MC9S12C96CFAE557 - 16-Bit 96KB Flash HCS12 MCU 48-LQFP | NXP
Référence : MC9S12C96CFAE557 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.4 | $7,40 |
| 10 | $6.8 | $68,00 |
| 100 | $6.1 | $610,00 |
| 500 | $5.5 | $2 750,00 |
| 1 000 | $4.95 | $4 950,00 |
MC9S12C96CFAE557 Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash/ROM), volatile working memory (RAM), and a set of programmable peripherals onto one die. The HCS12 core family occupies the 16-bit microcontrollers niche - wider data paths and richer instruction sets than 8-bit MCUs while remaining simpler, lower power, and easier to use than 32-bit ARM Cortex-M parts. In the broader taxonomy: microcontroller -> embedded processor -> semiconductor -> integrated circuit. Flash-based HCS12 devices are commonly used where deterministic interrupt latency and on-chip CAN are required.
Key features of the MC9S12C96CFAE557 include 96 KB Flash with security and in-application programming support, 1 KB EEPROM for data logging, an internal bandgap voltage regulator that derives the core 2.5 V from the external 5 V rail, a phase-locked-loop (PLL) for flexible bus-clock generation, a background debug mode (BDM) interface for non-intrusive debug, and an on-chip CAN 2.0 A/B controller with hardware filtering. The 48-LQFP package exposes 31 general-purpose I/O lines and supports automotive ambient grades of -40C to +125C.
The device uses a Harvard-style 16-bit CPU12 core with an enhanced instruction set (including fuzzy logic and table-lookup instructions) that simplifies encoder/decoder and control-loop code. The integrated CAN module eliminates external controller chips, and the bandgap regulator plus on-chip POR/BOR circuits simplify power-tree design in distributed nodes such as sensor clusters, body controllers and seat modules.
Typical applications include CAN node endpoints in vehicle body and chassis networks, LIN-to-CAN bridges, industrial CANopen and DeviceNet slave stations, HVAC fan and blower controllers, and general-purpose 16-bit control boards that require Flash with field-upgrade capability.
Design with this part by keeping the external supply between 3.0 V and 5.5 V and using a 100 nF decoupling cap on each VDD/VSS pair. The CAN bus requires a TJA1050 or similar transceiver; the MCU CAN TX/RX pins are not 5 V bus-tolerant and must not be wired directly to a CANH/CANL cable.
This page consolidates distributor pricing, drop-in alternatives, and design notes specific to the MC9S12C96CFAE557, complementing the manufacturer datasheet with selection and lifecycle context.
Alternatives de remplacement direct pour MC9S12C96CFAE557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12C96CFAE557 (même facteur de forme et même empreinte) — différant par Package, ADC, Core, Program Memory Size, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12C96CFAE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12C128VFAE
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →MC9S12C64CFAE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12GC96MFUE
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →MC9S12C96CFAE557 Valeurs maximales et caractéristiques électriques
| Core | HCS12 (CPU12) |
| Largeur du bus de données | 16-bit |
| Program Memory Size | 96 KB (Flash) |
| RAM Size | 4 KB |
| EEPROM Size | 1 KB |
| Fréquence d'horloge maximale | 25 MHz |
| Supply Voltage Range | 2.97 V to 5.5 V |
| Plage de température de fonctionnement | -40C to +125C (automotive AEC-Q100 grade) |
| Boîtier | 48-LQFP (7x7 mm, 0.5 mm pitch) |
| Number of I/O Pins | 31 |
| ADC | 10-bit, up to 8 channels |
| PWM Channels | Up to 6 channels |
| Communication Interfaces | 1x CAN 2.0 A/B, 2x SCI (UART), 1x SPI, 1x I2C |
| On-chip Voltage Regulator | Yes (bandgap, generates internal 2.5 V) |
| PLL | Yes |
| Debug Interface | BDM (Background Debug Mode) |
| Type de montage | Surface Mount |
Configuration des broches de MC9S12C96CFAE557
| Broche 1 | VDD — External 5 V supply (2.97 V to 5.5 V) |
| Broche 2 | VSS — Ground |
| Broche 3 | XOSC — Crystal oscillator input |
| Broche 4 | XOSC2 — Crystal oscillator output |
| Broche 5 | RESET — Active-low reset input |
