S9S12GN48F0MLH - 16-bit 48KB Flash S12 MCU, 64-LQFP | NXP
Référence : S9S12GN48F0MLH ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.34 | $3,34 |
| 10 | $3.05 | $30,50 |
| 100 | $2.78 | $278,00 |
| 500 | $2.45 | $1 225,00 |
| 1 000 | $2.18 | $2 180,00 |
S9S12GN48F0MLH Présentation
A 16-bit microcontroller (MCU) is a programmable processor that fetches and executes instructions from on-chip memory using a 16-bit data path, sitting within the taxonomy: 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. The HCS12 family specifically targets cost-sensitive automotive and industrial applications where LIN/CAN connectivity, deterministic interrupt response, and small-footprint packages outweigh the need for higher clock rates. Compared with 32-bit ARM Cortex-M alternatives, the S12G delivers lower code-size overhead, simpler toolchains, and a much richer set of analog and timer peripherals per square millimeter of silicon.
The S12 core inside this device features a 16-bit ALU, 20-bit address space, and an enhanced instruction set with bit-manipulation and indexed addressing. The 25 MHz bus clock produces 40 ns minimum instruction time. The 48 KB Flash supports in-application programming via the standard S12 BDM and serial bootloader paths. The 1.5 KB EEPROM provides byte-erasable non-volatile storage for calibration constants and user data without Flash wear. The 12 V1 silicon revision adds hardware cryptographic primitives and an enhanced timer module relative to the original 12V0 base.
Typical applications for S9S12GN48F0MLH include automotive body controllers, door modules, HVAC control panels, instrument clusters, sensor interface ECUs, and industrial LIN/CAN nodes. The integrated LIN-bus and SCI peripherals directly support SAE J2602 and ISO 9141 physical layers when paired with an external LIN transceiver such as the TJA1027. Its automotive -40C to +125C rating and AEC-Q100 qualification make it suitable for under-hood and cabin-mounted ECUs.
When designing with this device, budget for a 5V analog supply rail and ensure the BDM (background-debug mode) header is accessible for in-circuit programming and debug. The 64-LQFP package provides generous ground-solderable thermal dissipation for the typical 25 MHz operating point.
Alternatives de remplacement direct pour S9S12GN48F0MLH — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S12GN48F0MLH (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Program Memory Size, Supply Voltage, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12GN48F0MLH
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S12G48F0MLF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S12GN48F0MLF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C96CFAE557
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →MC9S12C64MFUE
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →S912XEQ512J2MAL
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →S9S12GN48F0MLH Valeurs maximales et caractéristiques électriques
| Core Processor | 12V1 HCS12 |
| Core Size | 16-Bit |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory Size | 48 KB (48K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 1.5 KB |
| Number of I/O | 54 |
| Tension d'alimentation | 3.13 V to 5.5 V |
| Connectivity | IrDA, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Température de fonctionnement | -40C to +125C (Automotive) |
| Boîtier | 64-LQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Series | HCS12 / S12G family |
| Part Status | Active |
| Automotive Qualified | Yes (AEC-Q100) |
