PIC32MZ0512EFE144-E/JWX - 32-bit 180MHz MCU 512KB Flash | Microchip
Référence : PIC32MZ0512EFE144-E/JWX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.45 | $9,45 |
| 10 | $8.85 | $88,50 |
| 100 | $7.95 | $795,00 |
| 500 | $7.2 | $3 600,00 |
| 1 000 | $6.55 | $6 550,00 |
PIC32MZ0512EFE144-E/JWX Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable peripherals; the PIC32MZ EF family represents Microchip's high-end 32-bit MCU tier, positioned between standard microcontrollers and application processors. The PIC32MZ EF series targets connectivity, industrial automation, automotive, IoT, graphics/HMI, and motor control applications by combining a high-performance MIPS32 core with rich connectivity peripherals such as Ethernet, USB, CAN (omitted in this "No CAN" variant), and high-speed ADCs.
Key features of the PIC32MZ0512EFE144-E/JWX include a MIPS32 M-Class core with DSP instructions, up to 120 general-purpose I/O pins, integrated 12-bit ADC and analog comparators, multiple UART/SPI/I2C peripherals, hardware crypto acceleration is omitted in the "EFE" variant, and CAN-FD is omitted per the "No CAN" suffix. The wide operating voltage range of 2.0V to 3.6V supports both battery-powered and industrial 3.3V systems. The 144-TFBGA package footprint keeps the device compatible with the rest of the PIC32MZ EF 144-pin family, enabling PCB layout reuse across variants.
Typical applications include industrial control panels, building automation gateways, USB/Ethernet-connected sensor hubs, low-cost graphics HMI displays, and BLDC/PMSM motor control firmware. The combination of large Flash and SRAM resources makes the part well-suited to embedded protocol stacks (TCP/IP, MQTT, USB device classes) without external memory. When designing with this MCU, place decoupling capacitors (100 nF plus 4.7 uF bulk) within 3 mm of each power pin and follow Microchip's TFBGA layout guidelines for the 0.5 mm pitch land pattern to ensure reliable reflow.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same PIC32MZ family, and practical design notes that are not present in the manufacturer datasheet. Engineers evaluating the PIC32MZ0512EFE144-E/JWX should treat it as the cost-optimized member of the EF family and use the comparison table to weigh it against higher-speed and larger-memory siblings.
Alternatives de remplacement direct pour PIC32MZ0512EFE144-E/JWX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFE144-E/JWX (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Crypto Engine, DSP Extensions.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFE144T-E/JWX
✅ Remplacement direct✓ En stock
$7.93 / unité
Voir la fiche technique →PIC32MZ0512EFE144-I/JWX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFK144-E/JWX
✅ Remplacement direct✓ En stock
$9.21 / unité
Voir la fiche technique →PIC32MZ0512EFE144T-I/JWX
✅ Remplacement direct✓ En stock
$7.71 / unité
Voir la fiche technique →PIC32MZ0512EFE144-250I/JWX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFE144-E/JWX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (32-bit) |
| Maximum CPU Speed | 180 MHz |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Boîtier | 144-TFBGA (7x7 mm, 1.02 mm height) |
| Nombre de broches | 144 |
| GPIO Count | 120 |
| Supply Voltage Range | 2.0 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +125C (E - Extended) |
| Crypto Accelerator | No (EFE variant) |
| CAN Module | No (No CAN variant) |
| Supply Packaging | Tray |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du PIC32MZ0512EFE144-E/JWX 144-tfbga (7x7 mm, 1.02 mm height)
Configuration des broches du PIC32MZ0512EFE144-E/JWX (boîtier 144-tfbga (7x7 mm, 1.02 mm height)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ0512EFE144-E/JWX.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ0512EFE144-E/JWX convient pour 7 applications: Industrial Control & Automation, IoT Edge Gateways & Connected Sensors, USB Device Peripherals, Graphical HMI Displays, BLDC / PMSM Motor Control, Automotive Body Electronics, Portable Medical Devices.
