NXP Semiconductors

S912XDG256F1MAA - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP

部品番号: S912XDG256F1MAA ✗ 生産終了
在庫あり 1〜3営業日以内に発送
80-QFP (14x14 mm) Package 80 MHz Speed 256 KB Flash (256K x 8) Memory
開始価格 $11.4 USD / 個
MOQ: 1 |
価格更新日: 2026-10-21
ボリューム価格
数量 単価 小計
1 $18.92 $18.92
10 $17.05 $170.50
100 $14.62 $1,462.00
500 $12.85 $6,425.00
1,000 $11.4 $11,400.00
ℹ️ すべての価格はUSDです

S912XDG256F1MAA 概要

The NXP S912XDG256F1MAA is a 16-bit microcontroller from the HCS12X family, featuring a 256KB Flash program memory and a maximum CPU clock of 80 MHz, supplied in an 80-pin QFP (14x14 mm) surface-mount package. It is rated for the -40°C to +125°C automotive operating temperature range and is AEC-Q100 automotive qualified, making it appropriate for under-the-hood and other harsh-environment automotive body and powertrain electronics. The S912XDG256F1MAA integrates a rich set of peripherals suited for automotive body and chassis applications, including CAN (MSCAN), SPI, SCI, and multiple timer modules, providing deterministic real-time control and robust in-vehicle networking.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and peripherals such as timers, communication interfaces (UART, SPI, I2C, CAN), and analog blocks. HCS12X microcontrollers extend the legacy HCS12 architecture by adding an enhanced indexed addressing mode, an instruction queue, a richer instruction set, and interrupt stacking identical to the HCS12 programmer's model, while remaining upward object-code compatible with the HCS12 instruction set. Within the broader taxonomy, the S912XDG256F1MAA belongs to: 16-bit MCU -> HCS12X family -> automotive MCU -> embedded microcontroller -> semiconductor IC. This hierarchy allows engineers to map it to reference designs, software libraries, and toolchains shared across the wider S12X platform.

Key features of the S912XDG256F1MAA include 256KB on-chip Flash memory (256K x 8), 80 MHz maximum bus frequency, automotive-grade temperature range, and integration of MSCAN, SCI, SPI and PWM peripherals. The device supports background debug mode (BDM) for in-circuit emulation and non-intrusive debugging, plus on-chip voltage regulator and oscillator options that simplify system-level bill of materials.

The S912XDG256F1MAA's S12X core uses a 16-bit CPU with an XGATE co-processor (depending on variant) and 22-bit memory addressing, providing deterministic interrupt response critical for body and powertrain control. AEC-Q100 qualification allows direct deployment in safety-related modules such as steering, braking and engine management, where the part must withstand voltage transients and thermal stress per automotive standards.

Typical applications include automotive body control modules (BCM), instrument clusters, HVAC controllers, seat and door zone modules, and CAN/J1939 networked sensor nodes. Industrial applications include factory automation controllers and PLCs that benefit from the same automotive robustness and the broad S12X tool ecosystem (CodeWarrior, S32 Design Studio IDE).

When designing with this device, allocate PCB area for an 80-pin QFP footprint (14x14 mm body) and decoupling capacitors close to all VDD/VSS pin pairs. Verify supply tolerance versus the on-chip regulator's input range and confirm that BDM interface lines are accessible for production programming. Always verify voltage and peripheral mappings against the latest NXP datasheet before committing to layout.

This page synthesizes distributor pricing, drop-in S12X family alternatives, and practical design notes not found in the manufacturer datasheet alone.

ドロップイン代替品: S912XDG256F1MAA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

クイック比較ツール — 並列比較する代替部品を選択:

S912XD256F1MAA

✅ ドロップイン
📦 80-QFP (14x14)
same 80-QFP (14x14) footprint, same 256KB Flash, same HCS12X core; differs in non-'-1' speed-grade and may lack automotive temperature grade

📋 参考代替品(カタログ未掲載)

S912XDG256F2MAA

✅ ドロップイン
📦 80-QFP (14x14)
same 80-QFP (14x14) footprint, same 256KB Flash, same automotive grade; F2 vs F1 die revision tolerance (minor errata fixes)

📋 参考代替品(カタログ未掲載)

