PIC32MZ1024ECG064-I/MR - 200MHz 32-bit MCU 1MB Flash 64-VQFN | Microchip
Référence : PIC32MZ1024ECG064-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.85 | $128,50 |
| 100 | $11.4 | $1 140,00 |
| 500 | $10.05 | $5 025,00 |
| 1 000 | $8.9 | $8 900,00 |
PIC32MZ1024ECG064-I/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a wide range of programmable peripherals on one die. Within the broader taxonomy, an MCU is a sub-class of microprocessors that adds on-chip memory and I/O, which itself belongs to the category of embedded processors and, ultimately, semiconductors. The 32-bit class (vs. 8-bit and 16-bit) targets applications that require large code space, high-throughput DSP/algorithm workloads, rich connectivity stacks (Ethernet, USB, CAN), and graphical user interfaces.
Key features include Peripheral Pin Select (PPS) for flexible function remapping, 8 hardware-programmable DMA channels plus 12 dedicated DMA channels with automatic data-size detection, a 12-bit ADC, and 5V-tolerant I/O when configured as inputs (outputs are 3.3V). The dual-panel Flash architecture enables live firmware updates without halting the application, which is critical for industrial and IoT devices that must remain in service across the upgrade. Operating temperature is industrial-grade -40C to +85C.
The PIC32MZ EC family is built on a superscalar MIPS core with a tightly-coupled prefetch cache and a dedicated Flash controller, which delivers deterministic interrupt latency and high code density. The integrated Ethernet MAC plus USB High-Speed OTG removes the need for external connectivity ICs in many designs, while the SQI interface enables external serial NOR Flash up to 80 MB/s for additional code or data storage.
Typical applications include industrial Ethernet gateways, USB host/device peripherals, embedded HMI with TFT displays, IoT edge nodes with secure firmware update, motor control, and high-speed data acquisition. The PIC32MZ1024ECG064-I/MR is well suited to any of these where 1 MB code space, 512 KB RAM and high-throughput connectivity are simultaneously required.
When designing with this device, note that the core supply is 2.3V-3.6V; a clean 3.3V rail with adequate bulk decoupling is essential. Multiple PGECx/PGEDx pairs are available - any pair may be used, but both pins of a chosen pair must be used together for ICSP.
This page synthesizes distributor pricing, package-specific drop-in alternatives, and practical design notes drawn from the Microchip datasheet and reference manual.
Alternatives de remplacement direct pour PIC32MZ1024ECG064-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024ECG064-I/MR (même facteur de forme et même empreinte) — différant par ADC, Package, USB, Ethernet, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024ECG064T-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024ECG064-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024ECG064-V/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024ECG064-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Core Clock Speed (max) | 200 MHz |
| Performance | 330 DMIPS, 3.28 CoreMark/MHz |
| Program Flash | 1 MB (dual-panel, live-update) |
| SRAM | 512 KB |
| Boîtier | 64-pin VQFN (MR), 9x9 mm |
| Nombre de broches | 64 |
| Tension d'alimentation | 2.3 V to 3.6 V |
| I/O Logic Levels | 5 V tolerant inputs, 3.3 V outputs |
| ADC | 12-bit |
| DMA Channels | 8 programmable + 12 dedicated |
| Connectivity | USB 2.0 High-Speed OTG, 10/100 Ethernet MAC, SQI |
| RTCC | Yes (Real-Time Clock Calendar) |
| Peripheral Pin Select (PPS) | Yes |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024ECG064-I/MR
| Broche 1 | RB14 — General purpose I/O with PPS |
| Broche 2 | RB15 — General purpose I/O with PPS |
| Broche 3 | AN0/CVD7/RP13 — Analog input 0 / PPS remappable RP13 |
| Broche 4 | AN1/CVD8/RP14 — Analog input 1 / PPS remappable RP14 |
| Broche 5 | AN2/CVD9/RP15 — Analog input 2 / PPS remappable RP15 |
| Broche 6 | AN3/RP16 — Analog input 3 / PPS remappable RP16 |
| Broche 7 | AN4/RP17 — Analog input 4 / PPS remappable RP17 |
| Broche 8 | VREF+/CVREF+ — ADC voltage reference positive input |
| Broche 9 | VREF-/CVREF- — ADC voltage reference negative input |
