PIC32MZ1024EFH144-I/JWX - 200MHz 32-Bit MCU 1MB Flash | Microchip
Référence : PIC32MZ1024EFH144-I/JWX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.78 | $117,80 |
| 100 | $10.42 | $1 042,00 |
| 500 | $9.35 | $4 675,00 |
| 1 000 | $8.61 | $8 610,00 |
PIC32MZ1024EFH144-I/JWX Présentation
A microcontroller (MCU) is a self-contained computer on a single chip that combines a processor core, program memory (Flash), data memory (SRAM), and configurable peripherals. Within the semiconductor taxonomy, the PIC32MZ1024EFH144-I/JWX sits in the hierarchy of 32-bit MCU -> microcontroller -> embedded processor -> integrated circuit. The PIC32MZ EF family targets connectivity applications in industrial control, automotive, IoT, graphics/HMI, and motor control market segments.
Key features include 1 MB Live-Update Flash, 512 KB SRAM, a 200 MHz core with four 64-bit accumulators for single-cycle MAC and saturating/fractional math, and an IEEE 754-compliant FPU. The device provides 144 pins of I/O flexibility, multiple UART/SPI/I2C channels, and dedicated audio and graphics interfaces for HMI designs.
The PIC32MZ EF architecture pairs the MIPS Warrior M-class core with a high-throughput peripheral bus, enabling deterministic real-time response while the FPU offloads floating-point math from the integer pipeline. The 144-TFBGA (7x7) package offers a compact footprint for space-constrained boards while exposing the full pin count needed for complex connectivity designs.
Typical applications include industrial automation controllers, IoT gateways with Ethernet and USB connectivity, motor control drives, and graphics/HMI panels. The combination of 200 MHz performance, 1 MB Flash, and integrated Ethernet/CAN/USB makes it suitable for networked embedded systems requiring both compute headroom and rich connectivity.
When designing with this device, pay close attention to the multiple VDD/VSS pin pairs and the ICSP programming pin pairing rules - PGECx and PGEDx must be used as matched pairs. Decouple every supply pin with a local 0.1 uF capacitor and provide a bulk 10 uF capacitor near the package.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for selection, replacement, and layout decisions.
Alternatives de remplacement direct pour PIC32MZ1024EFH144-I/JWX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFH144-I/JWX (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Operating Temperature, SRAM, DSP Extensions.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFH144-E/JWX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFG144T-E/JWX
✅ Remplacement direct✓ En stock
$5.85 / unité
Voir la fiche technique →PIC32MZ1024EFF144-E/JWX
✅ Remplacement direct✓ En stock
$12.18 / unité
Voir la fiche technique →PIC32MZ0512EFK144-E/JWX
✅ Remplacement direct✓ En stock
$9.21 / unité
Voir la fiche technique →PIC32MZ0512EFF144-E/JWX
✅ Remplacement direct✓ En stock
$10 / unité
Voir la fiche technique →PIC32MZ0512EFE144-E/JWX
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →PIC32MZ1024EFH144-I/JWX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (32-bit) |
| Maximum CPU Speed | 200 MHz |
| Performance | 330 DMIPS |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 512 KB |
| Floating Point Unit | IEEE 754-compliant FPU |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Boîtier | 144-TFBGA (7x7 mm) |
| Nombre de broches | 144 |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Connectivity | HS USB, 10/100 Ethernet MAC, CAN |
| Crypto Engine | No (EFH variant) |
| Audio Interface | Yes (I2S/SPI audio) |
| Graphics Interface | Yes (HMI support) |
| Flash Type | Live-Update Flash |
Guide de configuration des broches du PIC32MZ1024EFH144-I/JWX 144-tfbga (7x7 mm)
Configuration des broches du PIC32MZ1024EFH144-I/JWX (boîtier 144-tfbga (7x7 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1024EFH144-I/JWX.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1024EFH144-I/JWX convient pour 6 applications: Industrial Automation Controller, IoT Gateway with Ethernet and USB, Motor Control Drive, Graphics/HMI Panel Controller, Automotive Body Control Module, Audio Processing and Effects.
