S912ZVC96F0MLF - 96KB Flash S12Z MagniV 16-bit MCU | NXP
Référence : S912ZVC96F0MLF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.1 | $111,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.65 | $4 325,00 |
| 1 000 | $7.5 | $7 500,00 |
S912ZVC96F0MLF Présentation
An S12Z microcontroller is a 16-bit member of the NXP HC12/S12 architecture family, often classed within the broader automotive microcontroller and embedded MCU taxonomies (low-end automotive MCU -> body-domain ECU MCU -> S12 MagniV family). The MagniV line specifically integrates the voltage regulator and physical-layer LIN transceiver on-chip, eliminating external LIN transceivers and external supply regulators to reduce the BOM and shrink PCB area for body-electronics modules.
Key headline features include 96 KB (96K x 8) program Flash, 8 KB SRAM, a 32 MHz maximum CPU frequency with a 32 MHz bus clock, a 10-channel 10-bit SAR ADC, an integrated 5V linear regulator, a LIN 2.x/SCI physical layer, multiple timers (TIM, RTI, PIT), PWM channels, and a peripheral set covering GPIO, SPI, and SCI for in-vehicle networking. The RWW (Read-While-Write) Flash allows EEPROM emulation without an external serial EEPROM.
Architecture is built around the 16-bit S12Z enhanced CPU with extended address space, hardware stack pointer handling, and BGND debug; the device integrates high-voltage analog inputs (5V/12V-tolerant), EEPROM at 2 KB, and a -40 to +125C AEC-Q100 grade-1 qualified operating range. The 48-LQFP footprint is shared across the ZV/ZC MagniV family variants, allowing pin-compatible upgrades across memory sizes.
Typical applications include automotive HVAC door modules, seat controllers, window lift and door mirror modules, body-control slaves (LIN nodes), instrument cluster auxiliary circuits, and other body-domain ECUs. The integrated LIN and 5V regulator simplify LIN slave design versus discrete LIN MCU + external transceiver solutions.
When designing with this device, ensure adequate decoupling (>=100 nF plus >=4.7 uF bulk) near the integrated regulator output, dedicate a star-ground connection between ADC analog ground and digital ground, and respect LIN bus load impedance requirements per the LIN 2.x specification. AEC-Q100 grade-1 qualification at -40 to +125C makes the part directly suitable for under-hood and door-module placements.
Alternatives de remplacement direct pour S912ZVC96F0MLF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912ZVC96F0MLF (même facteur de forme et même empreinte) — différant par Core, Series, ADC, Package, Program Memory Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912ZVCA19F0MLFR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912ZVC12F0MLF
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →E912ZVC96F0MLF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912ZVC64F0MLF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S912ZVC19F0MLF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S912ZVC96F0MLF Valeurs maximales et caractéristiques électriques
| Series | MagniV S12Z |
| Core | S12Z (16-bit) |
| Program Memory (Flash) | 96 KB (96K x 8) |
| RAM Size | 8 KB |
| EEPROM (emulated) | 2 KB |
| Maximum CPU Frequency | 32 MHz |
| Bus Clock | 32 MHz |
| Supply Voltage (Vdd) | 5 V (integrated regulator), wide external supply tolerance per datasheet |
| ADC | 10-ch, 10-bit |
| LIN Physical Layer | Integrated LIN 2.x / SCI transceiver |
| Température de fonctionnement | -40C to +125C (AEC-Q100 Grade 1) |
| Boîtier | 48-LQFP (7x7 mm), LFQFP |
| Type de montage | Surface Mount |
| Terminal Form | Gull Wing |
| AEC-Q100 | Qualified (Automotive) |
Configuration des broches de S912ZVC96F0MLF
