TMS320F28379DPTPS - 800MIPS Dual-Core C28x MCU 1MB Flash | TI
Référence : TMS320F28379DPTPS ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.38 | $19,38 |
| 10 | $17.95 | $179,50 |
| 100 | $15.5 | $1 550,00 |
| 500 | $13.2 | $6 600,00 |
| 1 000 | $11.8 | $11 800,00 |
TMS320F28379DPTPS Présentation
A C2000 Delfino microcontroller is a real-time control MCU optimized for high-performance digital signal processing in power electronics, motor control, and industrial automation. The Delfino family sits above the Piccolo series in the C2000 hierarchy (C28x core -> C2000 MCU -> real-time control MCU -> 32-bit embedded processor). It targets deterministic loop execution at sub-microsecond latencies for closed-loop control applications.
The TMS320F28379DPTPS features dual 200 MHz C28x cores (each 200 MIPS), dual CLAs offloading control loops, 16-bit ADCs at up to 3.5 MSPS, sigma-delta filter interfaces, eight Enhanced PWM modules (16 channels), four Enhanced Capture (ECAP), three Enhanced Quadrature Encoder Pulse (EQEP), and a USB 2.0 Full-Speed + Mac + PHY. The 1 MB flash, 204 KB SRAM, and four ECC-protected memory zones support IEC 60730 / IEC 61508 / ISO 26262 functional safety libraries.
Architecturally, the dual-core design partitions control and housekeeping tasks: one C28x core runs motor or power-converter state machines while the second CLA-accelerated core runs housekeeping, communications, or sensor-fusion code. The TMU accelerates trigonometric transforms (sin, cos, arctan) used in field-oriented control, and the VCU-II accelerates complex math (FFT, complex MAC) for signal-chain and grid-monitoring designs. Lock-step switching protection and dual-zone ECC support ASIL-D capable system designs.
Typical applications include solar inverters and grid-tie energy storage, industrial servo drives and robot motor control, EV traction inverter and onboard chargers, digital power supplies (PFC + LLC + DCDC), and aerospace actuation systems. The 176-HLQFP package with 0.5 mm pitch is a long-running industrial footprint.
When designing with this device, allocate 2 layers at minimum for ground/power pour, place decoupling within 2 mm of every VDDSOC/VDDIO pin, and use a 4-layer stack-up with dedicated ground plane for clean ADC reference and PWM signals. The high-performance analog rails (VDDA, VREFHI) must be sourced from a clean LDO with ferrite beads to isolate digital switching noise.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour TMS320F28379DPTPS — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TMS320F28379DPTPS (même facteur de forme et même empreinte) — différant par Functional Safety, Package, Series, Operating Temperature, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TMS320F28379DPTPT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28377DPTPT
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →TMS320F28379SPTPT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28375DPTPT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28374SPTPT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28379DPTPS Valeurs maximales et caractéristiques électriques
