SPC5602BF2MLL6 - 32-bit 256KB Flash 64MHz MCU | NXP
Référence : SPC5602BF2MLL6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.88 | $6,88 |
| 10 | $6.54 | $65,40 |
| 100 | $6.19 | $619,00 |
| 500 | $5.88 | $2 940,00 |
| 1 000 | $5.59 | $5 590,00 |
SPC5602BF2MLL6 Présentation
A microcontroller (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals such as timers, communication interfaces, and I/O ports into one chip. Within the broader hierarchy of semiconductors, MCUs belong to the embedded processor category, sitting below application processors but above simple logic ICs in system complexity. The SPC5602BF2MLL6 targets the automotive and industrial embedded-control segment of this taxonomy.
Key features of the SPC5602BF2MLL6 include the 32-bit Power Architecture e200z0h CPU core clocked at 64 MHz, 256KB on-chip flash for program storage, and automotive-grade temperature performance from -40C to +125C. The device integrates CANbus, I2C, LINbus, SCI, and SPI connectivity interfaces, along with DMA, POR, PWM, and watchdog timer (WDT) peripherals, providing 79 general-purpose I/O lines.
Architecturally, the e200z0h core is a Power Architecture Book E compliant processor optimized for cost-sensitive real-time control. The MPC560xB family was specifically designed for automotive body electronics such as lighting modules, door and seat control, window lift, and HVAC controllers, where CAN and LIN network connectivity, deterministic interrupt response, and wide temperature operation are mandatory.
Typical applications include automotive body control modules, gateway and sub-network nodes using CAN and LIN, industrial automation controllers requiring robust 32-bit processing, and motor control or actuator drive systems using the integrated PWM peripherals.
Design consideration: confirm the supply voltage configuration (the MPC56xx family in this configuration operates from 3.3V/5V I/O domains) and verify flash programming support through the NXP SPC5 software ecosystem early in development, since toolchain choice affects time-to-market.
This page synthesizes distributor pricing, drop-in alternative analysis, design notes, and application guidance not found in a single manufacturer datasheet, giving engineers a complete selection view of the SPC5602BF2MLL6.
Alternatives de remplacement direct pour SPC5602BF2MLL6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SPC5602BF2MLL6 (même facteur de forme et même empreinte) — différant par Program Memory Size, Series, Package, Connectivity, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC5602BK0VLQ4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5602BK0CLQ4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5643LFF2MLQ1
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →SPC5602BF2MLL6 Valeurs maximales et caractéristiques électriques
| Core Processor | e200z0h (Power Architecture) |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Program Memory Size | 256KB (256K x 8) |
| Program Memory Type | FLASH |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 79 |
| Tension d'alimentation | 3.3 V / 5 V |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 100-LQFP (14x14 mm) |
| Package Code | LFQFP |
| Terminal Form | Gull Wing |
| Type de montage | Surface Mount |
| Series | MPC56xx Qorivva |
| Part Status | Active |
| Qualification Grade | Automotive Grade |
Guide de configuration des broches du SPC5602BF2MLL6 lfqfp
Configuration des broches du SPC5602BF2MLL6 (boîtier lfqfp). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour SPC5602BF2MLL6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
SPC5602BF2MLL6 convient pour 6 applications: Automotive Body Control Modules, Lighting Control Modules, Door and Seat Control Units, HVAC Control Systems, Industrial Automation Controllers, Gateway and Network Interface Nodes.
Automotive Body Control Modules
The SPC5602BF2MLL6 is purpose-built for automotive body control modules (BCMs) that centralize lighting, door, wiper, and seat functions. Its e200z0h 64 MHz core provides deterministic real-time response for switch debouncing and load control, while 79 GPIO lines deliver the channel density a BCM demands. The CANbus and LINbus interfaces connect the module to the vehicle network, and the -40C to +125C automotive temperature grade ensures reliability across the under-dash and engine-bay-adjacent environments. Typical designs use PWM outputs for LED interior lighting dimming and WDT supervision for functional safety housekeeping.
Recommandé
Lighting Control Modules
Exterior and interior lighting modules benefit directly from the SPC5602BF2MLL6's integrated PWM peripherals and high GPIO count. The 64 MHz e200z0h core executes lamp diagnosis, short-circuit detection, and PWM dimming loops with cycle times suitable for flicker-free LED operation. According to NXP family documentation, the MPC560xB series was created specifically for body electronics including lighting. The LINbus interface links the module to the BCM over a low-cost single-wire network, while the 256KB flash stores calibration tables for multiple lamp variants on one PCB platform.
