PIC32MZ1024EFH100-E/PT - 32-bit 180MHz MCU, 1MB Flash | Microchip
Référence : PIC32MZ1024EFH100-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.42 | $164,20 |
| 100 | $14.2 | $1 420,00 |
| 500 | $12.05 | $6 025,00 |
| 1 000 | $10.65 | $10 650,00 |
PIC32MZ1024EFH100-E/PT Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. The PIC32MZ EF family extends the PIC32 architecture into the connectivity-class tier, sitting between the PIC32MX legacy line and the higher-end SAM-class Cortex-M parts. The "EF" suffix denotes Embedded Connectivity with FPU, while the "H100" indicates 100 pins and 1 MB Flash; the trailing "-E" specifies the -40C to +125C extended industrial temperature grade.
Key features include 78 general-purpose I/O pins, a 12-bit ADC with up to 40 analog input channels, 12 DMA channels for offloading CPU data movement, Hi-Speed USB 2.0, 10/100 Mbps Ethernet MAC, CAN 2.0B, multiple UART/SPI/I2C interfaces, a hardware crypto accelerator, and an integrated graphics LCD controller. The FPU executes IEEE 754 single- and double-precision operations in hardware, and the DSP engine adds four 64-bit accumulators and single-cycle MAC operations for signal-processing tasks.
Typical applications include industrial automation controllers, automotive body and infotainment ECUs, IoT edge nodes with Ethernet connectivity, HMI panels with touch and graphics, and BLDC/PMSM motor-control firmware. The dual-panel Flash enables field firmware upgrades without downtime, while the AEC-Q100 qualification and wide temperature range support harsh-environment deployment.
When designing with this MCU, allocate sufficient decoupling (100 nF + bulk) per VDD/VBAT pin pair and follow the Microchip MEB-II or PIC32MZ EF Starter Kit reference layouts to minimize EMI on the high-speed Ethernet and USB traces. Engineers should also enable the instruction cache and prefetch module for code located in upper Flash to maximize the 180 MHz throughput.
Alternatives de remplacement direct pour PIC32MZ1024EFH100-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFH100-E/PT (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Ethernet, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFH100-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFG100-I/PT
✅ Remplacement direct✓ En stock
$8.94 / unité
Voir la fiche technique →PIC32MZ1024EFF100-I/PF
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC32MZ1024EFE100-I/PT
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →PIC32MZ1024ECH100-I/PT
✅ Remplacement direct✓ En stock
$8.95 / unité
Voir la fiche technique →PIC32MZ1024EFH100-E/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 Warrior M-class |
| Core Width | 32-bit |
| Maximum CPU Clock | 180 MHz |
| DMIPS | 330 |
| FPU | IEEE 754 single/double precision hardware |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Program Flash | 1 MB (1M x 8) dual-panel Live-Update |
| SRAM | 512 KB (cache + general purpose) |
| Boot Flash | 160 KB |
| Operating Voltage | 3.3 V |
| Température de fonctionnement | -40C to +125C (extended grade, -E) |
| I/O Pins | 78 |
| ADC | 12-bit, up to 40 channels |
| DMA Channels | 12 |
| Boîtier | 100-pin TQFP (12x12 mm) |
| Type de montage | Surface Mount |
| Connectivity | HS USB 2.0, 10/100 Ethernet, CAN 2.0B, UART, SPI, I2C |
| Crypto Accelerator | Hardware AES/TDES (No Crypto variant per Mouser listing) |
| Automotive Qualification | AEC-Q100 |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFH100-E/PT
| Broche 1 | RA0 — General purpose I/O / analog input |
| Broche 2 | RA1 — General purpose I/O / analog input |
| Broche 3 | RA2 — General purpose I/O / analog input |
| Broche 4 | RA3 — General purpose I/O / analog input |
| Broche 5 | RA4 — General purpose I/O / analog input |
| Broche 6 | RA5 — General purpose I/O / analog input |
| Broche 7 | RA6 — General purpose I/O |
| Broche 8 | RA7 — General purpose I/O |
| Broche 9 | RA8 — General purpose I/O |
| Broche 10 | RA9 — General purpose I/O |
| Broche 11 | RA10 — General purpose I/O |
| Broche 12 | RA11 — General purpose I/O |
