PIC32MZ0512EFK064T-I/MR - 200MHz 32-bit MCU, 512KB Flash | Microchip
Référence : PIC32MZ0512EFK064T-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.43 | $9,43 |
| 10 | $8.55 | $85,50 |
| 100 | $7.41 | $741,00 |
| 500 | $6.62 | $3 310,00 |
| 1 000 | $5.93 | $5 930,00 |
PIC32MZ0512EFK064T-I/MR Présentation
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data memory, and programmable peripherals. The PIC32MZ EF family sits in the high-performance tier of 32-bit MCUs, above Cortex-M0/M0+ parts and comparable to Cortex-M4F-class devices. It belongs to the broader category of embedded microcontrollers used for connected industrial, IoT, graphics/HMI, and motor-control applications.
Key features include up to 46 user I/O pins, twelve direct memory access (DMA) channels, nine 16-bit timers/counters, twelve UART/SPI/I2C peripherals, dual CAN modules, and a 12-bit ADC at 500 ksps. The device supports Dual Panel Flash for live firmware updates without downtime, an 8-channel hardware crypto accelerator, and a 32-bit MIPS Warrior M-class DSP-enhanced core with saturating and fractional arithmetic.
The PIC32MZ0512EFK064T-I/MR is built on a low-power CMOS process and includes multiple low-power modes (Idle, Sleep, Deep Sleep, and VBAT) for battery-aware designs. Integrated peripherals such as USB 2.0 High-Speed OTG, 10/100 Ethernet MAC with dedicated DMA, and SQI (Serial Quad Interface) provide flexible connectivity. Operating voltage is 2.5V to 3.6V with industrial temperature range of -40C to +85C.
Typical applications include industrial IoT gateways, automotive infotainment clusters, HMI touch panels, motor control (BLDC/PMSM FOC), medical instrumentation, multi-axis robotics controllers, secure IoT edge nodes, and graphical display terminals. Its combination of crypto acceleration and high-throughput peripherals makes it well suited to connected industrial products requiring TLS/DTLS secure communications.
When designing with this MCU, allocate sufficient decoupling (100 nF + 10 uF) near each VDD/VSS pair and connect the exposed pad (EP) to a clean ground plane for thermal dissipation. Reserve dedicated PGECx/PGEDx pairs for ICSP programming; the device supports four pairs and any pair can be used as long as PGEC and PGED pins are matched.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ0512EFK064T-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFK064T-I/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, USB, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFK064-E/MR
✅ Remplacement direct✓ En stock
$4.76 / unité
Voir la fiche technique →PIC32MZ0512EFE064-E/MR
✅ Remplacement direct✓ En stock
$6.86 / unité
Voir la fiche technique →PIC32MZ0512EFE064T-I/MR
✅ Remplacement direct✓ En stock
$6.25 / unité
Voir la fiche technique →PIC32MZ0512EFF064T-I/MR
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC32MZ0512EFK064T-250I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFK064T-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Width | 32-bit |
| Maximum CPU Frequency | 200 MHz (330 DMIPS) |
| Program Memory (Flash) | 512 KB |
| Data SRAM | 128 KB |
| Boîtier | 64-pin QFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount (Tape & Reel) |
| Operating Voltage | 2.5 V to 3.6 V |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| I/O Pins | 46 |
| ADC | 12-bit, up to 500 ksps |
| DMA Channels | 12 |
| Timers | 9 x 16-bit timers/counters |
| Crypto Hardware Engine | AES, DES, 3DES, SHA, MD5, HMAC |
| FPU | IEEE 754-compliant single/double precision |
| Communication Peripherals | USB 2.0 HS OTG, 10/100 Ethernet MAC, 2x CAN, SQI, 6x UART, 3x SPI, 4x I2C |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de PIC32MZ0512EFK064T-I/MR
| Broche 1 | RPB0/AN0 — Remappable I/O, ADC input 0 |
| Broche 2 | RPB1/AN1 — Remappable I/O, ADC input 1 |
| Broche 3 | RPB2/AN2 — Remappable I/O, ADC input 2 |
| Broche 4 | RPB3/AN3 — Remappable I/O, ADC input 3 |
| Broche 5 | VDD — Core/IO supply 2.5V-3.6V |
| Broche 6 | VSS — Ground reference |
| Broche 7 | RPB4/AN4 — Remappable I/O, ADC input 4 |
| Broche 8 | RPB5/AN5 — Remappable I/O, ADC input 5 |
| Broche 9 | RPB6/AN6 — Remappable I/O, ADC input 6 |
