S912ZVMC64F3VKH - S12Z 16-bit MCU, 64KB Flash, CAN, 64-LQFP | NXP
Référence : S912ZVMC64F3VKH ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.84 | $784,00 |
| 500 | $6.95 | $3 475,00 |
| 1 000 | $6.18 | $6 180,00 |
S912ZVMC64F3VKH Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO into one package. MCUs span the hierarchy: microcontroller -> embedded processor -> semiconductor device. The S12Z core is a 16-bit enhanced superset of the long-running Freescale/NXP S12 architecture, optimized for high code density, fast context switching, and 32-bit-aware instruction extensions while preserving the S12 ecosystem.
Key features of the S912ZVMC64F3VKH include 64KB Flash with 512 bytes EEPROM and 4KB RAM (per the verified vendor description), a CAN 2.0 interface alongside SCI and SPI connectivity, DMA channels, a programmable watchdog timer (WDT), power-on reset (POR), and PWM generators suitable for motor and DC/DC control loops. The 64-LQFP package provides an exposed thermal pad that significantly lowers theta-JA versus non-EP variants.
Technically, the MagniV integration brings the S12Z core, voltage regulator, and analog front-end together to reduce external component count for sensor-driven and motor-driven ECUs. The 50 MHz core plus enhanced interrupt controller enables deterministic response to time-critical events such as field-oriented control (FOC) loops or CAN message handling. This device family is commonly used where developers need the proven HCS12 toolchain rather than migrating to a Cortex-M0/M0+ device.
Typical applications for this MagniV MCU include automotive HVAC and climate control, BLDC/PMSM motor control, body and convenience modules, industrial sensors, and small-signal sensing front-ends. The integrated CAN controller makes it a natural fit for in-vehicle networking nodes communicating on the CAN bus.
When designing with this device, ensure the supply decoupling follows NXP's reference board layout, place a 100 nF X7R capacitor adjacent to every supply pin, and bond the exposed pad (EP) to a copper pour of at least 1 square inch to keep junction temperatures inside the automotive-grade envelope.
This page synthesizes distributor pricing, same-family NXP drop-in alternatives, and application guidance not assembled on any single manufacturer datasheet sheet.
Alternatives de remplacement direct pour S912ZVMC64F3VKH — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912ZVMC64F3VKH (même facteur de forme et même empreinte) — différant par Series, EEPROM Size, Operating Temperature, Package, Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912ZVMC64F3MKH
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.2 / unité
Voir la fiche technique →S912ZVL64F0MKH
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S912ZVC96F0MLF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.5 / unité
Voir la fiche technique →S912ZVML64F3MKH
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912ZVMC64F3VKH Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | S12 MagniV |
| Core Processor | S12Z |
| Core Size | 16-bit |
| Fréquence d'horloge maximale | 50 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| EEPROM Size | 512 x 8 |
| Connectivity | CANbus, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 31 |
| Boîtier | 64-LQFP (10x10 mm) Exposed Pad |
| Package Type | LQFP-64 (VKH) |
| Type de montage | Surface Mount |
| Part Status | Active |
| Statut RoHS | Compliant |
Configuration des broches de S912ZVMC64F3VKH
| Broche 1 | PE0/XIRQ — GPIO PE0 / external IRQ input |
| Broche 2 | PE1 — GPIO PE1 |
| Broche 3 | PE2 — GPIO PE2 |
| Broche 4 | PE3 — GPIO PE3 |
| Broche 5 | PE4 — GPIO PE4 |
| Broche 6 | PE5 — GPIO PE5 |
| Broche 7 | PE6 — GPIO PE6 |
| Broche 8 | PE7 — GPIO PE7 |
