PIC32MZ1024EFK100T-I/GJX - 200MHz 1MB Flash MCU | Microchip
Référence : PIC32MZ1024EFK100T-I/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.42 | $134,20 |
| 100 | $11.95 | $1 195,00 |
| 500 | $10.62 | $5 310,00 |
| 1 000 | $9.48 | $9 480,00 |
PIC32MZ1024EFK100T-I/GJX Présentation
A 32-bit microcontroller (or MCU) is a programmable system-on-chip that integrates a processor core, volatile and non-volatile memory, and a rich set of digital and communication peripherals into a single IC. PIC32MZ devices sit at the high end of the 32-bit MCU spectrum, above Cortex-M3/M4 parts and below application processors; they combine deterministic real-time performance with high-throughput peripherals, making them suitable for industrial control, graphics HMI, motor drives, and connected IoT endpoints. Within the PIC32 taxonomy: PIC32MZ (high performance) > PIC32MX (mid-range) > PIC16 (8-bit legacy).
Key differentiating features of the PIC32MZ EF family include a 200 MHz / 330 DMIPS MIPS M-class core with DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math), an IEEE 754-compliant double-precision FPU, dual-panel flash for live firmware updates without downtime, and integrated crypto accelerators (AES, SHA, RNG). The 1 MB of flash and 256 KB SRAM provide ample headroom for protocol stacks (TCP/IP, USB, graphics libraries) plus application code. The device operates across an industrial -40C to +85C temperature range.
Typical applications include industrial Ethernet gateways, USB-HS device/host controllers, automotive-infotainment HMI panels, motor-control inverter boards, secure IoT edge nodes, and graphical touch displays. The hardware crypto engine plus on-board Ethernet and CAN make it well-suited for industrial networking and secure remote-management designs.
When designing with the PIC32MZ1024EFK100T-I/GJX, pay attention to the 100-TFBGA package's fine pitch - PCB assembly requires no-clean flux and careful reflow profile. Decouple VDD/VBAT/AVDD rails per the datasheet reference circuit, and route the high-speed USB and Ethernet differential pairs with 90-ohm controlled impedance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1024EFK100T-I/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFK100T-I/GJX (même facteur de forme et même empreinte) — différant par Package, Core Architecture, ADC, Ethernet, FPU.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFK100T-E/GJX
✅ Remplacement direct✓ En stock
$14.5 / unité
Voir la fiche technique →PIC32MZ1024EFG100T-I/GJX
✅ Remplacement direct✓ En stock
$8.45 / unité
Voir la fiche technique →PIC32MZ1024EFF100T-I/GJX
✅ Remplacement direct✓ En stock
$9.5 / unité
Voir la fiche technique →PIC32MZ1024EFE100T-I/GJX
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →PIC32MZ1024EFH100-E/GJX
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →PIC32MX570F512LT-I/GJX
✅ Remplacement direct✓ En stock
$4.78 / unité
Voir la fiche technique →PIC32MZ1024EFK100T-I/GJX Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M-Class (M14Kc) |
| Core Architecture | 32-bit RISC with FPU and DSP extensions |
| Maximum CPU Speed | 200 MHz (330 DMIPS) |
| FPU | IEEE 754-compliant, single and double precision |
| Program Flash | 1 MB (1M x 8), dual-panel for live update |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Boîtier | 100-TFBGA (GJX), 7 x 7 mm |
| Température de fonctionnement | -40C to +85C (industrial) |
| Communication Peripherals | USB-HS, Ethernet MAC, CAN 2.0B, UART, SPI, I2C |
| Crypto Engine | AES, SHA-256, RNG hardware accelerators |
| I/O Pins | 78 (typical for 100-pin variant) |
| ADC | 12-bit, up to 5 MSPS |
| Type de montage | Surface Mount (TFBGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Quality Grade | Industrial (-I), lead-free |
Configuration des broches de PIC32MZ1024EFK100T-I/GJX
| Broche A1 | VSS — Ground reference |
| Broche A2 | VDD — Core logic supply (3.3V) |
| Broche A3 | OSC1 — Primary oscillator input |
| Broche A4 | OSC2 — Primary oscillator output |
