NXP Semiconductors

S9S08DZ60F2MLHR - 8-bit S08 MCU 60KB Flash 40MHz | NXP

MPN: S9S08DZ60F2MLHR ✓ Active
In Stock Ships in 1-3 business days
2.7 V to 5.5 V Vdss 64-LQFP (10x10 mm) Package 40 MHz Speed 60 KB (60K x 8) Memory
From $4.08 USD / Unit
MOQ: 1 |
Price updated: 2026-10-19
Volume Pricing
Qty Unit Price Extended
1 $6.38 $6.38
10 $5.74 $57.40
100 $5.1 $510.00
500 $4.59 $2,295.00
1,000 $4.08 $4,080.00
ℹ️ All prices are in USD

S9S08DZ60F2MLHR Overview

The NXP S9S08DZ60F2MLHR is an 8-bit S08-family microcontroller (MCU) featuring a 40 MHz CPU core, 60 KB of on-chip Flash memory and an integrated LCD driver with CAN connectivity, housed in a 64-pin LQFP package (10x10 mm). It is rated for the automotive -40C to +125C temperature range and is qualified to AEC-Q100, making it suitable for harsh-environment body, chassis and industrial-control applications. The part integrates multiple timers, ADC channels and communication peripherals, supporting typical embedded-control workloads without external co-processors.

A microcontroller (MCU) is a single-chip computer that combines a CPU core, volatile and non-volatile memory, and programmable peripherals into one integrated circuit. The S08 core from NXP is a streamlined 8-bit CISC architecture that executes most instructions in a single bus cycle, balancing code density with deterministic interrupt response. Within the broader taxonomy, the S08DZ series sits below 16-bit S12 and 32-bit Kinetis families, targeting cost-sensitive, deterministic real-time control with low power consumption and small code footprints.

Key features include 60 KB of Flash program memory, 2 KB of RAM, 4 KB of EEPROM, an integrated CAN 2.0 A/B controller, an SCI, an SPI, an I2C interface, an LCD driver supporting up to 320 segments, multiple 16-bit timers (TPM), and a 12-bit SAR ADC with up to 24 channels. The 40 MHz bus clock delivers up to 20 MIPS, sufficient for brushed DC and stepper motor control loops, sensor fusion and human-machine interface (HMI) workloads.

The device uses an HCS08 instruction set with a background debug mode (BDM) accessible through a single-wire interface. On-chip voltage regulation supports 2.7V to 5.5V single-supply operation; the on-chip charge pump supports in-application Flash programming and EEPROM erase/write at full bus speed. Internal clock sources include an FLL-stabilized internal reference and a low-power oscillator, allowing flexible power modes (Run, Wait, Stop3).

Typical use cases include automotive instrument clusters, body controllers, HVAC control modules, industrial sensor hubs, and small graphical LCD-based HMI panels. The integrated CAN interface is well suited to vehicle network nodes where the part must exchange J-Link commands simultaneously with local sensor sampling.

When designing with this device, ensure adequate decoupling (100 nF + 4.7 uF minimum) near each supply pin, route the CAN bus with 120-ohm characteristic impedance, and verify LCD segment contrast across the operating temperature window. The 64-LQFP footprint requires standard surface-mount assembly; thermal dissipation is low (under 100 mW typical) and the exposed pad aids board-level thermal relief. This page synthesizes distributor pricing, drop-in same-family alternatives and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for S9S08DZ60F2MLHR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with S9S08DZ60F2MLHR (same form factor and footprint) — differing in Package, ADC, Core, Operating Temperature, CAN.

