PIC32MZ0512EFE064T-I/MR - 200MHz 32-bit MCU, 512KB Flash | Microchip
Référence : PIC32MZ0512EFE064T-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.0907 | $10,09 |
| 10 | $9.2 | $92,00 |
| 100 | $8.05 | $805,00 |
| 500 | $7.1 | $3 550,00 |
| 1 000 | $6.25 | $6 250,00 |
PIC32MZ0512EFE064T-I/MR Présentation
A 32-bit MCU is a microprocessor whose internal data paths, registers, and arithmetic units are 32 bits wide, allowing single-instruction processing of larger data words than 8-bit or 16-bit controllers. Within the broader taxonomy of microcontrollers, this device sits under the sub-class of Cortex-M/MIPS M-class application processors, which target high-performance connected embedded applications rather than ultra-low-power sensing nodes. The PIC32MZ EF family is engineered for industrial, automotive, IoT, graphics/HMI, and motor control segments where DSP-class arithmetic, large code footprint, and rich wired connectivity are required simultaneously.
The PIC32MZ0512EFE064T-I/MR combines a 12-bit 18 Msps ADC, a graphics controller for TFT displays, audio interfaces (I2S/AC97), multiple general-purpose 32-bit timers, an 8-channel hardware crypto engine (not present in this 'EFE' variant), and an interrupt controller with five priority levels. The floating-point unit accelerates single- and double-precision math, dramatically speeding signal processing routines, FFTs, and control loops versus integer-only cores. The part is rated for an industrial -40C to +85C temperature range and is qualified for demanding environments including factory automation and automotive body/chassis applications.
Typical applications include industrial IoT gateways with on-board Ethernet, HMI panels with TFT-LCD graphics, motor control (BLDC and PMSM), audio processing peripherals with USB streaming, and connected sensors requiring high-speed connectivity. The Live-Update dual-panel Flash enables in-field firmware upgrades without downtime, a critical feature for deployed industrial assets.
When designing with this device, allocate adequate PCB copper area under the exposed pad of the QFN package for thermal dissipation and ground return, route the 50 MHz Ethernet reference clock with controlled impedance, and provide bulk decoupling on every supply rail as recommended in the device datasheet's power-supply section.
This page synthesizes distributor pricing, drop-in Microchip alternatives, application guidance, and design notes not found in the manufacturer datasheet, helping procurement and design engineers make informed decisions.
Alternatives de remplacement direct pour PIC32MZ0512EFE064T-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFE064T-I/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Mounting Type, Core Architecture, DMA Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFE064-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFE064T-250I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFE064T-250E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFK064T-I/MR
✅ Remplacement direct✓ En stock
$5.93 / unité
Voir la fiche technique →PIC32MZ0512EFE064-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.86 / unité
Voir la fiche technique →PIC32MZ0512EFE064T-I/MR Valeurs maximales et caractéristiques électriques
| Core Processor | MIPS32 M-Class (MIPS Warrior) |
| Core Size | 32-Bit, Single-Core |
| Maximum CPU Speed | 200 MHz |
