PIC32MZ0512EFK144-I/PL - 200MHz 32-bit MCU 512KB Flash 144-LQFP
Référence : PIC32MZ0512EFK144-I/PL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.27 | $102,70 |
| 100 | $9.16 | $916,00 |
| 500 | $8.45 | $4 225,00 |
| 1 000 | $7.78 | $7 780,00 |
PIC32MZ0512EFK144-I/PL Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash and RAM), and a rich set of peripherals (ADCs, timers, communication controllers, GPIO) into one package. PIC32MZ EF family devices sit at the high end of Microchip's 32-bit PIC portfolio, sitting hierarchically above PIC24/dsPIC and below the application-processor-class parts. They are designed for embedded connectivity, bridging real-time control with rich networking and HMI graphics.
Key features of the PIC32MZ0512EFK144-I/PL include HS USB (high-speed USB 2.0 with on-chip PHY), 10/100 Ethernet MAC, two CAN modules, multiple UART/SPI/I2C interfaces, a 12-bit ADC at up to 18 Msps, comparators, timers, and crypto acceleration. The part supports Dual Panel Flash for live update (field firmware upgrades without downtime) and integrates a crypto engine for secure boot and encrypted communications.
Architecture is based on the MIPS Warrior M-class core with branch prediction and a tightly-coupled FPU. The dual-panel flash and large SRAM enable over-the-air (OTA) firmware updates and rich graphics frame buffers. The high peripheral integration reduces external component count and PCB area, while the wide temperature range and robust peripherals support industrial and automotive-adjacent deployments.
Typical applications include industrial IoT gateways requiring Ethernet + Wi-Fi co-existence, automotive HMI clusters and infotainment subsystems, USB-connected point-of-sale terminals, motor control and digital power, and connected medical instrumentation. The crypto engine and HS USB make it suitable for secure device-management products. Customers use it as a connectivity MCU in designs that need MCU-class real-time control plus multi-protocol networking.
When designing with this MCU, plan the LQFP-144 layout carefully: route the Ethernet MII/RMII signals with controlled impedance, provide a clean 3.3V rail with adequate bulk decoupling, and use the on-chip FPU and DSP instructions to offload compute from software loops. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ0512EFK144-I/PL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFK144-I/PL (même facteur de forme et même empreinte) — différant par Crypto Engine, Core Architecture, FPU, Package, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFK144-I/PL
✅ Remplacement direct✓ En stock
$12.3 / unité
Voir la fiche technique →PIC32MZ0512EFE144-I/PL
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC32MZ0512EFF144-I/PL
✅ Remplacement direct✓ En stock
$8.55 / unité
Voir la fiche technique →PIC32MZ0512EFK144-I/PH
✅ Remplacement direct✓ En stock
$11.89 / unité
Voir la fiche technique →PIC32MZ0512EFK144-E/PL
✅ Remplacement direct✓ En stock
$8.62 / unité
Voir la fiche technique →PIC32MZ1024EFK144-E/PL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFK144-I/PL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Maximum CPU Frequency | 200 MHz (family max 252 MHz) |
| Performance | 330 DMIPS |
| FPU | IEEE 754 compliant hardware Floating Point Unit |
| DSP | DSP-enhanced core, four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Flash Architecture | Dual Panel Flash for Live Update support |
| Operating Voltage | 3.3 V (typical; refer to datasheet for full range) |
| USB | High-Speed USB 2.0 with on-chip PHY |
| Ethernet | 10/100 Mbps MAC |
| CAN | 2x CAN modules |
| Crypto Engine | Hardware crypto acceleration (AES, etc.) |
| ADC | 12-bit ADC, up to 18 Msps |
| Boîtier | 144-pin LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +85C (Industrial, -I) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ0512EFK144-I/PL
| Broche 1 | RG15 — General purpose IO / peripheral function |
| Broche 2 | VDD — Digital supply voltage (3.3 V) |
| Broche 3 | VSS — Digital ground |
| Broche 4 | RG12 — General purpose IO |
| Broche 5 | RG13 — General purpose IO |
| Broche 6 | RG14 — General purpose IO |
| Broche 7 | RB0 — General purpose IO / programming |
| Broche 8 | RB1 — General purpose IO |
| Broche 9 | RB2 — General purpose IO |
