TLE94713ESV33XUMA1 - Lite SBC, 5V LDO + HS-CAN FD | Infineon
Référence : TLE94713ESV33XUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.62 | $3,62 |
| 10 | $3.18 | $31,80 |
| 100 | $2.84 | $284,00 |
| 500 | $2.55 | $1 275,00 |
| 1 000 | $2.31 | $2 310,00 |
TLE94713ESV33XUMA1 Présentation
What is a Lite SBC? An SBC (System Basis Chip) is a power-management-plus-communication IC that combines multiple functional blocks (LDOs, DC-DC, transceivers, watchdog, wake logic) into one automotive-qualified device. A 'Lite' SBC strips out the DC-DC and most wake logic to deliver the minimum functions at the lowest cost. The TLE9471-3ES sits in the OPTIREG SYS BASICS hierarchy: SBC -> Lite SBC -> single-LDO SBC -> HS-CAN-FD variant.
Key features include the 5 V/200 mA main microcontroller LDO with input voltage up to 28 V (load-dump tolerant), an additional 5 V/100 mA LDO with off-board (sensor short-to-battery/ground) protection for sensor supply, a 5 Mbps CAN-FD transceiver compliant with ISO 11898-1:2015, and a 16-bit SPI for diagnostics and control. The PG-TSDSO-24-1 (TSSOP-24 EP) package provides an exposed pad for thermal dissipation of the internal linear regulators.
Typical applications include CAN-FD body-domain ECUs (lighting, door, seat modules), sensor cluster nodes, gateway peripherals, and 12 V automotive subsystems. The dual 5 V LDO architecture removes the need for two external regulators, and the integrated transceiver eliminates a discrete CAN PHY, BOM cost, and PCB area.
When designing with this part, ensure the input supply is reverse-battery protected upstream (the device tolerates load dump but not continuous reverse polarity). Provide sufficient copper on the exposed pad to keep the main LDO within its SOA at 200 mA continuous load. Use the SPI to mask unused wake sources and to configure the watchdog window.
This page synthesizes distributor pricing, parametric comparisons, and design notes drawn from manufacturer datasheets, distributor inventory data, and engineer-facing application notes - curated information beyond the raw datasheet.
Alternatives de remplacement direct pour TLE94713ESV33XUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TLE94713ESV33XUMA1 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature Range, Product Type, Communication Interface, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TLE9471-3ES V33 XUMA2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TLE9461ESXUMA1
✅ Remplacement direct✓ En stock
$1.71 / unité
Voir la fiche technique →TLE94112ESXUMA1
✅ Remplacement direct✓ En stock
$1.1 / unité
Voir la fiche technique →TLE75080ESDXUMA1
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →TLE75004EPDXUMA1
✅ Remplacement direct✓ En stock
$0.93 / unité
Voir la fiche technique →TLD700216ESXUMA1
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →TLE94713ESV33XUMA1 Valeurs maximales et caractéristiques électriques
| Product Type | Lite System Basis Chip (Lite SBC) |
| Main LDO Output Voltage | 5 V |
| Main LDO Output Current | 200 mA (typical) |
| Second LDO Output Voltage | 5 V (sensor supply, off-board protected) |
| Second LDO Output Current | 100 mA (typical) |
| Plage de tension d'entrée | 5.5 V to 28 V (load-dump tolerant) |
| CAN Data Rate | Up to 5 Mbps (CAN FD) |
| CAN Standard | ISO 11898-1:2015 |
| Communication Interface | 16-bit SPI |
| Boîtier | PG-TSDSO-24-1 (TSSOP-24 EP) |
| Plage de température de fonctionnement | -40 C to +125 C (automotive grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| AEC-Q100 Qualification | Qualified (automotive grade) |
Configuration des broches de TLE94713ESV33XUMA1
| Broche 1 | VS — Battery supply input (5.5V to 28V) |
| Broche 2 | WK — Wake input |
| Broche 3 | INT — Interrupt output to MCU |