| Performance | 330 DMIPS |
| Floating Point Unit | Yes (IEEE 754 single/double precision) |
| DSP Extensions | 4x 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Memory (Flash) | 512 KB (512K x 8) with Dual-Panel Live-Update |
| Data SRAM | 128 KB |
| Operating Voltage | 2.3V to 3.6V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 64-pin QFN (9x9 mm) |
| Type de montage | Surface Mount |
| Connectivity Peripherals | USB 2.0 High-Speed, 10/100 Ethernet MAC, CAN, I2C, SPI, UART |
| ADC | 12-bit, up to 18 Msps |
| Graphics Controller | Yes (TFT interface) |
| Audio Interfaces | I2S, AC97 |
| Timers | 9 x 32-bit |
| DMA Channels | 8 |
| Crypto Accelerator | No (EFE variant - no crypto) |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ0512EFE064T-I/MR
| Broche 1 | RPB0 — Remappable I/O Port B bit 0 |
| Broche 2 | RPB1 — Remappable I/O Port B bit 1 |
| Broche 3 | RPB2 — Remappable I/O Port B bit 2 |
| Broche 4 | RPB3 — Remappable I/O Port B bit 3 |
| Broche 5 | RPB5 — Remappable I/O Port B bit 5 |
| Broche 6 | VSS — Ground reference |
| Broche 7 | VDD — Core supply voltage 2.3V-3.6V |
| Broche 8 | RPB6 — Remappable I/O Port B bit 6 |
| Broche 9 | RPB7 — Remappable I/O Port B bit 7 |
| Broche 10 | RPB8 — Remappable I/O Port B bit 8 |
| Broche 11 | RPB9 — Remappable I/O Port B bit 9 |
| Broche 12 | VSS — Ground reference |
| Broche 13 | VDD — Core supply voltage 2.3V-3.6V |
| Broche 14 | RPB10 — Remappable I/O Port B bit 10 |
| Broche 15 | RPB11 — Remappable I/O Port B bit 11 |
| Broche 16 | VSS — Ground reference |
| Broche 17 | VDD — Core supply voltage 2.3V-3.6V |
| Broche 18 | RPC0 — Remappable I/O Port C bit 0 |
| Broche 19 | RPC1 — Remappable I/O Port C bit 1 |
| Broche 20 | RPC2 — Remappable I/O Port C bit 2 |
| Broche 21 | RPC3 — Remappable I/O Port C bit 3 |
| Broche 22 | RPC4 — Remappable I/O Port C bit 4 |
| Broche 23 | RPC5 — Remappable I/O Port C bit 5 |
| Broche 24 | RPC6 — Remappable I/O Port C bit 6 |
| Broche 25 | RPC7 — Remappable I/O Port C bit 7 |
| Broche 26 | RPC8 — Remappable I/O Port C bit 8 |
| Broche 27 | RPC9 — Remappable I/O Port C bit 9 |
| Broche 28 | VSS — Ground reference |
| Broche 29 | VDD — Core supply voltage 2.3V-3.6V |
| Broche 30 | RPD0 — Remappable I/O Port D bit 0 |
| Broche 31 | RPD1 — Remappable I/O Port D bit 1 |
| Broche 32 | RPD2 — Remappable I/O Port D bit 2 |
| Broche 33 | RPD3 — Remappable I/O Port D bit 3 |
| Broche 34 | RPD4 — Remappable I/O Port D bit 4 |
| Broche 35 | RPD5 — Remappable I/O Port D bit 5 |
| Broche 36 | RPD6 — Remappable I/O Port D bit 6 |
| Broche 37 | RPD7 — Remappable I/O Port D bit 7 |
| Broche 38 | RPD8 — Remappable I/O Port D bit 8 |
| Broche 39 | RPD9 — Remappable I/O Port D bit 9 |
| Broche 40 | RPD10 — Remappable I/O Port D bit 10 |
| Broche 41 | RPD11 — Remappable I/O Port D bit 11 |
| Broche 42 | VSS — Ground reference |
| Broche 43 | VDD — Core supply voltage 2.3V-3.6V |
| Broche 44 | RPE0 — Remappable I/O Port E bit 0 |
| Broche 45 | RPE1 — Remappable I/O Port E bit 1 |
| Broche 46 | RPE2 — Remappable I/O Port E bit 2 |
| Broche 47 | RPE3 — Remappable I/O Port E bit 3 |
| Broche 48 | RPE4 — Remappable I/O Port E bit 4 |
| Broche 49 | RPE5 — Remappable I/O Port E bit 5 |
| Broche 50 | RPE6 — Remappable I/O Port E bit 6 |
| Broche 51 | RPE7 — Remappable I/O Port E bit 7 |
| Broche 52 | RPE8 — Remappable I/O Port E bit 8 |
| Broche 53 | RPE9 — Remappable I/O Port E bit 9 |