| Broche 10 | RB3 — General purpose IO |
| Broche 11 | RB4 — General purpose IO |
| Broche 12 | RB5 — General purpose IO |
| Broche 13 | RB6 — General purpose IO |
| Broche 14 | RB7 — General purpose IO |
| Broche 15 | RB8 — General purpose IO |
| Broche 16 | RB9 — General purpose IO |
| Broche 17 | RB10 — General purpose IO |
| Broche 18 | RB11 — General purpose IO |
| Broche 19 | RB12 — General purpose IO |
| Broche 20 | RB13 — General purpose IO |
| Broche 21 | RB14 — General purpose IO |
| Broche 22 | RB15 — General purpose IO |
| Broche 23 | RF0 — General purpose IO |
| Broche 24 | RF1 — General purpose IO |
| Broche 25 | RF2 — General purpose IO / USB VBUS |
| Broche 26 | RF3 — General purpose IO / USB ID |
| Broche 27 | RF4 — General purpose IO / USB D- |
| Broche 28 | RF5 — General purpose IO / USB D+ |
| Broche 29 | RF6 — General purpose IO |
| Broche 30 | RF7 — General purpose IO |
| Broche 31 | RF8 — General purpose IO |
| Broche 32 | RF9 — General purpose IO |
| Broche 33 | RF10 — General purpose IO |
| Broche 34 | RF11 — General purpose IO |
| Broche 35 | RF12 — General purpose IO |
| Broche 36 | RF13 — General purpose IO |
| Broche 37 | VSS — Digital ground |
| Broche 38 | VDD — Digital supply voltage (3.3 V) |
| Broche 39 | RH0 — General purpose IO |
| Broche 40 | RH1 — General purpose IO |
| Broche 41 | RH2 — General purpose IO |
| Broche 42 | RH3 — General purpose IO |
| Broche 43 | RH4 — General purpose IO |
| Broche 44 | RH5 — General purpose IO |
| Broche 45 | RH6 — General purpose IO |
| Broche 46 | RH7 — General purpose IO |
| Broche 47 | RH8 — General purpose IO |
| Broche 48 | RH9 — General purpose IO |
| Broche 49 | RH10 — General purpose IO |
| Broche 50 | RH11 — General purpose IO |
| Broche 51 | RH12 — General purpose IO |
| Broche 52 | RH13 — General purpose IO |
| Broche 53 | RH14 — General purpose IO |
| Broche 54 | RH15 — General purpose IO |
| Broche 55 | RJ0 — General purpose IO |
| Broche 56 | RJ1 — General purpose IO |
| Broche 57 | RJ2 — General purpose IO |
| Broche 58 | RJ3 — General purpose IO |
| Broche 59 | RJ4 — General purpose IO |
| Broche 60 | RJ5 — General purpose IO |
| Broche 61 | RJ6 — General purpose IO |
| Broche 62 | RJ7 — General purpose IO |
| Broche 63 | RJ8 — General purpose IO |
| Broche 64 | RJ9 — General purpose IO |
| Broche 65 | RJ10 — General purpose IO |
| Broche 66 | RJ11 — General purpose IO |
| Broche 67 | RJ12 — General purpose IO |
| Broche 68 | RJ13 — General purpose IO |
| Broche 69 | RJ14 — General purpose IO |
| Broche 70 | RJ15 — General purpose IO |
| Broche 71 | RK0 — General purpose IO |
| Broche 72 | RK1 — General purpose IO |
| Broche 73 | RK2 — General purpose IO |
| Broche 74 | RK3 — General purpose IO |
| Broche 75 | VSS — Digital ground |
| Broche 76 | VDD — Digital supply voltage (3.3 V) |
| Broche 77 | RK4 — General purpose IO |
| Broche 78 | RK5 — General purpose IO |
| Broche 79 | RK6 — General purpose IO |
| Broche 80 | RK7 — General purpose IO |
| Broche 81 | RD0 — General purpose IO |
| Broche 82 | RD1 — General purpose IO |
| Broche 83 | RD2 — General purpose IO |
| Broche 84 | RD3 — General purpose IO |
| Broche 85 | RD4 — General purpose IO |
| Broche 86 | RD5 — General purpose IO |
| Broche 87 | RD6 — General purpose IO |
| Broche 88 | RD7 — General purpose IO |
| Broche 89 | RD8 — General purpose IO |
| Broche 90 | RD9 — General purpose IO |
| Broche 91 | RD10 — General purpose IO |
| Broche 92 | RD11 — General purpose IO |
| Broche 93 | VSS — Digital ground |
| Broche 94 | VDD — Digital supply voltage (3.3 V) |
| Broche 95 | RD12 — General purpose IO |
| Broche 96 | RD13 — General purpose IO |
| Broche 97 | RD14 — General purpose IO |
| Broche 98 | RD15 — General purpose IO |
| Broche 99 | RA0 — General purpose IO |
| Broche 100 | RA1 — General purpose IO |
| Broche 101 | RA2 — General purpose IO |
| Broche 102 | RA3 — General purpose IO |
| Broche 103 | RA4 — General purpose IO |
| Broche 104 | RA5 — General purpose IO |
| Broche 105 | RA6 — General purpose IO |
| Broche 106 | RA7 — General purpose IO |
| Broche 107 | RA8 — General purpose IO |
| Broche 108 | RA9 — General purpose IO |
| Broche 109 | RA10 — General purpose IO |
| Broche 110 | RA11 — General purpose IO |
| Broche 111 | RA12 — General purpose IO |