Industrial Control & Automation
The PIC32MZ0512EFE144-E/JWX suits industrial PLC and motor control firmware where the 180 MHz MIPS32 core runs control loops in well under 100 us while 512 KB Flash accommodates full IEC 61131-3 runtimes plus custom logic. The 120 GPIO pins support multi-axis motion control with encoder feedback and the 12-bit ADC at 18 Msps handles current sensing. Industrial -40 to +125C temperature headroom and 3.6 V tolerant I/O allow direct interface to 24 V systems via external drivers.
Recommandé
IoT Edge Gateways & Connected Sensors
For IoT edge gateways aggregating sensor data over RS-485, I2C, or SPI, the PIC32MZ0512EFE144-E/JWX delivers TCP/IP stack and TLS handshakes within 512 KB Flash thanks to Microchip's MPLAB Harmony v3 TCP/IP Lite stack. The 128 KB SRAM fits TLS buffers for concurrent secure sessions. The low-power sleep modes (down to ~30 uA in retention) suit battery-powered sensor nodes while the 180 MHz burst mode handles wake-and-transmit events in milliseconds.
Recommandé
USB Device Peripherals
The PIC32MZ0512EFE144-E/JWX includes a Hi-Speed USB 2.0 device controller with integrated PHY, enabling USB peripherals such as data loggers, HID devices, or audio streaming without external components. The 180 MHz core handles USB isochronous transfers and 512 KB Flash fits USB stacks plus application code. The 144-TFBGA package fits compact dongle-style products and the 3.3 V I/O simplifies USB self-powered designs without level shifters.
Recommandé
Graphical HMI Displays
For low-cost graphical HMI panels driving TFT displays up to WVGA, the PIC32MZ0512EFE144-E/JWX pairs a 180 MHz core with a Parallel Master Port (PMP) for direct TFT interfacing. The 512 KB Flash stores GUI assets and the 128 KB SRAM holds framebuffers for partial-screen updates. The 120 GPIO pins support resistive or capacitive touch sensing and the integrated 12-bit ADC drives backlight control loops. The 7x7 mm TFBGA footprint simplifies 4-layer HMI board layouts.
Recommandé
BLDC / PMSM Motor Control
For sensorless or sensored BLDC and PMSM motor control, the PIC32MZ0512EFE144-E/JWX provides the 180 MHz MIPS throughput needed for FOC (field-oriented control) loops at 20-50 kHz switching frequency. The PWM/OC modules drive 3-phase inverter signals directly, while the 12-bit ADC samples phase currents synchronously to the PWM. The 128 KB SRAM allows lookup tables for sine/cosine and PI controllers per axis. Industrial temperature grade supports under-hood automotive motor control.
Recommandé
Automotive Body Electronics
Within automotive body controllers (BCM), instrument cluster MCUs, and HVAC control modules, the PIC32MZ0512EFE144-E/JWX delivers 180 MHz performance and -40 to +125C operation in a compact 144-TFBGA. The LIN/UART peripherals connect to body sensor networks and the 512 KB Flash fits AUTOSAR-lite stacks plus application software. The No-CAN variant suits LIN-only or CAN-externally-managed architectures where cost is critical. AEC-Q100 grade is not specified for the JWX temperature grade per the datasheet.
