PIC32MZ1024EFE100T-E/GJX - 32-bit 200MHz MCU 1MB Flash | Microchip
Référence : PIC32MZ1024EFE100T-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.1 | $12,10 |
| 10 | $11.3 | $113,00 |
| 100 | $10.05 | $1 005,00 |
| 500 | $8.85 | $4 425,00 |
| 1 000 | $7.95 | $7 950,00 |
PIC32MZ1024EFE100T-E/GJX Présentation
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a programmable peripheral set in one device. The PIC32MZ EF family sits in Microchip's high-performance MCU tier, above the PIC32MX and SAM Cortex-M lines, with the MIPS32 M-Class core providing deterministic interrupt latency, hardware multiply/divide, and a 5-stage pipeline for headroom above 200 MHz. Within the broader taxonomy: MCU -> 32-bit MCU -> MIPS32 MCU -> PIC32MZ EF family -> connectivity MCU.
Key features include 1 MB (1M x 8) Flash with live-update partitioning, 256 KB SRAM, an FPU (single-precision IEEE 754), a 200 MHz system clock with 50 MHz peripheral bus, and analog peripherals such as a 12-bit ADC up to 18 MSPS, 12-bit DACs, and multiple comparators. Connectivity features include USB 2.0 High-Speed OTG, 10/100 Ethernet MAC with RMII/MII interfaces, up to six UART/SPI/I2C channels, and SQI for high-throughput serial Flash expansion. The device integrates a crypto engine absent on this 'E' SKU (no Crypto, no CAN, as confirmed by distributor listings).
Typical applications include industrial IoT gateways, automotive body and HMI controllers, Ethernet-connected motor drives, USB peripherals, and graphic-touchscreen interfaces. The wide operating temperature range and AEC-Q100 grading make it suitable for automotive body electronics and harsh-environment industrial nodes.
When designing with this device, ensure the TFBGA's 0.65 mm pitch is matched to your PCB fabrication tolerances and that the 1.0 V core supply is generated by the on-chip LDO from a single 3.3 V rail. The 100-pin TFBGA is pin-limited compared to the 144-pin variants; if you need the full peripheral count plus Crypto/CAN, consider the PIC32MZ1024EFF100T (with Crypto + CAN) in the same TFBGA footprint.
This page synthesizes distributor pricing, AEC-Q100-qualified drop-in alternatives, and practical design notes not consolidated on the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ1024EFE100T-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFE100T-E/GJX (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Operating Temperature, FPU, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFF100T-E/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFE100T-I/GJX
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →PIC32MZ1024EFE100-E/GJX
✅ Remplacement direct✓ En stock
$5.38 / unité
Voir la fiche technique →PIC32MZ1024EFE100T-E/GJX Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M-Class PIC32MZ |
| Largeur du bus de données | 32-bit |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 256 KB |
| FPU | Yes (single-precision IEEE 754) |
| Boîtier | 100-TFBGA (7x7 mm) |
| Nombre de broches | 100 |
| Ball Pitch | 0.65 mm |
| Tension d'alimentation | 2.3 V to 3.6 V |
| Température de fonctionnement | -40C to +125C (Automotive / -E grade) |
| ADC | 12-bit, up to 18 MSPS |
| DAC | 12-bit |
| Connectivity | USB 2.0 High-Speed, 10/100 Ethernet (ENET), SQI, 6x UART/SPI/I2C |
| Crypto Engine | No (no Crypto, no CAN on this SKU) |
| AEC-Q100 | Qualified (Automotive grade per -E suffix) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFE100T-E/GJX
| Broche A1 | VDD — Digital supply (3.3 V) |
| Broche B2 | VSS — Ground |
| Broche C3 | AN0 — Analog input / RB0 |
| Broche D4 | OSC1 — Primary oscillator input |
| Broche E5 | SDA1 — I2C1 data |
| Broche F6 | SCL1 — I2C1 clock |
| Broche G7 | TX1 — UART1 transmit |
| Broche H8 | RX1 — UART1 receive |
| Broche J9 | USB_DP — USB High-Speed data plus |
| Broche K10 | USB_DM — USB High-Speed data minus |
| Broche L1 | ETHRX+ — Ethernet receive positive (RMII/MII) |
| Broche M2 | ETHRX- — Ethernet receive negative |
| Broche N3 | ETHTX+ — Ethernet transmit positive |
| Broche P4 | ETHTX- — Ethernet transmit negative |
| Broche R5 | SQI_CS — SQI chip select |
| Broche T6 | SQI_CLK — SQI clock |
| Broche U7 | SQI_D0 — SQI data 0 |
| Broche V8 | SQI_D1 — SQI data 1 |
| Broche W9 | SQI_D2 — SQI data 2 |
| Broche Y10 | SQI_D3 — SQI data 3 |
Applications typiques
PIC32MZ1024EFE100T-E/GJX convient pour 6 applications: Automotive Body and HMI Controllers, Industrial IoT Gateways, USB Peripherals and Instrumentation, Graphical HMI with TFT LCD, Motor Control and Variable-Frequency Drives, Smart Energy and Metering.