| Broche 6 | BKGD — Background Debug Mode (BDM) |
| Broche 7 | VDDR — Voltage regulator supply input |
| Broche 8 | VSSX1 — I/O ground |
| Broche 9 | PA0 — Port A bit 0 / PWM channel 0 |
| Broche 10 | PA1 — Port A bit 1 / PWM channel 1 |
| Broche 11 | PA2 — Port A bit 2 / PWM channel 2 |
| Broche 12 | PA3 — Port A bit 3 / PWM channel 3 |
| Broche 13 | PA4 — Port A bit 4 / PWM channel 4 |
| Broche 14 | PA5 — Port A bit 5 / PWM channel 5 |
| Broche 15 | PA6 — Port A bit 6 |
| Broche 16 | PA7 — Port A bit 7 |
| Broche 17 | VDDX — I/O supply (tied to VDDR) |
| Broche 18 | VSSX2 — I/O ground |
| Broche 19 | PB0 — Port B bit 0 / ADC channel 0 |
| Broche 20 | PB1 — Port B bit 1 / ADC channel 1 |
| Broche 21 | PB2 — Port B bit 2 / ADC channel 2 |
| Broche 22 | PB3 — Port B bit 3 / ADC channel 3 |
| Broche 23 | PB4 — Port B bit 4 / ADC channel 4 |
| Broche 24 | PB5 — Port B bit 5 / ADC channel 5 |
| Broche 25 | PB6 — Port B bit 6 / ADC channel 6 |
| Broche 26 | PB7 — Port B bit 7 / ADC channel 7 |
| Broche 27 | PC0 — Port C bit 0 / SCI RX0 |
| Broche 28 | PC1 — Port C bit 1 / SCI TX0 |
| Broche 29 | PC2 — Port C bit 2 / SCI RX1 |
| Broche 30 | PC3 — Port C bit 3 / SCI TX1 |
| Broche 31 | PC4 — Port C bit 4 / SPI SCK |
| Broche 32 | PC5 — Port C bit 5 / SPI MOSI |
| Broche 33 | PC6 — Port C bit 6 / SPI MISO |
| Broche 34 | PC7 — Port C bit 7 / SPI SS |
| Broche 35 | PD0 — Port D bit 0 / CAN TX |
| Broche 36 | PD1 — Port D bit 1 / CAN RX |
| Broche 37 | PD2 — Port D bit 2 / I2C SCL |
| Broche 38 | PD3 — Port D bit 3 / I2C SDA |
| Broche 39 | PD4 — Port D bit 4 |
| Broche 40 | PD5 — Port D bit 5 |
| Broche 41 | PD6 — Port D bit 6 |
| Broche 42 | PD7 — Port D bit 7 |
| Broche 43 | PE0 — Port E bit 0 |
| Broche 44 | PE1 — Port E bit 1 |
| Broche 45 | PE2 — Port E bit 2 |
| Broche 46 | PE3 — Port E bit 3 |
| Broche 47 | PE4 — Port E bit 4 |
| Broche 48 | PE5 — Port E bit 5 |
Applications typiques
MC9S12C96CFAE557 convient pour 6 applications: Automotive CAN Node Endpoints, Industrial CANopen / DeviceNet Slave Stations, LIN-to-CAN Bridge Modules, HVAC Blower and Fan Controllers, General-Purpose 16-bit Control Boards, Sensor Cluster Aggregators.
Automotive CAN Node Endpoints
The MC9S12C96CFAE557's on-chip CAN 2.0 A/B controller with hardware acceptance filtering, 96 KB Flash for J1939 stacks, and -40C to +125C automotive AEC-Q100 grade make it well suited for distributed CAN nodes such as body controllers, seat modules, mirror actuators and door-handle sensors. Per NXP S12C datasheet, the hardware CAN module offloads message filtering from the CPU12 core, leaving bandwidth for sensor sampling. Placed at each CAN endpoint with a TJA1050 or TJA1043 transceiver between the MCU TX/RX pins and the bus, the device replaces both an external MCU and CAN controller IC, reducing board area. Designers should verify the MCU's CAN TX/RX are 5 V tolerant only after the external transceiver; the bare MCU pins are not bus-rated.
Recommandé
Industrial CANopen / DeviceNet Slave Stations
With 96 KB Flash for CANopen or DeviceNet stack plus 4 KB RAM for object dictionary buffering, the MC9S12C96CFAE557 fits small industrial slaves such as valve manifolds, I/O blocks, sensor hubs and motor starters. The CPU12 core at 25 MHz handles the stack's scheduling and PDO/SDO processing with headroom, and the 10-bit ADC reads analog process variables directly. The part's 2.97 V to 5.5 V supply range allows operation from a 24 V industrial bus through a simple 5 V LDO. The integrated PWM channels also enable direct proportional-valve or heater drive without an external timer IC.
Recommandé
LIN-to-CAN Bridge Modules
The MC9S12C96CFAE557's dual SCI (UART) ports and single CAN module allow it to operate as a low-cost LIN-to-CAN gateway inside automotive body controllers. The 96 KB Flash holds both the LIN slave driver and the CAN transport layer; one SCI is reserved for LIN, the other SCI plus the CAN handle the car side. Per NXP S12C family reference manual, the SCI supports 13-bit break detection needed for LIN 2.x. The 48-LQFP's 31 GPIO lines expose enough pins for status LEDs and local diagnostic switches without external glue logic.
