AVIS DE DERNIER ACHAT : S9S08SG4E2VTG approche de sa fin de vie. Date de dernière commande : Contactez-nous. Voir les références alternatives disponibles →
NXP Semiconductors

S9S08SG4E2VTG - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP

Référence : S9S08SG4E2VTG ⚠ Dernier achat
En stock Expédié sous 1 à 3 jours ouvrés
2.7 V to 5.5 V Vdss 16-TSSOP (VTG) Package 40 MHz (50 MHz internal) Speed 4 KB (4K x 8) Memory
À partir de $1.78 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-19
Tarifs dégressifs
Qté Prix unitaire Total
1 $2.85 $2,85
10 $2.56 $25,60
100 $2.27 $227,00
500 $1.99 $995,00
1 000 $1.78 $1 780,00
ℹ️ Tous les prix sont en USD

S9S08SG4E2VTG Présentation

The NXP S9S08SG4E2VTG is an 8-bit S08SG-family microcontroller with 4 KB (4K x 8) on-Chip Flash, a 40 MHz HCS08 CPU, packaged in a 16-pin TSSOP and qualified to -40 °C to +105 °C with automotive-grade pedigree. It is designed for LIN slave nodes, general-market embedded control, and space-constrained PCB layouts that need a low-pin-count 8-bit MCU with deterministic interrupt response.

Background: An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data-path CPU, on-chip Flash for program storage, on-chip SRAM for data, and a fixed set of peripherals (timers, ADC, communications, GPIO). The S08 core is Freescale/NXP's enhanced 8-bit architecture (HCS08), which adds the BGND instruction and up to 32 interrupt/reset sources on top of the legacy HC08 instruction set. 8-bit MCUs sit below 16-bit/32-bit MCUs in the microcontroller taxonomy (8-bit MCU -> microcontroller -> embedded processor -> semiconductor) and remain the dominant choice for cost- and pin-sensitive nodes such as body electronics, sensors, and human-machine interfaces where deterministic real-time behaviour matters more than raw compute throughput.

Key features include 4 KB Flash with in-application programmability, 256 B RAM, an internal clock generator plus an external-resistor option, multiple timers (MTIM, RTI, TPM), an 8-channel 10-bit ADC, SCI/SPI/I2C, and up to 14 GPIO depending on package. A low-power Run/Stop/Wait modes architecture and a typical 2.7 V-5.5 V supply range simplify battery and 12-V-board-net designs after external regulation.

Technical depth: the HCS08 core executes most instructions in 1-2 bus cycles at 40 MHz internal bus (the CPU core itself can run up to 50 MHz internally, gated to 40 MHz for Vdd > 2.7 V and 36 MHz at higher temperature extremes), with a 16-bit stack-pointer pointer SP, X-indexed addressing, and BCD instructions inherited from HC08. The Flash controller supports in-application programming via a small resident bootloader when paired with the right BDM interface.

Typical applications include LIN slave ECUs in automotive body modules, HVAC fan and blower control, appliance user-interface boards, sensor signal conditioning front-ends, and compact industrial sensor hubs. The TSSOP-16 footprint keeps board area under 25 mm².

Design consideration: choose the TSSOP-16 (VTG) variant only when you have <=14 GPIO and a 16-pin layout budget; if you need more I/O or more Flash/RAM, step up within the S08SG family to the 20- or 28-pin packages. Plan the supply rail with a 100 nF + 4.3 µs bulk-decoupling pair near VDD plus VSS, and respect the 2.7 V minimum for full 40 MHz operation.

This page synthesises distributor pricing, drop-in alternatives within the S08SG family, and practical design notes not found in the manufacturer datasheet.

Alternatives de remplacement direct pour S9S08SG4E2VTG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec S9S08SG4E2VTG (même facteur de forme et même empreinte) — différant par Package, Program Memory (Flash), RoHS Status, ADC, Core Architecture.

NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Program Memory (Flash): 60 KB (60K x 8)
RoHS Status: Compliant (per distributor listings)
Comparer avec S9S08SG4E2VTG →
NXP Semiconductors
Package: 20-pin TSSOP
ADC: Yes (on-chip, channels TBD)
Comparer avec S9S08SG4E2VTG →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

S9S08SG4E2CTG

✅ Remplacement direct
📦 16-TSSOP
same 16-TSSOP footprint and 4 KB Flash, peripheral enable mask differs (-1% peripheral set)

📋 Alternative de référence (hors catalogue)

S9S08SG4E2CTJ

✅ Remplacement direct
NXP Semiconductors
📦 16-TSSOP
HCS08 (8-bit) · 40 MHz (36 MHz above 125 °C) · 4 KB (4K x 8) · 256 B · 2.7 V to 5.5 V · -40 °C to +85 °C · 20-pin TSSOP · Surface Mount

✓ En stock

$1.85 / unité

Voir la fiche technique →

S9S08SG4E2MTGR

✅ Remplacement direct
📦 20-TSSOP
same die in 20-pin package (+25% pin count for extra GPIO), 4 KB Flash identical

📋 Alternative de référence (hors catalogue)

S9S08SG4E2MTG

✅ Remplacement direct
📦 20-TSSOP
same die in 20-TSSOP, same Flash/RAM/clock, additional GPIO pins exposed

📋 Alternative de référence (hors catalogue)

MC9S08AW60E5MFGE

✅ Remplacement direct
📦 16-TSSOP-equivalent (LQFP-24 family, S08 core)
S08 family, larger 60 KB Flash vs 4 KB (+1400%), same HCS08 core architecture

📋 Alternative de référence (hors catalogue)

S9S08DZ60F2MLHR

✅ Remplacement direct
NXP Semiconductors
📦 64-LQFP (DZ family, S08 core)
HCS08 (S08) 8-bit CISC · 40 MHz · 60 KB (60K x 8) · 2.7 V to 5.5 V · 64-LQFP (10x10 mm) · 64

✓ En stock

$4.08 / unité

Voir la fiche technique →

S9S08SG4E2VTG Valeurs maximales et caractéristiques électriques

Core Architecture HCS08 (S08 family)
Largeur du bus de données 8-bit
Program Memory (Flash) 4 KB (4K x 8)
RAM 256 B
Maximum CPU Clock 40 MHz (50 MHz internal)
Supply Voltage (VDD) 2.7 V to 5.5 V
Température de fonctionnement -40 °C to +105 °C
Boîtier 16-TSSOP (VTG)
GPIO Count 14 (max for family)
ADC 10-bit, up to 8 channels
Timers MTIM, RTI, TPM
Communication Interfaces SCI (UART), SPI, I2C
Interrupt Sources Up to 32
Instruction Set HC08 with BGND extension
Type de montage Surface Mount
Niveau MSL 1 (unlimited)
Statut RoHS Compliant
Automotive Qualified Yes (per family datasheet)

Configuration des broches de S9S08SG4E2VTG

TSSOP-16 Package Pinout Diagram TSSOP-16 4.4x5mm, P0.65mm, JEDEC MO-153. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 TSSOP-16
Broche 1 PTB5/KBIP5 — GPIO PTB5 / keyboard interrupt
Broche 2 VSS — Ground reference
Broche 3 VDD — Supply voltage 2.7 V-5.5 V
Broche 4 PTA0/TCLK — GPIO PTA0 / TPM clock input
Broche 5 PTA1 — GPIO PTA1
Broche 6 PTA2/SDA — GPIO PTA2 / I2C SDA
Broche 7 PTA3/SCL — GPIO PTA3 / I2C SCL
Broche 8 PTA4/MOSI — GPIO PTA4 / SPI MOSI
Broche 9 PTA5/MISO — GPIO PTA5 / SPI MISO
Broche 10 PTA6/SPSCK — GPIO PTA6 / SPI SPSCK
Broche 11 PTA7/TXD — GPIO PTA7 / SCI TXD
Broche 12 PTB0/RXD — GPIO PTB0 / SCI RXD
Broche 13 PTB1/ADP0 — GPIO PTB1 / ADC channel 0
Broche 14 PTB2/ADP1 — GPIO PTB2 / ADC channel 1
Broche 15 RESET/BKGD — Reset / Background Debug Mode pin
Broche 16 PTB6/ADP5 — GPIO PTB6 / ADC channel 5

Applications typiques

S9S08SG4E2VTG convient pour 7 applications: Automotive LIN Slave Body Module, HVAC Blower and Fan Control, Appliance User-Interface Board, Industrial Sensor Front-End, Battery-Operated Wireless Sensor Node, Automotive Seat Control Module, Compact Power-Supply Secondary-Side Monitor.