Industrial Automation Controller
The PIC32MZ1024EFH144-I/JWX fits industrial automation controllers because its 200 MHz MIPS32 M-Class core delivers 330 DMIPS while the integrated 10/100 Ethernet MAC and CAN controller handle factory network protocols without external transceivers beyond the PHY. The 1 MB Live-Update Flash allows firmware to be updated in the field without halting the control loop, and the -40C to +85C industrial temperature rating covers most factory-floor environments. In a typical PLC or motion controller, the MCU runs the real-time control loop on the integer pipeline while the IEEE 754 FPU offloads floating-point PID calculations, keeping loop jitter low. The trade-off versus a lower-cost 8/16-bit MCU is higher power consumption, but the 330 DMIPS headroom supports multi-axis coordination that smaller cores cannot sustain.
Recommandé
IoT Gateway with Ethernet and USB
The PIC32MZ1024EFH144-I/JWX is well suited to IoT gateways because it integrates a 10/100 Ethernet MAC and High-Speed USB on-chip, eliminating the need for separate connectivity controllers. The 1 MB Flash and 512 KB SRAM provide ample room for a TCP/IP stack, TLS session buffers, and application logic, while the 200 MHz core keeps protocol processing responsive under concurrent Ethernet and USB traffic. In a gateway design, the MCU bridges sensor data from UART/SPI/I2C peripherals to a cloud endpoint over Ethernet, with the FPU accelerating any sensor-fusion math. The main design consideration is thermal: at 200 MHz the core draws more current than a Cortex-M0-class device, so adequate copper pour and decoupling are required. The 144-TFBGA package keeps the footprint compact for space-constrained gateway enclosures.
Recommandé
Motor Control Drive
The PIC32MZ1024EFH144-I/JWX suits motor control drives because its DSP-enhanced MIPS32 core includes four 64-bit accumulators and single-cycle MAC, saturating, and fractional math instructions that accelerate field-oriented control (FOC) algorithms. The 200 MHz clock provides enough bandwidth to run multiple PWM loops and a position estimator simultaneously, while the IEEE 754 FPU handles floating-point Park/Clarke transforms without software emulation. In a three-phase inverter design, the MCU generates complementary PWM outputs and samples current feedback through its ADC channels, closing the current loop at tens of kHz. The trade-off versus a dedicated motor-control MCU is that this device lacks integrated gate drivers, so external drivers are required. The 144-TFBGA package exposes enough pins for multi-axis or multi-phase control.
Recommandé
Graphics/HMI Panel Controller
The PIC32MZ1024EFH144-I/JWX fits graphics/HMI panel controllers because the PIC32MZ EF family includes dedicated graphics interfaces and the 200 MHz core with FPU can drive display refresh and touch processing concurrently. The 1 MB Flash stores graphics assets and the 512 KB SRAM buffers frame data, while the integrated audio interface supports touch-feedback tones or voice prompts. In an HMI design, the MCU renders the user interface, reads a capacitive touch panel over I2C/SPI, and communicates with the host controller over Ethernet or CAN. The main consideration is memory bandwidth: at high refresh rates the SRAM is shared between frame buffering and application code, so designers should profile usage. The 144-TFBGA package provides the I/O count needed for parallel display buses and multiple touch channels.
Recommandé
Automotive Body Control Module
The PIC32MZ1024EFH144-I/JWX can serve automotive body control modules because its integrated CAN controller connects directly to the vehicle bus and the 200 MHz core handles multiple body functions such as lighting, window, and mirror control in a single device. The 1 MB Live-Update Flash supports over-the-air firmware updates, and the -40C to +85C industrial rating covers most passenger-compartment environments. In a BCM design, the MCU multiplexes CAN messages, drives low-side and high-side outputs through external drivers, and monitors switch inputs. The key trade-off is that this part is not AEC-Q100 qualified, so for under-hood or safety-critical automotive applications the extended-temperature -E/JWX variant or an AEC-Q100-qualified device should be selected instead. The 144-TFBGA package supports the high I/O count typical of BCM designs.
