I/O port |
| Broche J11 | IC2/RD9 — Input capture 2 / I/O port |
| Broche K1 | AERXDV/RH8 — Alternate Ethernet RX data valid / I/O port |
| Broche K2 | AECRS/RH9 — Alternate Ethernet carrier sense / I/O port |
| Broche K3 | REFCLK/RH10 — Ethernet reference clock / I/O port |
| Broche K4 | AECOL/RH11 — Alternate Ethernet collision / I/O port |
| Broche K5 | AETXDV/RH12 — Alternate Ethernet TX data valid / I/O port |
| Broche K6 | AETXERR/RH13 — Alternate Ethernet TX error / I/O port |
| Broche K7 | IC3/RD10 — Input capture 3 / I/O port |
| Broche K8 | IC4/RD11 — Input capture 4 / I/O port |
| Broche K9 | IC5/RD12 — Input capture 5 / I/O port |
| Broche K10 | OC5/RD13 — Output compare 5 / I/O port |
| Broche K11 | VBUS — USB VBUS detect (USB-OTG) |
| Broche L1 | D+/RG3 (alt) — USB D+ data line / I/O port (shared) |
| Broche L2 | D-/RG2 (alt) — USB D- data line / I/O port (shared) |
| Broche L3 | VUSB3V3 — USB 3.3 V supply |
| Broche L4 | VDD — Power supply |
| Broche L5 | VSS — Ground |
| Broche L6 | VDD — Power supply |
| Broche L7 | VSS — Ground |
| Broche L8 | RD4 — I/O port |
| Broche L9 | RD5 — I/O port |
| Broche L10 | RD6 — I/O port |
| Broche L11 | RD7 — I/O port |
Applications typiques
PIC32MX775F256LT-80V/BG convient pour 6 applications: Industrial Ethernet Gateway, USB-OTG Device/Host Controller, CAN-based Automotive Body Controller, Point-of-Sale (POS) Terminal, Connected Medical Device, Industrial Protocol Bridge (CAN-USB-Ethernet).
Industrial Ethernet Gateway
The PIC32MX775F256LT-80V/BG is well suited for industrial Ethernet gateways because its integrated 10/100 Mbit MAC with MII/RMII interfaces allows direct connection to a PHY (such as Microchip KSZ8041) without an external MAC bridge. The 80 MHz MIPS32 M4K core delivers 105 DMIPS, sufficient to run an embedded TCP/IP stack (e.g., Microchip Harmony TCP/IP) while maintaining wire-speed packet forwarding. The 256 KB Flash holds the full TCP/IP + application stack, and 64 KB SRAM buffers Ethernet frames during peak load. The dual CAN modules allow the gateway to bridge industrial CANopen or DeviceNet segments to an Ethernet SCADA network. Operating voltage of 2.3 V to 3.6 V supports 3.3 V industrial rails, and the -40C to +105C industrial grade handles factory-floor environments.
Recommandé
USB-OTG Device/Host Controller
The PIC32MX775F256LT-80V/BG is ideal for USB-OTG device/host controllers because it integrates a USB 2.0 Full-Speed OTG controller with on-chip transceiver, eliminating the need for an external PHY. At 80 MHz, the M4K core runs the USB stack plus composite-device class drivers (CDC, HID, MSD) with DMA on the peripheral bus minimizing interrupt overhead. The 256 KB Flash accommodates dual-role USB stacks and vendor class firmware, while 64 KB SRAM handles USB endpoint buffers and protocol state. USB-OTG Session Request Protocol (SRP) and Host Negotiation Protocol (HNP) are supported in hardware, enabling portable USB devices that can act as either host or peripheral. Industrial temperature grade -40C to +105C allows use in factory diagnostic tools and outdoor instrumentation.
Recommandé
CAN-based Automotive Body Controller
The PIC32MX775F256LT-80V/BG fits CAN-based automotive body controllers because it integrates two independent CAN 2.0B controllers with hardware acceptance filters, supporting body-electronics networks (window, mirror, lighting, HVAC actuators) that often require multiple CAN channels. The 80 MHz core provides the processing headroom for CANopen, J1939, or OBD-II stack parsing at full bus load (1 Mbit/s). The 256 KB Flash and 64 KB SRAM are sized for typical body-controller firmware plus a CAN bootloader for field updates. The 121-ball TFBGA package, while not automotive-Q100 qualified, is acceptable for non-safety automotive body ECUs in non-AEC-Q100 applications; for safety-critical ECUs, choose a Q100-qualified variant. Operating voltage 2.3 V to 3.6 V tolerates automotive cranking transients when paired with a proper voltage regulator.
Recommandé
Point-of-Sale (POS) Terminal
The PIC32MX775F256LT-80V/BG suits point-of-sale terminals because its triple connectivity (Ethernet + USB + dual CAN) allows a single chip to drive a 10/100 LAN uplink, USB barcode scanner/PIN pad/thermal printer peripherals, and CAN-based fiscal cash-drawer or scale interfaces. The 80 MHz MIPS32 M4K core delivers sufficient processing for transaction processing, encryption helpers, and display refresh, while the 256 KB Flash holds the secure payment firmware and TLS library. The 64 KB SRAM supports transaction buffer storage and TLS session state. Operating voltage 2.3 V to 3.6 V and industrial temperature range -40C to +105C cover retail environments. The 121-ball TFBGA package (10x10 mm) keeps the BOM small for compact countertop terminals.
