Microchip Technology

PIC32MZ0512EFE144-I/PL - 200MHz 32-Bit MCU 512KB Flash | Microchip

Référence : PIC32MZ0512EFE144-I/PL ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
2.5V / 3.3V Vdss 144-LQFP (20x20 mm) Package 200 MHz Speed 512 KB (512K x 8) Memory
À partir de $6.95 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-03
Tarifs dégressifs
Qté Prix unitaire Total
1 $11.42 $11,42
10 $10.28 $102,80
100 $9.13 $913,00
500 $8.04 $4 020,00
1 000 $6.95 $6 950,00
ℹ️ Tous les prix sont en USD

PIC32MZ0512EFE144-I/PL Présentation

The Microchip PIC32MZ0512EFE144-I/PL is a high-performance MIPS32 M-Class 32-bit microcontroller from the PIC32MZ Embedded Connectivity with Floating Point Unit (EF) family, delivering 200 MHz CPU clock and 330 DMIPS performance with integrated FPU and DSP extensions. It features 512 KB Flash and 128 KB SRAM in a 144-pin LQFP (20x20 mm) package, with 3.3V single-supply operation. The device integrates dual-panel flash for live-update support, IEEE 754 compliant FPU, and four 64-bit accumulators with single-cycle MAC and saturating fractional math, enabling high-throughput signal processing.

A 32-bit microcontroller (MCU) is an embedded processor that executes instructions over a 32-bit data path, providing substantially higher arithmetic throughput than 8-bit or 16-bit MCUs while retaining deterministic real-time behaviour. Modern 32-bit MCUs integrate CPU core, flash program memory, SRAM, ADCs, communication peripherals, and timers on a single die. PIC32MZ EF parts belong to the broader RISC microcontroller taxonomy (CPU -> RISC -> 32-bit MCU -> ARM/MIPS variants -> PIC32MZ EF family), and are typically deployed in connected and graphics-rich embedded systems where MIPS-class cores outclass Cortex-M0/M3 in DSP workloads.

Key differentiating features include up to 252 MHz operation (for higher-grade family members), 2 MB live-update Flash option, integrated HS USB, Ethernet MAC, CAN, and advanced analog including 12-bit ADC at 18 MSPS. The EF family specifically targets connectivity, industrial, automotive, IoT, graphics (HMI), and motor control market segments, with hardware crypto absent on this 'No Crypto' variant. Compared to lower-tier PIC32MX parts, EF devices deliver 2-3x the DMIPS and add a true IEEE-754 FPU.

Architecture: MIPS Warrior M-class core with 16KB I-cache, 4KB D-cache, tightly-coupled memory, and a 7-stage pipeline. The peripheral set includes SQI for external serial flash, multiple UART/SPI/I2C, and high-speed connectivity IPs. The 144-LQFP package provides 120+ usable I/O with PPS (Peripheral Pin Select) remapping.

Typical applications include industrial Ethernet gateways, IoT edge nodes with TLS acceleration, multi-axis motor control (FOC), graphics HMI panels, automotive body/comfort modules, and audio DSP. The 'No Crypto' suffix indicates no hardware encryption engine, so secure applications should select the crypto-enabled variant.

When designing with this device, route the two PGECx/PGEDx ICSP pairs to accessible debug headers, provide a 12 MHz primary crystal or use the internal FRC, and ensure 100 nF + 10 µF decoupling close to each VDD/VSS pair. For 252 MHz operation, verify the -E extended-temperature grade and follow the datasheet's high-speed layout guidelines for USB and Ethernet differential pairs.

This page synthesizes distributor pricing, drop-in alternatives within the PIC32MZ EF family, and practical design notes not found in the manufacturer datasheet alone.

Alternatives de remplacement direct pour PIC32MZ0512EFE144-I/PL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec PIC32MZ0512EFE144-I/PL (même facteur de forme et même empreinte) — différant par FPU, Core Architecture, Package, ADC, Crypto Engine.

