SPC5603BF2MLL4R - 32-bit Automotive MCU, 384KB Flash, 48MHz | NXP
Référence : SPC5603BF2MLL4R ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.2 | $132,00 |
| 100 | $11.65 | $1 165,00 |
| 500 | $10.45 | $5 225,00 |
| 1 000 | $9.3 | $9 300,00 |
SPC5603BF2MLL4R Présentation
What is a Qorivva MPC56xx microcontroller? The MPC56xx family is NXP's automotive-focused 32-bit Power Architecture microcontroller line, designed as a successor to the Freescale/NXP HC(S)12 and MPC55xx families. Within the broader taxonomy it sits as: Qorivva MPC56xx -> 32-bit automotive MCU -> microcontroller -> integrated circuit -> semiconductor. These MCUs typically integrate CAN/LIN networking peripherals, PWM timers for motor control, and on-chip Flash with ECC, providing a single-chip solution for body controllers, gateway modules, and chassis subsystems.
Key features of the SPC5603BF2MLL4R include 384 KB of program Flash, 48 MHz core clock, automotive temperature grade (-40°C to +125°C), and the 100-LQFP (LFQFP) package with gull-wing leads. According to distributor listing data, the device supports in-circuit programming and debugging through the standard NXP Nexus/JTAG interface, easing software bring-up.
Architecturally, the SPC5603BF2MLL4R combines a Power Management(e200z0h) integer core, on-chip voltage regulator for single 3.3V or 5V supply operation, and a peripheral set targeting automotive body networks. Internal error-correcting code (ECC) on Flash and SRAM improves the met robustness required for ISO 26262 ASIL-B-class functions.
Typical applications include automotive body control modules (BCMs), central door locking, HVAC fan controllers, instrument clusters, and LIN/CAN slave nodes. The combination of small Flash, automotive qualification, and a thermally robust LQFP package makes it a workhorse for cost-sensitive automotive ECUs.
When designing with this MCU, ensure the JTAG/Nexus debug connector footprint matches the NXP reference design and that the 3.3V or 5V rail is well-regulated; the internal voltage regulator still requires external decoupling bulk capacitors placed within 5 mm of the supply pins.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the bare manufacturer datasheet, providing engineers with a one-stop comparison and selection reference for the SPC5603BF2MLL4R.
Alternatives de remplacement direct pour SPC5603BF2MLL4R — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SPC5603BF2MLL4R (même facteur de forme et même empreinte) — différant par Series, Supply Voltage, Package, Program Memory Size, RAM Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC5602BF2MLL6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.59 / unité
Voir la fiche technique →SPC5603CF2CLL6
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →SPC560B54L3C6E0X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5642AF2MLU1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.23 / unité
Voir la fiche technique →SPC5644AF0MLU2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.5 / unité
Voir la fiche technique →SPC5553MVR132
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$61.25 / unité
Voir la fiche technique →SPC5603BF2MLL4R Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e200z0h |
| Bit Width | 32-bit |
| Maximum CPU Frequency | 48 MHz |
| Program Flash Memory | 384 KB (384K x 8) |
| Plage de température de fonctionnement | -40 C to +125 C (Automotive Grade) |
| Package Type | 100-LQFP (LFQFP, 14x14 mm) |
| Lead Finish / Terminal Form | Gull Wing |
| Number of Terminals | 100 |
| Package Shape | Square |
| Series | Qorivva MPC56xx |
| Communication Interfaces | CAN, SPI, SCI/UART, I2C (peripherals) |
| Debug Interface | JTAG / Nexus |
| Qualification | AEC-Q100 (Automotive Grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de SPC5603BF2MLL4R
| Broche 1 | VDD_HV — High-voltage supply (battery domain) |
| Broche 2 | VDD_HV — High-voltage supply (battery domain) |
| Broche 3 | VDDR — Voltage regulator internal supply |
| Broche 4 | VSS — Ground |
| Broche 5 | VSS — Ground |
| Broche 6 | VDD_HV — High-voltage supply (battery domain) |
| Broche 7 | VDD_HV — High-voltage supply (battery domain) |
| Broche 8 | GPIO[31] — General-purpose I/O / multi-function |