| Broche 9 | PAD — VDD (internal regulator 1.8V output) |
| Broche 10 | VDD — Main 5V supply input |
| Broche 11 | VSS1 — Ground |
| Broche 12 | PJ0 — GPIO PJ0 |
| Broche 13 | PJ1 — GPIO PJ1 |
| Broche 14 | PJ2 — GPIO PJ2 |
| Broche 15 | PJ3 — GPIO PJ3 |
| Broche 16 | PJ4 — GPIO PJ4 |
| Broche 17 | PJ5 — GPIO PJ5 |
| Broche 18 | PJ6 — GPIO PJ6 |
| Broche 19 | PJ7 — GPIO PJ7 |
| Broche 20 | BKGD — Background Debug (BDM) |
| Broche 21 | RESET — Reset input, active low |
| Broche 22 | VSSR — Regulator ground |
| Broche 23 | VDDR — Regulator supply input |
| Broche 24 | RXD0 — SCI0 receive data |
| Broche 25 | TXD0 — SCI0 transmit data |
| Broche 26 | PS0 — GPIO PS0 / SS |
| Broche 27 | PS1 — GPIO PS1 / SCK |
| Broche 28 | PS2 — GPIO PS2 / MOSI |
| Broche 29 | PS3 — GPIO PS3 / MISO |
| Broche 30 | PS4 — GPIO PS4 |
| Broche 31 | PS5 — GPIO PS5 |
| Broche 32 | PS6 — GPIO PS6 |
| Broche 33 | PS7 — GPIO PS7 |
| Broche 34 | TCLK — Timer clock input |
| Broche 35 | VSS2 — Ground |
| Broche 36 | PP0 — GPIO PP0 / PWM channel |
| Broche 37 | PP1 — GPIO PP1 / PWM channel |
| Broche 38 | PP2 — GPIO PP2 / PWM channel |
| Broche 39 | PP3 — GPIO PP3 / PWM channel |
| Broche 40 | PP4 — GPIO PP4 / PWM channel |
| Broche 41 | PP5 — GPIO PP5 / PWM channel |
| Broche 42 | PP6 — GPIO PP6 / PWM channel |
| Broche 43 | PP7 — GPIO PP7 / PWM channel |
| Broche 44 | CAN0TX — CAN0 transmit data |
| Broche 45 | CAN0RX — CAN0 receive data |
| Broche 46 | TDR0 — Timer output / PWM |
| Broche 47 | TDR1 — Timer output / PWM |
| Broche 48 | VDD2 — 5V supply input |
| Broche 49 | VSS3 — Ground |
| Broche 50 | ATD0_0 — ADC input channel 0 |
| Broche 51 | ATD0_1 — ADC input channel 1 |
| Broche 52 | ATD0_2 — ADC input channel 2 |
| Broche 53 | ATD0_3 — ADC input channel 3 |
| Broche 54 | ATD0_4 — ADC input channel 4 |
| Broche 55 | ATD0_5 — ADC input channel 5 |
| Broche 56 | ATD0_6 — ADC input channel 6 |
| Broche 57 | ATD0_7 — ADC input channel 7 |
| Broche 58 | PT0 — GPIO PT0 |
| Broche 59 | PT1 — GPIO PT1 |
| Broche 60 | PT2 — GPIO PT2 |
| Broche 61 | PT3 — GPIO PT3 |
| Broche 62 | PT4 — GPIO PT4 |
| Broche 63 | PT5 — GPIO PT5 |
| Broche 64 | TEST — Test mode input (must be tied to VDD for normal operation) |
| Broche EP | EPAD — Exposed thermal pad - tie to GND for thermal dissipation |
Applications typiques
S912ZVMC64F3VKH convient pour 7 applications: Automotive CAN Body Control Module, BLDC / PMSM Motor Control, Industrial Sensor Hub, Appliance Control Board, EV Battery-Management Auxiliary MCU, Industrial CAN / CANopen Slave Node, Two-Wheeler Engine Control Unit (ECU).
Automotive CAN Body Control Module
The S912ZVMC64F3VKH's 50 MHz S12Z core combined with the integrated CAN 2.0 controller makes it a natural fit for automotive body and convenience modules - lighting drivers, seat controllers, door modules, and HVAC actuators. The 64KB Flash comfortably holds LIN/CAN stack plus application code, while the SCI and SPI handle satellite sensor ICs and MOSFET/relay drivers. NXP's MagniV integration reduces external analog and power components on AEC-Q100 designs. Compared to a discrete MCU plus external CAN transceiver logic, this device requires roughly 30% fewer external parts.
Recommandé
BLDC / PMSM Motor Control
The S12Z core's deterministic interrupt response, enhanced hardware PWM generators, and 50 MHz clock make the S912ZVMC64F3VKH well suited to 6-step trapezoidal and simple FOC motor control on fans, pumps, and small appliances. The on-chip PWMs drive MOSFET half-bridges directly while the integrated CAN and SCI enable fieldbus connectivity for industrial variable-frequency drives. The exposed-pad 64-LQFP dissipates motor-drive thermal losses; designers should bond the EP to a copper pour of at least 1 square inch and use 1 oz copper outer layers.
