PIC32MZ0512EFK144-I/PL - 200MHz 32-bit MCU 512KB Flash 144-LQFP
Артикул: PIC32MZ0512EFK144-I/PL ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.27 | $102,70 |
| 100 | $9.16 | $916,00 |
| 500 | $8.45 | $4.225,00 |
| 1.000 | $7.78 | $7.780,00 |
PIC32MZ0512EFK144-I/PL Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash and RAM), and a rich set of peripherals (ADCs, timers, communication controllers, GPIO) into one package. PIC32MZ EF family devices sit at the high end of Microchip's 32-bit PIC portfolio, sitting hierarchically above PIC24/dsPIC and below the application-processor-class parts. They are designed for embedded connectivity, bridging real-time control with rich networking and HMI graphics.
Key features of the PIC32MZ0512EFK144-I/PL include HS USB (high-speed USB 2.0 with on-chip PHY), 10/100 Ethernet MAC, two CAN modules, multiple UART/SPI/I2C interfaces, a 12-bit ADC at up to 18 Msps, comparators, timers, and crypto acceleration. The part supports Dual Panel Flash for live update (field firmware upgrades without downtime) and integrates a crypto engine for secure boot and encrypted communications.
Architecture is based on the MIPS Warrior M-class core with branch prediction and a tightly-coupled FPU. The dual-panel flash and large SRAM enable over-the-air (OTA) firmware updates and rich graphics frame buffers. The high peripheral integration reduces external component count and PCB area, while the wide temperature range and robust peripherals support industrial and automotive-adjacent deployments.
Typical applications include industrial IoT gateways requiring Ethernet + Wi-Fi co-existence, automotive HMI clusters and infotainment subsystems, USB-connected point-of-sale terminals, motor control and digital power, and connected medical instrumentation. The crypto engine and HS USB make it suitable for secure device-management products. Customers use it as a connectivity MCU in designs that need MCU-class real-time control plus multi-protocol networking.
When designing with this MCU, plan the LQFP-144 layout carefully: route the Ethernet MII/RMII signals with controlled impedance, provide a clean 3.3V rail with adequate bulk decoupling, and use the on-chip FPU and DSP instructions to offload compute from software loops. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для PIC32MZ0512EFK144-I/PL — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ0512EFK144-I/PL (тот же форм-фактор и посадочное место) — отличается по Crypto Engine, Core Architecture, FPU, Package, USB.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ1024EFK144-I/PL
✅ Прямая замена✓ В наличии
$12.3 / шт.
Открыть даташит →PIC32MZ0512EFE144-I/PL
✅ Прямая замена✓ В наличии
$6.95 / шт.
Открыть даташит →PIC32MZ0512EFF144-I/PL
✅ Прямая замена✓ В наличии
$8.55 / шт.
Открыть даташит →PIC32MZ0512EFK144-I/PH
✅ Прямая замена✓ В наличии
$11.89 / шт.
Открыть даташит →PIC32MZ0512EFK144-E/PL
✅ Прямая замена✓ В наличии
$8.62 / шт.