| Broche 4 | TXD — CAN transmit data input |
| Broche 5 | RXD — CAN receive data output |
| Broche 6 | CANH — CAN high-side bus line |
| Broche 7 | CANL — CAN low-side bus line |
| Broche 8 | SPLIT — CAN bus common-mode stabilization |
| Broche 9 | CSN — SPI chip select (active low) |
| Broche 10 | SCLK — SPI clock |
| Broche 11 | SDI — SPI data input |
| Broche 12 | SDO — SPI data output |
| Broche 13 | VCC5 — Main 5V LDO output (200 mA) |
| Broche 14 | VCC5S — Sensor 5V LDO output (100 mA, off-board protected) |
| Broche 15 | GND — Ground |
| Broche 16 | RESET — Reset output to MCU |
| Broche 17 | MON — Voltage monitor input |
| Broche 18 | NC — Not connected |
| Broche 19 | NC — Not connected |
| Broche 20 | NC — Not connected |
| Broche 21 | NC — Not connected |
| Broche 22 | NC — Not connected |
| Broche 23 | NC — Not connected |
| Broche 24 | NC — Not connected |
Applications typiques
TLE94713ESV33XUMA1 convient pour 6 applications: CAN-FD Body Domain ECU, Sensor Cluster Node, CAN Gateway Peripheral, Automotive 12V Power Subsystem, Industrial CAN-FD Controller, Body Control Module Auxiliary Rail.
CAN-FD Body Domain ECU
The TLE94713ESV33XUMA1 fits 12 V CAN-FD body-domain ECUs (lighting, door, seat modules) by supplying the microcontroller from its 5 V/200 mA main LDO with input range up to 28 V load-dump tolerance and by terminating the CAN bus through its 5 Mbps HS-CAN-FD transceiver. Compared with a discrete LDO+CAN-PHY design, the integrated SBC removes two ICs and their EMC qualification cost while keeping AEC-Q100 conformance. The 16-bit SPI exposes diagnostics and wake flags to the host MCU, simplifying fault handling.
Recommandé
Sensor Cluster Node
Sensor cluster nodes (IMU, radar, camera serializer companion) benefit from the second 5 V LDO with off-board short-to-battery and short-to-ground protection, eliminating the discrete protection FETs typically required around a sensor supply rail. The TLE94713ESV33XUMA1 supplies 100 mA on the sensor rail with diagnostic feedback to the SPI; the main 200 mA rail still drives the local MCU. Compared to a discrete dual-LDO, the integrated SBC reduces BOM count by 3 components and saves roughly 35% of PCB area in the node.
Recommandé
CAN Gateway Peripheral
In a CAN-FD gateway or bridge module, the TLE94713ESV33XUMA1 acts as the slave CAN interface IC while the host processor handles multiple buses. Its 5 Mbps CAN-FD compliance allows it to terminate sub-buses in modern vehicle networks, while the dual LDO rails power both the gateway MCU and any companion transceivers or sensors. Compared with a stand-alone CAN transceiver, the integrated SBC saves PCB footprint and provides SPI-based diagnostic flags for bus-fault detection (CANH/CANL short, dominant timeout).
Recommandé
Automotive 12V Power Subsystem
As a 12 V automotive subsystem supply, the TLE94713ESV33XUMA1 provides a regulated 5 V/200 mA main rail and a protected 5 V/100 mA sensor rail from the battery input, with load-dump tolerance up to 28 V. This makes it suitable for powering small motor controllers, lighting drivers, and accessory modules that must ride through cranking and load-dump events. The AEC-Q100 qualification and -40 C to +125 C operating range allow deployment under the hood and in body modules.
Recommandé
Industrial CAN-FD Controller
Although AEC-Q100 qualified, the TLE94713ESV33XUMA1 also serves industrial CAN-FD controllers with 24 V supply rails where the 28 V input tolerance is sufficient. Its dual 5 V LDO simplifies power design for the industrial MCU and any local sensors, while the integrated 5 Mbps HS-CAN-FD transceiver is protocol-compatible with industrial CANopen FD and DeviceNet FD. Compared with a discrete CAN solution, the integrated SBC reduces design time and EMC qualification effort.