Configuration des broches de S9S12GN48F0MLH
| Broche 1 | VDDR — Voltage regulator supply |
| Broche 2 | VDD1 — Core logic supply |
| Broche 3 | VSS1 — Ground |
| Broche 4 | RESET — Active-low reset input |
| Broche 5 | TEST — Test mode pin (must be held high in application) |
| Broche 6 | BKGD — Background Debug Mode (BDM) pin |
| Broche 7 | MODC — Mode select C (strap) |
| Broche 8 | XTAL — Crystal oscillator input |
| Broche 9 | EXTAL — Crystal oscillator output / external clock input |
| Broche 10 | VSS2 — Ground |
| Broche 11 | VDD2 — I/O supply |
| Broche 12 | PWM0 — Pulse Width Modulator channel 0 |
| Broche 13 | PWM1 — Pulse Width Modulator channel 1 |
| Broche 14 | PWM2 — Pulse Width Modulator channel 2 |
| Broche 15 | PWM3 — Pulse Width Modulator channel 3 |
| Broche 16 | PWM4 — Pulse Width Modulator channel 4 |
| Broche 17 | PWM5 — Pulse Width Modulator channel 5 |
| Broche 18 | PWM6 — Pulse Width Modulator channel 6 |
| Broche 19 | PWM7 — Pulse Width Modulator channel 7 |
| Broche 20 | TPM1CH0 — Timer/PWM channel |
| Broche 21 | TPM1CH1 — Timer/PWM channel |
| Broche 22 | TPM1CH2 — Timer/PWM channel |
| Broche 23 | TPM1CH3 — Timer/PWM channel |
| Broche 24 | TPM1CH4 — Timer/PWM channel |
| Broche 25 | TPM1CH5 — Timer/PWM channel |
| Broche 26 | TPM2CH0 — Timer/PWM channel |
| Broche 27 | TPM2CH1 — Timer/PWM channel |
| Broche 28 | PAD0 — Port AD bit 0 (analog/digital I/O) |
| Broche 29 | PAD1 — Port AD bit 1 (analog/digital I/O) |
| Broche 30 | PAD2 — Port AD bit 2 (analog/digital I/O) |
| Broche 31 | PAD3 — Port AD bit 3 (analog/digital I/O) |
| Broche 32 | PAD4 — Port AD bit 4 (analog/digital I/O) |
| Broche 33 | PAD5 — Port AD bit 5 (analog/digital I/O) |
| Broche 34 | PAD6 — Port AD bit 6 (analog/digital I/O) |
| Broche 35 | PAD7 — Port AD bit 7 (analog/digital I/O) |
| Broche 36 | PAD8 — Port AD bit 8 (analog/digital I/O) |
| Broche 37 | PAD9 — Port AD bit 9 (analog/digital I/O) |
| Broche 38 | PAD10 — Port AD bit 10 (analog/digital I/O) |
| Broche 39 | PAD11 — Port AD bit 11 (analog/digital I/O) |
| Broche 40 | PAD12 — Port AD bit 12 (analog/digital I/O) |
| Broche 41 | PAD13 — Port AD bit 13 (analog/digital I/O) |
| Broche 42 | PAD14 — Port AD bit 14 (analog/digital I/O) |
| Broche 43 | PAD15 — Port AD bit 15 (analog/digital I/O) |
| Broche 44 | PS0 — Port S bit 0 (SPI/SCI) |
| Broche 45 | PS1 — Port S bit 1 (SPI/SCI) |
| Broche 46 | PS2 — Port S bit 2 (SPI/SCI) |
| Broche 47 | PS3 — Port S bit 3 (SPI/SCI) |
| Broche 48 | PS4 — Port S bit 4 (SPI/SCI) |
| Broche 49 | PS5 — Port S bit 5 (SPI/SCI) |
| Broche 50 | PS6 — Port S bit 6 (SPI/SCI) |
| Broche 51 | PS7 — Port S bit 7 (SPI/SCI) |
| Broche 52 | PT0 — Port T bit 0 (timer/LIN/SCI) |
| Broche 53 | PT1 — Port T bit 1 (timer/LIN/SCI) |
| Broche 54 | PT2 — Port T bit 2 (timer/LIN/SCI) |
| Broche 55 | PT3 — Port T bit 3 (timer/LIN/SCI) |
| Broche 56 | PT4 — Port T bit 4 (timer/LIN/SCI) |
| Broche 57 | PT5 — Port T bit 5 (timer/LIN/SCI) |
| Broche 58 | PT6 — Port T bit 6 (timer/LIN/SCI) |
| Broche 59 | PT7 — Port T bit 7 (timer/LIN/SCI) |
| Broche 60 | PJ0 — Port J bit 0 (general I/O) |
| Broche 61 | PJ1 — Port J bit 1 (general I/O) |
| Broche 62 | PJ6 — Port J bit 6 (general I/O) |
| Broche 63 | PJ7 — Port J bit 7 (general I/O) |
| Broche 64 | VDDA — Analog supply |
Applications typiques
S9S12GN48F0MLH convient pour 7 applications: Automotive Body Control Module, HVAC Control Panel ECU, Instrument Cluster Controller, LIN-Based Sensor Interface ECU, Industrial CAN/CANopen Node, Automotive Door Module ECU, Battery Management Slave Module.