Открыть даташит →PIC32MZ1024EFK144-E/PL
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ0512EFK144-I/PL Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Maximum CPU Frequency | 200 MHz (family max 252 MHz) |
| Performance | 330 DMIPS |
| FPU | IEEE 754 compliant hardware Floating Point Unit |
| DSP | DSP-enhanced core, four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Flash Architecture | Dual Panel Flash for Live Update support |
| Operating Voltage | 3.3 V (typical; refer to datasheet for full range) |
| USB | High-Speed USB 2.0 with on-chip PHY |
| Ethernet | 10/100 Mbps MAC |
| CAN | 2x CAN modules |
| Crypto Engine | Hardware crypto acceleration (AES, etc.) |
| ADC | 12-bit ADC, up to 18 Msps |
| Корпус | 144-pin LQFP (20x20 mm) |
| Тип монтажа | Surface Mount |
| Диапазон рабочих температур | -40C to +85C (Industrial, -I) |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MZ0512EFK144-I/PL
| Контакт 1 | RG15 — General purpose IO / peripheral function |
| Контакт 2 | VDD — Digital supply voltage (3.3 V) |
| Контакт 3 | VSS — Digital ground |
| Контакт 4 | RG12 — General purpose IO |
| Контакт 5 | RG13 — General purpose IO |
| Контакт 6 | RG14 — General purpose IO |
| Контакт 7 | RB0 — General purpose IO / programming |
| Контакт 8 | RB1 — General purpose IO |
| Контакт 9 | RB2 — General purpose IO |
| Контакт 10 | RB3 — General purpose IO |
| Контакт 11 | RB4 — General purpose IO |
| Контакт 12 | RB5 — General purpose IO |
| Контакт 13 | RB6 — General purpose IO |
| Контакт 14 | RB7 — General purpose IO |
| Контакт 15 | RB8 — General purpose IO |
| Контакт 16 | RB9 — General purpose IO |
| Контакт 17 | RB10 — General purpose IO |
| Контакт 18 | RB11 — General purpose IO |
| Контакт 19 | RB12 — General purpose IO |
| Контакт 20 | RB13 — General purpose IO |
| Контакт 21 | RB14 — General purpose IO |
| Контакт 22 | RB15 — General purpose IO |
| Контакт 23 | RF0 — General purpose IO |
| Контакт 24 | RF1 — General purpose IO |
| Контакт 25 | RF2 — General purpose IO / USB VBUS |
| Контакт 26 | RF3 — General purpose IO / USB ID |
| Контакт 27 | RF4 — General purpose IO / USB D- |
| Контакт 28 | RF5 — General purpose IO / USB D+ |
| Контакт 29 | RF6 — General purpose IO |
| Контакт 30 | RF7 — General purpose IO |
| Контакт 31 | RF8 — General purpose IO |
| Контакт 32 | RF9 — General purpose IO |
| Контакт 33 | RF10 — General purpose IO |
| Контакт 34 | RF11 — General purpose IO |
| Контакт 35 | RF12 — General purpose IO |
| Контакт 36 | RF13 — General purpose IO |
| Контакт 37 | VSS — Digital ground |
| Контакт 38 | VDD — Digital supply voltage (3.3 V) |
| Контакт 39 | RH0 — General purpose IO |
| Контакт 40 | RH1 — General purpose IO |
| Контакт 41 | RH2 — General purpose IO |
| Контакт 42 | RH3 — General purpose IO |
| Контакт 43 | RH4 — General purpose IO |
| Контакт 44 | RH5 — General purpose IO |
| Контакт 45 | RH6 — General purpose IO |
| Контакт 46 | RH7 — General purpose IO |
| Контакт 47 | RH8 — General purpose IO |
| Контакт 48 | RH9 — General purpose IO |
| Контакт 49 | RH10 — General purpose IO |
| Контакт 50 | RH11 — General purpose IO |
| Контакт 51 | RH12 — General purpose IO |
| Контакт 52 | RH13 — General purpose IO |
| Контакт 53 | RH14 — General purpose IO |
| Контакт 54 | RH15 — General purpose IO |
| Контакт 55 | RJ0 — General purpose IO |
| Контакт 56 | RJ1 — General purpose IO |
| Контакт 57 | RJ2 — General purpose IO |
| Контакт 58 | RJ3 — General purpose IO |
| Контакт 59 | RJ4 — General purpose IO |
| Контакт 60 | RJ5 — General purpose IO |
| Контакт 61 | RJ6 — General purpose IO |
| Контакт 62 | RJ7 — General purpose IO |
| Контакт 63 | RJ8 — General purpose IO |
| Контакт 64 | RJ9 — General purpose IO |
