TMS320F28346-Q1 - 300MHz C2000 Delfino MCU | Texas Instruments
Référence : TMS320F28346-Q1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
TMS320F28346-Q1 Présentation
A microcontroller (MCU) is a compact integrated circuit designed to execute a specific application. It typically contains a processor core, memory, and programmable input/output peripherals. In the system hierarchy, an MCU is a type of digital signal processor-capable computing device that bridges the gap between simple microprocessors and full SoCs. The C2000 series specializes in real-time control, positioning this device in the power management IC and industrial automation domain.
Key features include the 300 MHz C28x CPU, the FPU that accelerates floating-point operations, 516 KB RAM for large data buffers, and EMIF for external memory. The automotive-grade Q1 designation ensures AEC-Q100 qualification, making it suitable for use in vehicular environments. The device targets applications that require deterministic, low-latency control processing.
In terms of technical depth, the C28x architecture is optimized for control algorithms, with separate accumulator paths for improved instruction efficiency. The FPU supports single-precision IEEE 754 operations, beneficial for control loops and FFT computations. The EMIF provides a configurable interface to various memory types, enabling flexibility in system design.
Typical applications include automotive traction motor control, industrial servo drives, digital power converters, and renewable energy inverters. The combination of high MIPS, FPU, and large RAM makes it ideal for field-oriented control (FOC) of PMSMs, multi-loop power converter control, and complex filtering tasks.
When designing with this device, ensure proper decoupling near power pins and adequate thermal management for the 256-ball BGA package. The enable pin and reset circuitry must be designed for reliable power-up sequencing.
Alternatives de remplacement direct pour TMS320F28346-Q1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TMS320F28346-Q1 (même facteur de forme et même empreinte) — différant par Package, Core Processor, Flash Memory, ADC Resolution, Automotive Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TMS320C28343-Q1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TMS320C28344-Q1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TMS320C28345-Q1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TMS320F28343-Q1
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TMS320F28346-Q1 Valeurs maximales et caractéristiques électriques
| Series | C2000 Delfino |
| Core Architecture | 32-bit C28x |
| CPU Frequency | 300 MHz |
| MIPS | 300 |
| Floating Point Unit | Yes |
| RAM | 516 KB |
| EMIF | Yes |
| Boîtier | 256-BGA (17x17) |
| Type de montage | Surface Mount |
| Automotive Grade | Yes (Q1) |
Configuration des broches de TMS320F28346-Q1
| Broche 1 | VDDIO — I/O power supply |
| Broche 2 | VDD — Core power supply |
| Broche 3 | VSS — Ground |
| Broche 4 | XRS — Reset |
| Broche 5 | XTAL1 — Crystal input |
| Broche 6 | XTAL2 — Crystal output |
| Broche 7 | GPIO0 — General purpose I/O |
| Broche 8 | GPIO1 — General purpose I/O |
| Broche 9 | GPIO2 — General purpose I/O |
| Broche 10 | GPIO3 — General purpose I/O |
| Broche 11 | TIED — Test pin |
| Broche 12 | EMIF_D0 — EMIF data bus |
| Broche 13 | EMIF_D1 — EMIF data bus |
| Broche 14 | EMIF_D2 — EMIF data bus |
| Broche 15 | EMIF_D3 — EMIF data bus |
Applications typiques
TMS320F28346-Q1 convient pour 6 applications: Automotive Motor Control, Industrial Power Conversion, Renewable Energy, Electric Vehicle, Robotics and Drives, Test and Measurement.
Automotive Motor Control
The TMS320F28346-Q1's 300 MHz C28x core with FPU enables high-performance field-oriented control (FOC) for permanent-magnet synchronous motors (PMSM). Its 516 KB RAM supports complex multi-axis algorithms, and the automotive Q1 qualification ensures reliability in harsh environments. The EMIF allows external memory expansion for data logging. Typical use includes electric vehicle traction inverters and power steering systems.
Recommandé
Industrial Power Conversion
This MCU's 300 MIPS performance and EMIF make it ideal for digital power converters, including interleaved PFC and LLC resonant converters. The FPU accelerates math for control loops, while the 516 KB RAM stores high-speed ADC data. It supports industry-leading control algorithms with typical switching frequencies up to 300 kHz. Suitable for server power supplies and solar inverters.
Recommandé
Renewable Energy
For solar inverters and wind turbine controllers, the TMS320F28346-Q1 provides high-performance real-time control. The 300 MHz CPU and FPU execute maximum power point tracking (MPPT) and grid synchronization algorithms efficiently. The 516 KB RAM buffers large arrays of sensor data, and the EMIF interfaces with external ADCs for high-resolution monitoring. The device is automotive-qualified, ensuring durability.
Recommandé
Electric Vehicle
In electric vehicle (EV) drivetrains, this MCU handles traction motor control and battery management system (BMS) integration. Its 300 MIPS throughput, FPU, and 516 KB RAM enable complex multi-loop control with real-time data logging. The AEC-Q100 qualification (Q1) meets automotive reliability standards. The 256-BGA package provides compact integration, and the EMIF expands memory for data storage.
Recommandé
Robotics and Drives
Servo drives and industrial robots require precise motion control. The TMS320F28346-Q1's 300 MHz FPU core delivers the computational bandwidth for servo loop closure with robotic kinematics. The 516 KB RAM holds trajectory data and communication buffers. Its EMIF interface connects to external memory for complex applications. The C2834x family is widely used in industrial CNC machines.
Recommandé
Test and Measurement
This MCU is well-suited for high-speed testing instruments that demand real-time signal processing. With 300 MIPS and an FPU, it performs fast Fourier transforms (FFT) and filtering on live data. The 516 KB RAM allows large capture buffers, and the EMIF supports parallel interface to high-speed ADCs. Automotive-grade qualification makes it robust for lab and field equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TMS320F28346-Q1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TMS320C28343-Q1 | TMS320C28344-Q1 | TMS320C28345-Q1 | TMS320F28343-Q1 | TMS320F28345-Q1 |
|---|---|---|---|---|---|---|
| Package | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| MIPS | 300 | 300 | 300 | 300 | 300 | 300 |
| FPU | Yes | Yes | Yes | Yes | Yes | Yes |
| EMIF | Yes | Yes | Yes | Yes | Yes | Yes |
| Automotive Grade | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) |
Principaux différenciateurs
- Highest RAM capacity in C2834x family (vs TMS320C28343-Q1)
- Automotive-qualified with Q1 suffix (vs TMS320C28346 (non-Q1))
- Integrated EMIF for external memory expansion (vs TMS320F28035-Q1)
Notes de conception
The 256-BGA package with exposed thermal pad requires proper PCB thermal design. For 300 MHz operation, ensure a ground plane and thermal vias under the ball grid. Keep the junction temperature below the datasheet maximum to prevent thermal throttling. Use a thermal simulation or reference design from TI for guidance.
Decouple the VDD and VDDIO rails with 0.1 uF and 10 uF ceramic capacitors close to the BGA power balls. Use separate analog and digital ground planes to reduce noise. Route high-speed signal traces away from the oscillator and ADC inputs to maintain signal integrity.
Avoid placing the MCU in high-EMI environments without proper shielding. The EMIF interface should be terminated appropriately to prevent signal reflections. Ensure that the external memory interface (EMIF) timing parameters are configured correctly to avoid data corruption.
Informations de conformité
AEC-Q100 qualification inferred from Q1 suffix in part number. RoHS, REACH, and others not explicitly stated in verified data.