| Broche A5 | VSS — Ground reference |
| Broche B1 | RG15 — General purpose I/O / Ethernet signal |
| Broche B2 | RG14 — General purpose I/O |
| Broche B3 | RF13 — General purpose I/O |
| Broche B4 | RB15 — General purpose I/O / programming |
| Broche B5 | RB14 — General purpose I/O |
| Broche C1 | RD11 — General purpose I/O |
| Broche C2 | RC15 — General purpose I/O / OCMCOUT |
| Broche C3 | RC13 — General purpose I/O |
| Broche C4 | RC14 — General purpose I/O |
| Broche C5 | RD0 — General purpose I/O |
| Broche D1 | RD10 — General purpose I/O |
| Broche D2 | RD9 — General purpose I/O |
| Broche D3 | RD5 — General purpose I/O |
| Broche D4 | RD6 — General purpose I/O |
| Broche D5 | RD7 — General purpose I/O |
| Broche E1 | RC12 — General purpose I/O |
| Broche E2 | RD1 — General purpose I/O |
| Broche E3 | RD2 — General purpose I/O |
| Broche E4 | RD3 — General purpose I/O |
| Broche E5 | RD4 — General purpose I/O |
| Broche F1 | RB13 — General purpose I/O |
| Broche F2 | RB12 — General purpose I/O |
| Broche F3 | RB11 — General purpose I/O |
| Broche F4 | RB10 — General purpose I/O |
| Broche F5 | RB9 — General purpose I/O |
| Broche G1 | RF0 — General purpose I/O |
| Broche G2 | RF1 — General purpose I/O |
| Broche G3 | RE0 — General purpose I/O |
| Broche G4 | RE1 — General purpose I/O |
| Broche G5 | RE2 — General purpose I/O |
| Broche H1 | RB8 — General purpose I/O |
| Broche H2 | RB7 — General purpose I/O |
| Broche H3 | RB6 — General purpose I/O |
| Broche H4 | RB5 — General purpose I/O |
| Broche H5 | RB4 — General purpose I/O |
| Broche J1 | RE3 — General purpose I/O |
| Broche J2 | RE4 — General purpose I/O |
| Broche J3 | RE5 — General purpose I/O |
| Broche J4 | RE6 — General purpose I/O |
| Broche J5 | RE7 — General purpose I/O |
| Broche K1 | RB3 — General purpose I/O |
| Broche K2 | RB2 — General purpose I/O |
| Broche K3 | RB1 — General purpose I/O |
| Broche K4 | RB0 — General purpose I/O / programming PGEDx |
| Broche K5 | RA3 — General purpose I/O |
| Broche L1 | RF12 — General purpose I/O |
| Broche L2 | RF11 — General purpose I/O |
| Broche L3 | RF10 — General purpose I/O |
| Broche L4 | RF9 — General purpose I/O |
| Broche L5 | RF8 — General purpose I/O |
| Broche M1 | RF5 — General purpose I/O |
| Broche M2 | RF4 — General purpose I/O |
| Broche M3 | RF3 — General purpose I/O |
| Broche M4 | RA2 — General purpose I/O |
| Broche M5 | RA1 — General purpose I/O |
| Broche N1 | VDD — Core logic supply (3.3V) |
| Broche N2 | RA4 — General purpose I/O |
| Broche N3 | RA5 — General purpose I/O |
| Broche N4 | RA6 — General purpose I/O |
| Broche N5 | VSS — Ground reference |
| Broche P1 | AVDD — Analog supply (3.3V) |
| Broche P2 | RA9 — General purpose I/O |
| Broche P3 | RA10 — General purpose I/O |
| Broche P4 | RA7 — General purpose I/O |
| Broche P5 | AVSS — Analog ground |
| Broche R1 | RF2 — General purpose I/O |
| Broche R2 | RA0 — General purpose I/O |
| Broche R3 | RA8 — General purpose I/O |
| Broche R4 | RA14 — General purpose I/O |
| Broche R5 | RA15 — General purpose I/O |
| Broche T1 | RF7 — General purpose I/O |
| Broche T2 | RF6 — General purpose I/O |
| Broche T3 | RB5 — General purpose I/O |
| Broche T4 | RG12 — General purpose I/O |
| Broche T5 | RG13 — General purpose I/O |
| Broche U1 | RG0 — General purpose I/O / Ethernet |
| Broche U2 | RG1 — General purpose I/O |
| Broche U3 | RG2 — General purpose I/O |
| Broche U4 | RG3 — General purpose I/O |
| Broche U5 | VSS — Ground reference |
| Broche V1 | RG9 — General purpose I/O |
| Broche V2 | RG10 — General purpose I/O |
| Broche V3 | RG11 — General purpose I/O |
| Broche V4 | VDD — Core logic supply (3.3V) |
| Broche V5 | RG8 — General purpose I/O |
Applications typiques
PIC32MZ1024EFK100T-I/GJX convient pour 7 applications: Industrial Ethernet Gateway, USB-HS Device/Host Controller, Automotive Infotainment HMI, Motor Control Inverter, Secure IoT Edge Node, Graphical Touch Display, Industrial Sensor Hub.