NXP Semiconductors
ADC: 16-channel, 12-bit, 2.5 us conversion
Core: HCS08 (S08 core)
Compare with S9S08DZ60F2MLHR →
NXP Semiconductors
Package: 48-LQFP (7x7 mm), 0.5 mm pitch
ADC: 12-bit, 24-channel, 2.5 us conversion
Core: HCS08 (8-bit)
Compare with S9S08DZ60F2MLHR →
NXP Semiconductors
Package: 48-pin LQFP (7x7 mm)
ADC: 24-channel, 12-bit, 2.5 us conversion
Core: HCS08 (S08) 8-bit CPU
Compare with S9S08DZ60F2MLHR →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
ADC: 24-channel, 12-bit, 2.5 µs conversion
Compare with S9S08DZ60F2MLHR →
NXP Semiconductors
ADC: 24-channel, 12-bit, 2.5 us conversion
Core: HCS08 (8-bit CISC)
Operating Temperature: -40 C to +85 C (industrial)
Compare with S9S08DZ60F2MLHR →
NXP Semiconductors
Package: 64-LQFP, 10 mm x 10 mm, 0.5 mm pitch
ADC: 24-channel, 12-bit, 2.5 µs conversion time
Core: HCS08 (enhanced S08), 8-bit CISC
Compare with S9S08DZ60F2MLHR →
NXP Semiconductors
Operating Temperature: -40 C to +85 C (industrial) / -40 C to +125 C (automotive)
Compare with S9S08DZ60F2MLHR →
NXP Semiconductors
Package: 16-TSSOP (VTG)
ADC: 10-bit, up to 8 channels
Operating Temperature: -40 °C to +105 °C
Compare with S9S08DZ60F2MLHR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

S9S08DZ60F1CLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
S08 · 8-bit · 40 MHz · 60 KB (60K x 8) Flash · 2 KB (2K x 8) · 2.7 V to 5.5 V · 53

✓ In Stock

$5.95 / Unit

View Datasheet →

S9S08DZ60F2MLHR-Q1

✅ Drop-In
📦 64-LQFP (10x10)
automotive Q1 suffix ordering code, same die and pinout; identical electrical specs

📋 Reference alternative (not in catalog)

MC9S08DZ60MLH

✅ Drop-In
📦 64-LQFP (10x10)
legacy MC9S08 prefix (pre-Safety), same 60 KB Flash and CAN/LCD peripherals in same LQFP-64 footprint

📋 Reference alternative (not in catalog)

MC9S08DZ60AMLH

✅ Drop-In
📦 64-LQFP (10x10)
older automotive-grade AMLH suffix vs F2MLHR; same die family and 64-LQFP pinout

📋 Reference alternative (not in catalog)

S9S08DN60F2VLH

✅ Drop-In
📦 64-LQFP (10x10)
DN60 lacks integrated LCD driver vs DZ60; same 60 KB Flash, CAN, ADC; pin-compatible in LQFP-64

📋 Reference alternative (not in catalog)

MC9S08DN60AMLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
8-bit microcontroller · Enhanced HCS08 core · 40 MHz · 20 MHz · 60 KB · 60K x 8 bits · 2 KB · 10-bit

✓ In Stock

$8.5845 / Unit

View Datasheet →

S9S08DZ60F2MLHR Maximum Ratings & Electrical Characteristics

Core Architecture HCS08 (S08) 8-bit CISC
Maximum CPU Frequency 40 MHz
Program Memory (Flash) 60 KB (60K x 8)
Operating Voltage Range 2.7 V to 5.5 V
Package 64-LQFP (10x10 mm)
Pin Count 64
Mounting Type Surface Mount
Operating Temperature Range -40C to +125C (automotive)
CAN Controller 1 x CAN 2.0 A/B (MSCAN)
LCD Driver Yes, integrated segment LCD driver
AEC-Q100 Qualification Yes (automotive grade)
RoHS Status Compliant (per distributor listings)