| Broche 10 | AVDD — Analog supply voltage |
| Broche 11 | AVSS — Analog ground |
| Broche 12 | AN5 — Analog input 5 |
| Broche 13 | AN6 — Analog input 6 |
| Broche 14 | AN7 — Analog input 7 |
| Broche 15 | AN8/RP18 — Analog input 8 / PPS remappable RP18 |
| Broche 16 | AN9/RP19 — Analog input 9 / PPS remappable RP19 |
| Broche 17 | AN10/RP20 — Analog input 10 / PPS remappable RP20 |
| Broche 18 | AN11/RP21 — Analog input 11 / PPS remappable RP21 |
| Broche 19 | AN12/RP22 — Analog input 12 / PPS remappable RP22 |
| Broche 20 | AN13/RP23 — Analog input 13 / PPS remappable RP23 |
| Broche 21 | AN14/RP24 — Analog input 14 / PPS remappable RP24 |
| Broche 22 | AN15/RP25 — Analog input 15 / PPS remappable RP25 |
| Broche 23 | VDD — Digital supply voltage |
| Broche 24 | VSS — Digital ground |
| Broche 25 | OSC1/RC1 — Crystal oscillator input / external clock input |
| Broche 26 | OSC2/RC2 — Crystal oscillator output |
| Broche 27 | RC3 — General purpose I/O |
| Broche 28 | RC4 — General purpose I/O |
| Broche 29 | RC5 — General purpose I/O |
| Broche 30 | RC6 — General purpose I/O |
| Broche 31 | RC7 — General purpose I/O |
| Broche 32 | RC8 — General purpose I/O |
| Broche 33 | RC9 — General purpose I/O |
| Broche 34 | PGEC1 — In-circuit Serial Programming clock 1 |
| Broche 35 | PGED1 — In-circuit Serial Programming data 1 |
| Broche 36 | VSS — Digital ground |
| Broche 37 | VDD — Digital supply voltage |
| Broche 38 | RD0 — General purpose I/O |
| Broche 39 | RD1 — General purpose I/O |
| Broche 40 | RD2 — General purpose I/O |
| Broche 41 | RD3 — General purpose I/O |
| Broche 42 | RD4 — General purpose I/O |
| Broche 43 | RD5 — General purpose I/O |
| Broche 44 | RD6 — General purpose I/O |
| Broche 45 | RD7 — General purpose I/O |
| Broche 46 | RD8 — General purpose I/O |
| Broche 47 | RD9 — General purpose I/O |
| Broche 48 | RD10 — General purpose I/O |
| Broche 49 | RD11 — General purpose I/O |
| Broche 50 | VSS — Digital ground |
| Broche 51 | VDD — Digital supply voltage |
| Broche 52 | RB0 — General purpose I/O |
| Broche 53 | RB1 — General purpose I/O |
| Broche 54 | RB2 — General purpose I/O |
| Broche 55 | RB3 — General purpose I/O |
| Broche 56 | RB4 — General purpose I/O |
| Broche 57 | RB5 — General purpose I/O |
| Broche 58 | RB6 — General purpose I/O |
| Broche 59 | RB7 — General purpose I/O |
| Broche 60 | RB8 — General purpose I/O |
| Broche 61 | RB9 — General purpose I/O |
| Broche 62 | RB10 — General purpose I/O |
| Broche 63 | RB11 — General purpose I/O |
| Broche 64 | RB12 — General purpose I/O |
Applications typiques
PIC32MZ1024ECG064-I/MR convient pour 6 applications: Industrial Ethernet Gateway, USB Host/Device Embedded Peripheral, Embedded HMI with TFT Display, IoT Edge Node with Secure Firmware Update, High-Speed Data Acquisition Front-End, Motor Control and Industrial Drive.
Industrial Ethernet Gateway
The PIC32MZ1024ECG064-I/MR fits industrial Ethernet gateways because it integrates a 10/100 Ethernet MAC, 200 MHz MIPS core (330 DMIPS), and 512 KB SRAM - enough headroom for lwIP + TCP/IP plus Modbus/Profinet stacks. Its 64-pin VQFN footprint keeps the PCB compact while leaving ample GPIO for serial, CAN or RS-485 links. The industrial -40 C to +85 C temperature grade allows deployment in factory-floor cabinets without derating.
Recommandé
USB Host/Device Embedded Peripheral
The integrated USB 2.0 High-Speed OTG controller makes the PIC32MZ1024ECG064-I/MR a natural fit for USB peripherals such as data loggers, programming dongles, HID devices and USB-to-UART bridges. 512 KB SRAM buffers High-Speed isochronous endpoints comfortably, and the 1 MB dual-panel Flash lets you ship firmware update tools that re-flash via USB without an external programmer. PPS reassigns USB pins around board constraints.
Recommandé
Embedded HMI with TFT Display
For embedded HMI panels, the PIC32MZ1024ECG064-I/MR delivers 330 DMIPS at 200 MHz - enough to drive a small TFT via PMP/parallel interface, render menus, and handle touch input in real time. The 1 MB Flash stores fonts, images and UI assets, while 512 KB SRAM holds frame buffers. PPS remaps the parallel data lines to spare pins, simplifying PCB layout around the display connector.