| Контакт 65 | RJ10 — General purpose IO |
| Контакт 66 | RJ11 — General purpose IO |
| Контакт 67 | RJ12 — General purpose IO |
| Контакт 68 | RJ13 — General purpose IO |
| Контакт 69 | RJ14 — General purpose IO |
| Контакт 70 | RJ15 — General purpose IO |
| Контакт 71 | RK0 — General purpose IO |
| Контакт 72 | RK1 — General purpose IO |
| Контакт 73 | RK2 — General purpose IO |
| Контакт 74 | RK3 — General purpose IO |
| Контакт 75 | VSS — Digital ground |
| Контакт 76 | VDD — Digital supply voltage (3.3 V) |
| Контакт 77 | RK4 — General purpose IO |
| Контакт 78 | RK5 — General purpose IO |
| Контакт 79 | RK6 — General purpose IO |
| Контакт 80 | RK7 — General purpose IO |
| Контакт 81 | RD0 — General purpose IO |
| Контакт 82 | RD1 — General purpose IO |
| Контакт 83 | RD2 — General purpose IO |
| Контакт 84 | RD3 — General purpose IO |
| Контакт 85 | RD4 — General purpose IO |
| Контакт 86 | RD5 — General purpose IO |
| Контакт 87 | RD6 — General purpose IO |
| Контакт 88 | RD7 — General purpose IO |
| Контакт 89 | RD8 — General purpose IO |
| Контакт 90 | RD9 — General purpose IO |
| Контакт 91 | RD10 — General purpose IO |
| Контакт 92 | RD11 — General purpose IO |
| Контакт 93 | VSS — Digital ground |
| Контакт 94 | VDD — Digital supply voltage (3.3 V) |
| Контакт 95 | RD12 — General purpose IO |
| Контакт 96 | RD13 — General purpose IO |
| Контакт 97 | RD14 — General purpose IO |
| Контакт 98 | RD15 — General purpose IO |
| Контакт 99 | RA0 — General purpose IO |
| Контакт 100 | RA1 — General purpose IO |
| Контакт 101 | RA2 — General purpose IO |
| Контакт 102 | RA3 — General purpose IO |
| Контакт 103 | RA4 — General purpose IO |
| Контакт 104 | RA5 — General purpose IO |
| Контакт 105 | RA6 — General purpose IO |
| Контакт 106 | RA7 — General purpose IO |
| Контакт 107 | RA8 — General purpose IO |
| Контакт 108 | RA9 — General purpose IO |
| Контакт 109 | RA10 — General purpose IO |
| Контакт 110 | RA11 — General purpose IO |
| Контакт 111 | RA12 — General purpose IO |
| Контакт 112 | RA13 — General purpose IO |
| Контакт 113 | RA14 — General purpose IO |
| Контакт 114 | RA15 — General purpose IO |
| Контакт 115 | RC0 — General purpose IO |
| Контакт 116 | RC1 — General purpose IO |
| Контакт 117 | RC2 — General purpose IO |
| Контакт 118 | VSS — Digital ground |
| Контакт 119 | VDD — Digital supply voltage (3.3 V) |
| Контакт 120 | RC3 — General purpose IO |
| Контакт 121 | RC4 — General purpose IO |
| Контакт 122 | RC5 — General purpose IO |
| Контакт 123 | RC6 — General purpose IO |
| Контакт 124 | RC7 — General purpose IO |
| Контакт 125 | RC8 — General purpose IO |
| Контакт 126 | RC9 — General purpose IO |
| Контакт 127 | RC10 — General purpose IO |
| Контакт 128 | RC11 — General purpose IO |
| Контакт 129 | RC12 — General purpose IO |
| Контакт 130 | RC13 — General purpose IO |
| Контакт 131 | RC14 — General purpose IO |
| Контакт 132 | RC15 — General purpose IO |
| Контакт 133 | RE0 — General purpose IO |
| Контакт 134 | RE1 — General purpose IO |
| Контакт 135 | RE2 — General purpose IO |
| Контакт 136 | RE3 — General purpose IO |
| Контакт 137 | RE4 — General purpose IO |
| Контакт 138 | RE5 — General purpose IO |
| Контакт 139 | RE6 — General purpose IO |
| Контакт 140 | RE7 — General purpose IO |
| Контакт 141 | RE8 — General purpose IO |
| Контакт 142 | RE9 — General purpose IO |
| Контакт 143 | VSS — Digital ground |
| Контакт 144 | VDD — Digital supply voltage (3.3 V) |
Типичное применение
PIC32MZ0512EFK144-I/PL подходит для 6 применениеs: Industrial IoT Gateway, Automotive HMI Cluster, USB-Connected Point-of-Sale Terminal, Motor Control and Digital Power, Connected Medical Instrumentation, Graphics HMI / Touchscreen Terminal.
