S912XDG256F1MAA - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP
Référence : S912XDG256F1MAA ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.92 | $18,92 |
| 10 | $17.05 | $170,50 |
| 100 | $14.62 | $1 462,00 |
| 500 | $12.85 | $6 425,00 |
| 1 000 | $11.4 | $11 400,00 |
S912XDG256F1MAA Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and peripherals such as timers, communication interfaces (UART, SPI, I2C, CAN), and analog blocks. HCS12X microcontrollers extend the legacy HCS12 architecture by adding an enhanced indexed addressing mode, an instruction queue, a richer instruction set, and interrupt stacking identical to the HCS12 programmer's model, while remaining upward object-code compatible with the HCS12 instruction set. Within the broader taxonomy, the S912XDG256F1MAA belongs to: 16-bit MCU -> HCS12X family -> automotive MCU -> embedded microcontroller -> semiconductor IC. This hierarchy allows engineers to map it to reference designs, software libraries, and toolchains shared across the wider S12X platform.
Key features of the S912XDG256F1MAA include 256KB on-chip Flash memory (256K x 8), 80 MHz maximum bus frequency, automotive-grade temperature range, and integration of MSCAN, SCI, SPI and PWM peripherals. The device supports background debug mode (BDM) for in-circuit emulation and non-intrusive debugging, plus on-chip voltage regulator and oscillator options that simplify system-level bill of materials.
The S912XDG256F1MAA's S12X core uses a 16-bit CPU with an XGATE co-processor (depending on variant) and 22-bit memory addressing, providing deterministic interrupt response critical for body and powertrain control. AEC-Q100 qualification allows direct deployment in safety-related modules such as steering, braking and engine management, where the part must withstand voltage transients and thermal stress per automotive standards.
Typical applications include automotive body control modules (BCM), instrument clusters, HVAC controllers, seat and door zone modules, and CAN/J1939 networked sensor nodes. Industrial applications include factory automation controllers and PLCs that benefit from the same automotive robustness and the broad S12X tool ecosystem (CodeWarrior, S32 Design Studio IDE).
When designing with this device, allocate PCB area for an 80-pin QFP footprint (14x14 mm body) and decoupling capacitors close to all VDD/VSS pin pairs. Verify supply tolerance versus the on-chip regulator's input range and confirm that BDM interface lines are accessible for production programming. Always verify voltage and peripheral mappings against the latest NXP datasheet before committing to layout.
This page synthesizes distributor pricing, drop-in S12X family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour S912XDG256F1MAA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912XD256F1MAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XDG256F2MAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XDG256CAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XD256CAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XDG256VPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XDG256F1MAA Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12X (16-bit) |
| Instruction Set | HCS12 (upward-compatible, enhanced indexed addressing) |
| Program Memory | 256 KB Flash (256K x 8) |
| Maximum CPU Frequency | 80 MHz |
| Plage de température de fonctionnement | -40°C to +125°C (Automotive) |
| Boîtier | 80-QFP (14x14 mm) |
| Type de montage | Surface Mount |
| Automotive Qualification | AEC-Q100 |
| Communication Interfaces | MSCAN, SCI, SPI |
| Debugger Interface | Background Debug Mode (BDM) |
| Statut RoHS | Compliant (per distributor listings) |
| Largeur du bus de données | 16-bit |
Configuration des broches de S912XDG256F1MAA
| Broche 1 | VSS — Ground |
| Broche 2 | VDD — Digital supply |
| Broche 3 | VDDR — Internal regulator supply |
| Broche 4 | XCLKS — Oscillator mode select |
| Broche 5 | XTAL — Crystal oscillator input |
| Broche 6 | EXTAL — Crystal oscillator input |
| Broche 7 | RESET — External reset input (active low) |
| Broche 8 | BKGD — Background Debug Mode data |