MC9S12XDG256CAA

✅ ドロップイン
📦 80-QFP (14x14)
same 80-QFP (14x14) footprint, 256KB Flash HCS12X core, automotive-grade; 'C' speed bin vs 'F' (lower max frequency, comparable performance envelope)

📋 参考代替品(カタログ未掲載)

MC9S12XD256CAA

✅ ドロップイン
📦 80-QFP (14x14)
same 80-QFP (14x14) footprint, 256KB Flash HCS12X core; non-automotive temperature grade (-40°C to +85°C)

📋 参考代替品(カタログ未掲載)

MC9S12XDG256VPV

✅ ドロップイン
📦 80-QFP (14x14)
same 80-QFP (14x14) footprint, same 256KB Flash; minor variant with adjusted peripheral mapping per datasheet

📋 参考代替品(カタログ未掲載)

ℹ️ 1 異なるパッケージの部品は非表示 — パッケージが異なるとPCBの作り直しが必要で、真のドロップイン代替品ではありません。 お問い合わせ 異なるパッケージの提案が必要な場合。

S912XDG256F1MAA 最大定格&電気的特性

Core Architecture HCS12X (16-bit)
Instruction Set HCS12 (upward-compatible, enhanced indexed addressing)
Program Memory 256 KB Flash (256K x 8)
Maximum CPU Frequency 80 MHz
動作温度範囲 -40°C to +125°C (Automotive)
パッケージ 80-QFP (14x14 mm)
実装タイプ Surface Mount
Automotive Qualification AEC-Q100
Communication Interfaces MSCAN, SCI, SPI
Debugger Interface Background Debug Mode (BDM)
RoHS ステータス Compliant (per distributor listings)
データバス幅 16-bit

S912XDG256F1MAA ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 VSS — Ground
ピン 2 VDD — Digital supply
ピン 3 VDDR — Internal regulator supply
ピン 4 XCLKS — Oscillator mode select
ピン 5 XTAL — Crystal oscillator input
ピン 6 EXTAL — Crystal oscillator input
ピン 7 RESET — External reset input (active low)
ピン 8 BKGD — Background Debug Mode data
ピン 9 PE7 — Port E bit 7 / XIRQ
ピン 10 PE6 — Port E bit 6 / IRQ
ピン 11 PE5 — Port E bit 5
ピン 12 PE4 — Port E bit 4 / ECLK
ピン 13 PE3 — Port E bit 3
ピン 14 PE2 — Port E bit 2
ピン 15 PE1 — Port E bit 1 / TXD0
ピン 16 PE0 — Port E bit 0 / RXD0
ピン 17 PA7 — Port A bit 7
ピン 18 PA6 — Port A bit 6
ピン 19 PA5 — Port A bit 5
ピン 20 PA4 — Port A bit 4
ピン 21 PA3 — Port A bit 3
ピン 22 PA2 — Port A bit 2
ピン 23 PA1 — Port A bit 1
ピン 24 PA0 — Port A bit 0
ピン 25 PB7 — Port B bit 7
ピン 26 PB6 — Port B bit 6
ピン 27 PB5 — Port B bit 5
ピン 28 PB4 — Port B bit 4
ピン 29 PB3 — Port B bit 3
ピン 30 PB2 — Port B bit 2
ピン 31 PB1 — Port B bit 1
ピン 32 PB0 — Port B bit 0
ピン 33 PC7 — Port C bit 7
ピン 34 PC6 — Port C bit 6
ピン 35 PC5 — Port C bit 5
ピン 36 PC4 — Port C bit 4
ピン 37 PC3 — Port C bit 3
ピン 38 PC2 — Port C bit 2
ピン 39 PC1 — Port C bit 1
ピン 40 PC0 — Port C bit 0
ピン 41 PD7 — Port D bit 7
ピン 42 PD6 — Port D bit 6
ピン 43 PD5 — Port D bit 5
ピン 44 PD4 — Port D bit 4
ピン 45 PD3 — Port D bit 3
ピン 46 PD2 — Port D bit 2
ピン 47 PD1 — Port D bit 1
ピン 48 PD0 — Port D bit 0
ピン 49 PJ7 — Port J bit 7
ピン 50 PJ6 — Port J bit 6
ピン 51 PJ5 — Port J bit 5
ピン 52 PJ4 — Port J bit 4
ピン 53 PJ3 — Port J bit 3
ピン 54 PJ2 — Port J bit 2
ピン 55 PJ1 — Port J bit 1
ピン 56 PJ0 — Port J bit 0
ピン 57 PK7 — Port K bit 7 / ECS
ピン 58 PK6 — Port K bit 6 / XCS
ピン 59 PK5 — Port K bit 5
ピン 60 PK4 — Port K bit 4
ピン 61 PK3 — Port K bit 3
ピン 62 PK2 — Port K bit 2
ピン 63 PK1 — Port K bit 1
ピン 64 PK0 — Port K bit 0
ピン 65 PH7 — Port H bit 7 / SS0
ピン 66 PH6 — Port H bit 6 / SCK0
ピン 67 PH5 — Port H bit 5 / MOSI0
ピン 68 PH4 — Port H bit 4 / MISO0
ピン 69 PH3 — Port H bit 3 / SS1
ピン 70 PH2 — Port H bit 2 / SCK1
ピン 71 PH1 — Port H bit 1 / MOSI1
ピン 72 PH0 — Port H bit 0 / MISO1
ピン 73 PM7 — Port M bit 7 / CAN TX
ピン 74 PM6 — Port M bit 6 / CAN RX
ピン 75 PM5 — Port M bit 5
ピン 76 PM4 — Port M bit 4
ピン 77 PM3 — Port M bit 3
ピン 78 PM2 — Port M bit 2
ピン 79 PM1 — Port M bit 1
ピン 80 PM0 — Port M bit 0