| Broche 13 | RA12 — General purpose I/O |
| Broche 14 | RA13 — General purpose I/O |
| Broche 15 | RA14 — General purpose I/O |
| Broche 16 | RA15 — General purpose I/O |
| Broche 17 | VSS — Ground |
| Broche 18 | VDD — 3.3V supply |
| Broche 19 | RB0 — General purpose I/O / programming |
| Broche 20 | RB1 — General purpose I/O / programming |
| Broche 21 | RB2 — General purpose I/O |
| Broche 22 | RB3 — General purpose I/O |
| Broche 23 | RB4 — General purpose I/O |
| Broche 24 | RB5 — General purpose I/O |
| Broche 25 | RB6 — General purpose I/O |
| Broche 26 | RB7 — General purpose I/O |
| Broche 27 | RB8 — General purpose I/O |
| Broche 28 | RB9 — General purpose I/O |
| Broche 29 | RB10 — General purpose I/O |
| Broche 30 | RB11 — General purpose I/O |
| Broche 31 | RB12 — General purpose I/O |
| Broche 32 | RB13 — General purpose I/O |
| Broche 33 | RB14 — General purpose I/O |
| Broche 34 | RB15 — General purpose I/O |
| Broche 35 | VSS — Ground |
| Broche 36 | VDD — 3.3V supply |
| Broche 37 | RC0 — General purpose I/O |
| Broche 38 | RC1 — General purpose I/O |
| Broche 39 | RC2 — General purpose I/O |
| Broche 40 | RC3 — General purpose I/O |
| Broche 41 | RC4 — General purpose I/O |
| Broche 42 | RC5 — General purpose I/O |
| Broche 43 | RC6 — General purpose I/O |
| Broche 44 | RC7 — General purpose I/O |
| Broche 45 | RC8 — General purpose I/O |
| Broche 46 | RC9 — General purpose I/O |
| Broche 47 | RC10 — General purpose I/O |
| Broche 48 | RC11 — General purpose I/O |
| Broche 49 | RC12 — General purpose I/O |
| Broche 50 | RC13 — General purpose I/O |
| Broche 51 | RC14 — General purpose I/O |
| Broche 52 | RC15 — General purpose I/O |
| Broche 53 | VSS — Ground |
| Broche 54 | VDD — 3.3V supply |
| Broche 55 | RD0 — General purpose I/O |
| Broche 56 | RD1 — General purpose I/O |
| Broche 57 | RD2 — General purpose I/O |
| Broche 58 | RD3 — General purpose I/O |
| Broche 59 | RD4 — General purpose I/O |
| Broche 60 | RD5 — General purpose I/O |
| Broche 61 | RD6 — General purpose I/O |
| Broche 62 | RD7 — General purpose I/O |
| Broche 63 | RD8 — General purpose I/O |
| Broche 64 | RD9 — General purpose I/O |
| Broche 65 | RD10 — General purpose I/O |
| Broche 66 | RD11 — General purpose I/O |
| Broche 67 | RD12 — General purpose I/O |
| Broche 68 | RD13 — General purpose I/O |
| Broche 69 | RD14 — General purpose I/O |
| Broche 70 | RD15 — General purpose I/O |
| Broche 71 | VSS — Ground |
| Broche 72 | VDD — 3.3V supply |
| Broche 73 | RE0 — General purpose I/O |
| Broche 74 | RE1 — General purpose I/O |
| Broche 75 | RE2 — General purpose I/O |
| Broche 76 | RE3 — General purpose I/O |
| Broche 77 | RE4 — General purpose I/O |
| Broche 78 | RE5 — General purpose I/O |
| Broche 79 | RE6 — General purpose I/O |
| Broche 80 | RE7 — General purpose I/O |
| Broche 81 | RF0 — General purpose I/O |
| Broche 82 | RF1 — General purpose I/O |
| Broche 83 | RF2 — General purpose I/O |
| Broche 84 | RF3 — General purpose I/O |
| Broche 85 | RF4 — General purpose I/O |
| Broche 86 | RF5 — General purpose I/O |
| Broche 87 | RF6 — General purpose I/O / Ethernet |
| Broche 88 | RF7 — General purpose I/O / Ethernet |
| Broche 89 | RF8 — General purpose I/O / Ethernet |
| Broche 90 | RF9 — General purpose I/O / Ethernet |
| Broche 91 | RF10 — General purpose I/O / Ethernet |
| Broche 92 | RF11 — General purpose I/O / Ethernet |
| Broche 93 | RF12 — General purpose I/O / Ethernet |
| Broche 94 | RF13 — General purpose I/O / Ethernet |
| Broche 95 | VSS — Ground |
| Broche 96 | VDD — 3.3V supply |
| Broche 97 | RG0 — General purpose I/O |
| Broche 98 | RG1 — General purpose I/O |
| Broche 99 | RG6 — General purpose I/O / system |
| Broche 100 | RG7 — General purpose I/O / system |
Applications typiques
PIC32MZ1024EFH100-E/PT convient pour 6 applications: Industrial Automation Controllers, Automotive Body and Infotainment ECUs, IoT Edge Gateways and Sensor Hubs, HMI Panels with Graphics Display, BLDC and PMSM Motor Control, Audio Processing and USB Headsets.