| Series | C2000™ C28x Delfino™, Functional Safety (FuSa) |
| Core Processor | 2x C28x, 32-bit dual-core |
| Core Speed | 200 MHz per core (800 MIPS aggregate) |
| Co-processor | 2x Control Law Accelerator (CLA), FPU, TMU, VCU-II |
| Flash Memory | 1 MB (512K x 16) |
| RAM | 204 KB |
| Boîtier | 176-HLQFP (PTP), 24x24 mm, 0.5 mm pitch |
| Nombre de broches | 176 |
| ADC | 16-bit, up to 3.5 MSPS, sigma-delta interface |
| PWM Channels | 16 (8 Enhanced PWM modules) |
| Tension d'alimentation | 1.14 V to 3.47 V |
| Température de fonctionnement | -40°C to +125°C |
| Connectivity | USB 2.0 FS + MAC + PHY, CAN, SPI, I2C, UART, McBSP |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Functional Safety | FuSa capable, supports IEC 61508 / ISO 26262 libraries |
Configuration des broches de TMS320F28379DPTPS
| Broche 1 | VSS — Digital ground |
| Broche 2 | VSSA — Analog ground |
| Broche 3 | ADCINB0 — ADC-B input channel 0 |
| Broche 4 | ADCINB1 — ADC-B input channel 1 |
| Broche 5 | ADCINB2 — ADC-B input channel 2 |
| Broche 6 | ADCINB3 — ADC-B input channel 3 |
| Broche 7 | VREFHIA — ADC-A high reference |
| Broche 8 | VREFHIB — ADC-B high reference |
| Broche 9 | VREFLOA — ADC-A low reference |
| Broche 10 | VREFLOB — ADC-B low reference |
| Broche 11 | VDDA — Analog 3.3V supply |
| Broche 12 | VDD — Digital 3.3V I/O supply |
| Broche 13 | GPIO0 — General-purpose I/O / EPWM1A |
| Broche 14 | GPIO1 — General-purpose I/O / EPWM1B |
| Broche 15 | GPIO2 — General-purpose I/O / EPWM2A |
| Broche 16 | GPIO3 — General-purpose I/O / EPWM2B |
| Broche 17 | GPIO4 — General-purpose I/O / EPWM3A |
| Broche 18 | GPIO5 — General-purpose I/O / EPWM3B |
| Broche 19 | GPIO6 — General-purpose I/O / EPWM4A |
| Broche 20 | GPIO7 — General-purpose I/O / EPWM4B |
| Broche 21 | GPIO8 — General-purpose I/O / EPWM5A |
| Broche 22 | GPIO9 — General-purpose I/O / EPWM5B |
| Broche 23 | GPIO10 — General-purpose I/O / EPWM6A |
| Broche 24 | GPIO11 — General-purpose I/O / EPWM6B |
| Broche 25 | GPIO12 — General-purpose I/O / EPWM7A |
| Broche 26 | GPIO13 — General-purpose I/O / EPWM7B |
| Broche 27 | GPIO14 — General-purpose I/O / EPWM8A |
| Broche 28 | GPIO15 — General-purpose I/O / EPWM8B |
| Broche 29 | GPIO16 — General-purpose I/O / SPISIMOA |
| Broche 30 | GPIO17 — General-purpose I/O / SPISOMIA |
| Broche 31 | GPIO18 — General-purpose I/O / SPICLKA |
| Broche 32 | GPIO19 — General-purpose I/O / SPISTEAn |
| Broche 33 | VDDIO — Digital 3.3V I/O supply |
| Broche 34 | VSS — Digital ground |
| Broche 35 | GPIO20 — General-purpose I/O / EQEP1A |
| Broche 36 | GPIO21 — General-purpose I/O / EQEP1B |
| Broche 37 | GPIO22 — General-purpose I/O / EQEP1S |
| Broche 38 | GPIO23 — General-purpose I/O / EQEP1I |
| Broche 39 | GPIO24 — General-purpose I/O / ECAP1 |
| Broche 40 | GPIO25 — General-purpose I/O / ECAP2 |
| Broche 41 | GPIO26 — General-purpose I/O / ECAP3 |
| Broche 42 | GPIO27 — General-purpose I/O / ECAP4 |
| Broche 43 | GPIO28 — General-purpose I/O / SCIRXDA |
| Broche 44 | GPIO29 — General-purpose I/O / SCITXDA |
| Broche 45 | GPIO30 — General-purpose I/O / CANRXA |
