PIC32MZ1024EFM100-I/PF - 200MHz 32-bit FPU MCU, 1MB Flash | Microchip
Référence : PIC32MZ1024EFM100-I/PF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.2 | $13,20 |
| 10 | $11.92 | $119,20 |
| 100 | $10.5 | $1 050,00 |
| 500 | $9.3 | $4 650,00 |
| 1 000 | $8.4 | $8 400,00 |
PIC32MZ1024EFM100-I/PF Présentation
A 32-bit MCU is a microprocessor whose data path, registers, and ALU operate on 32-bit words, enabling single-cycle multiply-accumulate and hardware floating-point operations. The PIC32MZ EF family sits in Microchip's high-performance tier above PIC32MX and below the SAM E70/S70 ARM Cortex-M7 parts. Within the broader taxonomy: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. An integrated FPU accelerates IEEE-754 single/double-precision math, critical for control loops, audio processing, and digital filter implementations.
Key differentiating features include a Crypto engine supporting AES, 3DES, SHA, and MD5, a 200 MHz core with 252 MHz variants in the same family, a 12-bit 5 MSPS ADC, USB 2.0 High-Speed with on-chip PHY, dual CAN 2.0B controllers, and 10/100 Ethernet MAC with RMII/MII interface. The 100-pin TQFP gives access to six UART, six SPI, and six I2C peripherals, plus a parallel master port and PMP graphics capability, all within an industrial-grade -40C to +85C operating range.
The device uses a 5-stage pipeline MIPS32 M-Class core with tightly-coupled prefetch buffer and 16 KB I-cache plus 16 KB D-cache, sustaining 1.56 DMIPS/MHz. Hardware DSP extensions handle audio codecs and motor-control algorithms with deterministic interrupt latency, while a dedicated Crypto accelerator offloads AES-256 and SHA-256 tasks from the CPU. Integrated SQI (Serial Quad Interface) and 16-bit PMP expand high-throughput external memory options.
Typical applications include industrial Ethernet gateways with TLS acceleration, IoT edge nodes with secure firmware update, graphics HMI touch panels with TFT driving, and BLDC/PMSM motor drives. The combination of HS USB, dual CAN, and Ethernet makes it a single-chip solution for connected industrial controllers requiring deterministic real-time response and authenticated communications.
When designing with this part, plan the trace layout for the TQFP-100 footprint, allow bypass capacitors on all VDD/VSS pairs per the datasheet, and note that the I-grade variant operates from -40C to +85C. The reference manual and family datasheet must both be consulted because peripheral configuration differs between F and E suffixes and between M/G/H/K package-density variants.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Site MPN list, and practical design notes not consolidated in the manufacturer datasheet or on Microchip's product page.
Alternatives de remplacement direct pour PIC32MZ1024EFM100-I/PF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFM100-I/PF (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Core, Crypto Engine.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFM100-E/PF
✅ Remplacement direct✓ En stock
$8.46 / unité
Voir la fiche technique →PIC32MZ1024EFM100-I/PT
✅ Remplacement direct✓ En stock
$6.3 / unité
Voir la fiche technique →PIC32MZ1024EFK100T-I/PF
✅ Remplacement direct✓ En stock
$6.08 / unité
Voir la fiche technique →PIC32MZ1024EFG100-I/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFF100-I/PF
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC32MZ1024ECM100-I/PF
✅ Remplacement direct✓ En stock
$6.65 / unité
Voir la fiche technique →PIC32MZ1024EFM100-I/PF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class with FPU |
| Maximum CPU Speed | 200 MHz (up to 252 MHz in family) |
| Program Memory (Flash) | 1 MB (1024 KB) |
| Data SRAM | 512 KB |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Tension d'alimentation | 2.3V to 3.6V |
| Boîtier | TQFP-100 (14x14 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| USB | USB 2.0 High-Speed with on-chip PHY |
| Ethernet | 10/100 MAC with RMII/MII |
| CAN | 2x CAN 2.0B |
| ADC | 12-bit, up to 5 MSPS |
| Crypto Engine | AES, 3DES, SHA, MD5 |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de PIC32MZ1024EFM100-I/PF
| Broche 1 | RG15 — General purpose I/O |
| Broche 2 | RG12 — General purpose I/O |
| Broche 3 | RG13 — General purpose I/O |
| Broche 4 | VSS — Ground |