S9S08DZ60F2MLHR Pin Configuration

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Pin 1 PTC0 — Port C bit 0 / TPM0 channel 0
Pin 2 PTC1 — Port C bit 1 / TPM0 channel 1
Pin 3 PTC2 — Port C bit 2 / TPM0 channel 2
Pin 4 PTC3 — Port C bit 3 / TPM0 channel 3
Pin 5 VDD — Supply voltage
Pin 6 VSS — Ground
Pin 7 PTC4 — Port C bit 4 / TPM0 channel 4
Pin 8 PTC5 — Port C bit 5 / TPM0 channel 5
Pin 9 PTC6 — Port C bit 6
Pin 10 PTC7 — Port C bit 7
Pin 11 PTD0 — Port D bit 0
Pin 12 PTD1 — Port D bit 1
Pin 13 PTD2 — Port D bit 2
Pin 14 PTD3 — Port D bit 3
Pin 15 PTD4 — Port D bit 4
Pin 16 PTD5 — Port D bit 5
Pin 17 PTD6 — Port D bit 6
Pin 18 PTD7 — Port D bit 7
Pin 19 PTE0 — Port E bit 0 / TXD
Pin 20 PTE1 — Port E bit 1 / RXD
Pin 21 PTE2 — Port E bit 2
Pin 22 PTE3 — Port E bit 3
Pin 23 PTE4 — Port E bit 4
Pin 24 PTE5 — Port E bit 5
Pin 25 PTE6 — Port E bit 6
Pin 26 PTE7 — Port E bit 7
Pin 27 PTF0 — Port F bit 0 / ADC channel
Pin 28 PTF1 — Port F bit 1 / ADC channel
Pin 29 PTF2 — Port F bit 2 / ADC channel
Pin 30 PTF3 — Port F bit 3 / ADC channel
Pin 31 PTF4 — Port F bit 4 / ADC channel
Pin 32 PTF5 — Port F bit 5 / ADC channel
Pin 33 PTF6 — Port F bit 6 / ADC channel
Pin 34 PTF7 — Port F bit 7 / ADC channel
Pin 35 PTG0 — Port G bit 0 / LCD segment
Pin 36 PTG1 — Port G bit 1 / LCD segment
Pin 37 PTG2 — Port G bit 2 / LCD segment
Pin 38 PTG3 — Port G bit 3 / LCD segment
Pin 39 VDD — Supply voltage (LCD charge pump)
Pin 40 VSS — Ground
Pin 41 PTH0 — Port H bit 0 / LCD segment
Pin 42 PTH1 — Port H bit 1 / LCD segment
Pin 43 PTH2 — Port H bit 2 / LCD segment
Pin 44 PTH3 — Port H bit 3 / LCD segment
Pin 45 PTH4 — Port H bit 4 / LCD segment
Pin 46 PTH5 — Port H bit 5 / LCD segment
Pin 47 PTH6 — Port H bit 6 / LCD segment
Pin 48 PTH7 — Port H bit 7 / LCD segment
Pin 49 BKGD — Background Debug Mode pin
Pin 50 RESET — Reset input (active low)
Pin 51 PTJ0 — Port J bit 0 / CAN TX
Pin 52 PTJ1 — Port J bit 1 / CAN RX
Pin 53 PTJ2 — Port J bit 2
Pin 54 PTJ3 — Port J bit 3
Pin 55 PTJ4 — Port J bit 4
Pin 56 PTJ5 — Port J bit 5
Pin 57 PTJ6 — Port J bit 6
Pin 58 PTJ7 — Port J bit 7
Pin 59 VDD — Supply voltage
Pin 60 VSS — Ground
Pin 61 PTA0 — Port A bit 0
Pin 62 PTA1 — Port A bit 1
Pin 63 PTA2 — Port A bit 2
Pin 64 PTA3 — Port A bit 3

Typical Applications

S9S08DZ60F2MLHR is suitable for 6 applications: Automotive Instrument Cluster, Automotive Body Control Module (BCM), HVAC Control Module, Industrial Sensor Hub with CAN, LCD-based Human-Machine Interface (HMI), Brushed DC Motor Controller.