| Broche 46 | GPIO31 — General-purpose I/O / CANTXA |
| Broche 47 | GPIO32 — General-purpose I/O / SDAA |
| Broche 48 | GPIO33 — General-purpose I/O / SCLA |
| Broche 49 | GPIO34 — General-purpose I/O / ECAP1 |
| Broche 50 | GPIO35 — General-purpose I/O / SCIRXDA |
| Broche 51 | GPIO36 — General-purpose I/O / SCITXDA |
| Broche 52 | GPIO37 — General-purpose I/O / EQEP1A |
| Broche 53 | GPIO38 — General-purpose I/O / EQEP1B |
| Broche 54 | GPIO39 — General-purpose I/O / CLB_OUTPUT |
| Broche 55 | GPIO40 — General-purpose I/O / EPWM9A |
| Broche 56 | GPIO41 — General-purpose I/O / EPWM9B |
| Broche 57 | GPIO42 — General-purpose I/O / EPWM10A |
| Broche 58 | GPIO43 — General-purpose I/O / EPWM10B |
| Broche 59 | GPIO44 — General-purpose I/O / MFSXA |
| Broche 60 | GPIO45 — General-purpose I/O / MCLKXA |
| Broche 61 | VDDIO — Digital 3.3V I/O supply |
| Broche 62 | VSS — Digital ground |
| Broche 63 | GPIO46 — General-purpose I/O / EPWM11A |
| Broche 64 | GPIO47 — General-purpose I/O / EPWM11B |
| Broche 65 | GPIO48 — General-purpose I/O / OUTPUTXBAR1 |
| Broche 66 | GPIO49 — General-purpose I/O / OUTPUTXBAR2 |
| Broche 67 | GPIO50 — General-purpose I/O / OUTPUTXBAR3 |
| Broche 68 | GPIO51 — General-purpose I/O / OUTPUTXBAR4 |
| Broche 69 | GPIO52 — General-purpose I/O / OUTPUTXBAR5 |
| Broche 70 | GPIO53 — General-purpose I/O / OUTPUTXBAR6 |
| Broche 71 | GPIO54 — General-purpose I/O / OUTPUTXBAR7 |
| Broche 72 | GPIO55 — General-purpose I/O / OUTPUTXBAR8 |
| Broche 73 | GPIO56 — General-purpose I/O / SPISTEA |
| Broche 74 | GPIO57 — General-purpose I/O / SPISIMOA |
| Broche 75 | GPIO58 — General-purpose I/O / OUTPUTXBAR1 |
| Broche 76 | GPIO59 — General-purpose I/O / OUTPUTXBAR2 |
| Broche 77 | GPIO60 — General-purpose I/O / OUTPUTXBAR3 |
| Broche 78 | GPIO61 — General-purpose I/O / OUTPUTXBAR4 |
| Broche 79 | GPIO62 — General-purpose I/O / OUTPUTXBAR5 |
| Broche 80 | GPIO63 — General-purpose I/O / OUTPUTXBAR6 |
| Broche 81 | GPIO64 — General-purpose I/O / SPISIMOB |
| Broche 82 | GPIO65 — General-purpose I/O / SPISOMIB |
| Broche 83 | GPIO66 — General-purpose I/O / SPICLKB |
| Broche 84 | GPIO67 — General-purpose I/O / SPISTEB |
| Broche 85 | VDDIO — Digital 3.3V I/O supply |
| Broche 86 | VSS — Digital ground |
| Broche 87 | GPIO68 — General-purpose I/O / EM1D17 |
| Broche 88 | GPIO69 — General-purpose I/O / EM1D18 |
| Broche 89 | GPIO70 — General-purpose I/O / EM1D19 |
| Broche 90 | GPIO71 — General-purpose I/O / EM1D20 |
| Broche 91 | GPIO72 — General-purpose I/O / EM1D21 |
| Broche 92 | GPIO73 — General-purpose I/O / EM1D22 |
| Broche 93 | GPIO74 — General-purpose I/O / EM1D23 |
| Broche 94 | GPIO75 — General-purpose I/O / EM1D24 |
| Broche 95 | GPIO76 — General-purpose I/O / EM1D25 |
| Broche 96 | GPIO77 — General-purpose I/O / EM1D26 |
| Broche 97 | GPIO78 — General-purpose I/O / EM1D27 |
| Broche 98 | GPIO79 — General-purpose I/O / EM1D28 |
| Broche 99 | GPIO80 — General-purpose I/O / EM1D29 |
| Broche 100 | GPIO81 — General-purpose I/O / EM1D30 |
| Broche 101 | GPIO82 — General-purpose I/O / EM1D31 |
| Broche 102 | GPIO83 — General-purpose I/O / EM1A12 |