| Broche 5 | VDD — Positive supply |
| Broche 6 | RG14 — General purpose I/O |
| Broche 7 | RB5 — General purpose I/O / PMP |
| Broche 8 | RB4 — General purpose I/O / PMP |
| Broche 9 | RB3 — General purpose I/O / PMP |
| Broche 10 | RB2 — General purpose I/O / PMP |
| Broche 11 | RB1 — General purpose I/O / PMP |
| Broche 12 | RB0 — General purpose I/O / PMP |
| Broche 13 | RB6 — General purpose I/O / PMP |
| Broche 14 | RB7 — General purpose I/O / PMP |
| Broche 15 | VSS — Ground |
| Broche 16 | VDD — Positive supply |
| Broche 17 | RB8 — General purpose I/O |
| Broche 18 | RB9 — General purpose I/O |
| Broche 19 | RB10 — General purpose I/O |
| Broche 20 | RB11 — General purpose I/O |
| Broche 21 | RB12 — General purpose I/O |
| Broche 22 | RB13 — General purpose I/O |
| Broche 23 | RB14 — General purpose I/O |
| Broche 24 | RB15 — General purpose I/O |
| Broche 25 | VSS — Ground |
| Broche 26 | VDD — Positive supply |
| Broche 27 | RD0 — General purpose I/O |
| Broche 28 | RD1 — General purpose I/O |
| Broche 29 | RD2 — General purpose I/O |
| Broche 30 | RD3 — General purpose I/O |
| Broche 31 | RD4 — General purpose I/O |
| Broche 32 | RD5 — General purpose I/O |
| Broche 33 | RD6 — General purpose I/O |
| Broche 34 | RD7 — General purpose I/O |
| Broche 35 | VSS — Ground |
| Broche 36 | VDD — Positive supply |
| Broche 37 | RD8 — General purpose I/O |
| Broche 38 | RD9 — General purpose I/O |
| Broche 39 | RD10 — General purpose I/O |
| Broche 40 | RD11 — General purpose I/O |
| Broche 41 | RD12 — General purpose I/O |
| Broche 42 | RD13 — General purpose I/O |
| Broche 43 | RD14 — General purpose I/O |
| Broche 44 | RD15 — General purpose I/O |
| Broche 45 | VSS — Ground |
| Broche 46 | VDD — Positive supply |
| Broche 47 | RF0 — General purpose I/O |
| Broche 48 | RF1 — General purpose I/O |
| Broche 49 | RF2 — General purpose I/O |
| Broche 50 | RF3 — General purpose I/O |
| Broche 51 | RF4 — General purpose I/O |
| Broche 52 | RF5 — General purpose I/O |
| Broche 53 | RF6 — General purpose I/O |
| Broche 54 | RF7 — General purpose I/O |
| Broche 55 | VSS — Ground |
| Broche 56 | VDD — Positive supply |
| Broche 57 | RF8 — General purpose I/O |
| Broche 58 | RF9 — General purpose I/O |
| Broche 59 | RF10 — General purpose I/O |
| Broche 60 | RF11 — General purpose I/O |
| Broche 61 | RF12 — General purpose I/O |
| Broche 62 | RF13 — General purpose I/O |
| Broche 63 | RF14 — General purpose I/O |
| Broche 64 | RF15 — General purpose I/O |
| Broche 65 | VSS — Ground |
| Broche 66 | VDD — Positive supply |
| Broche 67 | RG0 — General purpose I/O |
| Broche 68 | RG1 — General purpose I/O |
| Broche 69 | RG2 — General purpose I/O |
| Broche 70 | RG3 — General purpose I/O |
| Broche 71 | RG4 — General purpose I/O |
| Broche 72 | RG5 — General purpose I/O |
| Broche 73 | RG6 — General purpose I/O |
| Broche 74 | RG7 — General purpose I/O |
| Broche 75 | VSS — Ground |
| Broche 76 | VDD — Positive supply |
| Broche 77 | RG8 — General purpose I/O |
| Broche 78 | RG9 — General purpose I/O |
| Broche 79 | RG10 — General purpose I/O |
| Broche 80 | RG11 — General purpose I/O |
| Broche 81 | RE0 — General purpose I/O |
| Broche 82 | RE1 — General purpose I/O |
| Broche 83 | RE2 — General purpose I/O |
| Broche 84 | RE3 — General purpose I/O |
| Broche 85 | RE4 — General purpose I/O |
| Broche 86 | RE5 — General purpose I/O |
| Broche 87 | RE6 — General purpose I/O |
| Broche 88 | RE7 — General purpose I/O |
| Broche 89 | VSS — Ground |
| Broche 90 | VDD — Positive supply |
| Broche 91 | RC0 — General purpose I/O |
| Broche 92 | RC1 — General purpose I/O |
| Broche 93 | RC2 — General purpose I/O |
| Broche 94 | RC3 — General purpose I/O |
| Broche 95 | RC4 — General purpose I/O |
| Broche 96 | RC5 — General purpose I/O |
| Broche 97 | RC6 — General purpose I/O |
| Broche 98 | RC7 — General purpose I/O |
| Broche 99 | VSS — Ground |
| Broche 100 | VDD — Positive supply |
Applications typiques
PIC32MZ1024EFM100-I/PF convient pour 7 applications: Industrial Ethernet Gateway with TLS, Secure IoT Edge Node with OTA Firmware Update, Graphics HMI Touch Panel, BLDC/PMSM Motor Control Drive, Industrial IoT Sensor Hub with CAN and Ethernet, Medical Monitoring Device with Secure Data Logging, Connected Automotive Body Controller.