🚗

Automotive Instrument Cluster

The S9S08DZ60F2MLHR's integrated segment LCD controller (up to 320 segments per the NXP MC9S08DZ60 datasheet family) directly drives speedometer, tachometer and fuel gauges without an external driver IC, reducing BOM cost and PCB space. Its 60 KB Flash accommodates gauge graphics, warning-icon logic and CAN message decoding simultaneously. The 40 MHz S08 core executes gauge-sweep updates at >100 Hz refresh, well above flicker threshold, while AEC-Q100 qualification and -40C to +125C rating ensure reliability across under-dash thermal cycles.

🚗

Automotive Body Control Module (BCM)

Body control modules aggregate door locks, lighting, wipers and window controls, and the S9S08DZ60F2MLHR is well suited because its on-chip CAN 2.0 A/B controller (MSCAN) handles body-network messaging at 500 kbit/s without external bus controllers. The 12-bit ADC with multiple channels reads switch and sensor inputs, while 16-bit timers drive PWM outputs for lamp dimming and motor control. With 60 KB Flash and AEC-Q100 qualification, this part supports production-grade BCM firmware with full OSEK/OSEK-aware CAN stacks in a 64-LQFP footprint.

🌐

HVAC Control Module

HVAC head units require precise temperature sensing, fan-speed PWM control, segment LCD for status display and CAN communication to the vehicle network - all integrated in the S9S08DZ60F2MLHR. The 12-bit ADC accurately reads NTC thermistor temperature sensors, while the LCD driver directly displays setpoint, fan speed and mode without an external driver. The 40 MHz core easily handles closed-loop PID fan/blend-door control at sub-10 ms update rates, and AEC-Q100 plus -40C to +125C operation ensure dashboard thermal reliability.

🏭

Industrial Sensor Hub with CAN

Industrial sensor hubs aggregate analog/digital inputs and publish them over CAN, and the S9S08DZ60F2MLHR's MSCAN peripheral, 12-bit ADC and 60 KB Flash make it a strong fit. Operating from 2.7V to 5.5V simplifies integration with both 3.3V and 5V sensor rails, and the 64-LQFP package suits through-hole or reflow assembly on industrial PCBs. The wide -40C to +125C rating supports outdoor cabinet and factory-floor deployments.

📺

LCD-based Human-Machine Interface (HMI)

The integrated segment LCD driver of the S9S08DZ60F2MLHR eliminates external driver ICs for simple HMI panels such as appliance controls, vending machines or industrial operator panels. The driver supports up to 320 pixels (per the MC9S08DZ60 datasheet family), sufficient for status displays with icons, 7-segment numeric readouts and bar graphs. Combined with the CAN interface, an S9S08DZ60-based panel can serve as a remote HMI node on a CAN bus while maintaining deterministic local input scanning.

🏭

Brushed DC Motor Controller

The S9S08DZ60F2MLHR's 16-bit timer modules deliver PWM at frequencies well above the audible range, enabling silent brushed-DC motor drive for pumps, valves and small fans. The 12-bit ADC reads current sense and back-EMF for closed-loop torque/speed control, while CAN feedback enables remote diagnostics. The 60 KB Flash holds field-oriented control or PID firmware with safety checks, and the 64-LQFP package is robust for under-hood mounting.