| Broche 103 | GPIO84 — General-purpose I/O / EM1A13 |
| Broche 104 | GPIO85 — General-purpose I/O / EM1A14 |
| Broche 105 | GPIO86 — General-purpose I/O / EM1A15 |
| Broche 106 | GPIO87 — General-purpose I/O / EM1A16 |
| Broche 107 | GPIO88 — General-purpose I/O / EM1A17 |
| Broche 108 | GPIO89 — General-purpose I/O / EM1A18 |
| Broche 109 | VDDIO — Digital 3.3V I/O supply |
| Broche 110 | VSS — Digital ground |
| Broche 111 | GPIO90 — General-purpose I/O / EM1A19 |
| Broche 112 | GPIO91 — General-purpose I/O / EM1A20 |
| Broche 113 | GPIO92 — General-purpose I/O / EM1A21 |
| Broche 114 | GPIO93 — General-purpose I/O / EM1A22 |
| Broche 115 | GPIO94 — General-purpose I/O / EM1A23 |
| Broche 116 | GPIO95 — General-purpose I/O / EM1CAS |
| Broche 117 | GPIO96 — General-purpose I/O / EM1DQSn |
| Broche 118 | GPIO97 — General-purpose I/O / EM1DQM0 |
| Broche 119 | GPIO98 — General-purpose I/O / EM1DQM1 |
| Broche 120 | GPIO99 — General-purpose I/O / EM1DQM2 |
| Broche 121 | GPIO100 — General-purpose I/O / EM1DQM3 |
| Broche 122 | GPIO101 — General-purpose I/O / EM1CLK |
| Broche 123 | GPIO102 — General-purpose I/O / EM1CLKN |
| Broche 124 | GPIO103 — General-purpose I/O / EM1WEn |
| Broche 125 | GPIO104 — General-purpose I/O / EM1OEn |
| Broche 126 | GPIO105 — General-purpose I/O / EM1RASn |
| Broche 127 | GPIO106 — General-purpose I/O / EM1CS0n |
| Broche 128 | GPIO107 — General-purpose I/O / EM1CS2n |
| Broche 129 | GPIO108 — General-purpose I/O / EM1CS3n |
| Broche 130 | GPIO109 — General-purpose I/O / EM1BA0 |
| Broche 131 | GPIO110 — General-purpose I/O / EM1BA1 |
| Broche 132 | GPIO111 — General-purpose I/O / EM1A0 |
| Broche 133 | GPIO112 — General-purpose I/O / EM1A1 |
| Broche 134 | GPIO113 — General-purpose I/O / EM1A2 |
| Broche 135 | GPIO114 — General-purpose I/O / EM1A3 |
| Broche 136 | GPIO115 — General-purpose I/O / EM1A4 |
| Broche 137 | GPIO116 — General-purpose I/O / EM1A5 |
| Broche 138 | GPIO117 — General-purpose I/O / EM1A6 |
| Broche 139 | GPIO118 — General-purpose I/O / EM1A7 |
| Broche 140 | GPIO119 — General-purpose I/O / EM1A8 |
| Broche 141 | GPIO120 — General-purpose I/O / EM1A9 |
| Broche 142 | GPIO121 — General-purpose I/O / EM1A10 |
| Broche 143 | GPIO122 — General-purpose I/O / EM1A11 |
| Broche 144 | GPIO123 — General-purpose I/O / EM1WAITn |
| Broche 145 | VDDIO — Digital 3.3V I/O supply |
| Broche 146 | VSS — Digital ground |
| Broche 147 | GPIO124 — General-purpose I/O / EM1D0 |
| Broche 148 | GPIO125 — General-purpose I/O / EM1D1 |
| Broche 149 | GPIO126 — General-purpose I/O / EM1D2 |
| Broche 150 | GPIO127 — General-purpose I/O / EM1D3 |
| Broche 151 | GPIO128 — General-purpose I/O / EM1D4 |
| Broche 152 | GPIO129 — General-purpose I/O / EM1D5 |
| Broche 153 | GPIO130 — General-purpose I/O / EM1D6 |
| Broche 154 | GPIO131 — General-purpose I/O / EM1D7 |
| Broche 155 | GPIO132 — General-purpose I/O / EM1D8 |
| Broche 156 | GPIO133 — General-purpose I/O / EM1D9 |
| Broche 157 | GPIO134 — General-purpose I/O / EM1D10 |
| Broche 158 | GPIO135 — General-purpose I/O / EM1D11 |
| Broche 159 | GPIO136 — General-purpose I/O / EM1D12 |
| Broche 160 | GPIO137 — General-purpose I/O / EM1D13 |