Microchip Technology
FPU: IEEE 754-compliant single/double precision
Package: 144-pin LQFP (PL), 20x20 mm, 0.5 mm pitch
ADC: 12-bit, up to 18 MSPS
Microchip Technology
Core Architecture: MIPS32 M-Class (PIC32)
Crypto Engine: Not included (No Crypto variant)
Microchip Technology
FPU: IEEE 754 compliant (single/double precision)
Core Architecture: MIPS32 M-Class (Warrior M-class) 32-bit
Package: 144-pin LQFP (20x20 mm, 0.5 mm pitch)
Microchip Technology
Core Architecture: 32-bit RISC with FPU and DSP ASE
Package: 144-pin LQFP (20x20 mm)
ADC: 12-bit, 5 Msps, up to 48 channels
Microchip Technology
FPU: Yes (hardware floating-point unit)
Package: 144-pin TQFP (16x16 mm)
ADC: 12-bit, multi-channel
Microchip Technology
FPU: IEEE 754 single/double precision
Core Architecture: MIPS32 M-Class (MIPS Warrior)
Package: 144-LQFP (PL) 20x20 mm
Microchip Technology
FPU: IEEE 754 hardware floating point unit
Core Architecture: MIPS32 Warrior M-class, 5-stage pipeline
ADC: 12-bit, up to 5 MSPS
Microchip Technology
FPU: IEEE 754 compliant hardware Floating Point Unit
Package: 144-pin LQFP (20x20 mm)
ADC: 12-bit ADC, up to 18 Msps
Microchip Technology
FPU: Yes (hardware)
Core Architecture: MIPS32 M-Class (PIC32)
Package: 144-LQFP (20x20 mm, 0.5 mm pitch)
Microchip Technology
FPU: Yes (single-precision hardware)
Core Architecture: MIPS32 M-Class (32-bit)
ADC: 12-bit, up to 18 Msps

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

PIC32MZ1024EFE144-I/PL

✅ Remplacement direct
Microchip Technology
📦 144-LQFP (20x20)
MIPS32 M-Class (32-bit) · 200 MHz (max) · Yes (single-precision hardware) · Yes · 1 MB (1024 KB) · 256 KB · 2.3 V to 3.6 V · 120 (approx.)

✓ En stock

$8.95 / unité

Voir la fiche technique →

PIC32MZ0512EFE144-E/PL

✅ Remplacement direct
Microchip Technology
📦 144-LQFP (20x20)
MIPS32 M-Class (Warrior M-class) · 200 MHz (max) · 330 DMIPS · IEEE 754-compliant single/double precision · Yes - 4x 64-bit accumulators, single-cycle MAC · 512 KB (Dual Panel Live-Update) · 128 KB · 2.3 V to 3.6 V

✓ En stock

$7.75 / unité

Voir la fiche technique →

PIC32MZ0512EFE144T-I/PL

✅ Remplacement direct
Microchip Technology
📦 144-LQFP (20x20)
MIPS32 M-Class (Warrior M-class) 32-bit · 200 MHz (330 DMIPS) · IEEE 754 compliant (single/double precision) · 4 x 64-bit accumulators, single-cycle MAC, saturating and fractional math · 512 KB (dual-panel live update) · 128 KB · 2.5 V to 3.6 V (3.3 V typical) · -40 C to +85 C (Industrial)

✓ En stock

$6.32 / unité

Voir la fiche technique →
ℹ️ 2 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

PIC32MZ0512EFE144-I/PL Valeurs maximales et caractéristiques électriques

Core Architecture MIPS32 M-Class (Warrior M-class)
CPU Bit Width 32-bit
Maximum CPU Frequency 200 MHz
DMIPS Performance 330 DMIPS
Program Flash 512 KB (512K x 8)
SRAM 128 KB
FPU IEEE 754 compliant
DSP Extensions Single-cycle MAC, 4x 64-bit accumulators, saturating fractional math
Operating Voltage 2.5V / 3.3V
Boîtier 144-LQFP (20x20 mm)
Température de fonctionnement -40C to +85C (Industrial, I suffix)
Type de montage Surface Mount
ICSP Debug Pairs Multiple PGECx/PGEDx pairs
Crypto Engine No (No Crypto variant)
Statut RoHS Compliant
Lead-Free Yes
Niveau MSL 3 (168 hours)
MSCP / Family PIC32MZ EF