Industrial IoT Gateway
The PIC32MZ0512EFK144-I/PL is well suited to industrial IoT gateways that aggregate sensor data from RS-485, CAN, UART, and Ethernet networks and forward it to cloud backhauls. Its 200 MHz MIPS32 M-class core with IEEE 754 FPU handles TLS 1.2/1.3 handshakes and JSON/MQTT serialization at line speed, and the 128 KB SRAM is sufficient to host an LWIP stack plus concurrent HTTPS client buffers. The on-chip HS USB 2.0 PHY and 10/100 Ethernet MAC enable direct connection to LTE/5G modules and wired backhaul with deterministic latency. Industrial-grade -40C to +85C operation makes it deployable in factory cabinets and outdoor enclosures.
Рекомендуется
Automotive HMI Cluster
The PIC32MZ0512EFK144-I/PL can drive automotive HMI clusters and instrument panels that need high-performance graphics plus automotive-grade connectivity. Its 200 MHz core with hardware FPU accelerates TFT-LCD frame buffer manipulation, while the dual-panel live-update Flash supports OTA firmware rollbacks - critical for functional safety. The two on-chip CAN modules and HS USB support body-domain networking and diagnostic interfaces, and the 12-bit ADC at 18 Msps handles multi-channel sensor acquisition. Designers can pair this MCU with an external TFT controller and CAN transceiver for a complete cluster reference design.
Рекомендуется
USB-Connected Point-of-Sale Terminal
The PIC32MZ0512EFK144-I/PL is an excellent MCU for USB-connected point-of-sale (POS) terminals that need HS USB device/host/OTG, secure communications, and rich peripherals. The on-chip HS USB 2.0 PHY with internal transceiver saves a costly external PHY and BOM area, while the hardware crypto engine accelerates AES for payment-card data encryption. The 144-LQFP package exposes enough GPIO for keypad scanning, LCD module control, and secure-element SPI interfaces. The 200 MHz MIPS core with FPU enables fast DESFire/EMV transaction flows and TLS to backend acquirers.
Рекомендуется
Motor Control and Digital Power
The PIC32MZ0512EFK144-I/PL can be used as the control MCU in motor drives and digital power converters (solar inverters, telecom rectifiers). Its DSP-enhanced core with four 64-bit accumulators and single-cycle MAC handles field-oriented control (FOC) loops and PFC calculations within tight PWM periods, and the 12-bit ADC at 18 Msps digitizes current/voltage feedback with sub-microsecond latency. The two CAN modules enable daisy-chained inverter communication and Modbus/PMBus gateways. Pair this MCU with gate drivers and shunt-based current sensing for complete motor-drive reference designs.
Рекомендуется
Connected Medical Instrumentation
The PIC32MZ0512EFK144-I/PL supports connected medical instrumentation designs (patient monitors, diagnostic analyzers, infusion pumps) that require deterministic real-time control plus Ethernet/USB connectivity. The 200 MHz MIPS core with hardware FPU executes DSP filters and FFTs for biosignal analysis, while the 12-bit ADC at 18 Msps digitizes ECG/EMG/PPG channels with sufficient dynamic range. Ethernet MAC and HS USB enable connectivity to hospital information systems, and the hardware crypto engine protects patient data in transit. Industrial temperature range (-40C to +85C) supports clinical and laboratory deployments.