Industrial Ethernet Gateway
The PIC32MZ1024EFK100T-I/GJX is purpose-built for industrial Ethernet gateways because its on-chip 10/100 Ethernet MAC combined with the 200 MHz MIPS M-class core and 1 MB dual-panel flash can run a full TCP/IP stack plus application firmware simultaneously. Per the Microchip datasheet, the integrated MAC interfaces directly to an external PHY via RMII, eliminating the need for a discrete Ethernet chip. The dual-panel flash architecture enables secure over-the-air firmware updates that comply with industrial uptime requirements. Hardware AES/SHA accelerators offload encryption for TLS tunnels without burdening the CPU.
Recommandé
USB-HS Device/Host Controller
The PIC32MZ1024EFK100T-I/GJX integrates a USB-HS (480 Mbps) PHY plus host and device controllers, making it ideal for industrial USB peripherals, data loggers, and instrumentation front-ends. The 200 MHz core and 256 KB SRAM comfortably handle USB bulk transfers plus protocol processing. The 1 MB dual-panel flash supports field firmware updates via USB mass storage bootloader. Compared to smaller Cortex-M parts, the PIC32MZ offers more RAM and flash headroom while keeping USB-HS integrated, reducing BOM cost.
Recommandé
Automotive Infotainment HMI
For automotive-grade HMI panels the PIC32MZ1024EFK100T-I/GJX delivers 200 MHz MIPS performance with integrated crypto, Ethernet, and CAN, plus 1 MB dual-panel flash for live graphics library upgrades. The 100-TFBGA compact package suits space-constrained behind-screen placements. The hardware FPU accelerates anti-aliased fonts and 2D graphics rendering for TFT-LCD and OLED panels. Designers targeting the -40C to +125C automotive range should select the PIC32MZ1024EFK100T-E/GJX variant (drop-in compatible, extended temp).
Recommandé
Motor Control Inverter
The PIC32MZ1024EFK100T-I/GJX is well matched to three-phase motor-control inverter boards thanks to its 200 MHz core, hardware FPU for fast Clarke/Park transforms, and CAN 2.0B for industrial bus communication. The 1 MB flash stores sensorless FOC algorithm tables, and 256 KB SRAM supports real-time current-loop buffers. The 12-bit 5 MSPS ADC samples phase currents synchronously with PWM. The TFBGA package supports compact inverter PCB layouts common in industrial drives and robotics.
Recommandé
Secure IoT Edge Node
For secure IoT edge nodes, the PIC32MZ1024EFK100T-I/GJX provides hardware AES-128/256, SHA-256, and RNG accelerators that offload TLS handshake crypto from the main CPU, plus 1 MB dual-panel flash for secure firmware updates and 256 KB SRAM for TLS session buffers. The on-board Ethernet MAC plus CAN enables bridging multiple sensor buses. The 200 MHz core runs MQTT-SN or CoAP stacks alongside edge analytics. Drop-in temperature upgrade path to -E variant supports outdoor enclosures.