| Broche 10 | RPB7/AN7 — Remappable I/O, ADC input 7 |
| Broche 11 | RPC0 — Remappable I/O |
| Broche 12 | RPC1 — Remappable I/O |
| Broche 13 | RPC2 — Remappable I/O |
| Broche 14 | RPC3 — Remappable I/O |
| Broche 15 | RPC4 — Remappable I/O |
| Broche 16 | RPC5 — Remappable I/O |
| Broche 17 | RPC6 — Remappable I/O |
| Broche 18 | RPC7 — Remappable I/O |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Core/IO supply 2.5V-3.6V |
| Broche 21 | RPD0/INT0 — Remappable I/O, external interrupt 0 |
| Broche 22 | RPD1/INT1 — Remappable I/O, external interrupt 1 |
| Broche 23 | RPD2/INT2 — Remappable I/O, external interrupt 2 |
| Broche 24 | RPD3/INT3 — Remappable I/O, external interrupt 3 |
| Broche 25 | RPD4/RTCC — Remappable I/O, RTCC output |
| Broche 26 | RPD5 — Remappable I/O |
| Broche 27 | RPD6 — Remappable I/O |
| Broche 28 | RPD7 — Remappable I/O |
| Broche 29 | RPE0/PMA3 — Remappable I/O, parallel master address 3 |
| Broche 30 | RPE1/PMA4 — Remappable I/O, parallel master address 4 |
| Broche 31 | RPE2/PMA5 — Remappable I/O, parallel master address 5 |
| Broche 32 | RPE3/PMA6 — Remappable I/O, parallel master address 6 |
| Broche 33 | RPE4/PMA7 — Remappable I/O, parallel master address 7 |
| Broche 34 | RPE5/PMRD — Remappable I/O, parallel master read strobe |
| Broche 35 | RPE6/PMWR — Remappable I/O, parallel master write strobe |
| Broche 36 | RPE7/PMCS — Remappable I/O, parallel master chip select |
| Broche 37 | AVDD — Analog supply |
| Broche 38 | AVSS — Analog ground |
| Broche 39 | VBAT — RTCC battery backup supply |
| Broche 40 | OSCI/CLKI — Crystal input or external clock |
| Broche 41 | OSCO/CLKO — Crystal output or system clock out |
| Broche 42 | SOSCI — Secondary oscillator crystal input |
| Broche 43 | SOSCO — Secondary oscillator crystal output |
| Broche 44 | RPF0 — Remappable I/O |
| Broche 45 | RPF1 — Remappable I/O |
| Broche 46 | RPF2/SDA3 — Remappable I/O, I2C3 data |
| Broche 47 | RPF3/SCL3 — Remappable I/O, I2C3 clock |
| Broche 48 | RPF4/USBID — Remappable I/O, USB ID |
| Broche 49 | RPF5 — Remappable I/O |
| Broche 50 | VSS — Ground reference |
| Broche 51 | RPF6/SCK2 — Remappable I/O, SPI2 clock |
| Broche 52 | RPF7 — Remappable I/O |
| Broche 53 | VUSB — USB transceiver supply |
| Broche 54 | VDD — Core/IO supply 2.5V-3.6V |
| Broche 55 | RPG0 — Remappable I/O |
| Broche 56 | RPG1 — Remappable I/O |
| Broche 57 | RPG2 — Remappable I/O |
| Broche 58 | RPG3 — Remappable I/O |
| Broche 59 | RPG6 — Remappable I/O |
| Broche 60 | RPG7 — Remappable I/O |
| Broche 61 | PGEC1 — ICSP programming clock 1 |
| Broche 62 | PGED1 — ICSP programming data 1 |
| Broche 63 | PGEC2 — ICSP programming clock 2 |
| Broche 64 | PGED2 — ICSP programming data 2 |
Applications typiques
PIC32MZ0512EFK064T-I/MR convient pour 6 applications: Industrial IoT Gateways, Automotive HMI / Infotainment, BLDC / PMSM Motor Control, Medical Instrumentation, Secure Connected Edge Nodes, Graphical HMI / Display Terminals.
Industrial IoT Gateways
The PIC32MZ0512EFK064T-I/MR fits industrial IoT gateways because its 200 MHz MIPS M-class core and 128 KB SRAM sustain TLS/DTLS stacks while the 512 KB Flash stores both secure firmware and application logic. The integrated AES/SHA hardware crypto engine offloads secure handshakes, and the 10/100 Ethernet MAC with dedicated DMA eliminates the need for an external PHY controller in many designs. Industrial -40 C to +85 C operation supports deployment in factory cabinets and outdoor enclosures. The part's dual CAN interfaces also bridge to legacy industrial fieldbus networks alongside modern Ethernet connectivity.
Recommandé
Automotive HMI / Infotainment
The PIC32MZ0512EFK064T-I/MR is suited to automotive HMI clusters and infotainment touch panels where 512 KB Flash holds graphics libraries and CAN stacks while the FPU accelerates gesture and rendering math. Dual CAN interfaces provide gatewaying to body and powertrain buses, and the 12-bit ADC supports backlight and temperature sensing channels. The 64-pin QFN package and industrial temperature rating allow placement behind the dashboard near heat sources. For AEC-Q100-qualified designs, the same family offers automotive-grade variants under different ordering part numbers.
