PIC32MZ1024EFE100T-I/GJX - 200MHz 32-bit MCU, 1MB Flash, TFBGA-100 | Microchip
Référence : PIC32MZ1024EFE100T-I/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.92 | $4 460,00 |
| 1 000 | $8.1 | $8 100,00 |
PIC32MZ1024EFE100T-I/GJX Présentation
A 32-bit MCU (Microcontroller Unit) is an integrated circuit containing a CPU core, Flash program memory, SRAM, and programmable peripherals on a single die. Within the taxonomy, PIC32MZ EF devices sit inside the broader category of MIPS32 M-Class microcontrollers, which belong to the larger family of RISC microcontrollers, then SoCs (System-on-Chip), and ultimately integrated circuits. Microchip's PIC32 line bridges legacy 8/16-bit PIC architectures with 32-bit ARM-class performance, while remaining code-compatible with the MPLAB Harmony ecosystem.
Key features of this part include a MIPS32 M-Class core with hardware FPU and DSP extensions, 1 MB Flash (1M x 8), 256 KB SRAM, USB 2.0 High-Speed (PHY on-chip), 10/100 Mbps Ethernet MAC, SQI for high-throughput external memory or display interfaces, and multiple UART/SPI/I2C/CAN ports. The device supports up to 200 MHz CPU clock with 83 DMIPS per core and integrates a 12-bit ADC with up to 42 analog inputs depending on package variant.
The PIC32MZ EF family uses a superscalar MIPS core, dual-bank Flash with live update capability, and a peripheral bus matrix that allows simultaneous DMA and CPU accesses. The 7x7 mm TFBGA-100 footprint is one of the smallest 100-pin options in this family, enabling high-density board designs while still exposing most peripherals of the larger 144-pin variants.
Typical applications include industrial Ethernet gateways, USB peripherals and human-interface devices, IoT edge nodes, graphics/HMI controllers with external display, and motor-control subsystems. The combination of USB-HS + ENET + SQI makes the part particularly attractive for protocol-conversion and connectivity bridge designs in industrial automation.
When designing with this device, allocate PCB area for the TFBGA-100 land pattern and use Microchip's recommended 4-layer stack-up. Decoupling requires 0.1 µF capacitors on every AVDD/DVDD pair and a bulk 4.7 µF tantalum near the core supply. Ensure firmware is built with the matching XC32 compiler version for the EF silicon revision to avoid errata workarounds.
This page synthesizes distributor pricing, drop-in same-package alternatives from the same PIC32MZ EF family, and practical design notes not found in the manufacturer datasheet summary.
Alternatives de remplacement direct pour PIC32MZ1024EFE100T-I/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFE100T-I/GJX (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core, FPU, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFE100T-E/GJX
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →PIC32MZ1024EFE100-E/GJX
✅ Remplacement direct✓ En stock
$5.38 / unité
Voir la fiche technique →PIC32MZ1024EFH100T-I/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFF100T-I/GJX
✅ Remplacement direct✓ En stock
$9.5 / unité
Voir la fiche technique →PIC32MZ0512EFE100T-I/GJX
✅ Remplacement direct✓ En stock
$8.45 / unité
Voir la fiche technique →PIC32MZ1024EFE100T-I/GJX Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M-Class |
| Core Architecture | 32-bit RISC with FPU and DSP |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Nombre de broches | 100 |
| Boîtier | 100-TFBGA (7x7 mm) |
| USB Interface | USB 2.0 High-Speed (on-chip PHY) |
| Ethernet | 10/100 Mbps MAC (ENET) |
| Serial Quad Interface (SQI) | Yes |
| Température de fonctionnement | -40C to +85C (Industrial) |
| ADC | 12-bit |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
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Applications typiques
PIC32MZ1024EFE100T-I/GJX convient pour 7 applications: Industrial Ethernet Gateway, USB Human Interface Device (HID), IoT Edge Node with Sensor Aggregation, Graphics HMI Controller, Motor Control Subsystem, Point-of-Sale / Retail Terminal, Medical Monitoring Data Logger.
Industrial Ethernet Gateway
The PIC32MZ1024EFE100T-I/GJX is well suited for industrial Ethernet gateways because it integrates a 10/100 Mbps MAC (ENET) with DMA support, plus 256 KB SRAM that comfortably runs a TCP/IP stack such as lwIP or Microchip's Harmony Net. The 200 MHz MIPS32 core handles Modbus TCP, EtherNet/IP, or PROFINET packet processing in real time, while the 1 MB Flash stores the full application, web UI, and TLS certificates. Engineers commonly pair the part with an external PHY like the KSZ8061 for a complete 2-port switch plus gateway design.
Recommandé
USB Human Interface Device (HID)
With its integrated USB 2.0 High-Speed PHY and 1 MB Flash, the PIC32MZ1024EFE100T-I/GJX is ideal for USB HID peripherals such as industrial keyboards, barcode scanners, and programmable HMI panels. The on-chip PHY eliminates external USB transceivers, simplifying BOM and shrinking PCB area in the 7x7 mm TFBGA footprint. The 256 KB SRAM supports USB descriptor tables plus HID report buffers without external memory, while the 200 MHz core manages polling at 1 ms intervals even under heavy HID report traffic.