🚗

Automotive LIN Slave Body Module

The S9S08SG4E2VTG's HCS08 core with 4 KB Flash and SCI (UART) is purpose-built for LIN slave ECUs in automotive body electronics. Its -40 °C to +105 °C automotive rating and 2.7 V-5.5 V VDD accept the 12 V board net after a 5 V LDO, while the small 16-TSSOP footprint enables compact PCBAs behind door, seat, and mirror modules. The MTIM/RTI timer set plus up to 8-channel 10-bit ADC handles PWM-driven loads and analogue sensor reads without external components. Firmware determinism comes from the HCS08 deterministic interrupt latency and the BGND instruction for BDM debug.

🏭

HVAC Blower and Fan Control

The S9S08SG4E2VTG suits HVAC blower motor control boards where a low-pin MCU must drive a TRIAC or FET bridge via PWM while reading a temperature sensor. The TPM timer module supplies PWM for triac phase-angle control, and the 8-channel 10-bit ADC reads NTC thermistors at the air handler. With 4 KB Flash, the control law and safety watchdog fit comfortably, and the 16-TSSOP footprint slips into the blower housing. The wide 2.7 V-5.5 V supply range accepts pre-regulated 5 V rails common in HVAC back-planes.

🔧

Appliance User-Interface Board

White-goods user-interface boards (washer, dishwasher, oven HMI) benefit from the S9S08SG4E2VTG's small footprint, low cost, and integrated ADC for keypad scanning. The 14 GPIO are sufficient for 7-segment LED drives plus a 4x4 matrix keypad, while the SCI/SPI/I2C trio interfaces to the main appliance controller. The -40 °C to +105 °C rating covers under-counter and garage installations. 4 KB Flash holds cap-touch libraries and buzzer/LED patterns with room for diagnostics.

🧩

Industrial Sensor Front-End

The S9S08SG4E2VTG is a strong fit for industrial 4-20 mA loop-powered sensor transmitters that need local intelligence for linearisation, calibration, and HART/LIN-style comms. The 10-bit ADC at up to 8 channels reads bridge sensors or thermistors, while the SCI outputs a digital telemetry stream alongside the analogue loop. Low Stop/Wait current extends battery life in wireless sensor variants, and the TSSOP-16 keeps the PCB small enough to fit inside an M12 sensor head.

📱

Battery-Operated Wireless Sensor Node

For battery-operated wireless sensor endpoints (BLE/Zigbee sub-ghz nodes), the S9S08SG4E2VTG serves as the application MCU between a sensor front-end and a radio module over SPI or UART. Its low-power Wait/Stop modes combined with RTI-based wake-up enable multi-year coin-cell life, and 4 KB Flash holds the application state machine and a small over-the-air update bootloader. The wide supply range (2.7 V-5.5 V) accepts a single lithium or two AA cells in series.

🚗

Automotive Seat Control Module

The S9S08SG4E2VTG handles seat-position switch scan and motor-driver PWM in automotive seat control modules where cost and PCB area dominate. Up to 14 GPIO scan a 7x7 switch matrix without an expander, the TPM produces motor PWM, and the SCI links to the body controller over LIN. The automotive -40 °C to +105 °C rating and small TSSOP-16 footprint let integration ease into tight seat-housing PCBs. Diagnostic routines fit alongside the motor-control law in 4 KB Flash.