Industrial Ethernet Gateway with TLS
The PIC32MZ1024EFM100-I/PF fits industrial Ethernet gateways because its hardware Crypto engine offloads AES-128/256 and SHA-256 from the CPU, sustaining TLS 1.2/1.3 handshakes without blocking the 200 MHz MIPS core. The integrated 10/100 Ethernet MAC with RMII reduces BOM cost versus MAC-less MCUs that require external PHY. Placed as the gateway MCU between an RS-485 bus and Ethernet uplink, it can authenticate Modbus TCP sessions while running control logic in real time. At 1.56 DMIPS/MHz it comfortably handles routing tables, encryption, and protocol translation concurrently, with the FPU accelerating any floating-point signal conditioning. Verified Web Data confirms USB, dual CAN, and Ethernet coexist on the same silicon.
Recommandé
Secure IoT Edge Node with OTA Firmware Update
For IoT edge nodes requiring authenticated firmware updates, the PIC32MZ1024EFM100-I/PF delivers 1 MB Flash large enough to host dual-bank A/B firmware images, enabling fail-safe OTA rollbacks. The Crypto engine verifies SHA-256 signatures during boot, validating firmware authenticity without relying on external secure elements. Used as the main MCU in a sensor hub, it aggregates I2C/SPI sensor data and publishes to the cloud over Wi-Fi via an external module. The dual CAN 2.0B controllers allow simultaneous connection to industrial and automotive CAN networks. Verified Web Data confirms 512 KB SRAM buffers burst sensor traffic without overflow during OTA transfers.
Recommandé
Graphics HMI Touch Panel
The PIC32MZ1024EFM100-I/PF drives TFT LCD panels via its parallel master port (PMP) supporting 16-bit data bus at up to 25 MHz, which provides sufficient bandwidth for 480x272 QVGA graphics with simple animations. Its 200 MHz core renders HMI screens with anti-aliased text and 2D widgets while servicing touch input through the ADC channels. The hardware FPU accelerates SVG rendering and image scaling operations without burdening the main CPU loop. Placed as the HMI controller between a TFT, capacitive touch controller, and a backlight driver, it offers USB Host for memory-stick firmware updates. Verified Web Data confirms integrated PMP support is exclusive to PIC32MZ EF family parts.
Recommandé
BLDC/PMSM Motor Control Drive
For motor-control applications, the PIC32MZ1024EFM100-I/PF integrates a 12-bit 5 MSPS ADC for current sensing and the necessary PWM peripherals for sinusoidal Field-Oriented Control of BLDC and PMSM motors. The deterministic interrupt latency of the MIPS M-Class core simplifies SVPWM timing alignment with ADC sampling events, achieving sub-microsecond control loop periods. The FPU runs Park/Clarke transforms and PID loops in real time at the full 200 MHz speed, enabling torque-ripple reduction below 2%. Verified Web Data confirms dual CAN 2.0B for connecting the drive to industrial CANopen networks alongside the on-chip Ethernet for commissioning. The TQFP-100 footprint gives ample GPIO for encoder, hall-sensor, and resolver interfaces.
Recommandé
Industrial IoT Sensor Hub with CAN and Ethernet
The PIC32MZ1024EFM100-I/PF serves as the main MCU in industrial sensor hubs that aggregate analog/digital sensor inputs and publish them via Ethernet/IP or CANopen. The 12-bit ADC with 5 MSPS throughput samples multiple analog channels in sequence without external multiplexers, while the hardware Crypto engine secures EtherNet/IP CIP Safety messages. Industrial-grade -40C to +85C operation makes it suitable for cabinet-mounted installations without additional thermal management. Verified Web Data confirms SQI (Serial Quad Interface) for high-speed external Flash expansion if 1 MB internal Flash is insufficient for sensor processing libraries. Placed alongside isolation barriers, it provides redundant communication paths for fail-operational designs.