Configuration des broches de PIC32MZ0512EFE144-I/PL

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 VSS — Ground
Broche 2 PGED1 — ICSP data channel 1
Broche 3 PGEC1 — ICSP clock channel 1
Broche 4 AN0 — Analog input / GPIO
Broche 5 AN1 — Analog input / GPIO
Broche 6 VDD — Digital supply 3.3V
Broche 7 VSS — Ground
Broche 8 OSC1 — Crystal oscillator input
Broche 9 OSC2 — Crystal oscillator output
Broche 10 VDD — Digital supply 3.3V
Broche 11 VSS — Ground
Broche 12 RP0 — Remappable peripheral I/O 0
Broche 13 RP1 — Remappable peripheral I/O 1
Broche 14 RP2 — Remappable peripheral I/O 2
Broche 15 RP3 — Remappable peripheral I/O 3
Broche 16 RP4 — Remappable peripheral I/O 4
Broche 17 RP5 — Remappable peripheral I/O 5
Broche 18 RP6 — Remappable peripheral I/O 6
Broche 19 RP7 — Remappable peripheral I/O 7
Broche 20 RP8 — Remappable peripheral I/O 8
Broche 21 RP9 — Remappable peripheral I/O 9
Broche 22 VSS — Ground
Broche 23 VDD — Digital supply 3.3V
Broche 24 RP10 — Remappable peripheral I/O 10
Broche 25 RP11 — Remappable peripheral I/O 11
Broche 26 RP12 — Remappable peripheral I/O 12
Broche 27 RP13 — Remappable peripheral I/O 13
Broche 28 RP14 — Remappable peripheral I/O 14
Broche 29 RP15 — Remappable peripheral I/O 15
Broche 30 RP16 — Remappable peripheral I/O 16
Broche 31 RP17 — Remappable peripheral I/O 17
Broche 32 VSS — Ground
Broche 33 VDD — Digital supply 3.3V
Broche 34 RP18 — Remappable peripheral I/O 18
Broche 35 RP19 — Remappable peripheral I/O 19
Broche 36 RP20 — Remappable peripheral I/O 20
Broche 37 RP21 — Remappable peripheral I/O 21
Broche 38 RP22 — Remappable peripheral I/O 22
Broche 39 RP23 — Remappable peripheral I/O 23
Broche 40 RP24 — Remappable peripheral I/O 24
Broche 41 RP25 — Remappable peripheral I/O 25
Broche 42 VSS — Ground
Broche 43 VDD — Digital supply 3.3V
Broche 44 RP26 — Remappable peripheral I/O 26
Broche 45 RP27 — Remappable peripheral I/O 27
Broche 46 RP28 — Remappable peripheral I/O 28
Broche 47 RP29 — Remappable peripheral I/O 29
Broche 48 RP30 — Remappable peripheral I/O 30
Broche 49 RP31 — Remappable peripheral I/O 31
Broche 50 RP32 — Remappable peripheral I/O 32
Broche 51 RP33 — Remappable peripheral I/O 33
Broche 52 RP34 — Remappable peripheral I/O 34
Broche 53 VSS — Ground
Broche 54 VDD — Digital supply 3.3V
Broche 55 RP35 — Remappable peripheral I/O 35
Broche 56 RP36 — Remappable peripheral I/O 36
Broche 57 RP37 — Remappable peripheral I/O 37
Broche 58 RP38 — Remappable peripheral I/O 38
Broche 59 RP39 — Remappable peripheral I/O 39
Broche 60 RP40 — Remappable peripheral I/O 40
Broche 61 RP41 — Remappable peripheral I/O 41
Broche 62 RP42 — Remappable peripheral I/O 42
Broche 63 RP43 — Remappable peripheral I/O 43
Broche 64 VSS — Ground
Broche 65 VDD — Digital supply 3.3V
Broche 66 RP44 — Remappable peripheral I/O 44
Broche 67 RP45 — Remappable peripheral I/O 45
Broche 68 RP46 — Remappable peripheral I/O 46
Broche 69 RP47 — Remappable peripheral I/O 47
Broche 70 RP48 — Remappable peripheral I/O 48
Broche 71 RP49 — Remappable peripheral I/O 49
Broche 72 RP50 — Remappable peripheral I/O 50
Broche 73 RP51 — Remappable peripheral I/O 51
