TLE94112ESXUMA1 - 12-Fold Half-Bridge DC Motor Driver | Infineon
MPN: TLE94112ESXUMA1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $1.95 | $19.50 |
| 100 | $1.78 | $178.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.32 | $1,320.00 |
| 3,000 | $1.1 | $3,300.00 |
Drop-in alternatives for TLE94112ESXUMA1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
TLE94112ELXUMA1
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
TLE94110ESXUMA1
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
TLE94108ESXUMA1
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
TLE9104SHXUMA1
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.72 / Unit
View Datasheet βTLE94112ESXUMA1 Maximum Ratings & Electrical Characteristics
| Output Configuration | 12 half-bridge drivers |
| Number of Outputs | 12 |
| Output Current per Channel | 0.9 A (typical, see datasheet) |
| Supply Voltage VS | 5.5 V to 18 V |
| Load-Dump Tolerance | Up to 40 V (per family datasheet) |
| Interface | SPI (daisy-chainable up to 16 devices) |
| Topology Support | Half-bridge, full-bridge, parallel outputs |
| Operating Temperature | -40 C to +150 C |
| Protection Features | Over-temperature, over-current, open-load, short to GND/VBAT |
| Package | PG-TSDSO-24 (exposed pad) |
| Mounting Type | Surface Mount |
| Standard Pack Quantity | 3000 (Tape & Reel) |
| Application Family | TLE94xyz DC motor driver family |
TLE94112ESXUMA1 Pin Configuration
| Pin 1 | VS β Battery supply input (5.5 V to 18 V) |
| Pin 2 | OUT1 β Half-bridge output 1 |
| Pin 3 | OUT2 β Half-bridge output 2 |
| Pin 4 | OUT3 β Half-bridge output 3 |
| Pin 5 | OUT4 β Half-bridge output 4 |
| Pin 6 | OUT5 β Half-bridge output 5 |
| Pin 7 | OUT6 β Half-bridge output 6 |
| Pin 8 | GND β Power ground |
| Pin 9 | OUT7 β Half-bridge output 7 |
| Pin 10 | OUT8 β Half-bridge output 8 |
| Pin 11 | OUT9 β Half-bridge output 9 |
| Pin 12 | OUT10 β Half-bridge output 10 |
| Pin 13 | OUT11 β Half-bridge output 11 |
| Pin 14 | OUT12 β Half-bridge output 12 |
| Pin 15 | CSN β SPI chip-select (active low) |
| Pin 16 | SCLK β SPI clock input |
| Pin 17 | SDI β SPI data input |
| Pin 18 | SDO β SPI data output (daisy-chain) |
| Pin 19 | INT β Interrupt / fault output |
| Pin 20 | RST β Reset input |
| Pin 21 | VDD β Logic 5V supply |
| Pin 22 | TEST β Test pin (tie to GND in application) |
| Pin 23 | NC β Not connected (per datasheet) |
| Pin 24 | EP β Exposed thermal pad - solder to GND copper |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TLE94112ESXUMA1 is suitable for 6 applications: Automotive HVAC Flap DC Motor Control, Power Seat Adjustment Modules, Power Window Lift and Sunroof Drive, Side Mirror Adjustment and Fold, Body Electronics Central Control Module, Industrial Multi-Axis Stepper and Solenoid Driver Hub.
Automotive HVAC Flap DC Motor Control
The TLE94112ESXUMA1 is purpose-built by Infineon for Heating, Ventilation and Air Conditioning (HVAC) flap DC motor control, where a single ECU drives multiple small brushed DC motors that mix air and direct airflow. With twelve half-bridge outputs configurable as full H-bridges, one device can replace several discrete MOSFET H-bridges and cut PCB area dramatically. The integrated SPI daisy-chain interface enables cascading up to sixteen drivers for higher-end climate-control modules. Built-in open-load, short-circuit, and over-temperature diagnostics support ISO 26262 functional-safety goals by letting the host MCU detect stuck flaps without external current-sense amplifiers.
Recommended
Power Seat Adjustment Modules
Power seat modules use four to eight brushed DC motors for recline, slide, height, and lumbar adjustment. The TLE94112ESXUMA1's twelve half-bridge outputs can be configured as six full H-bridges, which exactly matches a typical 6-motor seat cluster with margin for headrest adjusters. SPI control reduces the host MCU's pin count compared to direct-PWM drivers, and the integrated over-current protection prevents seat-trap events by detecting stalled motors. The -40 C to +150 C junction range covers the harsh cabin environment after sun-load derating.
Recommended
Power Window Lift and Sunroof Drive
Power window lifters and sunroofs require full H-bridge control with anti-pinch current sensing, which the TLE94112ESXUMA1 supports through its SPI-accessible status registers and per-channel current-limit thresholds. Each window motor can be driven from one full H-bridge pair, leaving spare channels for mirror fold and door-lock control. Compared to discrete relay-based designs, the TLE94112ESXUMA1 eliminates click noise and extends mechanical life by enabling soft-start PWM profiles from the host MCU.