| Broche 1 | PAD15/AN15 — High-voltage analog / digital I/O (port AD) |
| Broche 2 | PAD14/AN14 — High-voltage analog / digital I/O |
| Broche 3 | PAD13/AN13 — High-voltage analog / digital I/O |
| Broche 4 | PAD12/AN12 — High-voltage analog / digital I/O |
| Broche 5 | PAD11/AN11 — High-voltage analog / digital I/O |
| Broche 6 | PAD10/AN10 — High-voltage analog / digital I/O |
| Broche 7 | PAD09/AN9 — Analog input 9 / digital I/O |
| Broche 8 | PAD08/AN8 — Analog input 8 / digital I/O |
| Broche 9 | PAD07/AN7 — Analog input 7 / digital I/O |
| Broche 10 | PAD06/AN6 — Analog input 6 / digital I/O |
| Broche 11 | PAD05/AN5 — Analog input 5 / digital I/O |
| Broche 12 | PAD04/AN4 — Analog input 4 / digital I/O |
| Broche 13 | PAD03/AN3 — Analog input 3 / digital I/O |
| Broche 14 | PAD02/AN2 — Analog input 2 / digital I/O |
| Broche 15 | PAD01/AN1 — Analog input 1 / digital I/O |
| Broche 16 | PAD00/AN0 — Analog input 0 / digital I/O |
| Broche 17 | VDDA — Analog supply for ADC |
| Broche 18 | VSSA — Analog ground for ADC |
| Broche 19 | VDDX — External supply input (battery / 12V tolerant) |
| Broche 20 | VSSX — External supply ground |
| Broche 21 | VDDR — Internal 5V regulator output |
| Broche 22 | VSSR — Internal regulator ground return |
| Broche 23 | LIN — LIN 2.x physical layer transmit/receive |
| Broche 24 | TXCAN — CAN transmit (if present) |
| Broche 25 | RXCAN — CAN receive (if present) |
| Broche 26 | BKGD/MS — Background Debug Mode / Mode Select |
| Broche 27 | RESET — Reset input, active low |
| Broche 28 | TEST — Factory test pin, tie to VDDR in normal operation |
| Broche 29 | VDDF — Flash supply / core logic supply |
| Broche 30 | VSSF — Flash / core logic ground |
| Broche 31 | PP0 — GPIO port P0 / PWM output |
| Broche 32 | PP1 — GPIO port P1 / PWM output |
| Broche 33 | PP2 — GPIO port P2 / PWM output |
| Broche 34 | PP3 — GPIO port P3 / PWM output |
| Broche 35 | PP4 — GPIO port P4 / PWM output |
| Broche 36 | PP5 — GPIO port P5 / PWM output |
| Broche 37 | PS0 — GPIO port S0 / SPI / SCI |
| Broche 38 | PS1 — GPIO port S1 / SPI / SCI |
| Broche 39 | PS2 — GPIO port S2 / SPI / SCI |
| Broche 40 | PS3 — GPIO port S3 / SPI / SCI |
| Broche 41 | PS4 — GPIO port S4 / SPI / SCI |
| Broche 42 | PS5 — GPIO port S5 / SPI / SCI |
| Broche 43 | PS6 — GPIO port S6 / SPI / SCI |
| Broche 44 | PS7 — GPIO port S7 / SPI / SCI |
| Broche 45 | PT0 — GPIO port T0 / Timer channel |
| Broche 46 | PT1 — GPIO port T1 / Timer channel |
| Broche 47 | PT2 — GPIO port T2 / Timer channel |
| Broche 48 | PT3 — GPIO port T3 / Timer channel |
Applications typiques
S912ZVC96F0MLF convient pour 6 applications: Automotive HVAC Door Module, Automotive Seat Controller LIN Slave, Window Lift / Door Mirror Module, Body-Control LIN Slave Node, Instrument Cluster Auxiliary Circuit, Industrial Sensor / Metering Module.
Automotive HVAC Door Module
The S912ZVC96F0MLF is well-suited to automotive HVAC door modules where each actuator uses a small LIN-attached stepper or DC motor. The integrated LIN physical layer removes an external transceiver, the 32 MHz S12Z core comfortably handles PID control loops, and 96 KB Flash stores the LIN scheduler plus diagnostics. AEC-Q100 grade-1 qualification and -40 to +125C rating fit door-module thermal stress.
Recommandé
Automotive Seat Controller LIN Slave
Seat-control ECUs distribute power and LIN across multiple zone nodes, each running a small LIN slave. The S912ZVC96F0MLF's 8 KB RAM and 96 KB Flash allow seat-position memory tables plus fault logging, the 10-bit ADC reads back current sense, and the integrated regulator removes an external 5V LDO. AEC-Q100 grade-1 supports under-seat thermal conditions up to +125C.