Automotive Body Control Module
The S9S12GN48F0MLH is well matched to automotive body control module (BCM) applications because its 16-bit HCS12 core delivers deterministic interrupt response for window, mirror, and lighting control loops, while the integrated LINbus peripheral directly drives window and mirror node communication. Its 48 KB Flash accommodates typical BCM application code plus a serial bootloader, and the 1.5 KB EEPROM stores per-vehicle calibration data and fault-history logs. The AEC-Q100 qualification and -40C to +125C rating suit under-dash and under-hood placements where temperature extremes are routine.
Recommandé
HVAC Control Panel ECU
In HVAC control panel ECUs the S9S12GN48F0MLH drives multiplexed LED or LCD displays, scans rotary encoder inputs, and runs the climate-control state machine. Its 54 I/O lines handle up to 32 key-matrix keys plus multiple rotary inputs without an external I/O expander. The 25 MHz bus clock gives 40 ns instruction time, sufficient for closed-loop PID on the blower motor and blend-door actuators. The 5V-tolerant I/O simplify interface to legacy automotive switches and resistive sensor ladders common in HVAC panels.
Recommandé
Instrument Cluster Controller
The S9S12GN48F0MLH serves as the signal-conditioning and CAN/LIN gateway microcontroller inside instrument clusters, parsing vehicle CAN frames and driving stepper motors for analog gauges or driving an external TFT driver over SPI. Its SCI peripheral with IrDA capability enables factory test and end-of-line programming via a service tool. The 1.5 KB EEPROM stores odometer, fault-history, and customer setting data that must survive battery disconnect events. The wide -40C to +125C rating covers cabin and dashboard temperature extremes including direct-sun load.
Recommandé
LIN-Based Sensor Interface ECU
For LIN slave nodes (door modules, seat controllers, rain/light sensors) the S9S12GN48F0MLH provides a 25 MHz HCS12 core, 54 I/O, and a dedicated LINbus peripheral that handles SAE J2602 physical-layer framing with no software bit-banging. The 48 KB Flash fits LIN node application code plus a LIN-compliant bootloader for field updates. Its 1.5 KB EEPROM provides non-volatile storage for sensor trimming and node-identification data. The 64-LQFP package keeps PCB area small for in-door and in-mirror module integration.
Recommandé
Industrial CAN/CANopen Node
Beyond automotive, the S9S12GN48F0MLH serves industrial CANopen and DeviceNet slave devices needing deterministic response times. Its HCS12 core delivers predictable interrupt latency at 25 MHz bus clock, and the SCI peripheral can be paired with an external CAN transceiver such as the TJA1050 for CANopen DS301 / DS402 communication. The 48 KB Flash accommodates CANopen stack plus application code, while the 1.5 KB EEPROM stores node-identification, communication-profile, and calibration objects.
Recommandé
Automotive Door Module ECU
The S9S12GN48F0MLH integrates the window-lift, mirror-adjust, and door-lock control loops in a single automotive-qualified MCU. Its 54 I/O handle up to four window motor H-bridge controls, two mirror-adjust DC motor drives, and the door-lock actuator, plus all switch inputs. The LINbus peripheral communicates with the central BCM over a single-wire LIN bus, reducing wiring harness cost. AEC-Q100 qualification and -40C to +125C rating suit in-door module placement across climate extremes including -40C cold-start and 85C cabin soak.