Recommandé
Portable Medical Devices
For portable medical peripherals (glucose meters, pulse oximeters, connected inhaler controllers), the PIC32MZ0512EFE144-E/JWX combines low-power Run and Idle modes (sub-100 uA/MHz) with a 180 MHz burst mode for sensor signal processing. The 12-bit ADC at 18 Msps captures photoplethysmography (PPG) waveforms, and the USB device port supports tethered data transfer to a host PC. The 144-TFBGA 7x7 mm footprint allows integration into credit-card-size form factors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFE144-E/JWX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFE144T-E/JWX | PIC32MZ0512EFE144-I/JWX | PIC32MZ0512EFK144-E/JWX | PIC32MZ0512EFE144T-I/JWX | PIC32MZ0512EFE144-250I/JWX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-TFBGA (7x7 mm) | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same |
| Maximum CPU Speed | 180 MHz | 180 MHz | 200 MHz (+11%) | 180 MHz | 200 MHz (+11%) | 252 MHz (+40%) |
| Flash Memory | 512 KB | 512 KB | 512 KB | 1024 KB (+100%) | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB (+100%) | 128 KB | 128 KB |
| Temperature Grade | E (-40C to +125C) | E (-40C to +125C) | I (-40C to +85C) | E (-40C to +125C) | I (-40C to +85C) | I (-40C to +85C) |
| Packing Format | Tray (JWX) | Tape & Reel | Tray | Tray | Tape & Reel | Tray |
| CAN Module | No | No | No | No | No | No |
Principaux différenciateurs
- Lowest-cost 144-TFBGA option in the EF family (vs PIC32MZ0512EFK144-E/JWX)
- Higher speed ceiling with -I industrial grade (vs PIC32MZ0512EFE144-I/JWX)
- Tray packing avoids Tape & Reel upcharge for low-volume (vs PIC32MZ0512EFE144T-E/JWX)
Notes de conception
The 144-TFBGA package has a 0.5 mm ball pitch and requires a 4-layer PCB with a continuous ground plane beneath the device for thermal dissipation and signal reference. Use Microchip's recommended land pattern from the package datasheet, with NSMD (non-solder mask defined) pads of 0.30 mm diameter and 0.5 mm pitch. Place 100 nF decoupling capacitors within 3 mm of each VDD/VDDIO pin pair and a single 4.7 uF bulk capacitor near the package corner.
Estimated: At 180 MHz CPU activity driving a mix of peripherals, typical power consumption is 80-120 mA from the 3.3 V supply. Worst-case power at 1.05 V internal core with full peripheral activity is approximately 0.4 W. The TFBGA package has theta_JA of about 25-30 C/W on a 4-layer JEDEC test board, so junction temperature rise above ambient in normal use is ~10-12 C. No external heatsink is required, but placing ground vias in the BGA land pattern (via-in-pad recommended) helps thermal performance.
Do not connect the TRACE pins (if unused) directly to GND - they need to be left floating or terminated with a weak pull-down per Microchip's debug documentation to avoid interference with the trace hardware. Configure unused GPIO pins as outputs driven low to minimize power consumption. The internal 8 MHz FRC oscillator is suitable for USB operation but USB Hi-Speed requires the 48 MHz Primary Oscillator with PLL for jitter compliance - do not rely on the FRC for USB isochronous transfers.
The 144-TFBGA fanout requires microvia or sub-0.1 mm trace technology. Route high-speed signals (Ethernet RMII, USB DP/DN, SDRAM clocks) on the top layer with reference to the second-layer ground plane and length-match within 150 mils. For RMII Ethernet, the 50 MHz reference clock must be length-matched to within 50 mils of the data lines. Place the Ethernet PHY within 50 mm of the MCU to keep RMII rise times clean.
When designing with this MCU, place the 32.768 kHz low-power crystal within 5 mm of the SOSC pins with a guard ring on the ground plane. The main oscillator traces should be 8-12 mils wide and length-matched within 1 mm. Keep ADC analog inputs away from switching power traces and route them over a quiet analog ground island that joins the digital ground at a single point near the MCU's GND pin.
Informations de conformité
RoHS compliant per Microchip product page and the PIC32MZ EF family datasheet. The -E temperature grade extends to +125C but the part is not AEC-Q100 qualified; for automotive applications requiring AEC-Q100, use a PIC32MZ AEC-Q100 qualified variant from Microchip's automotive portfolio.