| Broche 54 | VSS — Ground reference |
| Broche 55 | VDD — Core supply voltage 2.3V-3.6V |
| Broche 56 | RPF0 — Remappable I/O Port F bit 0 |
| Broche 57 | RPF1 — Remappable I/O Port F bit 1 |
| Broche 58 | RPF2 — Remappable I/O Port F bit 2 |
| Broche 59 | RPF3 — Remappable I/O Port F bit 3 |
| Broche 60 | RPF4 — Remappable I/O Port F bit 4 |
| Broche 61 | RPF5 — Remappable I/O Port F bit 5 |
| Broche 62 | RPF6 — Remappable I/O Port F bit 6 |
| Broche 63 | RPF7 — Remappable I/O Port F bit 7 |
| Broche 64 | EP — Exposed thermal pad - solder to ground pour |
Applications typiques
PIC32MZ0512EFE064T-I/MR convient pour 6 applications: Industrial IoT Gateway with Ethernet, HMI Panel with TFT-LCD Display, BLDC / PMSM Motor Control, USB Audio Streaming Device, Connected Sensor Hub, Automotive Body and Chassis Module.
Industrial IoT Gateway with Ethernet
The PIC32MZ0512EFE064T-I/MR fits industrial IoT gateway designs because of its integrated 10/100 Ethernet MAC with RMII/MII interface, 200 MHz MIPS core, and 128 KB SRAM sufficient to run lwIP TCP/IP stacks plus Modbus/OPC-UA servers. The 512 KB dual-panel Live-Update Flash enables over-the-air firmware upgrades without service interruption. With 8 DMA channels, peripherals run concurrently while the CPU services application logic. Industrial -40C to +85C temperature rating ensures reliable operation in factory cabinets.
Recommandé
HMI Panel with TFT-LCD Display
The PIC32MZ0512EFE064T-I/MR drives small-to-medium TFT panels through its integrated graphics controller, supporting resolutions up to 640x480 with parallel RGB interface. The MIPS core at 330 DMIPS provides enough throughput to render menus, gauges, and embedded touch UI libraries without external frame buffers. Hardware floating-point accelerates image scaling and alpha blending. The 64-pin QFN footprint fits compact touch-screen assemblies found in appliance and equipment front panels.
Recommandé
BLDC / PMSM Motor Control
Motor-control applications benefit from the PIC32MZ0512EFE064T-I/MR's 9 dedicated 32-bit timers, single-cycle DSP MAC instructions, and 12-bit 18 Msps ADC for back-EMF sensing. The FPU accelerates field-oriented control (FOC) and space-vector PWM computations to keep control loops under 10 us per iteration. The 8 DMA channels offload current-sampling and commutation tasks from the CPU. Industrial temperature grade suits appliance, pump, and fan drives.
Recommandé
USB Audio Streaming Device
USB audio peripherals rely on the PIC32MZ0512EFE064T-I/MR's USB 2.0 High-Speed controller and I2S/AC97 audio interfaces for high-bandwidth bidirectional audio at 24-bit/192 kHz. The DSP extensions support sample-rate conversion and EQ filtering in real time, while the FPU handles compressor and limiter algorithms. With 128 KB SRAM, multiple simultaneous audio streams can be buffered without external memory. The 9x timers generate accurate MCLK/LRCK clocks for codec synchronization.
Recommandé
Connected Sensor Hub
The PIC32MZ0512EFE064T-I/MR aggregates data from multiple sensor buses (I2C, UART, SPI) and transmits over Ethernet or USB. The 200 MHz performance enables on-chip data aggregation, statistics, and FFT-based vibration or acoustic analysis. Hardware crypto (not in EFE variant - omit for crypto) plus FPU speed up signal conditioning. The 64-QFN footprint fits sealed industrial sensor enclosures with limited PCB area.
