MC9S12DT128MPVE - 16-bit HCS12 MCU, 128KB Flash, LQFP-112 | NXP
Référence : MC9S12DT128MPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $45.3 | $45,30 |
| 10 | $43.5 | $435,00 |
| 100 | $41.2 | $4 120,00 |
| 500 | $38.9 | $19 450,00 |
| 1 000 | $36.5 | $36 500,00 |
MC9S12DT128MPVE Présentation
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, memory, and peripheral functions such as timers, serial interfaces, and analog-to-digital converters. In the system hierarchy, an MCU sits at the embedded control level above discrete logic and below application processors, and the S12D family belongs to the broader 16-bit automotive microcontroller segment originated by Motorola and continued by Freescale Semiconductor, now NXP Semiconductors.
Key features of the MC9S12DT128 include two asynchronous serial communications interfaces (SCI), an 8-channel input capture/output capture enhanced capture timer, two 8-channel 10-bit ADCs, an 8-channel pulse-width modulator, 91 discrete I/O lines, and an Inter-IC (IIC) bus. The 16-bit HCS12 CPU core executes a compact instruction set well suited to automotive multiplexing and body-electronics workloads.
Architecturally, the MC9S12D family members are fully pin compatible, allowing designers to choose different memory and peripheral options for scalable designs on one PCB. The device operates from a 2.35V to 5.25V supply and across an automotive -40C to +125C temperature range, consistent with its intended vehicle-network deployment. Note that NXP lists this part as NRND (Not Recommended for New Designs), so it should be used for maintenance of existing designs rather than new developments.
Typical applications include automotive body control modules, instrument clusters, gateway and multiplexing nodes, and industrial control panels that require robust 16-bit control with CAN-class networking peripherals and generous flash headroom.
When designing with this device, verify long-term supply strategy early because of its NRND status and plan a migration path toward the same pin-compatible S12D family variants with larger flash (for example the DG/DJ/DP variants) if code size grows.
This page synthesizes distributor pricing tiers, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with all data verified against NXP, DigiKey, Mouser, and Octopart listings as of 2026-10-18.
Alternatives de remplacement direct pour MC9S12DT128MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DT128MPVE (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Supply Voltage, ADC, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DG128MPVE
✅ Remplacement direct✓ En stock
$11.75 / unité
Voir la fiche technique →MC9S12DJ128MPVE
✅ Remplacement direct✓ En stock
$19.25 / unité
Voir la fiche technique →MC9S12DP128MPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT128VPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT128MPVE Valeurs maximales et caractéristiques électriques
| Core | HCS12 |
| Core Architecture | 16-bit |
| Maximum Clock Speed | 25 MHz |
| Flash Program Memory | 128KB (128K x 8) |
| RAM | 8KB (8K x 8) |
| EEPROM | 2KB (2K x 8) |
| Supply Voltage Range | 2.35 V to 5.25 V |
| Number of I/O | 91 |
| ADC Resolution | 10-bit |
| ADC Channels | 16 (two 8-channel 10-bit ADCs) |
| PWM Channels | 8-channel |
| Serial Interfaces | 2x SCI, IIC |
| Timers | 8-channel IC/OC enhanced capture timer |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Terminal Form | Gull Wing |
| Temperature Grade | Automotive |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) |
| Oscillator Type | Internal |
Guide de configuration des broches du MC9S12DT128MPVE 112-lqfp (20x20 mm)
Configuration des broches du MC9S12DT128MPVE (boîtier 112-lqfp (20x20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12DT128MPVE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12DT128MPVE convient pour 6 applications: Automotive Body Control Modules, Instrument Clusters, Automotive Gateway and Multiplexing Nodes, Industrial Motor Control and Actuation, Sensor Signal Acquisition Systems, Legacy ECU Maintenance and Service Electronics.
Automotive Body Control Modules
Body control modules (BCM) consolidate lighting, locking, wiper, and seat functions behind a single networked controller, exactly the automotive multiplexing workload the MC9S12D family was introduced for. The MC9S12DT128MPVE's 91 I/O lines provide dense direct drive and sensing for relays and switches, while two 8-channel 10-bit ADCs digitize analog switch and sensor inputs without external converters. The 8-channel PWM directly controls lamp dimming and motor speed. Its -40C to +125C automotive temperature grade tolerates under-dash thermal environments. Placed on a LIN/CAN-gatewayed BCM board, the 25 MHz HCS12 core runs the multiplexing protocol stack with margin, and the 2KB EEPROM retains calibration data through power cycles.
Recommandé
Instrument Clusters
Instrument clusters combine stepper-motor gauge drive, telltale lighting, warning tones, and network communication. The MC9S12DT128MPVE fits because its 8-channel PWM output drives gauge pointers and backlight dimming with smooth duty resolution, while the enhanced capture timer with 8 input-capture channels time-stamps wheel-speed and engine pulses without CPU loading. The two 8-channel 10-bit ADCs read fuel level, coolant temperature, and battery voltage, and the SCI ports communicate with the vehicle gateway. With 128KB flash, the full cluster firmware plus diagnostic routines fits without external memory, and the -40C to +125C grade covers windshield-adjacent thermal conditions. Its NRND status means new cluster designs should qualify an active S12 successor while service programs can continue using this part.