Broche 74 RP52 — Remappable peripheral I/O 52
Broche 75 VSS — Ground
Broche 76 VDD — Digital supply 3.3V
Broche 77 RP53 — Remappable peripheral I/O 53
Broche 78 RP54 — Remappable peripheral I/O 54
Broche 79 RP55 — Remappable peripheral I/O 55
Broche 80 RP56 — Remappable peripheral I/O 56
Broche 81 RP57 — Remappable peripheral I/O 57
Broche 82 RP58 — Remappable peripheral I/O 58
Broche 83 RP59 — Remappable peripheral I/O 59
Broche 84 RP60 — Remappable peripheral I/O 60
Broche 85 VSS — Ground
Broche 86 VDD — Digital supply 3.3V
Broche 87 RP61 — Remappable peripheral I/O 61
Broche 88 RP62 — Remappable peripheral I/O 62
Broche 89 RP63 — Remappable peripheral I/O 63
Broche 90 RP64 — Remappable peripheral I/O 64
Broche 91 RP65 — Remappable peripheral I/O 65
Broche 92 RP66 — Remappable peripheral I/O 66
Broche 93 RP67 — Remappable peripheral I/O 67
Broche 94 RP68 — Remappable peripheral I/O 68
Broche 95 VSS — Ground
Broche 96 VDD — Digital supply 3.3V
Broche 97 RP69 — Remappable peripheral I/O 69
Broche 98 RP70 — Remappable peripheral I/O 70
Broche 99 RP71 — Remappable peripheral I/O 71
Broche 100 RP72 — Remappable peripheral I/O 72
Broche 101 RP73 — Remappable peripheral I/O 73
Broche 102 RP74 — Remappable peripheral I/O 74
Broche 103 RP75 — Remappable peripheral I/O 75
Broche 104 RP76 — Remappable peripheral I/O 76
Broche 105 RP77 — Remappable peripheral I/O 77
Broche 106 RP78 — Remappable peripheral I/O 78
Broche 107 RP79 — Remappable peripheral I/O 79
Broche 108 RP80 — Remappable peripheral I/O 80
Broche 109 VSS — Ground
Broche 110 VDD — Digital supply 3.3V
Broche 111 RP81 — Remappable peripheral I/O 81
Broche 112 RP82 — Remappable peripheral I/O 82
Broche 113 RP83 — Remappable peripheral I/O 83
Broche 114 RP84 — Remappable peripheral I/O 84
Broche 115 RP85 — Remappable peripheral I/O 85
Broche 116 RP86 — Remappable peripheral I/O 86
Broche 117 RP87 — Remappable peripheral I/O 87
Broche 118 RP88 — Remappable peripheral I/O 88
Broche 119 RP89 — Remappable peripheral I/O 89
Broche 120 RP90 — Remappable peripheral I/O 90
Broche 121 RP91 — Remappable peripheral I/O 91
Broche 122 RP92 — Remappable peripheral I/O 92
Broche 123 RP93 — Remappable peripheral I/O 93
Broche 124 VSS — Ground
Broche 125 VDD — Digital supply 3.3V
Broche 126 RP94 — Remappable peripheral I/O 94
Broche 127 RP95 — Remappable peripheral I/O 95
Broche 128 RP96 — Remappable peripheral I/O 96
Broche 129 RP97 — Remappable peripheral I/O 97
Broche 130 RP98 — Remappable peripheral I/O 98
Broche 131 RP99 — Remappable peripheral I/O 99
Broche 132 RP100 — Remappable peripheral I/O 100
Broche 133 RP101 — Remappable peripheral I/O 101
Broche 134 VSS — Ground
Broche 135 VDD — Digital supply 3.3V
Broche 136 RP102 — Remappable peripheral I/O 102
Broche 137 RP103 — Remappable peripheral I/O 103
Broche 138 RP104 — Remappable peripheral I/O 104
Broche 139 RP105 — Remappable peripheral I/O 105
Broche 140 RP106 — Remappable peripheral I/O 106
Broche 141 RP107 — Remappable peripheral I/O 107
Broche 142 RP108 — Remappable peripheral I/O 108
Broche 143 RP109 — Remappable peripheral I/O 109
Broche 144 RP110 — Remappable peripheral I/O 110