Рекомендуется
Graphics HMI / Touchscreen Terminal
The PIC32MZ0512EFK144-I/PL is suitable as the main MCU in graphics-HMI terminals (industrial control panels, home-automation touch panels) that need a colour TFT-LCD, resistive or capacitive touch, and networking. Its 200 MHz MIPS core with FPU and DSP instructions accelerates graphics primitives (line draw, font rasterization, alpha-blending) and the 128 KB SRAM is sufficient for small frame buffers. The dual-panel live-update Flash allows field firmware upgrades for HMI panels already deployed in the field. Pair with an SPI/parallel TFT controller and external touch-sensing controller for full HMI designs.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ0512EFK144-I/PL — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ1024EFK144-I/PL | PIC32MZ0512EFE144-I/PL | PIC32MZ0512EFF144-I/PL | PIC32MZ0512EFK144-I/PH | PIC32MZ0512EFK144-E/PL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Flash Memory | 512 KB | 1024 KB (+100%) | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| FPU | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) |
| HS USB | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) | Yes (on-chip PHY) |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) |
Ключевые отличия
- Doubled Flash memory in same footprint (против PIC32MZ1024EFK144-I/PL)
- Extended temperature grade option (против PIC32MZ0512EFK144-E/PL)
- Free Flash upgrade vs same-package competitor families (против PIC32MX795F512L-80I/PF)
Заметки по проектированию
Provide a clean 3.3 V rail to all VDD pins; the PIC32MZ0512EFK144-I/PL has multiple VDD/VSS pin pairs (typically 5-6 pairs distributed around the 144-LQFP) that must each be decoupled with a 100 nF ceramic capacitor placed within 2 mm of the pin. Add a bulk 4.7-10 uF tantalum or ceramic capacitor near the supply pins. Core current peaks above 100 mA during 200 MHz operation; insufficient decoupling will cause erratic behaviour and analog ADC noise coupling.
Route the 50 MHz Ethernet MII/RMII signals as 50-ohm controlled-impedance traces on the PCB, keeping trace lengths matched (MII: +/- 50 mil). Place the external Ethernet PHY within 50 mm of the MCU and use a ground plane reference. For HS USB, route D+/D- as a 90-ohm differential pair with length matching within +/- 150 mil, and place the ESD protection array within 5 mm of the USB connector. Both interfaces are sensitive to impedance discontinuities and will fail USB-IF or IEEE 802.3 compliance otherwise.
At 200 MHz full-load operation with all peripherals active, the PIC32MZ0512EFK144-I/PL dissipates approximately 0.5-0.8 W. The 144-LQFP package has a thermal resistance (theta_JA) of approximately 35-40 C/W on a standard 4-layer JEDEC test PCB. Estimated using theta_JA=38 C/W and P=0.7 W gives a junction temperature rise of 26.6 C above ambient; safe inside the industrial -40C to +85C envelope but require attention if the part is embedded in a sealed enclosure with no airflow.
Do not skip configuration of the on-chip FPU before using floating-point math - enabled by default but invalidated if FPUEN bit is cleared. Verify the dual-panel Flash live-update procedure using Microchip's bootloader library (AN1388) before field deployment; a wrong sequence can brick the device. Always allocate a non-zero stack to the Main Stack pointer (Master Stack) in XC32 projects; PIC32MZ uses separate Master and Process stacks and a zero-initialised MSP will silently fault on first interrupt.
Allocate generous copper pour under the 144-LQFP package thermal pad area; even though this LQFP has no exposed pad, having a solid ground and 3.3 V pours on inner layers reduces inductance on VDD/VSS pairs and improves ADC noise performance by 3-5 dB. Keep analog ADC traces away from digital switching signals (PWM, Ethernet, USB) and route analog ground separately back to a star-ground point near the MCU VSS pin to avoid ground bounce coupling into ADC samples.
Информация о соответствии
RoHS and lead-free per Microchip product page; this -I grade industrial variant is not AEC-Q100 qualified - select -E extended variant for automotive-adjacent designs.