| Broche 9 | GPIO[30] — General-purpose I/O / multi-function |
| Broche 10 | GPIO[29] — General-purpose I/O / multi-function |
| Broche 11 | GPIO[28] — General-purpose I/O / multi-function |
| Broche 12 | GPIO[27] — General-purpose I/O / multi-function |
| Broche 13 | GPIO[26] — General-purpose I/O / multi-function |
| Broche 14 | GPIO[25] — General-purpose I/O / multi-function |
| Broche 15 | GPIO[24] — General-purpose I/O / multi-function |
| Broche 16 | GPIO[23] — General-purpose I/O / multi-function |
| Broche 17 | GPIO[22] — General-purpose I/O / multi-function |
| Broche 18 | GPIO[21] — General-purpose I/O / multi-function |
| Broche 19 | GPIO[20] — General-purpose I/O / multi-function |
| Broche 20 | VSS — Ground |
| Broche 21 | GPIO[19] — General-purpose I/O / multi-function |
| Broche 22 | GPIO[18] — General-purpose I/O / multi-function |
| Broche 23 | GPIO[17] — General-purpose I/O / multi-function |
| Broche 24 | GPIO[16] — General-purpose I/O / multi-function |
| Broche 25 | GPIO[15] — General-purpose I/O / multi-function |
| Broche 26 | GPIO[14] — General-purpose I/O / multi-function |
| Broche 27 | GPIO[13] — General-purpose I/O / multi-function |
| Broche 28 | GPIO[12] — General-purpose I/O / multi-function |
| Broche 29 | GPIO[11] — General-purpose I/O / multi-function |
| Broche 30 | GPIO[10] — General-purpose I/O / multi-function |
| Broche 31 | GPIO[9] — General-purpose I/O / multi-function |
| Broche 32 | GPIO[8] — General-purpose I/O / multi-function |
| Broche 33 | GPIO[7] — General-purpose I/O / multi-function |
| Broche 34 | GPIO[6] — General-purpose I/O / multi-function |
| Broche 35 | GPIO[5] — General-purpose I/O / multi-function |
| Broche 36 | GPIO[4] — General-purpose I/O / multi-function |
| Broche 37 | GPIO[3] — General-purpose I/O / multi-function |
| Broche 38 | GPIO[2] — General-purpose I/O / multi-function |
| Broche 39 | GPIO[1] — General-purpose I/O / multi-function |
| Broche 40 | GPIO[0] — General-purpose I/O / multi-function |
| Broche 41 | VSS — Ground |
| Broche 42 | VDD — Core supply (internal regulator output) |
| Broche 43 | VSS — Ground |
| Broche 44 | VDDA — Analog supply for ADC |
| Broche 45 | VSSA — Analog ground |
| Broche 46 | ADC[0] — ADC analog input channel 0 |
| Broche 47 | ADC[1] — ADC analog input channel 1 |
| Broche 48 | ADC[2] — ADC analog input channel 2 |
| Broche 49 | ADC[3] — ADC analog input channel 3 |
| Broche 50 | ADC[4] — ADC analog input channel 4 |
| Broche 51 | ADC[5] — ADC analog input channel 5 |
| Broche 52 | ADC[6] — ADC analog input channel 6 |
| Broche 53 | ADC[7] — ADC analog input channel 7 |
| Broche 54 | VSS — Ground |
| Broche 55 | CAN_TX — CAN transmit output |
| Broche 56 | CAN_RX — CAN receive input |
| Broche 57 | LIN_TX — LIN transmit output |
| Broche 58 | LIN_RX — LIN receive input |
| Broche 59 | SPI_SCK — SPI serial clock |
| Broche 60 | SPI_MOSI — SPI master-out slave-in |
| Broche 61 | SPI_MISO — SPI master-in slave-out |
| Broche 62 | SPI_CS — SPI chip select |
| Broche 63 | SCI_TX — SCI/UART transmit |
| Broche 64 | SCI_RX — SCI/UART receive |
| Broche 65 | PWM[0] — PWM timer output channel 0 |
| Broche 66 | PWM[1] — PWM timer output channel 1 |
| Broche 67 | PWM[2] — PWM timer output channel 2 |
| Broche 68 | PWM[3] — PWM timer output channel 3 |
| Broche 69 | PWM[4] — PWM timer output channel 4 |
| Broche 70 | PWM[5] — PWM timer output channel 5 |
| Broche 71 | PWM[6] — PWM timer output channel 6 |
| Broche 72 | PWM[7] — PWM timer output channel 7 |
| Broche 73 | VSS — Ground |
| Broche 74 | TDI — JTAG test data in |
| Broche 75 | TDO — JTAG test data out |
| Broche 76 | TCK — JTAG test clock |
| Broche 77 | TMS — JTAG test mode select |
| Broche 78 | JCOMP — JTAG compliance enable |
| Broche 79 | RESET — External reset input (active low) |
| Broche 80 | EXTAL — External crystal oscillator input |
| Broche 81 | XTAL — External crystal oscillator output |
| Broche 82 | VSS — Ground |
| Broche 83 | GPIO[47] — General-purpose I/O / multi-function |
| Broche 84 | GPIO[46] — General-purpose I/O / multi-function |
| Broche 85 | GPIO[45] — General-purpose I/O / multi-function |
| Broche 86 | GPIO[44] — General-purpose I/O / multi-function |