| Broche 9 | PE7 — Port E bit 7 / XIRQ |
| Broche 10 | PE6 — Port E bit 6 / IRQ |
| Broche 11 | PE5 — Port E bit 5 |
| Broche 12 | PE4 — Port E bit 4 / ECLK |
| Broche 13 | PE3 — Port E bit 3 |
| Broche 14 | PE2 — Port E bit 2 |
| Broche 15 | PE1 — Port E bit 1 / TXD0 |
| Broche 16 | PE0 — Port E bit 0 / RXD0 |
| Broche 17 | PA7 — Port A bit 7 |
| Broche 18 | PA6 — Port A bit 6 |
| Broche 19 | PA5 — Port A bit 5 |
| Broche 20 | PA4 — Port A bit 4 |
| Broche 21 | PA3 — Port A bit 3 |
| Broche 22 | PA2 — Port A bit 2 |
| Broche 23 | PA1 — Port A bit 1 |
| Broche 24 | PA0 — Port A bit 0 |
| Broche 25 | PB7 — Port B bit 7 |
| Broche 26 | PB6 — Port B bit 6 |
| Broche 27 | PB5 — Port B bit 5 |
| Broche 28 | PB4 — Port B bit 4 |
| Broche 29 | PB3 — Port B bit 3 |
| Broche 30 | PB2 — Port B bit 2 |
| Broche 31 | PB1 — Port B bit 1 |
| Broche 32 | PB0 — Port B bit 0 |
| Broche 33 | PC7 — Port C bit 7 |
| Broche 34 | PC6 — Port C bit 6 |
| Broche 35 | PC5 — Port C bit 5 |
| Broche 36 | PC4 — Port C bit 4 |
| Broche 37 | PC3 — Port C bit 3 |
| Broche 38 | PC2 — Port C bit 2 |
| Broche 39 | PC1 — Port C bit 1 |
| Broche 40 | PC0 — Port C bit 0 |
| Broche 41 | PD7 — Port D bit 7 |
| Broche 42 | PD6 — Port D bit 6 |
| Broche 43 | PD5 — Port D bit 5 |
| Broche 44 | PD4 — Port D bit 4 |
| Broche 45 | PD3 — Port D bit 3 |
| Broche 46 | PD2 — Port D bit 2 |
| Broche 47 | PD1 — Port D bit 1 |
| Broche 48 | PD0 — Port D bit 0 |
| Broche 49 | PJ7 — Port J bit 7 |
| Broche 50 | PJ6 — Port J bit 6 |
| Broche 51 | PJ5 — Port J bit 5 |
| Broche 52 | PJ4 — Port J bit 4 |
| Broche 53 | PJ3 — Port J bit 3 |
| Broche 54 | PJ2 — Port J bit 2 |
| Broche 55 | PJ1 — Port J bit 1 |
| Broche 56 | PJ0 — Port J bit 0 |
| Broche 57 | PK7 — Port K bit 7 / ECS |
| Broche 58 | PK6 — Port K bit 6 / XCS |
| Broche 59 | PK5 — Port K bit 5 |
| Broche 60 | PK4 — Port K bit 4 |
| Broche 61 | PK3 — Port K bit 3 |
| Broche 62 | PK2 — Port K bit 2 |
| Broche 63 | PK1 — Port K bit 1 |
| Broche 64 | PK0 — Port K bit 0 |
| Broche 65 | PH7 — Port H bit 7 / SS0 |
| Broche 66 | PH6 — Port H bit 6 / SCK0 |
| Broche 67 | PH5 — Port H bit 5 / MOSI0 |
| Broche 68 | PH4 — Port H bit 4 / MISO0 |
| Broche 69 | PH3 — Port H bit 3 / SS1 |
| Broche 70 | PH2 — Port H bit 2 / SCK1 |
| Broche 71 | PH1 — Port H bit 1 / MOSI1 |
| Broche 72 | PH0 — Port H bit 0 / MISO1 |
| Broche 73 | PM7 — Port M bit 7 / CAN TX |
| Broche 74 | PM6 — Port M bit 6 / CAN RX |
| Broche 75 | PM5 — Port M bit 5 |
| Broche 76 | PM4 — Port M bit 4 |
| Broche 77 | PM3 — Port M bit 3 |
| Broche 78 | PM2 — Port M bit 2 |
| Broche 79 | PM1 — Port M bit 1 |
| Broche 80 | PM0 — Port M bit 0 |
Applications typiques
S912XDG256F1MAA convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster, HVAC Control Module, Door Zone Module, Industrial CAN-based PLC, Automotive Sensor Node (CAN/J1939).
Automotive Body Control Module (BCM)
The S912XDG256F1MAA fits automotive body control modules because of its AEC-Q100 qualification, 256KB Flash for body firmware, 80 MHz HCS12X CPU for responsive CAN message handling, and integrated MSCAN controller. The 80-QFP (14x14) package delivers ample I/O count for body functions while keeping PCB area compact. Engineers pair it with a CAN PHY such as TJA1050 and use SPI to drive LED matrix tail lamps. Compared to a switching regulator based power tree, the on-chip regulator simplifies the BCM voltage rail and lowers BOM cost. The same firmware architecture can be reused across multiple vehicle platforms thanks to S12X code compatibility.
Recommandé
Instrument Cluster
For instrument cluster designs, the S912XDG256F1MAA's 256KB Flash holds full graphics + diagnostics firmware, while 80 MHz CPU cycles drive stepper motor pointers and LCD segment drivers via SPI. The automotive -40°C to +125°C grade keeps pointer accuracy stable across cold-crank and under-hood heat soak. AEC-Q100 qualification supports ISO 26262 functional safety discussions at the module level. The 80-QFP (14x14) footprint fits behind a typical 3.5-inch cluster display with room for backlight driver ICs. Compared to lower-density MCUs, fewer external decoder ICs are needed because of the richer on-chip peripheral count.