Recommandé
IoT Edge Node with Sensor Aggregation
The PIC32MZ1024EFE100T-I/GJX is a strong fit for IoT edge nodes that aggregate multiple sensors (SPI, I2C, UART, analog) and forward data over Ethernet or USB. Its 12-bit ADC with up to 42 input channels (per family datasheet) handles analog sensor readout, while multiple UART/SPI/I2C ports connect to digital sensors. The 256 KB SRAM supports local data buffering for offline periods, and the 1 MB Flash stores MQTT/CoAP client firmware plus TLS libraries for secure gateway uploads.
Recommandé
Graphics HMI Controller
For graphics HMI panels, the PIC32MZ1024EFE100T-I/GJX drives TFT LCDs via the SQI interface (used as a display bus or for display-buffer Flash) while the 200 MHz core handles graphics rendering with hardware FPU. The 256 KB SRAM stores framebuffer tiles, and the 1 MB Flash holds GUI assets and font tables. The integrated Ethernet enables remote HMI monitoring and firmware updates, making the part suitable for factory-floor operator panels up to 480x272 resolution.
Recommandé
Motor Control Subsystem
The PIC32MZ1024EFE100T-I/GJX is used in motor control subsystems where it generates PWM signals (via motor-control PWM peripherals), samples phase currents via the 12-bit ADC, and runs FOC (Field-Oriented Control) algorithms on its MIPS32 core with hardware FPU. The 200 MHz clock supports 20 kHz PWM with full PID loops and sensorless estimators. The integrated Ethernet allows real-time motor telemetry streaming to factory MES systems for predictive maintenance.
Recommandé
Point-of-Sale / Retail Terminal
POS terminals benefit from the PIC32MZ1024EFE100T-I/GJX combination of USB-HS (for peripherals like barcode scanners and receipt printers), Ethernet (for payment gateway connectivity), and SQI (for fast external Flash holding the OS image and transaction logs). The 1 MB Flash stores the embedded Linux or RTOS application, and 256 KB SRAM supports cryptographic operations for EMV chip-card readers. The industrial temperature grade ensures reliable operation in retail back-office environments.
Recommandé
Medical Monitoring Data Logger
For medical monitoring data loggers (non-life-support), the PIC32MZ1024EFE100T-I/GJX provides USB-HS for fast data offload, Ethernet for hospital network uploads, and ample SRAM to buffer patient waveform data. The 12-bit ADC samples physiological signals at sufficient resolution for non-diagnostic monitoring, and the 1 MB Flash stores log files between offloads. The industrial temperature range covers typical clinical and ambulatory environments, while the small TFBGA package fits compact wearable enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFE100T-I/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFE100T-E/GJX | PIC32MZ1024EFE100-E/GJX | PIC32MZ1024EFH100T-I/GJX | PIC32MZ1024EFF100T-I/GJX | PIC32MZ0512EFE100T-I/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Core Architecture | MIPS32 M-Class, 32-bit | MIPS32 M-Class, 32-bit | MIPS32 M-Class, 32-bit | MIPS32 M-Class, 32-bit | MIPS32 M-Class, 32-bit | MIPS32 M-Class, 32-bit |
| Maximum CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 2 MB | 2 MB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 512 KB | 512 KB | 128 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| USB Interface | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
Principaux différenciateurs
- Extended temperature range option in same footprint (vs PIC32MZ1024EFE100T-I/GJX vs PIC32MZ1024EFE100T-E/GJX)
- Drop-in memory upgrade path (vs PIC32MZ1024EFE100T-I/GJX vs PIC32MZ1024EFH100T-I/GJX)
- Cost-down memory-reduced variant (vs PIC32MZ1024EFE100T-I/GJX vs PIC32MZ0512EFE100T-I/GJX)
Notes de conception
The TFBGA-100 (7x7 mm) package requires a 4-layer PCB with a continuous ground plane under the BGA array. Microchip's recommended land pattern uses 0.4 mm ball pitch with NSMD (non-solder mask defined) pads. Use 0.1 mm (4 mil) trace-and-space design rules between BGA escape traces. Add 4-6 via-in-pad (filled and capped) for the inner power balls to improve thermal and electrical performance.
Place one 0.1 µF ceramic decoupling capacitor within 2 mm of every DVDD/AVDD ball pair, plus a 4.7 µF bulk tantalum or polymer capacitor near the core supply. Separate analog and digital ground planes with a single-point tie under the MCU. Estimated: total decoupling budget at 200 MHz core clock is approximately 12-16 ceramic caps to keep ripple within 3% of nominal supply. Do not share decoupling capacitors between analog and digital domains.
Estimated: at 200 MHz CPU clock with all peripherals active, the PIC32MZ1024EFE100T-I/GJX dissipates approximately 0.6-0.9 W depending on peripheral use. The TFBGA-100 has a theta_JA of approximately 30-35 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of about 20-30 C above ambient. For industrial (-40C to +85C) operation, design for ambient temperatures up to 70C to keep Tj below 100C and apply thermal vias under the central BGA balls to spread heat into the inner ground plane.
Do not assume that 'EFE100' and 'EFH100' parts share identical firmware - the EFH variant has 2 MB Flash with a different memory map, requiring linker script updates when porting. Always match the XC32 compiler version to the silicon revision specified in the errata. The USB-HS PHY requires a precise 12 MHz reference clock; using an inaccurate crystal causes USB compliance failures that are difficult to debug post-layout.
Informations de conformité
RoHS and lead-free confirmed per Microchip product page. Not AEC-Q100 qualified - choose the E/GJX variant for applications that need to push beyond 85C, but verify AEC-Q100 status separately. Halogen-free status not specified in the verified data; consult Microchip directly for confirmation.