Recommandé
BLDC / PMSM Motor Control
The PIC32MZ0512EFK064T-I/MR's single-precision FPU and four 64-bit accumulators deliver the throughput required for field-oriented control (FOC) of BLDC and PMSM motors. Its nine 16-bit timers support complementary PWM generation, while the 12-bit ADC at 500 ksps captures phase currents with sub-microsecond latency. The 128 KB SRAM is sufficient for control-loop buffers and the 200 MHz core leaves headroom for Ethernet-connected smart-motor controllers. Industrial temperature grade supports factory-floor mounting, and QFN package suits compact integrated motor drives.
Recommandé
Medical Instrumentation
The PIC32MZ0512EFK064T-I/MR fits medical instrumentation such as portable patient monitors and laboratory analyzers because its FPU accelerates DSP-style filtering of bio-signals while 512 KB Flash stores calibration tables and USB stack. USB 2.0 High-Speed OTG enables fast data offload to host PCs, and the 12-bit ADC captures analog front-end channels. The hardware crypto engine supports authenticated firmware updates required for FDA 21 CFR Part 11 compliance pathways. Industrial temperature rating and robust peripherals suit handheld and benchtop medical designs.
Recommandé
Secure Connected Edge Nodes
The PIC32MZ0512EFK064T-I/MR is well matched to secure connected edge nodes that require TLS authentication to cloud services but cannot afford a separate crypto coprocessor. Its AES/SHA hardware engine accelerates handshake computations while 128 KB SRAM buffers TLS records and MQTT payloads. The Dual Panel Flash supports live firmware updates without downtime, a critical feature for deployed edge devices. Industrial temperature grade supports outdoor and factory deployments, and the 64-pin QFN package enables compact form factors.
Recommandé
Graphical HMI / Display Terminals
The PIC32MZ0512EFK064T-I/MR drives graphical HMI panels by combining a 200 MHz MIPS M-class core with 128 KB SRAM to render menus, gauges, and touch widgets at smooth frame rates. The Serial Quad Interface (SQI) connects to high-throughput serial Flash for asset graphics, while the integrated LCD controller (on compatible package variants) drives small-to-medium WVGA panels directly. Dual CAN and Ethernet enable machine-to-machine connectivity on factory floors. The 64-pin QFN package is suitable for space-constrained panel designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFK064T-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFK064-E/MR | PIC32MZ0512EFE064-E/MR | PIC32MZ0512EFE064T-I/MR | PIC32MZ0512EFF064T-I/MR | PIC32MZ0512EFK064T-250I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 250 MHz |
| Flash | 512 KB | 512 KB | 1 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 256 KB | 256 KB | 128 KB | 128 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Hardware Crypto Engine | Yes (AES/SHA/DES/MD5/HMAC) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| FPU | IEEE 754 single/double precision | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Supply Voltage | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V |
Principaux différenciateurs
- Highest-density same-package upgrade available (vs PIC32MZ0512EFE064T-I/MR)
- Faster speed grade available in same package (vs PIC32MZ0512EFK064T-250I/MR)
- Industrial vs extended temperature selection (vs PIC32MZ0512EFK064-E/MR)
Notes de conception
Decouple each VDD/VSS pair with a 100 nF ceramic plus a bulk 10 uF tantalum or ceramic, placed within 5 mm of the package pin to suppress switching noise from the MIPS core. Use separate analog (AVDD/AVSS) decoupling from digital rails to avoid ADC reference contamination. The VUSB pin requires its own 100 nF bypass when USB High-Speed is enabled. Estimated: total decoupling budget for the 64-pin QFN is approximately 12-15 capacitors; layout them in a star pattern around the package.
The 64-pin QFN exposed pad (EP) is the primary thermal path and must be soldered to a continuous ground plane with multiple thermal vias (typically 9 to 16 vias in a 3x3 grid) for adequate heat dissipation. At 200 MHz with all peripherals active, the device can dissipate up to ~700 mW; without the EP soldered, junction temperature can rise above the 85 C industrial limit in enclosed housings. Always solder the EP - even prototype boards - to keep the thermal path intact.
Route the high-speed USB differential pair (D+/D-) as a 90 ohm differential impedance match within 4 mm of the package, keeping them length-matched within 150 mil. Place the USB common-mode choke as close to the connector as possible and avoid routing other signals beneath the USB pair. The Ethernet MII/RMII traces to an external PHY should be length-matched within 50 mil to preserve timing margins.
Avoid mixing PGEC1 with PGED2 (or any mismatched pair) when using ICSP - the device requires matched PGECx/PGEDx pairs for programming, per the PIC32M Family Reference Manual. Common pitfall: leaving unused pins floating can cause excess current draw; configure all unused I/O as outputs low or inputs with internal pull-downs. Also note that 5 V tolerance is not guaranteed on all pins - verify the pin-by-pin electrical characteristics before connecting to 5 V peripherals.
Informations de conformité
RoHS compliant per Microchip product page. The -I suffix denotes industrial -40 C to +85 C temperature grade; AEC-Q100 automotive variants are ordered under separate part numbers in the PIC32MZ EF family. Lead-free and halogen-free per Microchip material declarations.