Recommended Products Summary

TJA1057 High-speed CAN transceiver companion Used in: Automotive Instrument Cluster, HVAC Control Module, Industrial Sensor Hub with CAN MC9S08DZ60MLH Same-family cluster MCU variant Used in: Automotive Instrument Cluster TJA1042 NXP Semiconductors Used in: Automotive Body Control Module (BCM) MC33660EFCC LIN transceiver for sub-network nodes Used in: Automotive Body Control Module (BCM) MC9S08DZ48F1CLH Lower-Flash variant for simpler HVAC UI Used in: HVAC Control Module MC9S08DZ32AMLH NXP Semiconductors Used in: Industrial Sensor Hub with CAN S9S08DZ48F1CLH NXP Semiconductors Used in: LCD-based Human-Machine Interface (HMI) MC9S08LL36CLK NXP Semiconductors Used in: LCD-based Human-Machine Interface (HMI) MC9S08DZ96CLH NXP Semiconductors Used in: Brushed DC Motor Controller MC9S08DV60AMLH NXP Semiconductors Used in: Brushed DC Motor Controller
What is the operating temperature range of the S9S08DZ60F2MLHR?
The S9S08DZ60F2MLHR operates from -40C to +125C, qualifying it for AEC-Q100 automotive-grade applications. According to NXP's MC9S08DZ60 datasheet family, this wide temperature window supports under-hood, body and chassis automotive electronics as well as industrial environments with similar thermal stress. Designers should still validate LCD contrast and ADC accuracy at the temperature extremes of their specific design.
How much Flash memory does the S9S08DZ60F2MLHR have?
The S9S08DZ60F2MLHR includes 60 KB (60K x 8) of on-chip Flash program memory. According to the NXP MC9S08DZ60 datasheet family, the Flash supports in-application programming via the on-chip charge pump and can be erased sector-by-sector. This capacity supports moderate-sized control firmware with CAN, ADC, LCD and PWM stacks combined.
Is the S9S08DZ60F2MLHR pin-compatible with the MC9S08DZ60 series?
Yes. According to NXP community discussions and the MC9S08DZ60 datasheet family, the S9S08DZ60F2MLHR is functionally and pin-compatible with the legacy MC9S08DZ60 parts in the same 64-LQFP package. Designers rebuilding obsolete MC9S08DZ60 AMLH boards can drop in the S9S08DZ60 F2MLH variant without PCB rework, provided firmware is recompiled for the latest mask set.
What is the difference between S9S08DZ60F2MLHR and S9S08DZ60F1CLH?
Both parts are 8-bit S08 MCUs with 60 KB Flash in the 64-LQFP package, but the F2 mask set (S9S08DZ60F2MLHR) offers improved errata fixes and lower power consumption versus the earlier F1. The 'M' in the suffix denotes the 64-LQFP package, 'LH' is NXP's LQFP-64 designator, and 'R' indicates tape-and-reel packaging.
Where can I download the S9S08DZ60F2MLHR datasheet PDF?
The official datasheet covering the S9S08DZ60F2MLHR is published by NXP as document MC9S08DZ60 (covering the MC9S08DZ60/48/32/16 family) and is available as a free PDF at https://www.nxp.com/docs/en/data-sheet/MC9S08DZ60.pdf. This single PDF documents the full DZ60 family since all variants share a common die. Mouser and DigiKey also host the PDF on their product pages.
What is the current price of the S9S08DZ60F2MLHR?
As of 2026-10-19, the S9S08DZ60F2MLHR is listed at approximately $6.38 per unit at 1500-piece quantity on distributor channels such as LCSC (from $2.87 in stock) and other authorized resellers. Pricing varies by quantity break and reel size; XAIPART offers tiered pricing starting at $6.38 (qty 1) down to $4.08 (qty 1000). For an exact quote, request a quote through XAIPART's order desk.
Is the S9S08DZ60F2MLHR in stock and what is the lead time?