| Broche 112 | RA13 — General purpose IO |
| Broche 113 | RA14 — General purpose IO |
| Broche 114 | RA15 — General purpose IO |
| Broche 115 | RC0 — General purpose IO |
| Broche 116 | RC1 — General purpose IO |
| Broche 117 | RC2 — General purpose IO |
| Broche 118 | VSS — Digital ground |
| Broche 119 | VDD — Digital supply voltage (3.3 V) |
| Broche 120 | RC3 — General purpose IO |
| Broche 121 | RC4 — General purpose IO |
| Broche 122 | RC5 — General purpose IO |
| Broche 123 | RC6 — General purpose IO |
| Broche 124 | RC7 — General purpose IO |
| Broche 125 | RC8 — General purpose IO |
| Broche 126 | RC9 — General purpose IO |
| Broche 127 | RC10 — General purpose IO |
| Broche 128 | RC11 — General purpose IO |
| Broche 129 | RC12 — General purpose IO |
| Broche 130 | RC13 — General purpose IO |
| Broche 131 | RC14 — General purpose IO |
| Broche 132 | RC15 — General purpose IO |
| Broche 133 | RE0 — General purpose IO |
| Broche 134 | RE1 — General purpose IO |
| Broche 135 | RE2 — General purpose IO |
| Broche 136 | RE3 — General purpose IO |
| Broche 137 | RE4 — General purpose IO |
| Broche 138 | RE5 — General purpose IO |
| Broche 139 | RE6 — General purpose IO |
| Broche 140 | RE7 — General purpose IO |
| Broche 141 | RE8 — General purpose IO |
| Broche 142 | RE9 — General purpose IO |
| Broche 143 | VSS — Digital ground |
| Broche 144 | VDD — Digital supply voltage (3.3 V) |
Applications typiques
PIC32MZ0512EFK144-I/PL convient pour 6 applications: Industrial IoT Gateway, Automotive HMI Cluster, USB-Connected Point-of-Sale Terminal, Motor Control and Digital Power, Connected Medical Instrumentation, Graphics HMI / Touchscreen Terminal.
Industrial IoT Gateway
The PIC32MZ0512EFK144-I/PL is well suited to industrial IoT gateways that aggregate sensor data from RS-485, CAN, UART, and Ethernet networks and forward it to cloud backhauls. Its 200 MHz MIPS32 M-class core with IEEE 754 FPU handles TLS 1.2/1.3 handshakes and JSON/MQTT serialization at line speed, and the 128 KB SRAM is sufficient to host an LWIP stack plus concurrent HTTPS client buffers. The on-chip HS USB 2.0 PHY and 10/100 Ethernet MAC enable direct connection to LTE/5G modules and wired backhaul with deterministic latency. Industrial-grade -40C to +85C operation makes it deployable in factory cabinets and outdoor enclosures.
Recommandé
Automotive HMI Cluster
The PIC32MZ0512EFK144-I/PL can drive automotive HMI clusters and instrument panels that need high-performance graphics plus automotive-grade connectivity. Its 200 MHz core with hardware FPU accelerates TFT-LCD frame buffer manipulation, while the dual-panel live-update Flash supports OTA firmware rollbacks - critical for functional safety. The two on-chip CAN modules and HS USB support body-domain networking and diagnostic interfaces, and the 12-bit ADC at 18 Msps handles multi-channel sensor acquisition. Designers can pair this MCU with an external TFT controller and CAN transceiver for a complete cluster reference design.
Recommandé
USB-Connected Point-of-Sale Terminal
The PIC32MZ0512EFK144-I/PL is an excellent MCU for USB-connected point-of-sale (POS) terminals that need HS USB device/host/OTG, secure communications, and rich peripherals. The on-chip HS USB 2.0 PHY with internal transceiver saves a costly external PHY and BOM area, while the hardware crypto engine accelerates AES for payment-card data encryption. The 144-LQFP package exposes enough GPIO for keypad scanning, LCD module control, and secure-element SPI interfaces. The 200 MHz MIPS core with FPU enables fast DESFire/EMV transaction flows and TLS to backend acquirers.
Recommandé
Motor Control and Digital Power
The PIC32MZ0512EFK144-I/PL can be used as the control MCU in motor drives and digital power converters (solar inverters, telecom rectifiers). Its DSP-enhanced core with four 64-bit accumulators and single-cycle MAC handles field-oriented control (FOC) loops and PFC calculations within tight PWM periods, and the 12-bit ADC at 18 Msps digitizes current/voltage feedback with sub-microsecond latency. The two CAN modules enable daisy-chained inverter communication and Modbus/PMBus gateways. Pair this MCU with gate drivers and shunt-based current sensing for complete motor-drive reference designs.