Applications typiques

PIC32MZ0512EFE144-I/PL convient pour 6 applications: Industrial Ethernet Gateway, IoT Edge Node with TLS, Multi-Axis Motor Control (FOC), Graphics HMI Display Controller, Automotive Body/Comfort Module, Audio DSP and Effects Processor.

🏭

Industrial Ethernet Gateway

The PIC32MZ0512EFE144-I/PL's integrated Ethernet MAC combined with the 200 MHz MIPS core and IEEE-754 FPU makes it ideal for industrial Ethernet gateway designs. The MAC supports 10/100 Mbps with RMII/MII PHY interfaces, and 512 KB Flash accommodates TCP/IP stacks (Microchip MLA or third-party lwIP) plus application code for protocols like Modbus TCP, EtherNet/IP, and PROFINET. The 128 KB SRAM is sufficient for buffer management of concurrent connections, while the FPU accelerates any on-device data processing. Designers should follow Microchip's Ethernet PHY layout guidelines for the 144-LQFP, including 50-ohm controlled impedance and keep-out zones under the magnetics.

🧩

IoT Edge Node with TLS

This part fits IoT edge nodes requiring secure TLS connections and on-device sensor processing. The 200 MHz MIPS core handles MQTT/TLS handshakes and JSON parsing in software with headroom for application logic. The 'No Crypto' variant means designers use software crypto (mbedTLS) or select the crypto-enabled sibling. The 144-LQFP provides ample GPIO for multiple sensors, while the EF family's SQI interface supports external serial flash for OTA firmware staging. Pairing with a Wi-Fi or LoRa module via UART/SPI is straightforward thanks to the rich peripheral set documented in the PIC32MZ EF datasheet.

🏭

Multi-Axis Motor Control (FOC)

Field-oriented control of three-phase PMSM motors demands deterministic PWM, fast ADC sampling, and DSP throughput - all delivered by the PIC32MZ0512EFE144-I/PL. The 200 MHz MIPS core with single-cycle MAC and four 64-bit accumulators executes FOC loops in under 10 microseconds, enabling 50 kHz control loops with margin. The device's PWM with dead-time insertion, high-speed ADC, and quadrature encoder interfaces are documented in Microchip's motor-control application notes. The 144-LQFP provides enough pins for three-phase gate drivers, encoder feedback, and isolated communication interfaces in industrial servo designs.

📺

Graphics HMI Display Controller

HMI panels with TFT displays need a fast core for graphics rendering, framebuffer management, and touch handling - all within the PIC32MZ0512EFE144-I/PL's capability envelope. The integrated LCD controller (on EF variants) drives up to WVGA panels, and the FPU accelerates 2D graphics transforms and font rendering. Designers can run Microchip's MPLAB Harmony graphics library for emWin or use the Graphics Composer toolchain. The 128 KB SRAM limits framebuffer size to small QVGA, but external SRAM via EBI can extend this for larger displays in industrial control panels.

🚗

Automotive Body/Comfort Module

Automotive body controllers require -40C to +125C operation, CAN bus connectivity, and reliable PWM-driven actuators. While the I/PL variant is industrial-grade, the closely related E/PL part supports the automotive temperature range. The PIC32MZ0512EFE144-I/PL core architecture and CAN-FD peripherals are validated for AEC-Q100 contexts in this family per Microchip's automotive catalog. Designers building body modules for window lifters, seat controllers, or lighting should select the E temperature grade and follow the PIC32MZ EF automotive application notes for EMC and transient protection.