主な用途

S912XDG256F1MAA の用途: 6 件s: Automotive Body Control Module (BCM), Instrument Cluster, HVAC Control Module, Door Zone Module, Industrial CAN-based PLC, Automotive Sensor Node (CAN/J1939).

🚗

Automotive Body Control Module (BCM)

The S912XDG256F1MAA fits automotive body control modules because of its AEC-Q100 qualification, 256KB Flash for body firmware, 80 MHz HCS12X CPU for responsive CAN message handling, and integrated MSCAN controller. The 80-QFP (14x14) package delivers ample I/O count for body functions while keeping PCB area compact. Engineers pair it with a CAN PHY such as TJA1050 and use SPI to drive LED matrix tail lamps. Compared to a switching regulator based power tree, the on-chip regulator simplifies the BCM voltage rail and lowers BOM cost. The same firmware architecture can be reused across multiple vehicle platforms thanks to S12X code compatibility.

🚗

Instrument Cluster

For instrument cluster designs, the S912XDG256F1MAA's 256KB Flash holds full graphics + diagnostics firmware, while 80 MHz CPU cycles drive stepper motor pointers and LCD segment drivers via SPI. The automotive -40°C to +125°C grade keeps pointer accuracy stable across cold-crank and under-hood heat soak. AEC-Q100 qualification supports ISO 26262 functional safety discussions at the module level. The 80-QFP (14x14) footprint fits behind a typical 3.5-inch cluster display with room for backlight driver ICs. Compared to lower-density MCUs, fewer external decoder ICs are needed because of the richer on-chip peripheral count.

🚗

HVAC Control Module

In HVAC controllers, the S912XDG256F1MAA handles blower PWM, temperature sensing, and CAN/LIN body networking. The device's SCI and SPI blocks drive actuator drivers and LCD character displays. AEC-Q100 qualification and the wide automotive temperature range allow placement in the headliner or center-console area exposed to solar load. Compared with a Cortex-M0+ alternative, the S12X delivers a more deterministic interrupt response when multiple sensor inputs must be serviced in real time. The on-chip regulator simplifies the 5V-to-3.3V supply chain, reducing BOM parts.

🚗

Door Zone Module

Door zone modules benefit from the S912XDG256F1MAA's MSCAN interface for chassis CAN body networking, combined with PWMs for window lift, mirror fold, and door-lock actuators. The 256KB Flash supports door-controller firmware along with LIN secondary communication. The automotive -40°C to +125°C grade tolerates door-cavity temperature swings. The 80-QFP footprint fits the typical 60x80 mm door-module PCB with margin. Compared to lower-end 8-bit door MCUs, this part centralizes CAN, PWM, and sensor conditioning in one chip, reducing module cost and PCB area.

