TMS320F28346-Q1 - 300MHz C2000 Delfino MCU | Texas Instruments
MPN: TMS320F28346-Q1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for TMS320F28346-Q1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
TMS320C28343-Q1
β Drop-Inπ Reference alternative (not in catalog)
TMS320C28344-Q1
β Drop-Inπ Reference alternative (not in catalog)
TMS320C28345-Q1
β Drop-Inπ Reference alternative (not in catalog)
TMS320F28343-Q1
β Drop-Inβ In Stock
Contact for price
View Datasheet βTMS320F28345-Q1
β Drop-Inπ Reference alternative (not in catalog)
TMS320F28346-Q1 Maximum Ratings & Electrical Characteristics
| Series | C2000 Delfino |
| Core Architecture | 32-bit C28x |
| CPU Frequency | 300 MHz |
| MIPS | 300 |
| Floating Point Unit | Yes |
| RAM | 516 KB |
| EMIF | Yes |
| Package | 256-BGA (17x17) |
| Mounting Type | Surface Mount |
| Operating Temperature | [DATA_NEEDED: Operating Temperature Range] |
| Supply Voltage | [DATA_NEEDED: Supply Voltage Range] |
| ADC Resolution | [DATA_NEEDED: ADC Resolution] |
| PWM Channels | [DATA_NEEDED: PWM Channels] |
| Flash Memory | [DATA_NEEDED: Flash Memory] |
| Automotive Grade | Yes (Q1) |
TMS320F28346-Q1 Pin Configuration
| Pin 1 | VDDIO β I/O power supply |
| Pin 2 | VDD β Core power supply |
| Pin 3 | VSS β Ground |
| Pin 4 | XRS β Reset |
| Pin 5 | XTAL1 β Crystal input |
| Pin 6 | XTAL2 β Crystal output |
| Pin 7 | GPIO0 β General purpose I/O |
| Pin 8 | GPIO1 β General purpose I/O |
| Pin 9 | GPIO2 β General purpose I/O |
| Pin 10 | GPIO3 β General purpose I/O |
| Pin 11 | TIED β Test pin |
| Pin 12 | EMIF_D0 β EMIF data bus |
| Pin 13 | EMIF_D1 β EMIF data bus |
| Pin 14 | EMIF_D2 β EMIF data bus |
| Pin 15 | EMIF_D3 β EMIF data bus |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TMS320F28346-Q1 is suitable for 6 applications: Automotive Motor Control, Industrial Power Conversion, Renewable Energy, Electric Vehicle, Robotics and Drives, Test and Measurement.
Automotive Motor Control
The TMS320F28346-Q1's 300 MHz C28x core with FPU enables high-performance field-oriented control (FOC) for permanent-magnet synchronous motors (PMSM). Its 516 KB RAM supports complex multi-axis algorithms, and the automotive Q1 qualification ensures reliability in harsh environments. The EMIF allows external memory expansion for data logging. Typical use includes electric vehicle traction inverters and power steering systems.
Recommended
Industrial Power Conversion
This MCU's 300 MIPS performance and EMIF make it ideal for digital power converters, including interleaved PFC and LLC resonant converters. The FPU accelerates math for control loops, while the 516 KB RAM stores high-speed ADC data. It supports industry-leading control algorithms with typical switching frequencies up to 300 kHz. Suitable for server power supplies and solar inverters.
Recommended
Renewable Energy
For solar inverters and wind turbine controllers, the TMS320F28346-Q1 provides high-performance real-time control. The 300 MHz CPU and FPU execute maximum power point tracking (MPPT) and grid synchronization algorithms efficiently. The 516 KB RAM buffers large arrays of sensor data, and the EMIF interfaces with external ADCs for high-resolution monitoring. The device is automotive-qualified, ensuring durability.
Recommended
Electric Vehicle
In electric vehicle (EV) drivetrains, this MCU handles traction motor control and battery management system (BMS) integration. Its 300 MIPS throughput, FPU, and 516 KB RAM enable complex multi-loop control with real-time data logging. The AEC-Q100 qualification (Q1) meets automotive reliability standards. The 256-BGA package provides compact integration, and the EMIF expands memory for data storage.
Recommended
Robotics and Drives
Servo drives and industrial robots require precise motion control. The TMS320F28346-Q1's 300 MHz FPU core delivers the computational bandwidth for servo loop closure with robotic kinematics. The 516 KB RAM holds trajectory data and communication buffers. Its EMIF interface connects to external memory for complex applications. The C2834x family is widely used in industrial CNC machines.
Recommended
Test and Measurement
This MCU is well-suited for high-speed testing instruments that demand real-time signal processing. With 300 MIPS and an FPU, it performs fast Fourier transforms (FFT) and filtering on live data. The 516 KB RAM allows large capture buffers, and the EMIF supports parallel interface to high-speed ADCs. Automotive-grade qualification makes it robust for lab and field equipment.
Recommended
Recommended Products Summary
Engineering reference data for TMS320F28346-Q1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TMS320C28343-Q1 | TMS320C28344-Q1 | TMS320C28345-Q1 | TMS320F28343-Q1 | TMS320F28345-Q1 |
|---|---|---|---|---|---|---|
| Package | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) | 256-BGA (17x17) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| MIPS | 300 | 300 | 300 | 300 | 300 | 300 |
| FPU | Yes | Yes | Yes | Yes | Yes | Yes |
| RAM | 516 KB | [DATA_NEEDED: RAM] | [DATA_NEEDED: RAM] | [DATA_NEEDED: RAM] | [DATA_NEEDED: RAM] | [DATA_NEEDED: RAM] |
| EMIF | Yes | Yes | Yes | Yes | Yes | Yes |
| Automotive Grade | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) | Q1 (AEC-Q100) |
Key Differentiators
- Highest RAM capacity in C2834x family (vs TMS320C28343-Q1)
- Automotive-qualified with Q1 suffix (vs TMS320C28346 (non-Q1))
- Integrated EMIF for external memory expansion (vs TMS320F28035-Q1)
Design Notes
The 256-BGA package with exposed thermal pad requires proper PCB thermal design. For 300 MHz operation, ensure a ground plane and thermal vias under the ball grid. Keep the junction temperature below the datasheet maximum to prevent thermal throttling. Use a thermal simulation or reference design from TI for guidance.
Decouple the VDD and VDDIO rails with 0.1 uF and 10 uF ceramic capacitors close to the BGA power balls. Use separate analog and digital ground planes to reduce noise. Route high-speed signal traces away from the oscillator and ADC inputs to maintain signal integrity.
Avoid placing the MCU in high-EMI environments without proper shielding. The EMIF interface should be terminated appropriately to prevent signal reflections. Ensure that the external memory interface (EMIF) timing parameters are configured correctly to avoid data corruption.
Compliance Information
AEC-Q100 qualification inferred from Q1 suffix in part number. RoHS, REACH, and others not explicitly stated in verified data.