Recommandé
Automotive Gateway and Multiplexing Nodes
The MC9S12D family introduction explicitly names automotive multiplexing applications, and gateway nodes are the canonical example: translating traffic between body, powertrain, and diagnostic buses. The MC9S12DT128MPVE's SCI/IIC serial interfaces, combined with an external CAN transceiver layer, implement gateway translation tasks; the 25 MHz HCS12 core provides deterministic interrupt handling for time-critical frames. The 128KB flash accommodates the routing tables plus flash-resident diagnostic bootloaders, and the 8KB RAM buffers message queues. Because all S12D family members share the same 112-LQFP pin map, a single gateway PCB can be populated with DG/DT/DP variants to scale channel count per vehicle trim level without layout changes.
Recommandé
Industrial Motor Control and Actuation
Beyond vehicles, the DT128's timer-centric peripheral set suits industrial actuation: the 8-channel enhanced capture timer measures feedback from encoders and Hall sensors while the 8-channel PWM drives motor bridges and solenoids. The dual 10-bit ADCs sample current and position feedback at 8-channel depth, closing the control loop on-chip. The wide 2.35V to 5.25V supply range simplifies integration into 5V industrial logic environments, and the -40C to +125C operating range permits enclosed control cabinets near heat sources. With 91 I/O lines, discrete limit switches and indicator outputs connect without port expanders. Note the HCS12 core is not DSP-class, so high-bandwidth field-oriented control should remain on companion hardware, using the MCU for sequencing and supervision.
Recommandé
Sensor Signal Acquisition Systems
Data acquisition nodes benefit from the MC9S12DT128MPVE's 16 analog input channels (two 8-channel 10-bit ADCs) that multiplex thermistor, pressure, and potentiometer inputs without external analog multiplexers. The enhanced capture timer's input-capture channels provide precise period and duty measurement for pulse-output flow and speed sensors. Acquired values are time-stamped, filtered in the 8KB RAM, and logged into the 2KB EEPROM for calibration-critical parameters, or streamed out via the SCI ports to a supervisory controller. The 25 MHz core performs oversampling and averaging in real time, improving effective resolution of the 10-bit converters. Its wide industrial temperature coverage and LQFP-112 surface-mount format fit standard industrial PCB assembly processes.
Recommandé
Legacy ECU Maintenance and Service Electronics
A significant ongoing use of the MC9S12DT128MPVE is sustaining existing electronic control units that already use S12D silicon, where firmware and certification history are locked to this family. Here the part's value is continuity: same die, same flash programming tools, same pin map across DG/DT/DJ/DP variants lets service lines substitute pin-compatible family members when the DT128 allocation tightens under NRND. The 2KB EEPROM preserves per-vehicle calibration records across reprogramming events, and the on-chip flash supports field updates through the SCI-based bootloader. Procurement teams should pair remaining DT128 stock with a qualified DG128/DJ128 cross so PCB assembly can continue uninterrupted as NRND inventory is consumed.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DT128MPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DG128MPVE | MC9S12DJ128MPVE | MC9S12DP128MPVE | MC9S12DT128VPV |
|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy) |
| Core / Bus Speed | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz |
| Flash / RAM / EEPROM | 128KB / 8KB / 2KB | 128KB / 8KB / 2KB | 128KB / 8KB / 2KB | 128KB / 8KB / 2KB | 128KB / 8KB / 2KB |
| ADC | 2x 8-channel 10-bit | 2x 8-channel 10-bit | 2x 8-channel 10-bit | 2x 8-channel 10-bit | 2x 8-channel 10-bit |
| Peripheral Emphasis | Enhanced capture timer (8ch IC/OC) | CAN-capable general-purpose mix | Different timer/CAN split | Maximum CAN channels and I/O | Same DT silicon |
| Lifecycle Status | NRND | Active / NRND per variant - verify | Active / NRND per variant - verify | Active / NRND per variant - verify | NRND |
| Supply Voltage | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V |
Principaux différenciateurs
- Timer-centric peripheral set for high-channel-count timing tasks (vs MC9S12DG128MPVE)
- Full family pin compatibility enables scalable platforms (vs MC9S12DP128MPVE)
- NRND status is a sourcing trade-off (vs MC9S12DT128VPV)
Notes de conception
The MC9S12DT128MPVE is NRND per NXP's official product page. Do not start a new design on this part. For existing designs, secure stock now and qualify MC9S12DG128MPVE or MC9S12DJ128MPVE as continuity substitutes - the S12D family is fully pin compatible, so the PCB needs no rework, but the peripheral differences (timer vs CAN emphasis) require a firmware review and re-verification of peripheral initialization code before substitution.
The device operates from 2.35V to 5.25V across the VDD/VDDR pin groups. In automotive 12V systems, provide upstream transient protection (load-dump clamping) before the local regulator feeding the MCU, and decouple each supply pin group with 100 nF ceramics placed within 2-3 mm of the pins plus one bulk capacitor per supply domain. Verify the exact per-pin voltage requirements in the S12D family datasheet electrical characteristics table, as the DT variant groups supply pins by domain.
The 112-LQFP (20x20 mm) gull-wing footprint requires the standard JEDEC-style land pattern with 0.5 mm pitch routing; allow a via-fan-out region under the body for the 91 I/O signals. Keep the oscillator traces short and guarded by ground, route the ADC analog inputs away from PWM and bus switching nets, and use the bottom-layer ground plane continuous beneath the ADC input traces to protect 10-bit conversion accuracy in noisy vehicle environments.
Informations de conformité
The package code LQFP implies a lead-free capable package family and the part is an automotive-grade device (-40C to +125C), but explicit RoHS/REACH/AEC-Q100 compliance statements were not present in the provided verified web data. Consult the NXP product page environmental section for authoritative compliance data.