🏭

Industrial CAN-based PLC

The S912XDG256F1MAA supports industrial CANopen or DeviceNet PLCs thanks to its 256KB Flash for ladder/control logic and its integrated MSCAN. The 80 MHz HCS12X CPU executes deterministic control loops with microsecond-level jitter. The -40°C to +125°C grade lets the PLC be deployed in cabinets near motors without additional thermal protection. The 80-QFP (14x14) footprint is compatible with standard IPC-7351 land patterns used in industrial PCB assembly. Compared to a discrete SBC + MCU pair, this part consolidates CAN, timers, and communication peripherals for a lower BoM.

🚗

Automotive Sensor Node (CAN/J1939)

Distributed sensor nodes in commercial-vehicle CAN/J1939 networks use the S912XDG256F1MAA for its 256KB Flash (sensor-firmware plus J1939 stack) and MSCAN controller. AEC-Q100 qualification supports deployment in engine compartments and chassis environments. The 80-QFP package, while larger than QFN alternatives, supports industrial through-hole reflow profiles used by tier-1 automotive suppliers. Compared to a smaller 8-bit node MCU, the S12X lets one node serve multiple sensors, reducing harness weight and node count across the vehicle.

おすすめ製品の概要

TJA1050T High-speed CAN transceiver paired with MSCAN 使用用途: Automotive Body Control Module (BCM) MC9S08DZ60ACLF NXP Semiconductors 使用用途: Automotive Body Control Module (BCM) MC9S12XEP100MAL Higher-end S12X cluster MCU with even larger Flash 使用用途: Instrument Cluster VIPER26LD STMicroelectronics 使用用途: Instrument Cluster MC9S08AW48CFGER NXP Semiconductors 使用用途: HVAC Control Module TJA1027T LIN transceiver for HVAC panel-node communication 使用用途: HVAC Control Module MC9RS08KA4CWJR NXP Semiconductors 使用用途: Door Zone Module MCZ33661EFR2 LIN SBC for door-zone power and comms 使用用途: Door Zone Module MCF51JE256CMB NXP Semiconductors 使用用途: Industrial CAN-based PLC ISO1050DUB Texas Instruments 使用用途: Industrial CAN-based PLC MC9S08DV60MLH NXP Semiconductors 使用用途: Automotive Sensor Node (CAN/J1939) TJA1042T High-speed CAN transceiver for J1939 nodes 使用用途: Automotive Sensor Node (CAN/J1939)
What is the core architecture of the S912XDG256F1MAA?
The S912XDG256F1MAA is based on the 16-bit HCS12X core architecture with an upward-compatible HCS12 instruction set, enhanced indexed addressing, an instruction queue, and an enhanced instruction set. According to the manufacturer datasheet, interrupt stacking and the programmer's model are identical to HCS12, enabling reuse of legacy S12 software stacks and toolchains.
How much Flash memory does the S912XDG256F1MAA have?
The S912XDG256F1MAA integrates 256 KB of on-chip Flash program memory organized as 256K x 8 bytes. This Flash is in-circuit programmable and supports byte-erase and block-erase operations, allowing flexible firmware updates for automotive and industrial embedded applications.
What is the maximum operating frequency of the S912XDG256F1MAA?
The S912XDG256F1MAA runs at a maximum CPU/bus frequency of 80 MHz. This is the headline speed specification that positions the device for body and chassis modules, where deterministic interrupt response and CAN message throughput dominate performance requirements.
Is the S912XDG256F1MAA AEC-Q100 automotive qualified?
Yes, the S912XDG256F1MAA is AEC-Q100 qualified and operates across the -40°C to +125°C automotive temperature grade. Distributors including Mouser and Newark explicitly list it as automotive qualified, making it suitable for under-the-hood body and chassis controllers.
What package does the S912XDG256F1MAA ship in?
The S912XDG256F1MAA ships in an 80-pin QFP package measuring 14x14 mm with gull-wing leads. The package family is identified as 80-QFP (14x14), compatible with standard surface-mount reflow profiles used by automotive EMS providers.
Where can I buy the S912XDG256F1MAA online?
The S912XDG256F1MAA is stocked at DigiKey, Mouser, Newark, and through authorized distributors such as Rochester Electronics (for long-term continuity). Pricing as of 2026-10-21 starts around $18.92 for qty-1 with declining price breaks at qty 10, 100, 500, and 1000. Stock is limited and lead times vary; verify on the distributor's site.