Recommandé
Door and Seat Control Units
Door modules controlling window lift, mirror adjustment, and central locking use the SPC5602BF2MLL6 for its balance of 32-bit processing headroom and cost efficiency. The 79 I/O pins accommodate Hall sensors, switch matrices, and motor H-bridge control signals, while DMA offloads periodic sensor sampling from the e200z0h core. The CANbus interface routes commands from the BCM, and the integrated watchdog timer provides the supervision expected in safety-relevant pinch-protection window algorithms. The 14x14 mm 100-LQFP package fits the compact PCBs typical of door harness interfaces.
Recommandé
HVAC Control Systems
Automotive heating, ventilation, and air conditioning controllers use the SPC5602BF2MLL6 to run blower motor PWM control, blend-door actuator positioning, and temperature sensor acquisition simultaneously. The 64 MHz core handles PID control loops with margin, while the SPI and I2C interfaces connect to quadrant sensor ICs and display drivers. The 256KB flash holds multiple trim-level calibration sets, and the automotive -40C to +125C rating covers cabin electronics environments. LIN connectivity supports integration into zone-based climate architectures without additional network controller chips.
Recommandé
Industrial Automation Controllers
Beyond automotive, the MPC560xB family as documented by NXP also addresses industrial applications. The SPC5602BF2MLL6 serves as a compact 32-bit control processor in factory automation nodes, pump and fan controllers, and distributed I/O units. Its CANbus interface is widely used in industrial fieldbus systems, SPI links to ADCs and memory, and the WDT plus POR peripherals improve uptime in unattended equipment. The 100-pin LQFP provides enough I/O for sensor and actuator clusters while remaining hand-assemblable for prototyping, and the wide -40C to +125C temperature range suits harsh enclosures.
Recommandé
Gateway and Network Interface Nodes
Sub-network gateway nodes that bridge a high-speed CAN backbone to LIN-based actuator clusters use the SPC5602BF2MLL6's dual-protocol connectivity. The e200z0h core at 64 MHz executes message filtering, translation, and diagnostic (UDS-style) handlers within bounded latency, and DMA supports buffered CAN message transfer without core loading. With 256KB flash, the node stores protocol stacks plus firmware-update capability, and the 79 GPIO lines handle local wake-up and I/O expansion. The automotive grade rating keeps the node compliant with vehicle qualification flows.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC5602BF2MLL6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC5602BK0VLQ4 | SPC5602BK0CLQ4 | SPC5643LFF2MLQ1 |
|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP - same | 100-LQFP - same | 100-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z0h (Power Architecture) 32-bit | e200z0h (Power Architecture) 32-bit | e200z0h (Power Architecture) 32-bit | e200z4xx family core (higher tier) |
| Qualification | Automotive Grade | Automotive Grade | Automotive Grade | Automotive Grade (Q1 suffix) |
Principaux différenciateurs
- Larger flash option in same footprint (vs SPC5602BK0VLQ4)
- True pin-compatible family substitution path (vs SPC5602BK0CLQ4)
- Cost-efficient entry point vs higher-tier SPC56 family (vs SPC5643LFF2MLQ1)
Notes de conception
The SPC5602BF2MLL6 requires a multi-rail power scheme typical of the MPC560xB family: a core supply and separate I/O supply (3.3V/5V domains per distributor parametric data). Use a system basis chip or dedicated power management IC to guarantee correct power-up sequencing and to generate the MCU reset. Decouple each supply pin pair with 100 nF ceramics placed within 2 mm of the pins, plus bulk capacitance near the regulator. Verify the exact rail voltages and sequencing order in the manufacturer datasheet reference design before board sign-off.
The 100-LQFP (14x14 mm) gull-wing footprint needs standard 0.5 mm-class land pattern design per the manufacturer package outline. Route the CAN and LIN transceiver traces as short as practical and place the transceivers (e.g., TJA1051, TJA1021) close to the MCU pins. Provide a solid ground plane under the MCU and crystal; keep the oscillator loop compact with guard ground. Unused GPIO can be left unconnected but should be configured as inputs with pull in firmware to avoid floating-node EMI issues.
Common pitfalls with the SPC5602BF2MLL6: (1) suffix-code confusion - variants such as SPC5602BK0VLQ4 differ in flash density and packaging; always decode the full ordering code against NXP ordering information before BOM substitution. (2) Firmware portability - code built for ARM Cortex-M MCUs will not run on the Power Architecture e200z0h core; use the NXP SPC5 studio ecosystem. (3) Automotive qualification - do not replace with industrial-grade MCUs in vehicle programs without requalification. Verify supply voltage settings per the datasheet.
Informations de conformité
Automotive Grade qualification per distributor listings; LFQFP package code indicates lead-free finish. Specific RoHS/REACH certificates should be pulled from the NXP product page compliance documents.