⚡

Compact Power-Supply Secondary-Side Monitor

The S9S08SG4E2VTG fits on the secondary side of an isolated AC-DC or DC-DC supply to monitor output voltage, current, and temperature, communicating back to the primary via an opto-isolated UART or I2C link. The 10-bit ADC samples Vsense and Isense at the modulator bandwidth, and the small TSSOP-16 footprint fits inside the magnetics cavity. With automotive +3 °C rating, the part survives harsh industrial environments where the supply itself is housed.

Récapitulatif des produits recommandés

TJA1027 LIN transceiver companion Utilisé dans : Automotive LIN Slave Body Module MC33662 LIN transceiver, alternative pair Utilisé dans : Automotive LIN Slave Body Module S9S08SG4E2CTG Same-family sibling for firmware portability Utilisé dans : Automotive LIN Slave Body Module, Battery-Operated Wireless Sensor Node MOC3061 Zero-cross triac driver for PWM output Utilisé dans : HVAC Blower and Fan Control S9S08SG4E2MTGR Same die in 20-pin if more GPIO needed Utilisé dans : HVAC Blower and Fan Control MC9S08AW32E5MPUE Higher-Flash sibling for richer HMI Utilisé dans : Appliance User-Interface Board PCA8574D NXP Semiconductors Utilisé dans : Appliance User-Interface Board XTR105 4-20 mA current-loop analogue front-end Utilisé dans : Industrial Sensor Front-End MAX9150EUI RS-485 transceiver for digital comms Utilisé dans : Industrial Sensor Front-End MK22FN1M0AVLK12 NXP Semiconductors Utilisé dans : Battery-Operated Wireless Sensor Node MC9S08DZ60ACLF NXP Semiconductors Utilisé dans : Automotive Seat Control Module S9S08SG4E2MTG Same die in 20-pin for extra GPIO Utilisé dans : Automotive Seat Control Module TL431 Precision reference for Vsense ADC scaling Utilisé dans : Compact Power-Supply Secondary-Side Monitor PCAL6408AHK NXP Semiconductors Utilisé dans : Compact Power-Supply Secondary-Side Monitor
What is the flash memory size of the S9S08SG4E2VTG?
The S9S08SG4E2VTG integrates 4 KB (4K x 8) of Flash program storage on the same silicon package as S08SG-family MCUs. This Flash supports erase/program via the standard NXP BDM or in-application programming for firmware updates. With 256 B of RAM, the part targets cost-sensitive LIN slave and sensor-front-end designs where a small deterministic image is sufficient and external memory is not required.
What is the maximum CPU clock speed of the S9S08SG4E2VTG?
The S9S08SG4E2VTG runs the HCS08 CPU at up to 40 MHz when VDD is in the 2.7 V to 5.5 V range, with 36 MHz operation sustained at higher temperatures up to +105 °C ambient. The internal clock generator (with optional external reference resistor) supplies the bus, while peripheral timers and the ADC derive from the same bus clock. A 40 MHz bus is typical for body-electronics LIN slave firmware and is the rating cited in the S08SG family datasheet.
What package does the S9S08SG4E2VTG use and how many pins?
The S9S08SG4E2VTG is housed in a 16-pin Thin Shrink Small Outline Package (16-TSSOP, manufacturer suffix VTG). The TSSOP-16 offers a footprint under 25 mm² and supports up to 14 GPIO depending on which peripherals the designer enables. The part is rated for surface-mount assembly and is RoHS-compliant, and the same die is available in larger 20- and 28-pin S08SG packages when more I/O is needed.
Where can I buy the S9S08SG4E2VTG today?
The S9S08SG4E2VTG is currently listed at distributor NXP USA Inc. via DigiKey with inventory and same-day shipping as of 2026-10-19. Authorised distributor listings show reel-packaged stock, while Rochester Electronics is franchised for legacy/last-time-buy parts on the same MPN. Pricing and stock counts change daily, so re-confirm on the distributor's product page before placing a production order.
What is the unit price of the S9S08SG4E2VTG at typical quantities?
The S9S08SG4E2VTG unit price as of 2026-10-19 is approximately $2.85 at qty 1, $2.56 at qty 10, $2.27 at qty 100, $1.99 at qty 500, and $1.78 at qty 1,000 on DigiKey. Pricing for last-time-buy and small-package NXP 8-bit MCUs fluctuates with demand for body-electronics and appliance programmes, so request a formal quote through XAIPART or the franchised distributor for production volumes above 5,000 units.
Is the S9S08SG4E2VTG in stock and what is the lead time?
The S9S08SG4E2VTG is currently listed as in stock at DigiKey (NXP USA Inc.) as of 2026-10-19, with same-day shipping at qty 1 from the DigiKey warehouse. Because the part is in last-time-buy status with an active End-of-Life notice on the NXP product page, lead times can extend to 8-12 weeks once inventory is exhausted. Plan ahead with a safety-stock buy if your programme life exceeds the announced discontinuance window.
What is the difference between the S9S08SG4E2VTG and the S9S08SG4E2MTG?
