TLE9166EQXUMA1 - 6 Half-Bridge SPI Motor Driver | Infineon
Référence : TLE9166EQXUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.23 | $3,23 |
| 10 | $3.05 | $30,50 |
| 100 | $2.71 | $271,00 |
| 500 | $2.42 | $1 210,00 |
| 1 000 | $2.15 | $2 150,00 |
TLE9166EQXUMA1 Présentation
A half-bridge motor driver is a type of motor driver IC that uses multiple half-bridge output stages to switch current through motor windings in response to logic-level control signals. In the broader power management hierarchy, half-bridge drivers belong to the motor driver category within power management ICs, sitting alongside gate drivers, H-bridges, and full motor-controller SoCs that integrate FOC algorithms.
Key differentiating features include six integrated half-bridges that can be configured as three full H-bridges, an SPI bus for command and diagnostic readback, integrated protection functions such as over-current, over-temperature, and under-voltage lockout, and a charge-pump (CP pin) that supplies the high-side gate drive. The PG-TSDSO-32-1 package exposes VS (battery supply), VDD (logic supply), the CP charge pump input, six half-bridge outputs, and SPI pins on a single IC.
The TLE9166EQXUMA1 uses an NMOS half-bridge architecture with charge-pump-generated high-side gate drive, allowing low RDS(on) switching without the cost and footprint of P-channel devices. The integrated 25 kHz PWM engine handles chopping and freewheeling, while the SPI interface enables per-bridge configuration, current-limit setpoints, and fault-flag readback for ECU diagnostics.
Typical applications include automotive door-lock actuators, power-window and power-mirror motors, HVAC damper and blower controls, and other body-electronics brushed DC loads. The wide VS range and integrated protections suit it to 12 V automotive electrical environments subject to load-dump and jump-start transients.
When designing with this device, ensure VS is decoupled with a low-ESR bulk capacitor placed close to the IC, follow Infineon's PCB layout guidance for the exposed pad, and configure the SPI watchdog to meet your application's fault-recovery timing.
This page synthesizes distributor pricing, drop-in alternatives from the same Infineon half-bridge family, and design notes that extend beyond the manufacturer datasheet.
Alternatives de remplacement direct pour TLE9166EQXUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TLE9166EQXUMA1 (même facteur de forme et même empreinte) — différant par Package, Output Configuration, Product Type, Operating Temperature Range, Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TLE94104EPXUMA1
✅ Remplacement direct✓ En stock
$1.7 / unité
Voir la fiche technique →TLE94110ESXUMA1
✅ Remplacement direct✓ En stock
$2.45 / unité
Voir la fiche technique →TLE92633BQXXUMA2
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →TLE9180D32QKXUMA1
✅ Remplacement direct✓ En stock
$4.71 / unité
Voir la fiche technique →TLE82422LXUMA2
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →TLE95613QXXUMA1
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →TLD5097EPXUMA1
✅ Remplacement direct✓ En stock
$1.9 / unité
Voir la fiche technique →TLE9166EQXUMA1 Valeurs maximales et caractéristiques électriques
| Product Type | Multi Half-Bridge Motor Driver IC |
| Number of Half-Bridges | 6 |
| Configuration de sortie | NMOS, half-bridge |
| Interface | SPI |
| PWM Frequency | 25 kHz (engine) |
| Charge Pump | Integrated CP pin for high-side gate drive |
| Boîtier | PG-TSDSO-32-1 |
| Type de montage | Surface Mount |
| Nombre de broches | 32 |
| Integrated Protection | Over-current, over-temperature, under-voltage lockout (per datasheet) |
| Target Application | Automotive door lock, body electronics brushed DC motors |
| Statut RoHS | Compliant |
Configuration des broches de TLE9166EQXUMA1
| Broche 1 | VS — Battery supply for half-bridges |
| Broche 2 | OUT1 — Half-bridge output 1 |
| Broche 3 | OUT1 — Half-bridge output 1 (complementary switch node) |
| Broche 4 | OUT2 — Half-bridge output 2 |
| Broche 5 | OUT2 — Half-bridge output 2 (complementary switch node) |
| Broche 6 | OUT3 — Half-bridge output 3 |
| Broche 7 | OUT3 — Half-bridge output 3 (complementary switch node) |
| Broche 8 | GND — Ground |
| Broche 9 | VDD — Logic supply for SPI and I/O buffers |
| Broche 10 | CP — Charge pump input for high-side gate drive |
| Broche 11 | CSN — SPI chip select (active low) |
| Broche 12 | CLK — SPI clock |
| Broche 13 | SDI — SPI data input |
| Broche 14 | SDO — SPI data output |
| Broche 15 | OUT4 — Half-bridge output 4 |
| Broche 16 | OUT4 — Half-bridge output 4 (complementary switch node) |
| Broche 17 | OUT5 — Half-bridge output 5 |
| Broche 18 | OUT5 — Half-bridge output 5 (complementary switch node) |
| Broche 19 | OUT6 — Half-bridge output 6 |
| Broche 20 | OUT6 — Half-bridge output 6 (complementary switch node) |
| Broche 21 | GND — Ground |
| Broche 22 | VS — Battery supply for half-bridges |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | WK — Wake input |
| Broche 27 | INT — Interrupt output to MCU |
| Broche 28 | RST — Reset input |
| Broche 29 | TEST — Test mode pin (per datasheet) |
| Broche 30 | GND — Ground |
| Broche 31 | NC — Not connected (per datasheet) |
| Broche 32 | EP — Exposed pad / thermal pad - connect to GND |
Applications typiques
TLE9166EQXUMA1 convient pour 6 applications: Automotive Door Lock Actuator, Power Window and Power Mirror Motors, HVAC Damper and Blower Motors, Body Control Module (BCM) Brushed Loads, Industrial Brushed DC Motor Control, Robotics and Small AGV Drive Wheels.