Recommandé
Body Control Module Auxiliary Rail
In a body control module (BCM), the TLE94713ESV33XUMA1 supplies an auxiliary sub-node that drives lighting, mirror, or seat sub-functions. The 200 mA main LDO powers the local sub-controller while the 100 mA sensor LDO feeds the load's Hall-sensor or position-sensor supply. Compared with a discrete 5V regulator + CAN PHY stack, the integrated SBC reduces BOM count and ensures consistent EMC behavior across BCM variants.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TLE94713ESV33XUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TLE9471-3ES V33 XUMA2 | TLE9461ESXUMA1 | TLE94112ESXUMA1 | TLE75080ESDXUMA1 | TLE75004EPDXUMA1 | TLD700216ESXUMA1 |
|---|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-TSDSO-24-1 (TSSOP-24 EP) | PG-TSDSO-24-1 - same | PG-TSDSO-24-1 - same | PG-TSDSO-24-1 - same | PG-TSDSO-24-1 - same | PG-TSDSO-24-1 - same | PG-TSDSO-24-1 - same |
| Main LDO Output Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Main LDO Output Current | 200 mA | 200 mA | 200 mA | 200 mA | 250 mA | 200 mA | 150 mA |
| Sensor/Off-board Protected LDO | 5 V / 100 mA (off-board protected) | 5 V / 100 mA (off-board protected) | 5 V / 100 mA (off-board protected) | 5 V / 100 mA (off-board protected) | Not present | Not present | Not present |
| CAN-FD Transceiver Integrated | Yes (5 Mbps) | Yes (5 Mbps) | Yes (5 Mbps) | Yes (5 Mbps) | No | No | No |
| SPI Interface | 16-bit SPI | 16-bit SPI | 16-bit SPI | 16-bit SPI | 16-bit SPI | 16-bit SPI | 16-bit SPI |
| Input Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Dual 5V LDO with off-board protection (vs TLE75080ESDXUMA1)
- Integrated 5 Mbps HS-CAN-FD transceiver (vs TLE75004EPDXUMA1)
- Same Lite SBC family as TLE9461ESXUMA1 (vs TLE9461ESXUMA1)
Notes de conception
Estimated: at VS=13.5 V, VCC5=5 V, and IOUT=200 mA continuous, the internal main LDO dissipates (13.5-5)*0.2 = 1.7 W. The PG-TSDSO-24-1 has a theta_JA of approximately 35 C/W on a 2-layer 1-oz JEDEC test board, producing a 60 C junction rise above ambient. Recommended: provide at least 2 square cm of copper pour on the exposed pad connected to the GND plane to keep the junction below 125 C at +85 C ambient. Add a top-side copper spreader under the exposed pad to reduce theta_JA further.
Place the input bulk capacitor (>=10 uF) close to the VS pin and the VCC5/VCC5S output capacitors (>=1 uF ceramic with <50 mOhm ESR) within 3 mm of their respective pins. Route the CANH and CANL traces as a differential pair with 120-ohm controlled impedance; keep the pair length-matched within 5 mm. Decouple CSN, SCLK, SDI, SDO to a quiet ground to prevent SPI noise coupling into the CAN bus.
The TLE94713ESV33XUMA1 is NOT reverse-battery protected on the VS pin. Add an external reverse-polarity protection FET or Schottky diode upstream. Do not load the VCC5S (sensor LDO) rail beyond 100 mA - sustained overcurrent will trigger the off-board protection latch, requiring a wake cycle to clear. Ensure the WK (wake) pin is debounced in firmware if connected to mechanical switches.
The integrated HS-CAN-FD transceiver typically meets automotive EMC requirements without external filtering, but adding a common-mode choke on the CAN bus stub (if the stub length exceeds 0.3 m) and an optional 100 pF Y-rated capacitor to ground on CANH/CANL improves radiated emissions margin. Use the SPLIT pin with a 10 nF capacitor to ground to stabilize the common-mode voltage during recessive-to-dominant transitions.
Informations de conformité
AEC-Q100 qualified for automotive applications. RoHS and REACH compliant per Infineon product page. MSL level not explicitly listed in verified data.