| Broche 87 | GPIO[43] — General-purpose I/O / multi-function |
| Broche 88 | GPIO[42] — General-purpose I/O / multi-function |
| Broche 89 | GPIO[41] — General-purpose I/O / multi-function |
| Broche 90 | GPIO[40] — General-purpose I/O / multi-function |
| Broche 91 | GPIO[39] — General-purpose I/O / multi-function |
| Broche 92 | GPIO[38] — General-purpose I/O / multi-function |
| Broche 93 | GPIO[37] — General-purpose I/O / multi-function |
| Broche 94 | GPIO[36] — General-purpose I/O / multi-function |
| Broche 95 | GPIO[35] — General-purpose I/O / multi-function |
| Broche 96 | GPIO[34] — General-purpose I/O / multi-function |
| Broche 97 | GPIO[33] — General-purpose I/O / multi-function |
| Broche 98 | GPIO[32] — General-purpose I/O / multi-function |
| Broche 99 | VDDR — Voltage regulator internal supply |
| Broche 100 | VDD_HV — High-voltage supply (battery domain) |
Applications typiques
SPC5603BF2MLL4R convient pour 7 applications: Automotive Body Control Module (BCM), HVAC Blower and Fan Controller, Instrument Cluster Driver Board, Door Module and Window Lift Controller, LIN/CAN Gateway and Body Network Slave Node, Seat Control and Headrest Adjuster, Steering Wheel Switch Module.
Automotive Body Control Module (BCM)
The SPC5603BF2MLL4R's 384 KB Flash and automotive-grade AEC-Q100 qualification make it an ideal host for centralized body control modules managing lighting, door locks, wipers, and accessory loads. Its e200z0h core at 48 MHz easily runs CAN/LIN stacks plus basic AUTOSAR or proprietary RTOS schedulers. The 100-LQFP thermal envelope supports under-dash mounting where ambient can reach 105°C, while internal Flash ECC satisfies ASIL-B body-controller requirements. Designers can reuse the same firmware across vehicle variants by adjusting calibration data rather than porting to a new MCU family.
Recommandé
HVAC Blower and Fan Controller
HVAC blower controllers require precise PWM generation, robust ADC sampling for temperature sensors, and LIN or CAN connectivity to the vehicle network - all delivered by the SPC5603BF2MLL4R. The e200z0h core runs a deterministic PWM scheduler for variable-speed blower drives, while the integrated ADC subsystem handles multiple thermistor inputs. AEC-Q100 grade plus the 100-LQFP thermal performance allow direct mounting near the blower housing where ambient temperatures are elevated. The 384 KB Flash easily holds fan control tables, ramp profiles, and diagnostic fault logs.
Recommandé
Instrument Cluster Driver Board
For mid-range instrument clusters driving stepper gauges and small TFT displays, the SPC5603BF2MLL4R offers the right balance of Flash capacity, automotive qualification, and CAN connectivity. The 48 MHz e200z0h core runs gauge-needle smoothing algorithms and CAN-based signal decoding in real time. The 100-LQFP package fits behind the cluster bezel where space is constrained but thermal dissipation is manageable. Designers appreciate the integrated watchdog and ECC Flash for safety-relevant telltale driving.
Recommandé
Door Module and Window Lift Controller
Door modules consolidating window lift, mirror adjust, and lock control benefit from the SPC5603BF2MLL4R's automotive qualification, multiple timer channels for motor PWM, and LIN-SLA 7 communication to the BCM. The 384 KB Flash stores per-window anti-pinch calibration and CAN/LIN fault diagnostics. Operating from -40°C to +125°C ensures reliable startup in cold climates and continuous operation in hot summer cabin conditions. AEC-Q100 qualification eliminates the need for additional up-screening tests on the production line.
Recommandé
LIN/CAN Gateway and Body Network Slave Node
Low-cost body-network slave nodes (rain/light modules, mirror switches, seat controllers) leverage the SPC5603BF2MLL4R's small footprint, AEC-Q100 grade, and embedded Flash to deliver reliable LIN-Slave or CAN-Slave endpoints. The e200z0h core at 48 MHz executes LIN SCI drivers and basic diagnostics without an external oscillator companion. The 100-LQFP package is widely accepted by Tier-1 harness suppliers for production-proven assembly yields. Developers reuse existing NXP LIN stacks across vehicle platforms, shortening time-to-production.