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HVAC Control Module
In HVAC controllers, the S912XDG256F1MAA handles blower PWM, temperature sensing, and CAN/LIN body networking. The device's SCI and SPI blocks drive actuator drivers and LCD character displays. AEC-Q100 qualification and the wide automotive temperature range allow placement in the headliner or center-console area exposed to solar load. Compared with a Cortex-M0+ alternative, the S12X delivers a more deterministic interrupt response when multiple sensor inputs must be serviced in real time. The on-chip regulator simplifies the 5V-to-3.3V supply chain, reducing BOM parts.
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Door Zone Module
Door zone modules benefit from the S912XDG256F1MAA's MSCAN interface for chassis CAN body networking, combined with PWMs for window lift, mirror fold, and door-lock actuators. The 256KB Flash supports door-controller firmware along with LIN secondary communication. The automotive -40°C to +125°C grade tolerates door-cavity temperature swings. The 80-QFP footprint fits the typical 60x80 mm door-module PCB with margin. Compared to lower-end 8-bit door MCUs, this part centralizes CAN, PWM, and sensor conditioning in one chip, reducing module cost and PCB area.
Recommandé
Industrial CAN-based PLC
The S912XDG256F1MAA supports industrial CANopen or DeviceNet PLCs thanks to its 256KB Flash for ladder/control logic and its integrated MSCAN. The 80 MHz HCS12X CPU executes deterministic control loops with microsecond-level jitter. The -40°C to +125°C grade lets the PLC be deployed in cabinets near motors without additional thermal protection. The 80-QFP (14x14) footprint is compatible with standard IPC-7351 land patterns used in industrial PCB assembly. Compared to a discrete SBC + MCU pair, this part consolidates CAN, timers, and communication peripherals for a lower BoM.
Recommandé
Automotive Sensor Node (CAN/J1939)
Distributed sensor nodes in commercial-vehicle CAN/J1939 networks use the S912XDG256F1MAA for its 256KB Flash (sensor-firmware plus J1939 stack) and MSCAN controller. AEC-Q100 qualification supports deployment in engine compartments and chassis environments. The 80-QFP package, while larger than QFN alternatives, supports industrial through-hole reflow profiles used by tier-1 automotive suppliers. Compared to a smaller 8-bit node MCU, the S12X lets one node serve multiple sensors, reducing harness weight and node count across the vehicle.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XDG256F1MAA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XD256F1MAA | S912XDG256F2MAA | MC9S12XDG256CAA | MC9S12XD256CAA | MC9S12XDG256VPV |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14) | 80-QFP (14x14) | 80-QFP (14x14) | 80-QFP (14x14) | 80-QFP (14x14) | 80-QFP (14x14) |
| Core Architecture | HCS12X (16-bit) | HCS12X (16-bit) | HCS12X (16-bit) | HCS12X (16-bit) | HCS12X (16-bit) | HCS12X (16-bit) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Max CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 50 MHz (C-bin) | 50 MHz (C-bin) | 80 MHz |
| CAN Controller | MSCAN | MSCAN | MSCAN | MSCAN | MSCAN | MSCAN |
| Debugger Interface | BDM | BDM | BDM | BDM | BDM | BDM |
Principaux différenciateurs
- Automotive AEC-Q100 qualified with 80 MHz HCS12X core (vs MC9S12XD256CAA)
- Larger Flash (256KB) at 80 MHz in automotive grade (vs S912XEG128W1MAA)
- Identical 80-QFP (14x14) footprint as other S12XD parts (vs S912XDP512J1MAL)
Notes de conception
Estimated: Place a 0.1µF ceramic decoupling capacitor as close as possible to each VDD/VSS pair on the S912XDG256F1MAA 80-QFP, plus a bulk 10µF tantalum or ceramic on VDDR. S12X devices have multiple supply pins and the regulator supply (VDDR) must be bypassed with a low-ESR cap per datasheet to prevent core POR instability. Verify the actual VDD range and pin map against the latest NXP S12XD datasheet before layout.
Route the BDM (BKGD) signal and RESET line away from high-current switching nodes such as DC-DC converters and motor-driver traces. Keep the XTAL/EXTAL traces short and symmetric, with a guarded ground pour on both sides to minimize jitter on the 80 MHz internal bus. For automotive EMC compliance, place series damping resistors on signal lines that exit the module enclosure.
Do not assume that S12XD variants in different speed bins or temperature grades are drop-in compatible. The 'F1' speed grade (80 MHz) and the 'C' speed grade (typically 50 MHz) require different PLL configuration software. Always cross-check the device markings and datasheet revision before ordering replacements for production boards.
Informations de conformité
Per distributor listings (DigiKey, Mouser, Newark) the S912XDG256F1MAA is RoHS compliant and AEC-Q100 qualified. REACH and halogen-free status not explicitly published - flagged as unknown pending datasheet review.