Recommandé
Connected Medical Device
The PIC32MX775F256LT-80V/BG is a strong fit for connected medical devices such as patient monitors, infusion pumps, and diagnostic instruments that require Ethernet for EMR connectivity, USB for service/charging ports, and CAN for internal sensor networks. The 80 MHz MIPS32 M4K core delivers 105 DMIPS, supporting real-time signal processing for vital-sign algorithms and TCP/IP TLS connections for HIPAA-compliant data upload. The 256 KB Flash and 64 KB SRAM hold a real-time OS kernel, drivers, and application firmware. The industrial temperature range -40C to +105C supports clinical environments including operating rooms and cold-storage supply areas. The integrated 10-bit ADC with 16 channels handles direct sensor interfaces (temperature, pressure, SpO2 analog front-ends) without an external ADC.
Recommandé
Industrial Protocol Bridge (CAN-USB-Ethernet)
The PIC32MX775F256LT-80V/BG is purpose-built for industrial protocol-bridge nodes that translate between CAN fieldbus, USB service ports, and Ethernet plant networks. The two CAN controllers accept incoming CAN 2.0B frames, the 80 MHz core parses and reformats them, and either the Ethernet MAC streams them as Modbus-TCP packets or the USB-OTG port exposes them to a service technician's laptop. The 256 KB Flash holds the protocol-conversion firmware plus web-based management UI; 64 KB SRAM handles concurrent CAN, USB, and Ethernet packet buffers. The wide operating voltage 2.3 V to 3.6 V and -40C to +105C industrial temperature range cover factory cabinet environments. The integrated 10-bit ADC supports bridge diagnostics (rail voltage, board temperature) without extra silicon.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX775F256LT-80V/BG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX775F256L-80V/BG | PIC32MX775F256LT-80I/BG | PIC32MX764F128LT-I/BG | PIC32MX575F512LT-80I/BG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 512 KB (+100%) |
| SRAM | 64 KB | 64 KB | 64 KB | 32 KB (-50%) | 64 KB |
| Max CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Ethernet | 10/100 Mbit MAC | 10/100 Mbit MAC | 10/100 Mbit MAC | 10/100 Mbit MAC | None |
| CAN Modules | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 0 (none) | 0 (none) |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| Operating Temperature | -40C to +105C (V) | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Triple-connectivity on a single chip (vs PIC32MX575F512LT-80I/BG)
- Industrial temperature grade V (-40C to +105C) (vs PIC32MX775F256LT-80I/BG)
- 105 DMIPS performance at 80 MHz (vs PIC32MX764F128LT-I/BG)
- Dual independent CAN 2.0B modules (vs PIC32MX764F128LT-I/BG)
Notes de conception
The 121-ball TFBGA package has 0.8 mm ball pitch, which requires via-in-pad PCB fabrication to route inner balls out without dog-bone traces. Use a 4-layer minimum stackup with a dedicated ground plane directly under the BGA to control impedance for the 50 MHz RMII Ethernet signals. Decoupling: place 100 nF X7R 0402 capacitors on every VDD ball pair (B1/B2 and adjacent), plus a 4.7 uF bulk cap within 5 mm of the package. Route USB D+/D- as a 90 ohm differential pair with length matching within 150 mil, and route Ethernet MII/RMII pairs with 50 ohm single-ended impedance.
Estimate: at 80 MHz with full Ethernet+USB+CAN activity, the core draws approximately 70 mA from VDD at 3.3 V, yielding ~230 mW of digital power dissipation. The MCU also draws ~25 mA from AVDD for the ADC and PHY biasing. Total supply current is ~95 mA. Use a low-noise LDO (e.g., MCP1700) for the analog AVDD rail to avoid coupling switching noise into ADC measurements; the digital VDD can use a switching regulator for efficiency. Add a 10 uF + 100 nF decoupling pair at every supply ball grouping.
The 121-ball TFBGA has a thermal resistance of approximately 32 C/W (theta_JA) on a 4-layer JEDEC test board. At the estimated 230 mW worst-case dissipation, the junction rises ~7C above ambient - well within the -40C to +105C industrial temperature range. No external heatsink is required for normal operation. For designs with the chip located near other heat sources (e.g., power regulators), provide adequate copper pours on top and inner layers tied to ground for additional heat spreading.
Do not leave the JTAG/TRACE pins floating - tie TRST low through a 10 kohm resistor to ground for normal operation, or to VDD only when JTAG is in use. The two CAN modules share clocking infrastructure - if you use only one CAN, tie the unused TX pin to ground via 10 kohm and leave RX unconnected per Microchip errata. For USB-OTG operation, the VBUS ball must be connected through a voltage divider (100k/20k) to sense USB host voltage; do not tie directly to VDD.
The 10/100 Ethernet MAC requires an external PHY (e.g., KSZ8041 for MII/RMII). For 100 Mbit operation, the REFCLK signal is 50 MHz and must be routed with controlled impedance; place a 33 ohm series termination resistor at the MAC TX pins if trace length exceeds 25 mm. The CAN bus signals (C1TX, C1RX) should be routed as a differential pair with 120 ohm characteristic impedance, with the bus termination resistor (120 ohm) placed only at the physical ends of the bus, not at intermediate nodes.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - the PIC32MX family is positioned for industrial, not automotive safety-critical ECUs. For AEC-Q100 variants, refer to the dsPIC33 or PIC32MX automotive product lines.