🎧

Audio DSP and Effects Processor

Audio effects pedals, mixing consoles, and amplifiers benefit from the PIC32MZ0512EFE144-I/PL's MIPS core with single-cycle MAC and FPU. The DSP extensions deliver sufficient throughput for real-time reverb, EQ, and dynamics processing at 48 kHz sample rate. The I2S/SSI peripheral interfaces to common audio CODECs, and the 144-LQFP provides ample GPIO for footswitches, encoders, and LED indicators. Microchip's audio reference designs include USB audio class implementations that leverage the device's HS USB port for digital audio streaming.

Récapitulatif des produits recommandés

LAN8720A 10/100 Ethernet PHY for RMII interface Utilisé dans : Industrial Ethernet Gateway KSZ8081RNA Industrial-grade Ethernet PHY alternative Utilisé dans : Industrial Ethernet Gateway ATWINC1500 Wi-Fi module companion Utilisé dans : IoT Edge Node with TLS SX1276 LoRa transceiver for long-range IoT Utilisé dans : IoT Edge Node with TLS DRV8301 Three-phase gate driver for BLDC/PMSM Utilisé dans : Multi-Axis Motor Control (FOC) ACS722 Current sense for FOC feedback Utilisé dans : Multi-Axis Motor Control (FOC) TFT3P5587 QVGA TFT display module Utilisé dans : Graphics HMI Display Controller FT5336 Capacitive touch controller Utilisé dans : Graphics HMI Display Controller TLE7259-3GE CAN-FD transceiver Utilisé dans : Automotive Body/Comfort Module VNQ660SP STMicroelectronics Utilisé dans : Automotive Body/Comfort Module PCM5101A 32-bit audio DAC with I2S interface Utilisé dans : Audio DSP and Effects Processor SSM2603 Audio CODEC for line-level I/O Utilisé dans : Audio DSP and Effects Processor
What is the CPU core and clock speed of PIC32MZ0512EFE144-I/PL?
The PIC32MZ0512EFE144-I/PL uses a MIPS32 M-Class (Warrior M-class) 32-bit core running at up to 200 MHz, delivering 330 DMIPS. According to Microchip's PIC32MZ EF family datasheet DS60001320H, this represents the standard (non-E speed grade) variant; the E grade parts in this family reach up to 252 MHz.
How much Flash and SRAM does PIC32MZ0512EFE144-I/PL have?
The PIC32MZ0512EFE144-I/PL integrates 512 KB of program Flash and 128 KB of SRAM. Per Microchip's datasheet, the dual-panel flash architecture supports live-update firmware over-the-air, and SRAM is split between general-purpose and a DMA-accessible region for high-throughput peripherals.
Does PIC32MZ0512EFE144-I/PL have a hardware FPU?
Yes, the PIC32MZ0512EFE144-I/PL includes a hardware IEEE 754-compliant single-precision floating-point unit. This accelerates floating-point DSP, control loops, and graphics transforms substantially versus software-emulated FP on Cortex-M3/M4F-only competitors.
What is the difference between PIC32MZ0512EFE144-I/PL and PIC32MZ0512EFE144-I/PH?
Both share the same silicon die, but the I/PL variant uses a 144-LQFP (20x20) package while the I/PH uses a 144-TQFP (16x16) package. Per Microchip ordering info, the PH is a smaller-footprint variant and is not pin-to-pin drop-in for PL designs - PCB rework is required.
What is the difference between PIC32MZ0512EFE144-I/PL and PIC32MZ1024EFE144-I/PL?
The 0512 variant has 512 KB Flash and 128 KB SRAM, while the 1024 variant has 1024 KB Flash and 256 KB SRAM. Both share the same 200 MHz core, FPU, and 144-LQFP package, so the 1024 is a drop-in upgrade when more code space is needed.