As of 2026-10-19, the S9S08DZ60F2MLHR is in stock at several distributors including LCSC (93+ units available from $2.87) and DigiKey ('ships today' listing). NXP factory lead time for non-stock quantities is typically 8-12 weeks. For confirmed stock and lead times, request a quote from XAIPART with target quantity and required delivery date.
Where to buy S9S08DZ60F2MLHR online?
Authorized distributors carrying the S9S08DZ60F2MLHR online include DigiKey (digikey.com), Mouser (mouser.com), LCSC (lcsc.com), Hotenda, and Jotrin Electronics. XAIPART also supplies this part with tiered pricing visible on this page. Always source from authorized channels to ensure traceability and avoid counterfeit risk on legacy automotive parts.
Can the S9S08DZ60F2MLHR replace an obsolete MC9S08DZ60AMLH?
Yes, the S9S08DZ60F2MLHR is widely cited as the recommended replacement for the obsolete MC9S08DZ60AMLH. According to NXP community threads and the MC9S08DZ60 datasheet, both parts share the same 64-LQFP pinout, same 60 KB Flash, same CAN peripheral and same S08 instruction set. Existing firmware should recompile cleanly against the latest header files, but always verify peripheral base addresses in the new mask.
What are the key features of the S9S08DZ60F2MLHR for automotive use?
The S9S08DZ60F2MLHR combines AEC-Q100 qualification with an integrated CAN 2.0 controller, integrated LCD segment driver (up to 320 segments), 12-bit ADC, multiple 16-bit timers, and 60 KB Flash in a 64-LQFP package. According to the NXP MC9S08DZ60 datasheet family, these features target body controllers, instrument clusters and HVAC modules where on-chip LCD and CAN reduce BOM cost.
What is the best NXP drop-in replacement for the S9S08DZ60F2MLHR?
The best NXP drop-in replacements in the same 64-LQFP footprint are the S9S08DZ48F1CLH (48 KB Flash, lower-cost option), S9S08DZ32AMLH (32 KB Flash), and S9S08DZ16F1MLC (16 KB Flash). All four parts share the S08DZ family peripherals (CAN, LCD, ADC, timers) in the same 64-LQFP package, allowing downward migration if code fits smaller Flash.
S9S08DZ60F2MLHR vs MC9S08DN60AMLH - which is better for body controllers?
Both are 8-bit S08 MCUs in the 64-LQFP package, but the S9S08DZ60F2MLHR includes an integrated LCD segment driver, while the MC9S08DN60AMLH lacks LCD but offers a different peripheral mix. For body controllers with LCD HMI, choose S9S08DZ60F2MLHR. For pure CAN/sensor body modules without LCD, the MC9S08DN60AMLH may be lower cost.
What can replace the S9S08DZ60F2MLHR if it goes out of stock?
If the S9S08DZ60F2MLHR becomes hard to source, drop-in alternatives in the same S08DZ family and 64-LQFP footprint include S9S08DZ48F1CLH (48 KB Flash), S9S08DZ32AMLH (32 KB Flash), S9S08DZ16F1MLC (16 KB Flash), and the legacy MC9S08DZ60MLH. All share the same S08 core, CAN peripheral and LQFP-64 pinout, making them true drop-in replacements.
When should I choose the S9S08DZ60F2MLHR over the MC9S08DZ32AMLH?
Choose the S9S08DZ60F2MLHR when your firmware exceeds 32 KB Flash, or when you need the latest F2 mask set for errata fixes and lower power. The S9S08DZ32AMLH is suitable only for smaller code sizes (under 32 KB) where cost dominates. Both share the 64-LQFP package, so PCB layout is identical - selection is purely a firmware-size and mask-revision decision.
What tools are needed to develop firmware for the S9S08DZ60F2MLHR?
Firmware development for the S9S08DZ60F2MLHR requires NXP's CodeWarrior for HCS08 (legacy) or the current Eclipse-based S32 Design Studio / MCUXpresso for S08 with the appropriate service pack. Programming uses the single-wire Background Debug Mode (BDM) interface via NXP's P&E Multilink or Cyclone programmers. Header files and peripheral definition PDFs are bundled in the MC9S08DZ60 datasheet family.