Automotive Door Lock Actuator
The TLE9166EQXUMA1's 6 half-bridges can be wired as three full H-bridges, directly driving the lock / unlock motors of 3-door or 4-door body controllers in a single IC. The 25 kHz PWM engine provides silent chopping outside the audible band, while SPI diagnostics return per-motor fault flags to the BCM for OBD-II compliance. Integrated OCP and OTP protect the actuator wiring from stall-current damage, replacing discrete H-bridges and reducing PCB area by roughly 40%.
Recommandé
Power Window and Power Mirror Motors
Each brushed DC window or mirror motor requires a full H-bridge; the TLE9166EQXUMA1 drives 3 such motors from one IC, supporting anti-pinch PWM chopping at 25 kHz with SPI-programmable current limit. The integrated UVLO and over-temperature shutdown protect against stalled-motor conditions common in winter and door-strap misuse. Infineon's automotive-grade qualification supports PPAP and AEC-Q documentation requirements for window-module ECUs.
Recommandé
HVAC Damper and Blower Motors
The TLE9166EQXUMA1 drives HVAC mode-door, recirculation, and blend-door actuators as 3 brushed DC motors from one IC, with SPI control matching typical HVAC control module ECUs. The 25 kHz PWM frequency avoids audible whine, while integrated protections handle stall conditions when damper linkages jam. The PG-TSDSO-32-1 footprint keeps the HVAC module compact and supports reflow-compatible automotive assembly.
Recommandé
Body Control Module (BCM) Brushed Loads
In BCM designs, the TLE9166EQXUMA1 consolidates multiple brushed DC loads - such as fuel-flap actuators, tailgate release, and seat-adjustment motors - behind a single SPI-controlled IC. SPI diagnostics allow the BCM to log per-load fault codes for dealer service tools, while the integrated charge pump eliminates external high-side drive components. The PG-TSDSO-32-1 footprint supports standard BCM PCB stack-ups.
Recommandé
Industrial Brushed DC Motor Control
Outside automotive, the TLE9166EQXUMA1 drives 3 industrial brushed DC motors in conveyor diverters, small valve actuators, and printer paper-feed modules. The SPI bus enables deterministic multi-axis control from an MCU, while the 25 kHz PWM engine keeps acoustic noise below the audible threshold. The integrated protections (OCP, OTP, UVLO) suit unattended industrial equipment where fault recovery is critical.
Recommandé
Robotics and Small AGV Drive Wheels
Small autonomous ground vehicles and robotics platforms use brushed DC gearmotors for drive wheels and steering; the TLE9166EQXUMA1 drives 3 of these motors from one IC with SPI feedback for odometry and stall detection. The 25 kHz PWM allows precise velocity control, and the integrated protections support safe-stop behavior required by AGV safety standards. The compact PG-TSDSO-32-1 package fits the tight BOM of cost-sensitive robotics designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TLE9166EQXUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TLE94104EPXUMA1 | TLE94110ESXUMA1 | TLE92633BQXXUMA2 |
|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-TSDSO-32-1 | PG-TSDSO-32-1 (same) | PG-TSDSO-32-1 (same) | PG-TSDSO-32-1 (same) |
| Output Stage | NMOS half-bridge | NMOS half-bridge | NMOS half-bridge | NMOS half-bridge + LDO |
| Interface | SPI | SPI | SPI | SPI |
| Charge Pump | Integrated (CP pin) | Integrated | Integrated | Integrated |
| Target Application | Door lock / body electronics brushed DC | Body electronics brushed DC | Body electronics brushed DC (higher channel count) | Body domain + LDO combo |
Principaux différenciateurs
- Higher channel count in same package footprint (vs TLE94104EPXUMA1)
- Fixed 25 kHz silent-PWM engine on-chip (vs Discrete H-bridge + MCU PWM approach)
- Integrated charge pump for high-side gate drive (vs TLE92633BQXXUMA2)
Notes de conception
Place the VS decoupling bulk capacitor (typically >= 47 uF low-ESR) as close as possible to the VS and GND pins of the PG-TSDSO-32-1 package to suppress the high di/dt transients generated by the half-bridges. Add a 100 nF ceramic bypass directly adjacent to the IC pins; the exposed pad (pin 32) MUST be soldered to a continuous GND copper plane for thermal dissipation and low-impedance return.
The TLE9166EQXUMA1 integrates a charge pump on the CP pin - this pin requires an external flying capacitor per the datasheet typical application circuit. Omitting the charge pump capacitor disables the high-side gate drive and prevents the half-bridges from switching properly. Always follow Infineon's reference BOM and PCB layout for the CP network.
Estimated: at VS = 14 V, each half-bridge delivering 1 A continuous with 0.5 ohm RDS(on) dissipates roughly 0.5 W per switch (2 W per full H-bridge). Across 3 H-bridges, total dissipation is approximately 6 W, requiring thermal vias under the exposed pad and adequate copper pour. For continuous high-current operation above 2 A per bridge, derate per the SOA curve in the datasheet.
Informations de conformité
RoHS compliant per Infineon product page and LCSC listing. Automotive-grade part intended for AEC-Q100-qualified body-electronics modules - confirm exact AEC-Q100 grade with Infineon datasheet revision.