Recommandé
HVAC Blower and Fan Controllers
The MC9S12C96CFAE557 drives HVAC blowers and small fans through its on-chip PWM channels and 10-bit ADC for closed-loop tach feedback. With six PWM outputs available and 96 KB Flash for control algorithms, the part handles ramp-up, overshoot suppression and stall detection in software while keeping the BOM to a minimum. The 2.97 V to 5.5 V range covers both 5 V logic and 3.3 V sensor rails, and the -40C to +125C temperature grade supports under-hood mounting. The integrated CAN port lets the blower node report diagnostics to the body controller without a discrete CAN controller IC.
Recommandé
General-Purpose 16-bit Control Boards
For factory automation test fixtures, laboratory instruments and educational boards, the MC9S12C96CFAE557 provides a 16-bit CPU12 core, 96 KB Flash, BDM debug, and a rich peripheral mix (CAN, SCI, SPI, I2C, PWM, ADC) in a hobbyist-friendly 48-LQFP. The BDM interface allows non-intrusive single-wire debug, and the 0.5 mm pitch 48-LQFP is hand-solderable with care. Designers typically pair the MCU with a 4-16 MHz crystal and one decoupling capacitor per VDD pin; total external component count is low.
Recommandé
Sensor Cluster Aggregators
The MC9S12C96CFAE557's 10-bit ADC (up to 8 channels) and dual SCI ports let it aggregate several analog and serial sensors (temperature, pressure, flow) and re-broadcast them over CAN to a central body controller. With 96 KB Flash holding the sensor conditioning and CAN transport code, and 4 KB RAM buffering raw samples, the device fits automotive sensor cluster designs behind the bumper or in the engine bay. The part's wide 5 V tolerance simplifies interfacing to legacy 5 V automotive sensors without level shifters.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12C96CFAE557 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12C96CFAE | MC9S12C128VFAE | MC9S12C64CFAE | MC9S12GC96MFUE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 64-QFP (10x10 mm) - different |
| Core | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) |
| Program Memory (Flash) | 96 KB | 96 KB | 128 KB | 64 KB | 96 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Maximum Clock Frequency | 25 MHz (50 MHz with PLL) | 25 MHz (50 MHz with PLL) | 25 MHz (50 MHz with PLL) | 25 MHz (50 MHz with PLL) | 25 MHz (50 MHz with PLL) |
| CAN 2.0 Modules | 1 | 1 | 1 | 1 | 1 |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Smaller 48-LQFP footprint vs D-family 80-QFP parts (vs MC9S12D64MFUER)
- More Flash than the C64 derivative (vs MC9S12C64CFAE)
- Field-upgradeable Flash with security (vs MC9S12C96CFAE (tray variant))
Notes de conception
Place a 100 nF ceramic decoupling capacitor on each of the four VDD/VSS pairs and a bulk 4.7 uF tantalum on VDDR. The on-chip bandgap regulator derives internal 2.5 V from VDDR; bypass that pin with 100 nF ceramic to VSSX. Per the NXP S12C family reference manual, the regulator requires at least 4.7 uF of output capacitance to remain stable across the -40C to +125C range.
Keep the XOSC/XOSC2 traces short (under 5 mm) and surround them with a ground pour to avoid coupling noise into the PLL reference. Place the crystal within 10 mm of the MCU. Route RESET and BKGD away from PWM edges to avoid spurious debug entry. The CAN TX/RX traces should be a matched 100 ohm differential pair to the external transceiver (TJA1050) for clean signalling.
Do not connect MCU CAN TX/RX directly to a CAN bus cable - these pins are not bus-rated. Always use an external transceiver (TJA1050, TJA1043). Avoid using POR (Power-On Reset) pins as GPIO, since driving them low can hold the part in reset. When using the BDM interface, ensure the BKGD pin is not pulled low at power-up or the part will enter debug mode unintentionally.
The 10-bit ADC's reference is internal; for applications requiring better than 8 effective bits, add external RC filtering on the analog inputs and decouple VDDX/VSSX near the analog pins. Sample-and-hold acquisition time is configurable; use at least 8 ADC bus cycles for sources with > 10 kohm impedance. Avoid switching high-current PWM outputs on adjacent pins during ADC sampling to limit crosstalk.
Informations de conformité
RoHS and REACH compliance not directly stated in the verified web data; AEC-Q100 grade inferred from the -40C to +125C automotive temperature range mentioned by NXP and distributors. Lead-free status confirmed by NXP part detail page.