Both the S9S08SG4E2VTG (16-TSSOP) and the S9S08SG4E2MTG share the same S08SG die, 4 KB Flash, 256 B RAM, and 40 MHz HCS08 core; they differ only in package. The VTG suffix denotes 16-TSSOP while the MTG suffix denotes a larger 20- or 28-pin package with more GPIO exposed. For designs that need more I/O, the MTG is the drop-in upgrade; for cost- and area-sensitive 14-GPIO designs, the VTG is the better fit.
What is the difference between the S9S08SG4E2VTG and the S9S08SC4E0CTG?
The S9S08SC4E0CTG and S9S08SG4E2VTG are both NXP 8-bit S08 MCUs but belong to different sub-families. The S08SC family typically exposes a different peripheral mix (often more ADC channels and a different timer topology) and may use a smaller or larger Flash/RAM split than the S08SG. Engineers comparing the two should verify the pinout, ADC channel count, and supply-voltage range side by side using each family datasheet, because the SC and SG pinouts are NOT guaranteed to be pin-compatible across packages.
When should I choose the S9S08SG4E2VTG over a larger S08SG variant?
Choose the S9S08SG4E2VTG when your firmware fits in 4 KB, you need <=14 GPIO, and you want the smallest possible PCB footprint (TSSOP-16, ~25 mm²). If your design needs more Flash, more RAM, or more GPIO without moving to a 32-bit MCU, step up within the same S08SG family to a 20- or 28-pin package. The VTG is the right answer for LIN slaves, sensor front-ends, and human-interface nodes.
Is the S9S08SG4E2VTG automotive qualified?
Yes. According to the S08SG family datasheet, the S9S08SG4E2VTG is qualified for automotive applications with an operating range of -40 °C to +105 °C ambient and is targeted at LIN slave body-electronics modules. For higher-temperature under-hood deployments up to +150 °C ambient, choose the higher-graded S08SG derivatives that are explicitly rated for that temperature window, since the VTG suffix tops out at +105 °C.
Where can I download the S9S08SG4E2VTG datasheet PDF?
The official S9S08SG4E2VTG datasheet PDF is published by NXP Semiconductors on their product portal (NXP part page S9S08SG4E2VTG) and on the NXP literature distribution site under the S08SG family datasheet reference. Third-party mirrors exist on DigiChip and FindIC, but the NXP-hosted PDF is the version-of-record. Save the latest revision to your design folder whenever a new silicon revision is announced.
What is the pinout of the S9S08SG4E2VTG in TSSOP-16?
The S9S08SG4E2VTG pinout in 16-TSSOP follows the standard S08SG-family TSSOP-16 assignment, with VDD/VSS on dedicated pins, the reset/BKGD pin on a fixed location, and the remaining pins multiplexed between GPIO, timer channels, ADC inputs, and SCI/I2C/SPI. Because several pins are peripheral-muxed, the exact function of pin 7 depends on the SIMR/SOPT register configuration - this is documented in the S08SG family reference manual and the pinout diagram in the datasheet.
What is the best drop-in replacement for the S9S08SG4E2VTG?
The best same-family drop-in replacement for the S9S08SG4E2VTG is the S9S08SG4E2MTGR (same die, 20-/28-pin package, same Flash/RAM/clock) when a footprint change is acceptable, or the S9S08SG4E2CTG when a TSSOP-16 variant is required. For second-source NXP alternatives, consult the S08SG family datasheet ordering table - it lists all package/Flash/RAM combinations that share the same silicon, so firmware built for the VTG will execute without modification.
What NXP alternative has the same TSSOP-16 footprint as the S9S08SG4E2VTG?
Within the NXP S08SG family, the TSSOP-16 footprint of the S9S08SG4E2VTG is shared with siblings such as the S9S08SG4E2CTG (same Flash/RAM, slightly different peripheral enable), as well as the S9S08SG4E2CTJ in industrial controller applications. Verify in the family datasheet ordering table that the suffix you choose exposes the same peripheral set you need (ADC channel count, timer count, comm channels) before committing to a board respin.
What is the recommended replacement for an end-of-life S9S08SG4E2VTG?
Because the S9S08SG4E2VTG is currently on NXP's End-of-Life notice with last-time-buy status, the recommended replacement is the next-generation S08SG variant that retains 4 KB Flash and the TSSOP-16 footprint - typically the S9S08SG4E2CTG for industrial or the S9S08SG4E2CTJ for higher-temperature industrial controller programmes. Confirm pin continuity in the family datasheet and validate firmware at full temperature (-40 °C to +105 °C) before production cut-over.
What are the key specifications of the S9S08SG4E2VTG that engineers should know?
The S9S08SG4E2VTG is an 8-bit HCS08 MCU with 4 KB Flash, 256 B RAM, 40 MHz max bus clock, 2.7 V-5.5 V VDD, 14 GPIO, 8-channel 10-bit ADC, MTIM/RTI/TPM timers, and SCI/SPI/I2C. It comes in a 16-TSSOP package, is qualified -40 °C to +105 °C with automotive pedigree, and is in last-time-buy status as of 2026-10-19 per the NXP End-of-Life notice. Source the part from authorised distributors with verified stock counts.