Is PIC32MZ0512EFE144-I/PL suitable for industrial Ethernet applications?
Yes, the PIC32MZ0512EFE144-I/PL integrates an Ethernet MAC and is well-suited for industrial protocols such as Modbus TCP, EtherNet/IP, and PROFINET. The 200 MHz core and FPU allow processing TCP/IP stacks plus application logic without offloading, per Microchip's TCP/IP library (MLA) reference designs.
What is the difference between -I and -E temperature grades for PIC32MZ EF?
The -I suffix denotes the Industrial temperature range of -40C to +85C, while the -E suffix extends to -40C to +125C for Automotive/Extended applications. The -E parts typically also have higher max CPU speed (252 MHz). For automotive or outdoor designs, select -E.
Where can I buy PIC32MZ0512EFE144-I/PL online?
PIC32MZ0512EFE144-I/PL is in stock at DigiKey, Mouser, LCSC, and major distributors. LCSC lists pricing from $4.56 USD as of 2026-10-04. For production volumes, Microchip Direct is the manufacturer's authorized channel with full traceability.
What is the price of PIC32MZ0512EFE144-I/PL?
The unit price of PIC32MZ0512EFE144-I/PL is approximately $11.42 USD at qty 1, dropping to $6.95 USD at qty 1000 as of 2026-10-04 per distributor listings on Octopart. LCSC offers competitive pricing starting at $4.56 USD in cut-tape quantities.
What is the lead time for PIC32MZ0512EFE144-I/PL?
Lead time for PIC32MZ0512EFE144-I/PL is typically same-day to 4 weeks at major distributors like DigiKey and Mouser as of 2026-10-04. For 10k+ volumes, Microchip Direct typically quotes 12-16 weeks. The PL package is the most widely stocked variant.
Is PIC32MZ0512EFE144-I/PL still in production?
Yes, PIC32MZ0512EFE144-I/PL is in active production as of 2026-10-04. Microchip's PIC32MZ EF family remains a current-generation high-performance MCU line with no end-of-life announcement. Lifecycle status is active per Microchip's product page.
Where do I download the PIC32MZ0512EFE144-I/PL datasheet PDF?
The PIC32MZ0512EFE144-I/PL datasheet PDF is available from Microchip's official documentation portal as document DS60001320H, covering the entire PIC32MZ EF family. The datasheet is also mirrored on distributor sites like DigiKey and Mouser with parametric search support.
What is the best drop-in replacement for PIC32MZ0512EFE144-I/PL?
The closest drop-in replacement within the same 144-LQFP footprint is PIC32MZ1024EFE144-I/PL (doubled Flash and SRAM, identical pinout). For cost-down, PIC32MZ0512EFE124-I/PL has 1 MB Flash but the same LQFP-144 package; always verify against the device-specific pinout table before substitution.
Can PIC32MZ1024EFE144-I/PL replace PIC32MZ0512EFE144-I/PL directly?
Yes, PIC32MZ1024EFE144-I/PL is a true drop-in replacement in the same 144-LQFP (20x20) package. It doubles Flash to 1024 KB and SRAM to 256 KB while keeping the same 200 MHz MIPS core, FPU, and peripheral set. Per Microchip's datasheet, pin compatibility is verified for the PL package.
What is the difference between PIC32MZ EF and PIC32MZ EC families?
The PIC32MZ EF family integrates a FPU, HS USB, Ethernet, and SQI for higher-end connectivity applications, while the older PIC32MZ EC family lacks the FPU and is positioned for cost-sensitive general-purpose use. EF parts also feature the dual-panel live-update flash architecture.

