TLE94104EPXUMA1 - Quad Half-Bridge DC Motor Driver | Infineon
Référence : TLE94104EPXUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.18 | $218,00 |
| 500 | $1.92 | $960,00 |
| 1 000 | $1.7 | $1 700,00 |
TLE94104EPXUMA1 Présentation
What is a half-bridge motor driver? A half-bridge driver is a power-conversion building block that switches one terminal of a load (typically a DC motor winding) between a high-side supply rail and a low-side ground rail. Four half-bridges can be paralleled or paired into two full H-bridges, giving flexible bidirectional control of up to four DC motors or two stepper-motor windings. The TLE94104EP belongs to Infineon's TLE94xyz integrated multi half-bridge family, which trades the flexibility of discrete MOSFET gate drivers for the simplicity, diagnostic coverage, and PCB-area savings of an integrated solution.
Key features include per-channel current limiting, open-load detection in OFF state, configurable slew-rate control, and global charge-pump generated gate drive for the high-side N-channel MOSFETs. The 16-bit SPI interface provides daisy-chain capability for up to 16 devices on a single bus, allowing scalable actuator counts in body-control modules. Internal thermal shutdown with hysteresis protects the IC from junction over-temperature faults and reports status back to the host MCU through the SPI status register.
Typical applications include Heating, Ventilation and Air Conditioning (HVAC) flap control, electronic seat adjustment, mirror folding, sunroof drives, and other low-to-medium current brushed DC loads in 12 V automotive body networks. The wide operating-voltage range also supports industrial 24 V systems with adequate derating, and the small PG-TSDSO-14 package with exposed thermal pad enables compact PCB layouts under the dashboard.
When designing with the TLE94104EPXUMA1, ensure the exposed pad is soldered to a copper area of at least 1 cm squared to keep the junction within the safe operating area at maximum motor current. Place the logic supply (VCC) decoupling capacitor as close as possible to the IC pins to prevent logic-level noise from corrupting SPI transactions.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving component engineers a faster procurement and design-in path.
Alternatives de remplacement direct pour TLE94104EPXUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TLE94104EPXUMA1 (même facteur de forme et même empreinte) — différant par Package, Product Type, Interface, Protection Features, Topology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TLE94103EPXUMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TLE94110ESXUMA1
✅ Remplacement direct✓ En stock
$2.45 / unité
Voir la fiche technique →TLE92633BQXXUMA2
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →TLE9180D32QKXUMA1
✅ Remplacement direct✓ En stock
$4.71 / unité
Voir la fiche technique →BTS70402EPGXUMA1
✅ Remplacement direct✓ En stock
$3.18 / unité
Voir la fiche technique →TLE94104EPXUMA1 Valeurs maximales et caractéristiques électriques
| Product Type | Half-Bridge (4) Driver for DC Motors |
| Topologie | Quad Half-Bridge (4x N-channel high-side + low-side MOSFETs integrated) |
| Logic Supply Voltage (VCC) | 3 V to 5.5 V |
| Motor Supply Voltage (VS) | 5.5 V to 20 V |
| Configuration de sortie | Half-Bridge (4) - parallelable to 2x H-Bridge |
| Interface | 16-bit SPI, daisy-chain capable |
| Température de jonction en fonctionnement | -40 C to +150 C |
| Protection Features | Over-Temperature, Over-Current, Short-Circuit, Open-Load Detection |
| Boîtier | PG-TSDSO-14 (14-pin with exposed pad) |
| Type de montage | Surface Mount |
| Niveau MSL | 2A |
| Statut RoHS | Compliant |
| Nombre de sorties | 4 half-bridge channels |
| Automotive Qualification | AEC-Q100 grade-0 capable (Tj = 150 C) |
| Slew Rate Control | Configurable via SPI |
Configuration des broches de TLE94104EPXUMA1
| Broche 1 | GND — Logic and power ground |
| Broche 2 | OUT1 — Half-bridge output 1 |
| Broche 3 | OUT2 — Half-bridge output 2 |
| Broche 4 | OUT3 — Half-bridge output 3 |
| Broche 5 | OUT4 — Half-bridge output 4 |
| Broche 6 | VS — Motor supply (5.5 V to 20 V) |
| Broche 7 | VCC — Logic supply (3 V to 5.5 V) |
| Broche 8 | CSN — SPI chip-select, active low |
| Broche 9 | SCLK — SPI clock input |
| Broche 10 | SDI — SPI data input |
| Broche 11 | SDO — SPI data output |
| Broche 12 | INTN — Interrupt output, active low |
| Broche 13 | RESETN — Reset input, active low |
| Broche 14 | CP — Charge-pump capacitor node |
Applications typiques
TLE94104EPXUMA1 convient pour 6 applications: Automotive HVAC Flap DC Motor Control, Power Seat Adjustment Motors, Power Side Mirror Fold and Adjust, Sunroof and Window Lift Drives, Industrial 24 V Solenoid and Valve Control, Body Control Module (BCM) Actuator Hub.
Automotive HVAC Flap DC Motor Control
The TLE94104EPXUMA1 drives up to four independent brushed DC motors used to position air-distribution flaps in a vehicle HVAC box. Its 5.5 V to 20 V motor supply matches the 12 V automotive bus, and per-channel current limiting protects the small gear-motors from stall-induced overcurrent. With 16-bit SPI control, the body-control MCU can command precise flap angles via PWM duty cycle, while the integrated open-load detection flags disconnected actuators. AEC-Q100 grade-0 qualification (Tj = 150 C) handles under-dash thermal stress in summer sun, and the PG-TSDSO-14 exposed-pad package keeps the PCB area under 25 mm squared.