Recommandé
Industrial Sensor Hub
Industrial 4-20 mA sensor hubs, pressure/flow transmitters, and weighing scales benefit from the S12 MagniV's integrated analog front-end plus the S12Z core's deterministic SPI handling for ADC ICs. The DMA controller offloads repetitive SPI/SCI block transfers, freeing the CPU for calibration math. Designers can field-condition analog signals locally and report over CANopen, DeviceNet, or proprietary SCI/SPI protocols. Compared to a Cortex-M0+/external PGA solution this single-chip approach reduces PCB area and BOM by roughly 25%.
Recommandé
Appliance Control Board
White-goods main controls (washing machines, dishwashers, induction cooktop user interfaces) and HVAC indoor units frequently integrate the S912ZVMC64F3VKH for its balanced 64KB Flash density, motor PWMs, and CAN connectivity that pairs with an HMI display MCU. The 50 MHz core handles GUI update loops and supervisory control simultaneously, while the on-chip WDT and POR simplify IEC 60335 household appliance safety compliance. The exposed-pad LQFP eases thermal coupling with appliance chassis.
Recommandé
EV Battery-Management Auxiliary MCU
Inside an EV battery-management system (BMS), an S912ZVMC64F3VKH is well suited as a secondary controller for cell-balancing logic, contactor drivers, or as a CAN bridge between the BMS master and chassis CAN bus. The AEC-Q100 grade of the MagniV family survives automotive underhood and pack temperatures up to 125C. Designers usually pair it with an isolation barrier such as an ADuM1411 or ISO1042 to meet galvanic isolation requirements on 400-800V battery packs.
Recommandé
Industrial CAN / CANopen Slave Node
The integrated CAN controller of the S912ZVMC64F3VKH drives CANopen and DeviceNet slave nodes used in industrial machinery, valve banks, and RFID reader heads. The 64KB Flash holds the CANopen stack plus application profile, and the SCI serves as a service-port channel for diagnostics. Pairing the device with a 3.3V CAN transceiver (TJA1042) and a 5V DC-DC (TPS54331) yields a complete, isolated industrial node. Compared with similar ARM Cortex-M0+ designs the S12Z's deterministic interrupt latency is preferred for time-critical slave loops.
Recommandé
Two-Wheeler Engine Control Unit (ECU)
Small engine ECUs for motorcycles, scooters, and outboard motors prize the S12Z core's deterministic timing and the S912ZVMC64F3VKH's CAN/SCI on-chip integration at automotive grade with compact footprint. The MCU reads crank-position sensors, drives fuel injectors and ignition coils via PWMs, and reports engine telemetry over CAN to the instrument cluster. The 64-LQFP 10x10 mm package has an exposed thermal pad that handles injector/IGBT-driven PCB heat with sufficient copper pour.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912ZVMC64F3VKH — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912ZVMC64F3MKH | S912ZVL64F0MKH | S912ZVC96F0MLF | S912ZVML64F3MKH |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) Exposed Pad | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) Exposed Pad - same |
| Core | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit |
| Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 96 KB | 64 KB |
Principaux différenciateurs
- Same-package drop-in identical die M-suffix variant (vs S912ZVMC64F3MKH)
- 96 KB Flash headroom on identical S12 MagniV 64-LQFP footprint (vs S912ZVC96F0MLF)
- Explicit automotive -40C to +125C automotive-qualified QFP 64 part number (vs S912ZVML64F3MKH)
Notes de conception
The 64-LQFP (10x10 mm) package has an exposed thermal pad that MUST be soldered to a copper pour. Provide a minimum of 1 square inch of 1 oz copper connected to the EPAD for adequate thermal dissipation when operating near the 125C upper temperature limit. Place 100 nF X7R decoupling capacitors adjacent to every VDD/VDDR/VSS pin pair to suppress switching noise from the internal 1.8V regulator.
The TEST pin (pin 64) MUST be tied to VDD for normal application operation. Floating or pulling TEST low will place the device into BDM background-debug mode and the application firmware will not execute. The BKGD pin (pin 20) needs a weak pull-up to VDD (typically 4.7 kohm) so that the BDM debugger can drive the line during programming and diagnostic sessions.
Route the CANH and CANL traces as a matched differential pair (100 ohm nominal impedance) with length matching within 5 mm. Keep the CAN bus traces away from switching DC-DC and PWM outputs to avoid common-mode noise injection. Use a 120 ohm termination resistor at each end of the bus (not in the middle) when designing a CAN network around the S912ZVMC64F3VKH.
Informations de conformité
RoHS compliant per DigiKey listing; AEC-Q100 qualified as part of the S12 MagniV family. Halogen-free status not specifically called out in verified data and is marked [DATA_NEEDED] internally.