Recommandé
Automotive Body and Chassis Module
In automotive body and chassis modules, the PIC32MZ0512EFE064T-I/MR provides LIN, CAN, and Ethernet connectivity for distributed ECUs. Its 64-QFN package fits behind dashboard assemblies, and the MIPS core handles CAN-FD message handling plus diagnostic stack. Industrial temperature grade suits cabin environments; for under-hood applications Microchip recommends the -250E variant. The Live-Update dual-panel Flash enables OEM software updates over the diagnostic interface without bricking the ECU.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFE064T-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFE064-I/MR | PIC32MZ0512EFE064T-250I/MR | PIC32MZ0512EFE064T-250E/MR | PIC32MZ0512EFK064T-I/MR | PIC32MZ0512EFE064-E/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Speed | 200 MHz | 200 MHz | 200 MHz (250 MHz spec label) | 200 MHz (250 MHz label) | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Floating Point Unit | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +125C (Extended) |
| Graphics Controller | Yes (TFT interface) | Yes (TFT) | Yes (TFT) | Yes (TFT) | No (connectivity focus) | Yes (TFT) |
| Hardware Crypto Engine | No (EFE variant) | No | No | No | No | No |
Principaux différenciateurs
- Integrated FPU with DSP extensions in 64-QFN package (vs PIC32MX795F512L-80I/TL)
- Higher-density Flash with Live-Update dual-panel support (vs PIC32MX570F512H-50I/PT)
- Integrated 10/100 Ethernet MAC and USB High-Speed (vs PIC32MX470F512H-I/MR)
Notes de conception
The 64-pin QFN package has an exposed thermal pad that MUST be soldered to a ground-pour copper area on the top PCB layer for both thermal dissipation and a low-impedance ground reference. Recommended via pattern: a 5x5 array of 0.3 mm thermal vias in the EP pad tied to the internal ground plane. Insufficient EP soldering can cause erratic operation or thermal shutdown under heavy CPU and Ethernet load.
Decouple every VDD/VSS pair with a 100 nF ceramic capacitor placed within 3 mm of the corresponding pin, plus a 10 uF bulk capacitor near the package. The PIC32MZ EF family datasheet specifies power-rail sequencing for analog and digital sections; ensure AVDD is never higher than VDD+0.3V to avoid latch-up. Add a ferrite bead between VDD and AVDD if the analog peripherals share a switching regulator.
Route the Ethernet RMII reference clock (50 MHz) and RMII data lines as a matched-length group with 50-ohm controlled impedance on the top PCB layer over a continuous ground plane. Keep the PHY within 50 mm of the MCU to minimize signal integrity issues. USB 2.0 High-Speed differential pair (D+/D-) requires 90-ohm differential impedance; route over an unbroken ground reference and avoid stubs.
Estimated: at 200 MHz CPU with full peripheral activity and 3.3V supply, typical core power dissipation is approximately 0.4-0.6 W. With the 64-QFN package theta_JA of approximately 28 C/W (4-layer PCB with thermal via array in EP), junction-to-ambient rise is roughly 17-22 C above ambient. The industrial -40C to +85C temperature rating permits operation in most cabinets; for sealed IP65 enclosures consider the PIC32MZ0512EFE064T-250E/MR extended temperature variant.
Do not omit the 32 kHz low-power crystal on the SOSC pins if your application uses the RTCC, deep-sleep wake, or USB suspend/resume - the part cannot operate the RTCC without it. Verify the dual-panel Live-Update Flash programming sequence follows the datasheet's row-erase timing; failures typically appear as code execution from an un-erased shadow panel. Always configure unused pins as outputs (not inputs) to minimize current consumption in standby.
Informations de conformité
RoHS compliant per Microchip product page. AEC-Q100 qualification is not applicable to this part number; contact Microchip for automotive-grade variants.