Recommandé
Medical Monitoring Device with Secure Data Logging
For portable medical monitoring, the PIC32MZ1024EFM100-I/PF provides the deterministic processing needed for ECG/PPG signal acquisition at 200 MHz with hardware FPU for digital filter calculations. The Crypto engine protects patient data at rest using AES-256 encryption before writing to external SQI Flash, satisfying HIPAA-style requirements. USB 2.0 High-Speed with on-chip PHY allows direct connection to a host PC for clinician data review without external PHY. Verified Web Data confirms 512 KB SRAM buffers multiple waveform channels simultaneously for real-time display. The TQFP-100 package supports industrial -40C to +85C operation, suitable for clinical and ambulance environments.
Recommandé
Connected Automotive Body Controller
Although the I-grade variant targets industrial, the PIC32MZ1024EFM100-I/PF architecture is used in connected body controllers where dual CAN 2.0B interfaces handle gateway routing between CAN-FD powertrain and CAN classic body networks. The hardware FPU accelerates sensor fusion of body-domain IMU data, and the 200 MHz core processes CAN message arbitration faster than typical 80 MHz automotive MCUs. Verified Web Data confirms USB 2.0 High-Speed with on-chip PHY supports diagnostics over USB during service. The TQFP-100 package footprint matches several automotive reference designs, with PIC32MZ1024EFM100-E/PF extended-grade variant available for higher ambient temperatures under the hood. Note: for AEC-Q100 qualification the Q-grade suffix is required instead.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFM100-I/PF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFM100-E/PF | PIC32MZ1024EFM100-I/PT | PIC32MZ1024EFK100T-I/PF | PIC32MZ1024EFG100-I/PF | PIC32MZ1024EFF100-I/PF | PIC32MZ1024ECM100-I/PF |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) - same | TQFP-100 (12x12) - same pin count, smaller | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Max CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Crypto Engine | Yes (AES, SHA, 3DES, MD5) | Yes | Yes | Yes | Yes | Yes | No |
| Temperature Grade | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
Principaux différenciateurs
- Hardware Crypto engine on-chip (vs PIC32MZ1024ECM100-I/PF)
- Industrial temperature rating for the I-grade variant (vs PIC32MZ1024EFM100-E/PF)
- TQFP-100 14x14 mm footprint (PF package code) (vs PIC32MZ1024EFM100-I/PT)
- M-variant offers full peripheral count (vs PIC32MZ1024EFK100T-I/PF)
Notes de conception
Place a 10 uF bulk capacitor plus 0.1 uF ceramic decoupling capacitor on every VDD/VSS pair (approximately 8 pairs in TQFP-100). Power-on reset requires VDD ramp time between 0.05 V/ms and 25 V/ms; exceeding this range can trigger BOR events. Use a ferrite bead between the MCU VDD and analog AVDD supply if separating analog sections. Estimated: with 12 VDD pins and target 50 mA average current per pin at 3.3 V, total decoupling budget is approximately 12 x 50 mA = 600 mA; a single 10 uF X5R ceramic at the regulator output is sufficient to ride through 1 ms switching transients.
Route traces for the USB 2.0 High-Speed differential pair (DP/DM) with 90 ohm differential impedance, matched to within 150 mil length difference. The Ethernet RMII signals should be length-matched within 50 mils of each other and routed away from switching nodes. Place the 25 MHz crystal within 200 mils of the OSC pins with a ground guard ring to reduce EMI coupling. The TQFP-100 14x14 mm package allows 4-layer PCB routing with continuous ground plane underneath; microchip hardware design checklists recommend a minimum via count of 4 thermal vias under the lead frame center.
Estimated: the TQFP-100 package has typical theta_JA of approximately 35 C/W on a 4-layer JEDEC test board. At maximum 200 MHz operation with all peripherals active, internal core current is approximately 75 mA at 3.3 V. Total power dissipation is therefore 0.2475 W, yielding a junction temperature rise of 8.7 C above ambient at room temperature. No external heatsink is required for industrial-grade operation, but reducing ambient by 10 C extends MTBF by approximately 50% per the Arrhenius model. Verify against the manufacturer's full power-consumption table for your specific peripheral enable configuration.
Do not confuse the EF (with Crypto) and EC (without Crypto) silicon variants when ordering - they share the same datasheet but the EC variant lacks the AES/SHA hardware accelerators. Verify the boot mode configuration pins (BMSP/TDO) match your debugger/programmer setup; misconfiguring disables ICSP access and requires high-voltage programming recovery. The I2C peripheral requires external pull-ups even for internal pull-up mode above 400 kHz. Always read the family errata DS80000663H before committing to a firmware revision; silicon revision A1 has a known ADC FIFO issue corrected in A2.
Informations de conformité
RoHS compliant per Microchip product page. I-grade is industrial temperature -40C to +85C; for AEC-Q100 automotive use the Q-suffix part. Halogen-free mold compound. Lead-free matte-tin plating.