Engineering reference data for S9S08DZ60F2MLHR — comparison, design guidance, and compliance information.

Selection Guide

Choose the S9S08DZ60F2MLHR when you need an AEC-Q100-qualified 8-bit S08 MCU with 60 KB Flash, integrated CAN 2.0 A/B and on-chip segment LCD driver for automotive instrument clusters, BCMs, HVAC modules or industrial sensor hubs. The F2 mask set provides the latest errata fixes and is in active production, unlike the obsolete MC9S08DZ60AMLH. If your firmware fits in 32 KB or 48 KB, consider the S9S08DZ32AMLH or S9S08DZ48F1CLH for cost savings in the same 64-LQFP footprint. If you do not need LCD, choose the S9S08DN60F2VLH or MC9S08DN60AMLH to avoid paying for the LCD peripheral. All alternatives share the same 64-LQFP (10x10) footprint, so PCB layout is identical across the family.

Comparison with Alternatives

Parameter This Product S9S08DZ60F1CLH MC9S08DZ60MLH MC9S08DZ60AMLH S9S08DN60F2VLH MC9S08DN60AMLH
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-LQFP (10x10) 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same
Flash Memory 60 KB 60 KB 60 KB 60 KB 60 KB 60 KB
Integrated LCD Driver Yes Yes Yes Yes No (DN series) No (DN series)
CAN Controller MSCAN 2.0 A/B MSCAN 2.0 A/B MSCAN 2.0 A/B MSCAN 2.0 A/B MSCAN 2.0 A/B MSCAN 2.0 A/B
CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Operating Temperature -40C to +125C -40C to +125C -40C to +85C (industrial) -40C to +125C -40C to +105C -40C to +125C
Lifecycle Status Active (F2 mask) Active (older F1 mask) Legacy (pre-Safety) Obsolete / NRND Active Legacy

Key Differentiators

  • F2 mask set with latest errata fixes (vs S9S08DZ60F1CLH)
  • Integrated segment LCD driver (vs S9S08DN60F2VLH)
  • Active F2 production mask (vs MC9S08DZ60AMLH)

Design Notes

Place a 100 nF decoupling capacitor as close as possible to every VDD/VSS pair (typically 5 pairs on the 64-LQFP). Add a bulk 4.7 uF tantalum or ceramic capacitor near the MCU to handle Flash program/erase inrush. The on-chip voltage regulator requires a 100 nF between VREFLD/VREFP for stable regulation; failing to fit this cap causes Flash programming failures. Note: estimated capacitor values are typical engineering practice - confirm exact requirements against the NXP MC9S08DZ60 datasheet family.

Route the CANH and CANL signals as a 120-ohm differential pair with characteristic impedance control, keep them short and away from switching nodes, and add a common-mode choke plus TVS diode (e.g. NXP PESD1CAN) at the connector. The BDM (Background Debug Mode) pin should be brought to a 2x5 or 1x6 header for production programming and field firmware updates. Use a 4.7 kohm pull-up on RESET and ensure the trace is short to avoid false resets in noisy automotive environments.

The S9S08DZ60F2MLHR dissipates well under 100 mW in typical operation (estimated: ~50 mW at 40 MHz, 5V), so no heatsink is required. However, in sealed enclosures with no airflow, ambient temperature can approach 85C. Verify that the LCD bias voltage remains stable across temperature - the integrated charge pump may need a slightly larger reservoir cap at high temperature to maintain segment contrast. Confirm exact thermal numbers against the datasheet family rather than relying on this estimate.

Do not leave unused pins floating - configure them as outputs or enable internal pull-ups to prevent shoot-through and reduce EMI. The ADC reference voltage (VRH/VRL) must be decoupled with 100 nF and 10 uF capacitors; failing to do so introduces ADC noise that violates the 12-bit accuracy spec. When migrating from MC9S08DZ60AMLH to S9S08DZ60F2MLHR, verify the F2 mask errata against your firmware's reliance on any fixed errata workarounds from the older mask.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
[Data Needed]
Conflict Minerals
Compliant

AEC-Q100 automotive qualification confirmed by NXP Mouser listing; RoHS/REACH compliant per distributor data. Halogen-free status not explicitly listed in verified web data.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors S9S08DZ60F2MLHR MC9S08DZ60 MC9S08DZ60MLH MC9S08DZ60AMLH S9S08DZ48F1CLH S9S08DZ32AMLH S9S08DN60F2VLH Microcontroller MCU 8-bit HCS08 S08 core CISC architecture Flash memory MSCAN CAN 2.0 A/B segment LCD driver AEC-Q100 automotive grade 64-LQFP LQFP package LQFP-64 surface mount RoHS REACH Background Debug Mode BDM instrument cluster body control module BCM HVAC module industrial sensor hub
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