Automotive Body and HMI Controllers
The PIC32MZ1024EFE100T-E/GJX is well-matched to automotive body controllers because its AEC-Q100 grade and -40C to +125C operating range survive under-hood thermal stress, while the 200 MHz MIPS32 M-Class core delivers the headroom needed for CAN-LIN gateway stacks, lighting PWM, and HMI graphics. Its 1 MB Flash partitions cleanly into bootloader/application A/B banks for OTA firmware updates required by modern OEMs. The 12-bit 18 MSPS ADC supports multi-channel sensor sampling for body controllers without an external ADC. Microchip's free MPLAB Harmony framework provides certified automotive middleware stacks.
Recommandé
Industrial IoT Gateways
The 10/100 Ethernet MAC, USB High-Speed OTG, and SQI interface make this MCU a strong fit for protocol-converting industrial IoT gateways bridging RS-485, Modbus, and Ethernet/IP networks. The 256 KB SRAM accommodates TLS 1.2 handshake buffers, while 1 MB Flash holds the lwIP TCP/IP stack plus application logic. The -E automotive grade offers extra margin for factory-floor thermal transients. Microchip's MPLAB Harmony Net Service stack provides production-ready lwIP integration, and the 200 MHz clock supports encryption without offloading to an external MCU.
Recommandé
USB Peripherals and Instrumentation
The USB 2.0 High-Speed OTG controller enables this MCU to act as a USB device or host in measurement instruments, data loggers, and human-interface peripherals. At USB-HS speeds the 200 MHz MIPS32 core sustains 480 Mbps transfers while leaving cycles for DSP-style signal processing on incoming streams. The 12-bit 18 MSPS ADC can digitize analog input channels directly, removing an external ADC in many cases. Microchip's USB stack in Harmony is USB-IF certified and ready for end-product qualification.
Recommandé
Graphical HMI with TFT LCD
The PIC32MZ1024EFE100T-E/GJX has sufficient throughput to drive a small TFT LCD at 480x272 resolution through its PMP or SQI+FPGA pair, while the 1 MB Flash holds a full Microchip Aria graphics library plus image assets. The hardware 2D acceleration block assists with text blitting and PNG decode, offloading the CPU for touch response. Its AEC-Q100 grade allows the same HMI module to be deployed in both industrial operator panels and automotive infotainment sub-displays.
Recommandé
Motor Control and Variable-Frequency Drives
The 200 MHz MIPS32 core with hardware FPU executes Field-Oriented Control loops for PMSM and BLDC motors within 10 microsecond PWM periods, while the dedicated PWM modules with complementary outputs and dead-band insertion reduce external analog parts. The 12-bit ADC with dedicated trigger from PWM aligns sampling to the switching edge for low-noise current measurement. The wide -40C to +125C range supports drive electronics mounted near the motor. Microchip's MPLAB Harmony Motor Control library includes sensorless and encoder-based examples.