Recommandé
IoT Edge Node with Secure Firmware Update
The dual-panel Flash architecture is the PIC32MZ1024ECG064-I/MR's headline advantage for IoT edge nodes: one Flash bank can be erased and reprogrammed while the other runs the application, enabling live firmware updates without downtime. Combined with Ethernet or USB connectivity and 512 KB SRAM, this supports OTA upgrades in installed-base devices like smart meters, building automation controllers and remote sensors.
Recommandé
High-Speed Data Acquisition Front-End
The PIC32MZ1024ECG064-I/MR suits high-speed data acquisition front-ends thanks to its 12-bit ADC, 8 programmable + 12 dedicated DMA channels, and 200 MHz core for on-chip DSP/filtering. Streaming ADC data over USB High-Speed or Ethernet to a host PC is feasible given 512 KB SRAM buffering. PPS keeps analog and digital signal paths isolated by remapping digital functions away from sensitive analog pins.
Recommandé
Motor Control and Industrial Drive
In motor control and small industrial drives the PIC32MZ1024ECG064-I/MR's 200 MHz MIPS core runs field-oriented control (FOC) loops within the PWM period of typical 3-phase inverters. Its 12-bit ADC captures phase currents via synchronized sampling, and PPS routes PWM, QEI and fault inputs to convenient pins. The 64-pin VQFN keeps the controller board small enough to integrate inside an integrated servo or BLDC drive module.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024ECG064-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024ECG064T-I/MR | PIC32MZ1024ECG064-E/MR | PIC32MZ1024ECG064-V/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (MR, 9x9 mm) | 64-VQFN (MR, 9x9 mm) - same | 64-VQFN (MR, 9x9 mm) - same | 64-VQFN (MR, 9x9 mm) - same |
| Core Clock (max) | 200 MHz | 200 MHz | 200 MHz | 180 MHz |
| Flash | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) |
| USB 2.0 HS OTG | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| Packaging Form | Tray | Tape & Reel | Tray (Extended temp) | Tray (180 MHz) |
| Pinout Compatibility | Reference | Drop-in identical | Drop-in identical | Drop-in identical |
Principaux différenciateurs
- Dual-panel live-update Flash at 200 MHz in 64-pin VQFN (vs PIC32MX570F512H-I/MR)
- Integrated 10/100 Ethernet MAC and USB 2.0 High-Speed OTG (vs PIC32MX470F512H-I/MR)
- Industrial-grade -40 C to +85 C with full Peripheral Pin Select remap (vs PIC32MZ1024ECG064-V/MR (180 MHz variant))
Notes de conception
The PIC32MZ1024ECG064-I/MR core supply is 2.3 V to 3.6 V (decoded 2.3 V - 3.6 V). Use a low-dropout 3.3 V regulator with at least 200 mA actual supplies. Place a 10 uF bulk plus 0.1 uF ceramic decoupling capacitor on each VDD pin pair, and route a star ground with separate analog/digital returns converging at the exposed thermal pad. AVSS and VSS must be tied together at one point only.
At 200 MHz with all peripherals active, the device can dissipate around 400 mW. The 64-pin VQFN 9x9 mm package depends on its exposed thermal pad for heat removal. Solder the e-pad to a continuous ground copper pour on top and inner layers, with at least 25 thermal vias to the opposite copper plane. Without this, junction temperature can exceed 125 C in a sealed enclosure.
Route the analog signals (ANx, VREF+/-, AVSS) away from switching digital lines and PWM outputs to preserve ADC accuracy. Use PPS to remap noisy digital functions (timer outputs, PWM, SPI clocks) onto pins physically separated from analog inputs. Place a guard ring connected to AVSS around the analog section for best 12-bit ADC performance.
When using ICSP, any of the multiple PGECx/PGEDx pin pairs may be used, but both pins of the selected pair must be wired together - you cannot mix PGEC1 with PGED2. Forgetting this is a frequent cause of programmer-not-detected failures on first prototypes.
If USB High-Speed is used, the 90 ohm differential D+/D- traces must be length-matched within 150 mil and routed over a continuous ground plane. The USB DP/DN pins on the PIC32MZ are not ULPI; for true High-Speed (480 Mbps) an external ULPI PHY such as USB3300 is required - the integrated transceiver is Full-Speed-capable without PHY.
Informations de conformité
Industrial -I grade (not AEC-Q100 qualified - choose PIC32MZ1024ECG064-E/MR for automotive-adjacent extended temperature). RoHS and REACH compliant per Microchip product page.