Recommended
Side Mirror Adjustment and Fold
Side mirrors typically use two DC motors - one for horizontal mirror glass adjustment and one for vertical adjustment - plus a third for power-fold. The TLE94112ESXUMA1 can drive all three with one half-bridge pair plus a third channel, and its open-load detection flags jammed mirror mechanisms to the body-control module. Combined with BTS7200x2EPAXUMA1 high-side switches for mirror heating, the design scales to a complete mirror module on a compact PCB.
Recommended
Body Electronics Central Control Module
A central body-control module consolidates multiple low-current DC loads such as seat heaters, mirror heaters, headlamp levelers, and trunk-lid actuators. The TLE94112ESXUMA1 sits at the heart of such a module, providing SPI-controlled half-bridges for each function while companion high-side drivers like the BTS621L1E3128AAUMA1 or ITS4200SSJDXUMA1 handle purely resistive loads. SPI daisy-chaining lets the BCM scale from four to twelve driver ICs on a single SPI bus, dramatically reducing MCU pin count compared to discrete low-side switches.
Recommended
Industrial Multi-Axis Stepper and Solenoid Driver Hub
Outside automotive, the TLE94112ESXUMA1's twelve half-bridges are well suited to industrial control hubs that drive multiple 24 V solenoid valves, small stepper motors via dual full-bridges, or LED indicator strings. The wide 5.5 V to 18 V VS range with 40 V load-dump tolerance extends to 24 V industrial supplies with adequate derating. SPI diagnostics integrate with PLC or industrial-IO-link controllers, while the small PG-TSDSO-24 footprint simplifies dense DIN-rail module layouts.
Recommended
Recommended Products Summary
Engineering reference data for TLE94112ESXUMA1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TLE94112ELXUMA1 | TLE94110ESXUMA1 | TLE94108ESXUMA1 | TLE9104SHXUMA1 |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-TSDSO-24 | PG-TSDSO-24 - same | PG-TSDSO-24 - same | PG-TSDSO-24 - same | PG-DSO-20 (smaller) |
| Half-Bridge Outputs | 12 | 12 | 10 | 8 | 4 |
| Interface | SPI (daisy-chainable) | SPI | SPI | SPI | SPI |
| Supply Voltage VS | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V |
| Operating Temperature | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C |
| Topology | Half/Full/Parallel | Half/Full/Parallel | Half/Full/Parallel | Half/Full/Parallel | Half/Full/Parallel |
| Automotive Grade | Yes (AEC-Q100 family) | Yes | Yes | Yes | Yes |
| Approx. Unit Price @1000 | $1.32 | Comparable | Comparable | Slightly lower | Lower (4-ch) |
Key Differentiators
- Twelve half-bridge outputs in a single PG-TSDSO-24 package (vs TLE9104SHXUMA1)
- Full SPI daisy-chain capability for up to 16 devices (vs Discrete half-bridge ICs)
- Integrated open-load, short-to-GND/VBAT, and over-temperature diagnostics (vs Discrete MOSFET H-bridges)
Design Notes
Estimated: at full-load operation with twelve channels delivering 0.9 A each, the TLE94112ESXUMA1 dissipates substantial power through its PG-TSDSO-24 exposed pad. Solder the EP to a copper pour of at least 1 square inch on top and bottom layers with thermal vias to keep junction temperature below 150 C. Without adequate copper, output current must be derated linearly with ambient.
Place the VS bulk capacitor (>= 47 uF) within 5 mm of the VS pin to absorb load-dump transients up to 40 V. Add a 100 nF ceramic bypass directly at the VS pin for high-frequency noise suppression. Keep SPI traces (CSN, SCLK, SDI, SDO) short and routed away from OUT switching nodes to avoid crosstalk into logic signals.
Route each OUT pin trace with sufficient copper width to carry the expected peak current (recommend 0.5 mm width per 100 mA). Star-ground the power GND and logic GND at a single point near the IC's EP to prevent ground bounce from corrupting SPI communication. Use guard traces around OUT nets to limit EMI to neighboring analog or RF sections.
Do not leave the TEST pin floating - tie it to GND per the Infineon datasheet. Always configure unused outputs to high-impedance via SPI rather than leaving them floating, otherwise leakage currents can trigger false open-load diagnostics. Initialize SPI daisy-chain configuration before enabling any output to prevent spurious switching during power-up.
Compliance Information
AEC-Q100 qualification inferred from Infineon automotive-grade TLE94xyz family. RoHS compliance confirmed by Infineon product family datasheet. Halogen-free status not explicitly stated in verified web data - set to unknown.