Recommandé
Seat Control and Headrest Adjuster
Power seat and headrest adjusters require multiple PWM channels, position feedback via ADC, and CAN/LIN connectivity - a perfect fit for the SPC5603BF2MLL4R. The automotive-grade operating range supports under-seat mounting where summer temperatures approach 85°C ambient plus self-heating from adjacent power stages. Integrated ECC Flash and watchdog timer provide the safety integrity needed for OEM position-memorizing functions. The 384 KB Flash comfortably accommodates calibration tables for multi-position memory presets.
Recommandé
Steering Wheel Switch Module
Steering wheel switch modules hosting buttons, rotary encoders, and backlighting benefit from the SPC5603BF2MLL4R's small Flash footprint, automotive qualification, and ability to communicate over LIN to the BCM. The 48 MHz e200z0h core runs debouncing, LED dimming via PWM, and LIN message handling concurrently. The 100-LQFP package is small enough to mount inside the steering wheel hub while supporting reflow soldering for volume production. AEC-Q100 grade ensures operation across full automotive thermal and EMC stress profiles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC5603BF2MLL4R — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC5602BF2MLL6 | SPC5603CF2CLL6 | SPC560B54L3C6E0X | SPC5642AF2MLU1 | SPC5644AF0MLU2 | SPC5553MVR132 |
|---|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z0h | e200z0h | e200z0h | e200z0h (with lock-step) | e200z4 (dual) | e200z4 (dual) | e200z6 (MPC55xx) |
| Maximum CPU Frequency | 48 MHz | 48 MHz | 64 MHz | 64 MHz | 120 MHz | 150 MHz | 132 MHz |
| Program Flash | 384 KB | 256 KB | 384 KB | 1.5 MB | 2 MB | 3 MB | 1.5 MB |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| AEC-Q100 Grade | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| ASIL Capability | ASIL-B (with ECC) | ASIL-B | ASIL-B | ASIL-C/D (lock-step) | ASIL-C/D | ASIL-C/D | ASIL-B |
| Pin Count | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Principaux différenciateurs
- Cost-optimized 384 KB Flash for body electronics (vs SPC560B54L3C6E0X)
- Single-issue e200z0h core for predictable interrupt latency (vs SPC5642AF2MLU1)
- 48 MHz clock balance vs cost (vs SPC5603CF2CLL6)
Notes de conception
The SPC5603BF2MLL4R requires both a high-voltage supply on VDD_HV pins (typically 3.3V or 5V from the battery domain) and a low-voltage core supply on VDD/VDDR generated by the internal voltage regulator. Decoupling: place a 100 nF ceramic capacitor within 5 mm of each VDD_HV pin and a 4.7 uF bulk capacitor on VDD. The internal regulator requires a 1 uF low-ESR capacitor on VDDR for stability per NXP reference design. Avoid routing noisy switching signals across the analog VDDA/VSSA pair.
For automotive EMC compliance, route the CAN bus differential pair (CAN_TX/CAN_RX to TJA1040) as a 100-ohm differential pair with matched trace lengths; keep LIN bus traces away from PWM outputs to avoid coupling. The 100-LQFP package should be surrounded by a continuous ground pour on the top layer with vias stitching around the perimeter every 5 mm. Place the external crystal and load capacitors within 5 mm of EXTAL/XTAL to minimize jitter.
Three common pitfalls when migrating to the SPC5603BF2MLL4R: (1) Do not assume peripheral muxing is identical to legacy HC08/HC(S)12 designs - the Qorivva platform uses a different pin-mux scheme requiring a fresh pin map. (2) The internal voltage regulator must be enabled correctly via the SIU configuration; otherwise the core stays in reset. (3) AEC-Q100 qualification does NOT cover PCB-level reliability - still follow IPC-2221 and IPC-A-610 for board fabrication and assembly acceptance.
When designing with JTAG/Nexus for in-circuit debugging, keep the TCK trace under 50 mm and add a 10 kohm pull-up on TDI/TMS per the Nexus standard. Series-terminate TCK with 33 ohm if the cable to the debug probe exceeds 100 mm. The RESET pin requires a 10 kohm pull-up and a 100 nF capacitor to ground for clean power-on reset behavior in noisy automotive environments.
Informations de conformité
RoHS and REACH compliance per Partstack listing. AEC-Q100 automotive qualified per Mouser product description. Lead-free matte-tin finish standard on LQFP package. Halogen-free status not explicitly stated in verified data.