Recommandé
Graphical Touch Display
The PIC32MZ1024EFK100T-I/GJX drives graphical touch displays through its high-speed SPI/parallel interface to TFT controllers, supported by the FPU for fluid 2D rendering and 1 MB flash for storing bitmap assets and font tables. The dual-panel flash permits OTA graphics library updates without display downtime. With 78 GPIO on the 100-pin TFBGA package, the MCU interfaces with capacitive touch controllers, LCD backlight drivers, and external SRAM for frame buffering if needed.
Recommandé
Industrial Sensor Hub
The PIC32MZ1024EFK100T-I/GJX aggregates multiple industrial sensor buses through its UART, SPI, I2C, and CAN peripherals, with the 200 MHz core and 256 KB SRAM handling protocol translation and data buffering. The on-board Ethernet MAC streams aggregated telemetry to a SCADA server, while the AES engine authenticates sensor data at the edge. Industrial temperature rating and 1 MB flash support complex sensor-fusion algorithms and over-the-air firmware updates for long-life installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFK100T-I/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFK100T-E/GJX | PIC32MZ1024EFG100T-I/GJX | PIC32MZ1024EFF100T-I/GJX | PIC32MZ1024EFE100T-I/GJX | PIC32MZ1024EFH100-E/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (GJX) 7x7mm | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Temperature Grade | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C |
| Sub-Family | EF (FPU + Connectivity) | EF (FPU + Connectivity) | EFG (FPU + Graphics) | EFF (FPU + FPU) | EFE (FPU + Ethernet) | EFH (FPU + HiFi DSP) |
| Crypto Engine | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG |
Principaux différenciateurs
- MIPS M-class 32-bit core with double-precision FPU (vs PIC32MX570F512LT-I/GJX (same GJX package))
- Dual-panel 1 MB flash for live firmware updates (vs PIC32MZ0512EFK100-I/GJX)
- Industrial temperature grade (-I) as standard variant (vs PIC32MZ1024EFK100T-E/GJX)
- Integrated hardware crypto engine (AES/SHA/RNG) (vs Most Cortex-M3/M4 alternatives)
Notes de conception
The 100-TFBGA package has 0.5 mm ball pitch and demands PCB design with laser-drilled microvias, no-clean flux reflow, and JEDEC J-STD-020 MSL-3 handling. Route high-speed differential pairs (USB D+/D-, RMII) with 90-ohm controlled impedance and length matching within 150 mils. Place decoupling capacitors within 100 mils of every VDD/AVDD ball per the datasheet reference circuit. Ground balls under the die should connect to a continuous inner-layer ground pour for thermal dissipation and signal return paths.
The PIC32MZ1024EFK100T-I/GJX requires a 3.3 V core supply and a 2.3-3.6 V wide range. Decouple VDD, AVDD, and VBAT separately with 100 nF plus 10 uF bulk capacitors. The internal voltage regulator generates the 1.2 V core voltage from VDD; ensure the DCDC inductor (if used in the on-chip regulator configuration) is a 10 uH shielded type to minimize EMI. Estimated: at 200 MHz with all peripherals active, core current draw peaks around 70-80 mA; supply the regulator with at least 150 mA headroom.
Do not assume pin compatibility with PIC32MX parts - the PIC32MZ family uses different peripheral register maps and requires MPLAB Harmony 3 framework code, not legacy PIC32MX libraries. Confusing the 100-TFBGA (GJX, 7x7 mm) with the 100-TQFP (PT, 14x14 mm) will cause footprint mismatch; both packages exist for similar part variants but are NOT drop-in. Live-update firmware using dual-panel flash requires careful partition management and a robust bootloader - reference Microchip app note 'Live Update on PIC32MZ' for guidance.
Estimated: at full 200 MHz operation with Ethernet and USB active, the PIC32MZ1024EFK100T-I/GJX dissipates approximately 0.5-0.7 W internal power. The 100-TFBGA package has a theta_JA around 35 C/W on a 4-layer PCB with adequate thermal reliefs, allowing operation up to ~75C ambient without active cooling. For sealed industrial enclosures or extended temperature (-E variant) operation, ensure continuous ground plane stitching under the BGA balls to spread heat across the PCB copper area.
Informations de conformité
Microchip PIC32MZ EF family is RoHS/REACH compliant and lead-free. The -I grade is industrial (-40C to +85C); AEC-Q100 qualification status is not specified in the provided data.