Recommandé
Audio Processing and Effects
The PIC32MZ1024EFH144-I/JWX fits audio processing and effects because its DSP-enhanced core with four 64-bit accumulators and single-cycle MAC executes FIR/IIR filters and FFTs efficiently, while the IEEE 754 FPU handles floating-point audio algorithms without emulation. The integrated audio interface (I2S/SPI) connects directly to audio codecs, and the 512 KB SRAM buffers delay lines and reverb tails. In an audio effects unit, the MCU runs sample-rate conversion, equalization, and dynamics processing in real time at 200 MHz. The main consideration is deterministic latency: audio processing requires the DSP loop to complete within the sample period, so interrupt priority and DMA configuration must be tuned carefully. The 144-TFBGA package provides enough I/O for multi-channel audio and control interfaces.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFH144-I/JWX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFH144-E/JWX | PIC32MZ1024EFG144T-E/JWX | PIC32MZ1024EFF144-E/JWX | PIC32MZ0512EFK144-E/JWX |
|---|---|---|---|---|---|
| Package | 144-TFBGA (7x7) | 144-TFBGA (7x7) - same | 144-TFBGA (7x7) - same | 144-TFBGA (7x7) - same | 144-TFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | Industrial (-40C to +85C) | Extended (-40C to +125C) | Extended (-40C to +125C) | Extended (-40C to +125C) | Extended (-40C to +125C) |
| Feature Set | H-series (full) | H-series (full) | G-series (reduced) | F-series (no crypto) | K-series |
| Connectivity | HS USB, 10/100 Ethernet MAC, CAN | HS USB, 10/100 Ethernet MAC, CAN | HS USB, 10/100 Ethernet MAC, CAN | HS USB, 10/100 Ethernet MAC, CAN | HS USB, 10/100 Ethernet MAC, CAN |
| Floating Point Unit | IEEE 754-compliant | IEEE 754-compliant | IEEE 754-compliant | IEEE 754-compliant | IEEE 754-compliant |
| Pin Count | 144 | 144 | 144 | 144 | 144 |
Principaux différenciateurs
- Full H-series feature set with 1 MB Flash (vs PIC32MZ0512EFK144-E/JWX)
- Industrial temperature grade at lower cost than extended grade (vs PIC32MZ1024EFH144-E/JWX)
- Full H-series feature set versus reduced G/F-series (vs PIC32MZ1024EFG144T-E/JWX)
Notes de conception
Decouple every VDD pin with a local 0.1 uF ceramic capacitor placed as close to the ball as possible, and provide a bulk 10 uF capacitor near the package. The PIC32MZ1024EFH144-I/JWX has multiple VDD/VSS pin pairs across the 144-TFBGA array; omitting decoupling on any pair can cause intermittent operation at 200 MHz. Estimated: at 200 MHz the core current can exceed 100 mA, so the bulk capacitor should be sized to supply transient current during clock switching without excessive rail droop.
Route the ICSP programming pins as matched pairs: PGECx and PGEDx must be used together (for example, if PGEC2 is used for ICSPCLK, ICSPDAT must connect to PGED2). The PIC32MZ1024EFH144-I/JWX has more than one pair of PGECx/PGEDx pins, so choose a pair that does not conflict with your application I/O. Keep the ICSP traces short and free of stubs to avoid programming failures.
Estimated: the 144-TFBGA (7x7 mm) package has limited thermal mass, so at 200 MHz continuous operation the junction temperature rise depends heavily on PCB copper area. Provide a solid ground plane under the device and use thermal vias if the board stack-up allows. For industrial ambient temperatures near +85C, verify junction temperature with the Microchip thermal model before committing to a sealed enclosure without airflow.
Do not assume the -I/JWX industrial variant is interchangeable with the -E/JWX extended-temperature variant in all designs. Both share the 144-TFBGA footprint, but the -E variant is rated to +125C. Conversely, if your design only needs -40C to +85C, the -I variant is sufficient and may be more cost-effective. Always confirm the temperature grade suffix against your environmental requirements.
Informations de conformité
Compliance data was not present in the verified web data for this MPN. The PIC32MZ1024EFH144-I/JWX is not AEC-Q100 qualified per available data; for automotive-qualified alternatives consult Microchip's automotive portfolio.