Industrial Automation Controllers
The PIC32MZ1024EFH100-E/PT's 180 MHz MIPS core, hardware FPU, and 12 DMA channels make it well suited for PLC scan engines and machine controllers. With 1 MB of dual-panel Flash, controllers can store both the runtime and the firmware-update image simultaneously, enabling fail-safe field upgrades on packaging lines or process skids without halting production. The 40-channel 12-bit ADC supports multi-sensor analog acquisition from thermocouples, pressure transducers, and 4-20 mA loops, while the CAN 2.0B and 10/100 Ethernet interfaces tie the controller into industrial fieldbus and SCADA backbones. The -40C to +125C temperature grade covers unconditioned cabinet installations and outdoor enclosures.
Recommandé
Automotive Body and Infotainment ECUs
AEC-Q100 qualification combined with the extended -40C to +125C temperature window positions the PIC32MZ1024EFH100-E/PT for automotive body-control modules, HVAC controllers, and entry-level infotainment head units. The hardware crypto accelerator (where present) and DSP extensions offload filter math for audio post-processing, while Hi-Speed USB serves device connectivity for CarPlay/AndroidAuto bridging designs. The dual-panel Flash supports OTA-style firmware refreshes required by modern vehicle service procedures, and the 12 DMA channels sustain data movement between audio buffers, display frames, and CAN message queues without CPU stalls.
Recommandé
IoT Edge Gateways and Sensor Hubs
For edge-of-network IoT nodes aggregating wireless sensor data, the PIC32MZ1024EFH100-E/PT delivers simultaneous Ethernet connectivity, USB device-host stacks, and enough Flash (1 MB) to host a TLS-encrypted MQTT client plus application logic. The 512 KB SRAM buffers incoming sensor bursts, while 12 DMA channels handle data ingest from SPI-attached radios and I2C sensor chains without taxing the CPU. The FPU accelerates edge analytics such as FFT-based vibration analysis on predictive-maintenance gateways, and the -E temperature grade supports outdoor cabinet or factory-floor deployments without active cooling.
Recommandé
HMI Panels with Graphics Display
The PIC32MZ EF family integrates a graphics LCD controller capable of driving TFT panels up to WXGA, making the PIC32MZ1024EFH100-E/PT a strong fit for industrial HMI panels, appliance touchscreens, and medical bedside controllers. The MIPS core with hardware FPU renders vector graphics, anti-aliased fonts, and gauge widgets smoothly while the integrated cache hides Flash latency. Up to 78 I/O pins accommodate capacitive-touch I2C bridges, RGB backlight PWM, and external QSPI memory for asset-graphical assets. The dual-panel Flash lets service technicians push updated UI assets during commissioning without halting the line.