Recommandé
Window Lift / Door Mirror Module
Window-lift and door-mirror modules require LIN communication, brush motor control, anti-pinch ADC sampling, and AEC-Q100 grade-1 qualification. The S912ZVC96F0MLF fits this profile with its integrated LIN and 5V regulator, 10-bit ADC for current-sense, and 96 KB Flash for anti-pinch algorithms. The 48-LQFP 7x7 package is small enough for placement inside mirror housings.
Recommandé
Body-Control LIN Slave Node
Body-control slaves (interior lighting, ambient trim, RLS sensor) typically attach to a central BCM via LIN and need a small, fully integrated MCU. The S912ZVC96F0MLF's integrated 5V regulator and LIN physical layer reduce the BOM to essentially the MCU plus bypass caps. 96 KB Flash allows node-local diagnostics plus CAN-to-LIN bridging when the BCM expects enriched telemetry.
Recommandé
Instrument Cluster Auxiliary Circuit
Auxiliary clusters and gauge-driver nodes often piggy-back on the instrument cluster and need a LIN-attached MCU for backlight, pointer, and indicator control. The S912ZVC96F0MLF provides PWM channels for backlight dimming plus LIN comms to the cluster MCU. The 32 MHz core handles cluster-fast pointer update loops while AEC-Q100 grade-1 supports dashboard thermal levels.
Recommandé
Industrial Sensor / Metering Module
Industrial LIN-attached flow, pressure, or heat meters benefit from the S912ZVC96F0MLF's 10-bit ADC (10 channels) for transducer readout and 96 KB Flash for calibration tables. The integrated LIN physical layer enables simple attachment to a host controller in metering cabinets. AEC-Q100 grade-1 also benefits outdoor enclosures with wider temperature swings than commercial-grade MCUs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912ZVC96F0MLF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912ZVCA19F0MLFR | S912ZVC12F0MLF | E912ZVC96F0MLF | S912ZVC64F0MLF |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Core | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit |
| Program Flash | 96 KB | 190 KB | 12 KB | 96 KB (extended screening) | 64 KB |
| RAM Size | 8 KB | 12 KB | 8 KB | 8 KB | 8 KB |
| Maximum Clock Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Integrated LIN Physical Layer | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) |
| Integrated 5V Regulator | Yes | Yes | Yes | Yes | Yes |
| Automotive Qualification (AEC-Q100) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (extended screening) | Yes (Grade 1) |
Principaux différenciateurs
- MagniV integration eliminates external LIN transceiver + external 5V LDO (vs S9S12G96F0VLFR)
- Higher memory headroom than S912ZVC12F0MLF (vs S912ZVC12F0MLF)
- Verified pin-compatible upgrade to 190 KB Flash variant (vs S912ZVCA19F0MLFR)
Notes de conception
The integrated 5V linear regulator (VDDR output) supplies the internal logic but cannot source significant current; decouple it with a 100 nF ceramic plus a 4.7 to 10 uF bulk capacitor placed within 10 mm of the pin. VDDX (battery/12V-tolerant input) still requires its own bulk capacitance and reverse-battery protection in the supply path. Always consult the NXP S12ZVC datasheet for the recommended external BOM.
Ensure the LIN bus load-pull resistance matches the LIN 2.x spec (typically 1 nF bus capacitance maximum). Do not connect a LIN node without the correct master/slave termination, and configure the device's internal LIN pull-up correctly during initialization. Pull-up of LIN to battery via external resistor is required only for the master node, not slaves.
The high-voltage analog input pins (PAD0-PAD15) tolerate 5V but not indefinite ESD; place TVS arrays near external connector pins. Use a star ground between VSSA (analog ground) and VSSX/VSSF (digital grounds) at a single point to keep ADC errors below 1 LSB. LQFP fine-pitch traces should be length-matched for parallel ADC sampling.
Informations de conformité
AEC-Q100 grade-1 qualified per NXP MagniV family marketing; RoHS compliant per distributor listings; halogen-free status is not stated in the verified distributor data and is therefore unknown.