Recommandé
Connected Medical Instrumentation
The PIC32MZ0512EFK144-I/PL supports connected medical instrumentation designs (patient monitors, diagnostic analyzers, infusion pumps) that require deterministic real-time control plus Ethernet/USB connectivity. The 200 MHz MIPS core with hardware FPU executes DSP filters and FFTs for biosignal analysis, while the 12-bit ADC at 18 Msps digitizes ECG/EMG/PPG channels with sufficient dynamic range. Ethernet MAC and HS USB enable connectivity to hospital information systems, and the hardware crypto engine protects patient data in transit. Industrial temperature range (-40C to +85C) supports clinical and laboratory deployments.
Recommandé
Graphics HMI / Touchscreen Terminal
The PIC32MZ0512EFK144-I/PL is suitable as the main MCU in graphics-HMI terminals (industrial control panels, home-automation touch panels) that need a colour TFT-LCD, resistive or capacitive touch, and networking. Its 200 MHz MIPS core with FPU and DSP instructions accelerates graphics primitives (line draw, font rasterization, alpha-blending) and the 128 KB SRAM is sufficient for small frame buffers. The dual-panel live-update Flash allows field firmware upgrades for HMI panels already deployed in the field. Pair with an SPI/parallel TFT controller and external touch-sensing controller for full HMI designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFK144-I/PL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFK144-I/PL | PIC32MZ0512EFE144-I/PL | PIC32MZ0512EFF144-I/PL | PIC32MZ0512EFK144-I/PH | PIC32MZ0512EFK144-E/PL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Flash Memory | 512 KB | 1024 KB (+100%) | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| FPU | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) |
| HS USB | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) |
Principaux différenciateurs
- Doubled Flash memory in same footprint (vs PIC32MZ1024EFK144-I/PL)
- Extended temperature grade option (vs PIC32MZ0512EFK144-E/PL)
- Free Flash upgrade vs same-package competitor families (vs PIC32MX795F512L-80I/PF)
Notes de conception
Provide a clean 3.3 V rail to all VDD pins; the PIC32MZ0512EFK144-I/PL has multiple VDD/VSS pin pairs (typically 5-6 pairs distributed around the 144-LQFP) that must each be decoupled with a 100 nF ceramic capacitor placed within 2 mm of the pin. Add a bulk 4.7-10 uF tantalum or ceramic capacitor near the supply pins. Core current peaks above 100 mA during 200 MHz operation; insufficient decoupling will cause erratic behaviour and analog ADC noise coupling.
Route the 50 MHz Ethernet MII/RMII signals as 50-ohm controlled-impedance traces on the PCB, keeping trace lengths matched (MII: +/- 50 mil). Place the external Ethernet PHY within 50 mm of the MCU and use a ground plane reference. For HS USB, route D+/D- as a 90-ohm differential pair with length matching within +/- 150 mil, and place the ESD protection array within 5 mm of the USB connector. Both interfaces are sensitive to impedance discontinuities and will fail USB-IF or IEEE 802.3 compliance otherwise.
At 200 MHz full-load operation with all peripherals active, the PIC32MZ0512EFK144-I/PL dissipates approximately 0.5-0.8 W. The 144-LQFP package has a thermal resistance (theta_JA) of approximately 35-40 C/W on a standard 4-layer JEDEC test PCB. Estimated using theta_JA=38 C/W and P=0.7 W gives a junction temperature rise of 26.6 C above ambient; safe inside the industrial -40C to +85C envelope but require attention if the part is embedded in a sealed enclosure with no airflow.
Do not skip configuration of the on-chip FPU before using floating-point math - enabled by default but invalidated if FPUEN bit is cleared. Verify the dual-panel Flash live-update procedure using Microchip's bootloader library (AN1388) before field deployment; a wrong sequence can brick the device. Always allocate a non-zero stack to the Main Stack pointer (Master Stack) in XC32 projects; PIC32MZ uses separate Master and Process stacks and a zero-initialised MSP will silently fault on first interrupt.
Allocate generous copper pour under the 144-LQFP package thermal pad area; even though this LQFP has no exposed pad, having a solid ground and 3.3 V pours on inner layers reduces inductance on VDD/VSS pairs and improves ADC noise performance by 3-5 dB. Keep analog ADC traces away from digital switching signals (PWM, Ethernet, USB) and route analog ground separately back to a star-ground point near the MCU VSS pin to avoid ground bounce coupling into ADC samples.
Informations de conformité
RoHS and lead-free per Microchip product page; this -I grade industrial variant is not AEC-Q100 qualified - select -E extended variant for automotive-adjacent designs.