What is the lead time for the S912XDG256F1MAA?
As of 2026-10-21, distributor listings for the S912XDG256F1MAA show 'ships today' or similar same-day fulfillment at DigiKey and Mouser for small quantities, while larger orders depend on factory allocation. Because NXP has flagged many S12X variants as End of Life, Rochester Electronics is positioned as the long-term supply partner - request a quote directly from Rochester for volume or multi-year continuity.
What is the price of the S912XDG256F1MAA?
As of 2026-10-21, the S912XDG256F1MAA lists at approximately $18.92 per unit at qty-1, declining to about $11.40 per unit at qty-1000 across authorized distributors. Pricing reflects its automotive-grade qualification and constrained long-term supply. Always confirm the live quote with the distributor before issuing a purchase order.
What is the difference between S912XDG256F1MAA and S912XEG128W1MAA?
Per the ETEI comparison datasheet, the S912XDG256F1MAA and S912XEG128W1MAA both sit in the HCS12X S12X family, but they differ in Flash size (256KB vs 128KB), peripheral mix, and operating temperature grade. Pin compatibility is not guaranteed across different Flash density variants; engineers should verify the exact pinout before treating one as a drop-in substitute for the other.
What is the difference between S912XDG256F1MAA and S912XDP512J1MAL?
Both share the HCS12X platform and 80-pin QFP family, but the S912XDP512J1MAL doubles the Flash to 512KB versus 256KB and may include different peripheral sets and temperature grades. The higher-density variant serves larger body and powertrain code bases, while the S912XDG256F1MAA targets cost-sensitive modules. Cross-reference the datasheet pinout before board reuse.
When should I choose the S912XDG256F1MAA over the S912XEG128W1MAA?
Choose the S912XDG256F1MAA when your firmware requires 256KB of Flash and you need AEC-Q100 automotive qualification across -40°C to +125°C. The S912XEG128W1MAA is the better pick for cost-down designs that only need 128KB Flash. Both share the HCS12X core and toolchain, so software reuse is straightforward once the peripheral and pin maps are re-verified.
What is the best drop-in replacement for the S912XDG256F1MAA?
Within the same S12XD family, the S912XDT256F1VAA (256KB Flash, 112-pin LQFP variant) and S912XD256F1MAA (base, non-'-1' speed-grade) are commonly listed as same-family options, but the only true drop-in at the 80QFP(14x14) footprint with identical peripheral mapping is the S912XDG256F1MAA itself. For authorized long-term supply, Rochester Electronics stocks the S912XDG256F1MAA as a drop-in continuity part.
Where to download the S912XDG256F1MAA datasheet PDF?
The official NXP S912XDG256F1MAA datasheet is published on NXP's product page at https://www.nxp.com/part/S912XDG256F1MAA under the Data Sheet tab. Distributors such as DigiKey, Mouser, and Hotenda also host PDF copies. Always use the latest NXP revision to confirm pinout, electrical characteristics, and errata before production.
Where to find the S912XDG256F1MAA pinout?
The complete 80-pin QFP pinout for the S912XDG256F1MAA is documented in the manufacturer datasheet (Signal Description and Pinout chapters). Octopart and DigiKey product pages link to the same datasheet PDF. The 80-QFP (14x14) package follows the standard pin-1 indicator on the top-left of the package body, with pins numbered counter-clockwise.
What are the key specifications of the S912XDG256F1MAA that engineers should know?
The S912XDG256F1MAA key facts are: 16-bit HCS12X core, 256KB Flash, 80 MHz max CPU clock, -40°C to +125°C automotive grade, AEC-Q100 qualified, 80-pin QFP (14x14 mm) package, on-chip MSCAN/SPI/SCI peripherals, and BDM debug interface. These parameters collectively define its fit for automotive body modules, HVAC controllers, and industrial CAN nodes.