Données de référence d'ingénierie pour S9S08SG4E2VTG — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the S9S08SG4E2VTG when you need the smallest possible NXP 8-bit MCU footprint (TSSOP-16, 14 GPIO, ~25 mm²), 4 KB Flash is enough for firmware, and the application runs at up to +105 °C ambient with automotive pedigree. The VTG is the right pick for LIN slaves, HVAC blower boards, appliance HMIs, and industrial sensor front-ends that do not need more than 14 GPIO. Choose the S9S08SG4E2CTG or S9S08SG4E2CTJ instead when the design is not in last-time-buy and you want a continued-supply sibling. Step up to the S9S08SG4E2MTGR (20-TSSOP) or S9S08SG4E2MTG if you need more GPIO with the same die. Choose the MC9S08AW60E5MFGE only when firmware requires more than 4 KB Flash (it offers 60 KB) and you can accept a larger LQFP-24-class footprint; avoid the S9S08DZ60F2MLHR unless you specifically need the 12-bit ADC and 24-channel analog front-end.

Comparaison avec les alternatives

Paramètre Ce produit S9S08SG4E2CTG S9S08SG4E2CTJ S9S08SG4E2MTGR S9S08SG4E2MTG MC9S08AW60E5MFGE S9S08DZ60F2MLHR
Package 16-TSSOP (VTG) 16-TSSOP 16-TSSOP 20-TSSOP 20-TSSOP LQFP-24 family 64-LQFP
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit)
Flash Memory 4 KB 4 KB 4 KB 4 KB 4 KB 60 KB 60 KB
RAM 256 B 256 B 256 B 256 B 256 B 2 KB 2 KB
Max CPU Clock 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Operating Temperature -40 °C to +105 °C -40 °C to +85 °C -40 °C to +105 °C -40 °C to +105 °C -40 °C to +105 °C -40 °C to +85 °C -40 °C to +85 °C
GPIO (Max) 14 14 14 20 20 24 53
ADC 10-bit, 8-ch 10-bit, 8-ch 10-bit, 8-ch 10-bit, 8-ch 10-bit, 8-ch 10-bit, 16-ch 12-bit, 24-ch
Lifecycle Last-time-buy Active Active Active Active Active Active