Recommandé
BLDC and PMSM Motor Control
Field-oriented control (FOC) of BLDC and PMSM motors demands hard-real-time PWM with deterministic interrupt latency, which the PIC32MZ1024EFH100-E/PT delivers via its 180 MHz MIPS core, hardware DSP extensions, and 12 DMA channels. The 40-channel 12-bit ADC at 1 Msps supports simultaneous shunt-current sampling required for sensorless FOC, while the PWM/SCCP/MCCP peripherals generate complementary center-aligned switching at up to 100 kHz. The FPU accelerates Park/Clarke transforms, and the 1 MB Flash holds both the motor-control library and the application code. The extended -40C to +125C grade covers under-hood and outdoor-drive installations.
Recommandé
Audio Processing and USB Headsets
With hardware FPU and DSP instructions, the PIC32MZ1024EFH100-E/PT can run parametric EQ, beamforming, and noise-cancellation algorithms in real time on multi-microphone headset arrays. Hi-Speed USB 2.0 enables low-latency digital audio streaming at 24-bit/96 kHz to host computers, while I2S ports interface to external codecs. The 512 KB SRAM hosts audio buffers and FFT working memory, and 1 MB Flash stores firmware plus DSP coefficient tables. The wide temperature grade supports automotive in-cabin microphone applications where cabin temperatures swing from -40C to +85C.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFH100-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFH100-I/PT | PIC32MZ1024EFG100-I/PT | PIC32MZ1024EFF100-I/PF | PIC32MZ1024EFE100-I/PT | PIC32MZ1024ECH100-I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (12x12 mm) | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Clock | 180 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Program Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| HS USB 2.0 | Yes | Yes | Yes | No | No | Yes |
| 10/100 Ethernet MAC | Yes | Yes | Yes | No | No | Yes |
| AEC-Q100 Qualified | Yes (extended grade) | Yes | Yes | Yes | Yes | Yes |
| Crypto Accelerator | Hardware AES/TDES | Hardware AES/TDES | Hardware AES/TDES | Hardware AES/TDES | Hardware AES/TDES | Hardware AES/TDES |
Principaux différenciateurs
- Hardware IEEE 754 FPU and DSP extensions (vs PIC32MX795F512L)
- Dual-panel Live-Update Flash (vs PIC32MZ1024EFH100-I/PT)
- Integrated Hi-Speed USB 2.0 and 10/100 Ethernet MAC (vs PIC32MZ1024EFE100-I/PT)
- 12-channel DMA offload engine (vs PIC32MZ1024EFF100-I/PF)
Notes de conception
Place a 100 nF ceramic decoupling capacitor as close as possible to every VDD/VSS pin pair (17 pins total: 5 VDD and 5 VSS as documented in the package pinout) plus a single 4.7 uF bulk capacitor near the package. The PIC32MZ EF core draws transient currents of up to 200 mA during Flash programming; insufficient decoupling can cause brown-out resets. Add a ferrite bead or Pi filter on the analog AVDD rail if ADC readings show noise.
Route the 50 MHz Ethernet RMII traces (RF6-RF13) as a matched-length group with 50 ohm characteristic impedance, keep them at least 3W away from the PWM traces, and place the LAN8720A PHY within 50 mm of the MCU to stay within signal-integrity margins. The 12x12 mm TQFP footprint uses 0.4 mm lead pitch; use 0.1 mm/0.2 mm trace-and-space with microvia-in-pad if going below 4-layer stack-up.
Do not enable the dual-panel Live-Update feature without first understanding the boot Flash bootloader (BFM) sequence documented in section 7 of the family datasheet; misuse can brick the device if the inactive panel becomes corrupted. Also note that the device ships with the JTAG enabled by default - if your design uses a 4-wire ICSP instead, you must disable JTAG in the configuration bits to free up the dedicated pins. Finally, the 3.3V supply must rise monotonically within the POR timing window; an RC reset supervisor is recommended.
At 180 MHz with peripherals active, the PIC32MZ EF core draws roughly 80 mA typical and 130 mA peak. Estimated: with theta_JA of approximately 45 C/W for the 100-pin TQFP on a 4-layer JEDEC test board, this yields a junction temperature rise of about 6 C above ambient at typical load - well within the +125C limit. For designs operating continuously at +125C ambient, derate clock speed or add a small copper heatsink pour.
Informations de conformité
AEC-Q100 qualified per Microchip automotive-grade catalog; RoHS and REACH compliant per DigiKey product listing. No halogen flame-retardants per Microchip environmental compliance disclosure.