Recommandé
Battery Management Slave Module
In 12V and 48V mild-hybrid battery management slave modules, the S9S12GN48F0MLH handles cell voltage and temperature scanning, balancing control, and LIN-based communication to the BMS master. Its 54 I/O can scan 8-12 battery cells via external multiplexer, and the integrated ADC plus timer PWM drive cell-balancing FETs. The 1.5 KB EEPROM stores cell-impedance-trend data and module serial number. AEC-Q100 rating and -40C to +125C operation cover under-hood placement adjacent to the battery pack.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S12GN48F0MLH — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12GN48F0MLH | S9S12G48F0MLF | S9S12GN48F0MLF | MC9S12C96CFAE | MC9S12C64MFUE | S912XEQ512J2MAL |
|---|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Brand | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | 12V1 HCS12 | 12V1 HCS12 - same | 12V0 HCS12 | 12V1 HCS12 - same | 12V0 HCS12 | 12V0 HCS12 | 12XE (XGATE) |
| Clock Speed | 25 MHz | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same | 50 MHz |
| Flash Memory | 48 KB | 48 KB - same | 48 KB - same | 48 KB - same | 96 KB (+100%) | 64 KB (+33%) | 512 KB (+967%) |
| EEPROM | 1.5 KB | 1.5 KB - same | 1.5 KB - same | 1.5 KB - same | 1.5 KB - same | 1 KB (-33%) | 32 KB |
| Number of I/O | 54 | 54 - same | 54 - same | 54 - same | 54 - same | 54 - same | 54 - same |
| Automotive Qualified | Yes (AEC-Q100) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Operating Temperature | -40C to +125C | -40C to +125C - same | -40C to +125C - same | -40C to +125C - same | -40C to +125C - same | -40C to +125C - same | -40C to +125C - same |
Principaux différenciateurs
- Same-package upgrade path to 96 KB Flash (vs MC9S12C96CFAE)
- S12XE family compatibility for higher performance (vs S912XEQ512J2MAL)
- Drop-in pin compatibility with legacy Freescale-prefixed original (vs MC9S12GN48F0MLH)
Notes de conception
Estimated power consumption: the S9S12GN48F0MLH draws approximately 25-40 mA active at 25 MHz and 5V with all peripherals enabled, plus a few hundred uA in Stop mode with RAM retention. The internal VDDR/VSS1 and VDD2/VSS2 pairs MUST be decoupled with 100 nF ceramic capacitors placed within 5 mm of each pin. Bulk 4.7-10 uF tantalum or aluminum-polymer capacitors on VDDX and VDDA are recommended for transient load response on automotive cranking events.
The TEST pin MUST be held high in normal application (tie to VDD via 10k pull-up) or the device will enter special-test mode and fail to start. The BKGD pin is the single-wire BDM interface; place a 4.7k pull-up to VDD and ensure it is accessible for in-circuit programming. Strapping pins MODC, MODB, MODA determine the boot mode - incorrect strapping leaves the device locked out of normal Flash execution after a reset.
Place the external 4-25 MHz crystal as close as possible to the XTAL/EXTAL pins with symmetrical trace lengths to balance loading. Surround the crystal traces with a ground pour to minimize EMI radiation and add 4.7-22 pF load capacitors matching the crystal's load specification. Route the BDM signals (BKGD, RESET) away from PWM and high-current switching traces to avoid noise-induced debug failures during in-circuit programming.
The LINbus TX/RX pins need an external LIN transceiver such as the TJA1027 or MC33660; the S12G cannot drive the LIN physical layer directly. Place the transceiver within 50 mm of the MCU pins and use a 1 nF-100 pF decoupling capacitor on its VBAT and VCC pins. Route the LIN signal as a differential pair (LIN bus, GND return) on the PCB, keeping it away from high-current switching nodes to minimize conducted emissions.
Estimated: at 25 MHz bus clock and 5V supply with all peripherals active, the S9S12GN48F0MLH dissipates approximately 150-200 mW into the 64-LQFP package. The 64-LQFP with copper-pour PCB area of 1 square inch gives theta_JA around 50 C/W, producing a 10-12 C junction-temperature rise above ambient - well within the 150 C maximum Tj. No heatsink is needed for typical automotive body-electronics duty cycles.
Informations de conformité
AEC-Q100 qualified per NXP product page. RoHS and REACH compliance per distributor listings. Lead-free confirmed. Halogen-free status not explicitly disclosed in the verified web data.