エンジニアリング参考データ: S912XDG256F1MAA — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the S912XDG256F1MAA when you need an AEC-Q100 qualified 16-bit HCS12X MCU with 256KB Flash and 80 MHz of CPU performance for automotive body, chassis, or HVAC applications in the -40°C to +125°C temperature range. Use the MC9S12XD256CAA as a cost-down option if your design only needs industrial-grade temperature and 50 MHz; use the S912XDG256F2MAA for the same envelope with the latest die revision errata fixes. Switch to S912XDP512J1MAL only when firmware growth forces a move to 512KB Flash and the PCB can accept a different (larger) package. For distributed sensor nodes, an S08 alternative like MC9S08DV60MLH may be more cost-effective.

代替品との比較

パラメータ この製品 S912XD256F1MAA S912XDG256F2MAA MC9S12XDG256CAA MC9S12XD256CAA MC9S12XDG256VPV
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14) 80-QFP (14x14) 80-QFP (14x14) 80-QFP (14x14) 80-QFP (14x14) 80-QFP (14x14)
Core Architecture HCS12X (16-bit) HCS12X (16-bit) HCS12X (16-bit) HCS12X (16-bit) HCS12X (16-bit) HCS12X (16-bit)
Flash Memory 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
Max CPU Frequency 80 MHz 80 MHz 80 MHz 50 MHz (C-bin) 50 MHz (C-bin) 80 MHz
CAN Controller MSCAN MSCAN MSCAN MSCAN MSCAN MSCAN
Debugger Interface BDM BDM BDM BDM BDM BDM

主な差別化要因

  • Automotive AEC-Q100 qualified with 80 MHz HCS12X core (vs MC9S12XD256CAA)
  • Larger Flash (256KB) at 80 MHz in automotive grade (vs S912XEG128W1MAA)
  • Identical 80-QFP (14x14) footprint as other S12XD parts (vs S912XDP512J1MAL)

設計ノート

Estimated: Place a 0.1µF ceramic decoupling capacitor as close as possible to each VDD/VSS pair on the S912XDG256F1MAA 80-QFP, plus a bulk 10µF tantalum or ceramic on VDDR. S12X devices have multiple supply pins and the regulator supply (VDDR) must be bypassed with a low-ESR cap per datasheet to prevent core POR instability. Verify the actual VDD range and pin map against the latest NXP S12XD datasheet before layout.

Route the BDM (BKGD) signal and RESET line away from high-current switching nodes such as DC-DC converters and motor-driver traces. Keep the XTAL/EXTAL traces short and symmetric, with a guarded ground pour on both sides to minimize jitter on the 80 MHz internal bus. For automotive EMC compliance, place series damping resistors on signal lines that exit the module enclosure.

Do not assume that S12XD variants in different speed bins or temperature grades are drop-in compatible. The 'F1' speed grade (80 MHz) and the 'C' speed grade (typically 50 MHz) require different PLL configuration software. Always cross-check the device markings and datasheet revision before ordering replacements for production boards.

コンプライアンス情報

RoHS
Compliant
REACH
Unknown
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Unknown

Per distributor listings (DigiKey, Mouser, Newark) the S912XDG256F1MAA is RoHS compliant and AEC-Q100 qualified. REACH and halogen-free status not explicitly published - flagged as unknown pending datasheet review.

データ検証日: 2026-10-21 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

S912XDG256F1MAA datasheet NXP S912XDG256F1MAA price S12XDG256F1MAA 256KB Flash MCU S912XDG256F1MAA 80-QFP HCS12X 256KB automotive MCU S912XDG256F1MAA vs MC9S12XD256CAA S912XDG256F1MAA buy online S912XDG256F1MAA AEC-Q100 S912XDG256F1MAA body control module S912XDG256F1MAA drop-in replacement

関連部品&用語

NXP Semiconductors S912XDG256F1MAA S912XD256F1MAA S912XDG256F2MAA MC9S12XDG256CAA MC9S12XD256CAA MC9S12XDG256VPV HCS12X HCS12 microcontroller 16-bit MCU automotive MCU Flash memory MSCAN BDM AEC-Q100 QFP package QFP-80 QFP-112 CAN bus LIN bus automotive body control module instrument cluster HVAC controller door zone module J1939 ISO 26262 RoHS
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