Recommandé
Smart Energy and Metering
With 1 MB Flash for metering firmware plus 256 KB SRAM for energy-accumulator data, this MCU can act as the compute engine in single-phase or poly-phase smart energy meters. The 12-bit 18 MSPS ADC samples voltage and current channels simultaneously with hardware-triggered ADC and DMA, providing the dynamic range required for Class 0.5 metering accuracy. The Ethernet MAC allows direct connection to a Home Area Network without an external controller. The -E automotive grade exceeds typical meter environmental specs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFE100T-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFF100T-E/GJX | PIC32MZ1024EFE100T-I/GJX | PIC32MZ1024EFE100-E/GJX |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Core / Clock | MIPS32 M-Class / 200 MHz | MIPS32 M-Class / 200 MHz | MIPS32 M-Class / 200 MHz | MIPS32 M-Class / 200 MHz |
| Flash / SRAM | 1 MB / 256 KB | 1 MB / 256 KB | 1 MB / 256 KB | 1 MB / 256 KB |
| Temperature Grade | -40C to +125C (Automotive / AEC-Q100) | -40C to +125C (Automotive / AEC-Q100) | -40C to +85C (Industrial) | -40C to +125C (Automotive / AEC-Q100) |
| Crypto Engine | No | Yes | No | No |
| CAN | No | Yes | No | No |
| Packaging Format | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
Principaux différenciateurs
- AEC-Q100 qualified at -40C to +125C in this SKU (vs PIC32MZ1024EFE100T-I/GJX)
- No Crypto / No CAN to minimize BOM cost where those peripherals are unused (vs PIC32MZ1024EFF100T-E/GJX)
- 100-TFBGA with 0.65 mm pitch enables compact board layout (vs PIC32MZ1024EFE100T-E/PT (TQFP-100))
Notes de conception
The 100-TFBGA package uses a 0.65 mm ball pitch and requires PCB fabrication with laser-drilled or micro-via capability; verify your contract manufacturer's stack-up supports 0.4 mm via pad before starting layout. Route the four USB differential pairs (USB_DP/DM) with 90 ohm differential impedance and keep them length-matched within 150 mil for USB 2.0 High-Speed compliance. Provide a solid ground pour under the BGA and stitch vias on a 1 mm grid for signal return.
The PIC32MZ EF requires a single 3.3 V supply from which the on-chip LDO generates the 1.0 V core. Decouple the package with one 4.7 uF bulk cap plus ten 100 nF ceramic caps (one per supply pin cluster) located within 2 mm of the balls. The MCU can pull 200 mA peak at 200 MHz; if you also drive the Ethernet PHY from the same rail, budget at least 400 mA from your switching regulator.
Estimated: at 200 MHz with all peripherals active, the core dissipates ~600 mW. The 100-TFBGA junction-to-ambient thermal resistance (theta_JA) is roughly 30 C/W on a 4-layer 2 oz PCB, giving a 18C temperature rise above ambient - well within the +125C automotive limit. Ensure the inner ground planes remain unbroken under the BGA to spread heat laterally and avoid hot-spotting.
The Ethernet RMII/MII signals must be length-matched within 50 mil between the MCU and external PHY; use series 22 ohm resistors on ETHTX+/-, ETHRX+/- to damp reflections and place the PHY within 25 mm of the MCU. The SQI interface runs at up to 80 MHz DDR-mode and requires 50 ohm controlled impedance with length-matching within 200 mil across the four data lanes and clock.
Do not assume the PIC32MZ1024EFE100T-E/GJX has CAN or the crypto engine - those features exist only on the EFF variants. Confusing the two can lead to PCBs that physically fit but firmware that misses required peripherals. Always re-check the 7th character of the part number (E = no Crypto/no CAN, F = Crypto + CAN) before commit.
Informations de conformité
AEC-Q100 qualified per Microchip product family page. RoHS and lead-free confirmed by Microchip product page; full compliance documentation available on request.