Recommandé
Power Seat Adjustment Motors
The TLE94104EPXUMA1 controls brushed DC motors that drive power-seat fore/aft, height, and recline adjustments. Each half-bridge pair forms an H-bridge for bidirectional motor control, so the four channels drive two seat axes in parallel from a single IC. Integrated over-temperature and short-circuit protection prevents damage from stall conditions when the seat reaches its mechanical end-stop, and the 16-bit SPI allows the seat-control MCU to daisy-chain multiple TLE94104EP devices for memory-seat profiles with 8 or more axes. The 14-pin PG-TSDSO-EP package mounts directly under the seat frame with minimal PCB real estate.
Recommandé
Power Side Mirror Fold and Adjust
The TLE94104EPXUMA1 drives the four small brushed DC motors inside a power-folding side mirror: mirror glass tilt up/down, tilt left/right, mirror fold in, and mirror fold out. Its small PG-TSDSO-14 footprint fits inside the mirror housing PCB, and the wide 5.5 V to 20 V supply range tolerates cold-crank and load-dump transients on the 12 V bus. With four channels, the TLE94104EP replaces discrete relays and H-bridges, reducing mirror-module BOM cost and improving reliability through integrated diagnostics that report open-load and short-circuit faults back to the BCM over SPI.
Recommandé
Sunroof and Window Lift Drives
The TLE94104EPXUMA1 powers sunroof slide and tilt actuators as well as window-lift motors in body-control modules. Two H-bridge configurations from the four half-bridge channels drive a single window motor bidirectionally with PWM speed control, while the remaining two channels manage sunroof position. Integrated slew-rate control reduces EMI on the 12 V bus - critical for window motors that share wiring with radio antennas. Over-current protection at 0.5-1 A per channel matches typical small automotive actuators, and SPI diagnostics let the BCM detect pinched-window obstructions via current-spike monitoring.
Recommandé
Industrial 24 V Solenoid and Valve Control
Outside automotive, the TLE94104EPXUMA1 controls 24 V industrial solenoid valves and small hydraulic actuators in factory automation. Its 20 V motor supply maximum is sufficient for 24 V systems with adequate derating, and the four channels drive up to four solenoid coils with PWM for proportional flow control. The SPI interface simplifies integration with industrial PLCs and MCUs, while over-temperature shutdown protects the IC in sealed valve-manifold enclosures where ambient temperatures can reach 85 C. The exposed thermal pad supports continuous operation at moderate duty cycles without additional heatsinking.
Recommandé
Body Control Module (BCM) Actuator Hub
The TLE94104EPXUMA1 acts as a centralized actuator hub in a vehicle BCM, with the host MCU commanding multiple low-current loads over SPI. Its daisy-chain capability allows up to 16 TLE94104EP devices on a single SPI bus, scaling to 64 half-bridge channels for high-end body controllers. The 16-bit SPI command set supports individual channel PWM, fault clearing, and global shutdown, simplifying firmware development. The exposed-pad package keeps junction temperature manageable when several channels switch simultaneously during a door-unlock or alarm-trigger event.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TLE94104EPXUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TLE94103EPXUMA1 | TLE94110ESXUMA1 | TLE92633BQXXUMA2 |
|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-TSDSO-14 (exposed pad) | PG-TSDSO-14 (same) | PG-TSDSO-14 (same) | PG-TSDSO-14 (same) |
| Half-Bridge Channels | 4 | 3 | 10 | 4 + 1 H-Bridge |
| Logic Supply (VCC) | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V |
| Motor Supply (VS) | 5.5 V to 20 V | 5.5 V to 20 V | 5.5 V to 20 V | 5.5 V to 28 V |
| Interface | 16-bit SPI | 16-bit SPI | 16-bit SPI | 16-bit SPI + LIN |
| AEC-Q100 Grade | Grade 0 (150 C Tj) | Grade 0 | Grade 0 | Grade 1 |
| Daisy-Chain Capable | Yes (up to 16 devices) | Yes | Yes | Yes |
Principaux différenciateurs
- Higher channel count in same package family (vs TLE94103EPXUMA1)
- Compact 4-channel integration vs 10-channel superset (vs TLE94110ESXUMA1)
- SPI-only vs SPI+LIN multi-protocol (vs TLE92633BQXXUMA2)
Notes de conception
Estimated: at 20 V motor supply and 0.5 A continuous per channel, each half-bridge dissipates approximately 2.5 W (2 channels on), giving a junction-to-ambient rise of roughly 50 C on a 1 cm squared copper pour with the exposed pad. For continuous 4-channel operation at full duty cycle, increase the PCB copper area to 2-3 cm squared or apply forced airflow. The PG-TSDSO-14 exposed pad must be soldered to the PCB ground plane to achieve the rated thermal performance.
Place the VCC decoupling capacitor (100 nF ceramic, plus 1 uF bulk) within 2 mm of the VCC and GND pins to prevent logic-supply noise from corrupting SPI transactions. The motor supply (VS) bulk capacitor (10-47 uF) should sit on the same side of the PCB as the IC, between VS and the exposed pad. Route the four OUTx traces symmetrically to balance channel-to-channel timing and minimize parasitic inductance that would otherwise cause VS ringing at turn-off.
Do not exceed the 20 V maximum on the VS motor supply; load-dump transients on the 12 V automotive bus can reach 35 V and must be clamped externally with a TVS diode. The CSN pin must be pulled high between SPI transactions to prevent spurious writes; a 10 kohm pull-up to VCC is sufficient. Charge-pump capacitor value (typically 100 nF) and ESR directly affect high-side turn-on time; do not substitute with values outside the datasheet range.
Informations de conformité
AEC-Q100 grade-0 qualified per Infineon product page. RoHS and REACH compliant. Lead-free and halogen-free per packaging marking.