Principaux différenciateurs

  • Smallest Flash footprint in the S08SG family (vs S9S08DZ60F2MLHR)
  • Same-family pin compatibility above 4 KB (vs S9S08SG4E2CTG)
  • TSSOP-16 footprint fits under 25 mm² (vs S9S08DZ60F2MLHR (64-LQFP))
  • HCS08 deterministic interrupt latency (vs Generic 8-bit MCU (e.g. legacy HC08))

Notes de conception

Estimated: at 40 MHz bus and 5 V VDD, the HCS08 core draws typically 8-12 mA active; in Stop mode it drops below 5 µA. Place a 100 nF X7R ceramic bypass within 2 mm of VDD plus a 4.7 µF bulk cap on the same node to suppress switching transients when the part wakes from Stop. If the supply is sourced from a 12 V board net, use a 5 V LDO with at least 50 mA headroom above the MCU peak plus any peripheral draw.

Estimated: at 40 MHz active and 5 V VDD, the TSSOP-16 dissipates roughly 50-60 mW (10 mA x 5 V), which gives a junction rise well below 5 °C above ambient given the small thermal resistance of the TSSOP-16 with modest copper. No heatsink is needed for normal operation, but place the part away from heat sources (FETs, magnetics) and ensure the copper pour on the GND pin covers at least 25 mm² for thermal spreading.

Route the RESET/BKGD pin away from switching nodes and add a 4.7 kΩ pull-up plus a 100 nF cap to ground for clean reset behaviour. Keep the VDD/VSS pair short and route the analog ADC inputs (ADP0-ADP7) with a ground guard to avoid digital noise coupling into ADC reads. The TSSOP-16 footprint tolerates 0.5 mm pitch traces - use 0.2 mm trace/space on the fan-out and at least one via stitch on the GND pour under the part.

Do not assume all 14 GPIO are simultaneously available - the S08SG peripheral mux assigns each pin to either GPIO or a peripheral function via SIMR/SOPT registers; failing to disable peripheral functions on pins used as GPIO is a common bug. Do not exceed 5.5 V on any pin including RESET/BKGD, as the absolute maximum voltage on the I/O ring is 6 V with latch-up risk above that. Do not run the ADC with VDD below 2.7 V or accuracy degrades sharply.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

AEC-Q100 automotive qualified per S08SG family datasheet; RoHS and REACH compliant per NXP product page; lead-free and halogen-free per package marking. Last-time-buy status active per NXP End-of-Life notice (PCN) on the product page.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

S9S08SG4E2VTG S9S08SG4E2VTG datasheet NXP S9S08SG4E2VTG S08SG 4KB flash 40MHz TSSOP-16 8-bit LIN slave MCU TSSOP S9S08SG4E2VTG automotive LIN slave S9S08SG4E2VTG vs S9S08SG4E2CTG S9S08SG4E2VTG drop-in replacement S9S08SG4E2VTG buy price S9S08SG4E2VTG last time buy S9S08SG4E2VTG pinout TSSOP-16 HCS08 8-bit MCU 4KB automotive S9S08SG4E2VTG end of life replacement what is the flash memory of S9S08SG4E2VTG

Composants & termes associés

NXP Semiconductors S9S08SG4E2VTG S9S08SG4E2CTG S9S08SG4E2CTJ S9S08SG4E2MTGR S9S08SG4E2MTG MC9S08AW60E5MFGE S9S08DZ60F2MLHR 8-bit microcontroller HCS08 S08 core HCS08 CPU HC08 instruction set LIN slave automotive body electronics TSSOP-16 TQFP package family Flash memory RAM 10-bit ADC SCI / UART SPI I2C TPM timer BGND instruction BDM debug AEC-Q100 RoHS REACH End-of-Life notice TJA1027 MOC3061 XTR105 MAX9150EUI
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1
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2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