Données de référence d'ingénierie pour PIC32MZ0512EFE144-I/PL — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose PIC32MZ0512EFE144-I/PL when you need a balanced 32-bit MCU with 512 KB Flash, integrated FPU, Ethernet MAC, and industrial temperature grade in a 144-LQFP for connectivity applications. Choose PIC32MZ1024EFE144-I/PL when you need more code space (1024 KB Flash, 256 KB SRAM) in the same package. Choose PIC32MZ0512EFE144-E/PL when you need 252 MHz operation and -40C to +125C automotive temperature range. Choose PIC32MZ0512EFE144T-I/PL when you need tape-and-reel packaging for high-volume SMT assembly. All four share the same 144-LQFP (20x20) footprint, enabling PCB layout reuse. Avoid PIC32MX variants for new designs unless cost is paramount, as the EF family's FPU, dual-panel flash, and integrated Ethernet deliver substantially higher performance.

Comparaison avec les alternatives

Paramètre Ce produit PIC32MZ1024EFE144-I/PL PIC32MZ0512EFE144-E/PL PIC32MZ0512EFE144T-I/PL
Package 144-LQFP (20x20) 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP (20x20) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Flash 512 KB 1024 KB 512 KB 512 KB
SRAM 128 KB 256 KB 128 KB 128 KB
Maximum CPU Frequency 200 MHz 200 MHz 252 MHz 200 MHz
Operating Temperature -40C to +85C -40C to +85C -40C to +125C -40C to +85C
FPU Yes (IEEE 754) Yes (IEEE 754) Yes (IEEE 754) Yes (IEEE 754)
Crypto Engine No No No No
Packaging Form Tray (I/PL) Tray (I/PL) Tray (E/PL) Tape and Reel

Principaux différenciateurs

  • True IEEE-754 hardware FPU versus software-emulated FP (vs PIC32MX795F512L-80I/PF (older PIC32MX family))
  • Dual-panel live-update Flash architecture (vs PIC32MX single-bank Flash)
  • Integrated Ethernet MAC on-chip (vs PIC32MX Ethernet variants require external MAC)

Notes de conception

Estimated: At 200 MHz CPU clock, 3.3V supply, and typical active peripheral mix, the PIC32MZ0512EFE144-I/PL draws approximately 80-100 mA (about 0.26-0.33 W). Use a low-noise LDO (e.g., MIC29150) or buck regulator with a ferrite bead filter on the AVDD rail. Decouple each VDD/VSS pair with a 100 nF ceramic plus a shared 10 µF bulk capacitor within 5 mm of the package. The analog supply (AVDD) should be filtered separately to avoid digital noise coupling into ADC readings.

The 144-LQFP (20x20) package has a 0.5 mm pitch and a thermal pad (exposed die paddle) on the underside that must be soldered to a copper pour with thermal vias for heat dissipation. Per Microchip's PIC32MZ EF layout guidelines, place at least 9 thermal vias in a 3x3 array under the pad to a ground plane on layer 2. Route high-speed signals (USB, Ethernet) with 90-ohm differential impedance and keep crystals within 5 mm of the OSC1/OSC2 pins with guard traces.

Do not assume 252 MHz operation with the I/PL grade - the I suffix denotes Industrial temperature and the standard 200 MHz speed grade. For 252 MHz operation, select the E/PL extended grade. Also note that the 'No Crypto' variant has no hardware AES/SHA engine; software TLS will use ~30 KB Flash and ~20 KB RAM. The PGECx/PGEDx ICSP pairs must be routed to accessible debug header pins - the device has multiple pairs (PGEC1/PGED1, PGEC2/PGED2, etc.) but only one pair is needed for debug.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS compliant per Microchip product page. Industrial temperature grade (I) only - not AEC-Q100 qualified. Select -E grade for automotive.

Données vérifiées le : 2026-10-04 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

PIC32MZ0512EFE144-I/PL PIC32MZ0512EFE144 datasheet Microchip PIC32MZ EF family 200MHz 32-bit microcontroller 512KB flash 144-LQFP MIPS MCU PIC32MZ0512EFE144 industrial Ethernet gateway PIC32MZ0512EFE144 vs PIC32MZ1024EFE144 PIC32MZ0512EFE144 drop-in replacement PIC32MZ0512EFE144-I/PL buy price what is the flash size of PIC32MZ0512EFE144 PIC32MZ EF FPU DSP extensions PIC32MZ motor control FOC reference design PIC32MZ0512EFE144 pinout 144-LQFP Hey Google what can replace PIC32MZ0512EFE144

Composants & termes associés

Microchip Technology PIC32MZ0512EFE144-I/PL PIC32MZ1024EFE144-I/PL PIC32MZ0512EFE144-E/PL PIC32MZ0512EFE144T-I/PL MIPS32 MIPS Warrior M-class 32-bit microcontroller MCU IEEE 754 FPU DSP extensions Ethernet MAC HS USB RoHS AEC-Q100 LQFP-144 surface mount ICSP industrial Ethernet Modbus TCP FOC motor control dual-panel flash live-update firmware
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