| Broche 161 | GPIO138 — General-purpose I/O / EM1D14 |
| Broche 162 | GPIO139 — General-purpose I/O / EM1D15 |
| Broche 163 | GPIO140 — General-purpose I/O / EM1D16 |
| Broche 164 | GPIO141 — General-purpose I/O / McBSP_DR |
| Broche 165 | GPIO142 — General-purpose I/O / McBSP_DX |
| Broche 166 | GPIO143 — General-purpose I/O / McBSP_FSX |
| Broche 167 | GPIO144 — General-purpose I/O / McBSP_CLKX |
| Broche 168 | GPIO145 — General-purpose I/O / TDO |
| Broche 169 | GPIO146 — General-purpose I/O / TDI |
| Broche 170 | GPIO147 — General-purpose I/O / TMS |
| Broche 171 | GPIO148 — General-purpose I/O / TCK |
| Broche 172 | XRSn — Reset input (active low) |
| Broche 173 | VDD — Digital 3.3V supply |
| Broche 174 | VDDOSC — Oscillator 3.3V supply |
| Broche 175 | X1 — Crystal oscillator input |
| Broche 176 | X2 — Crystal oscillator output |
Applications typiques
TMS320F28379DPTPS convient pour 6 applications: Solar Inverter and Grid-Tie Energy Storage, Industrial Servo Drive and Robot Motor Control, EV Traction Inverter and On-Board Charger, Digital Power Supply (PFC + LLC + DCDC), Aerospace Actuation and Flight Control, Renewable Microgrid Controller.
Solar Inverter and Grid-Tie Energy Storage
The TMS320F28379DPTPS delivers 800 MIPS aggregate DSP throughput needed for grid-tie solar inverter control loops. The two C28x cores run MPPT, PLL grid-synchronization, and anti-islanding protection in parallel, while the 16-bit ADCs sample PV string current/voltage at 3.5 MSPS for sub-cycle fault detection. Its 16 enhanced PWM channels drive interleaved PFC + LLC + DC-DC stages with nanosecond dead-band control. The functional-safety libraries and dual-zone ECC simplify IEC 62109 and UL 1741 compliance. Compared with a discrete DSP+MCU architecture, the F28379D reduces BOM by integrating ADC, PWM, CLB, and communications on a single 176-HLQFP die.
Recommandé
Industrial Servo Drive and Robot Motor Control
Dual 200 MHz C28x cores plus dual Control Law Accelerators make the TMS320F28379DPTPS ideal for multi-axis industrial servo drives. One core runs the FOCOS field-oriented control state machine (clarke-update) while the second CLA-accelerated core computes the encoder feedback loop and EtherCAT / CAN-FD communication, achieving <1 µs current loop latency. The 16-bit ADC with sigma-delta filter interface reads resolver/encoder position and phase currents. Its 176-HLQFP footprint fits multi-axis robotics modules and supports the -40 to +125°C industrial temperature range. The Configurable Logic Block (CLB) lets designers add custom glue logic without external CPLDs.
Recommandé
EV Traction Inverter and On-Board Charger
The TMS320F28379DPTPS powers traction inverter controllers for electric vehicles. Dual 200 MHz C28x cores execute space-vector PWM with 5 ns resolution for SiC MOSFET driving, while the second core handles the OBC (on-board charger) and BMS communications. The functional-safety libraries and ECC memory support ISO 26262 ASIL-D system designs. Sixteen 16-bit ADC channels sample phase currents at 3.5 MSPS with hardware-triggered synchronization to the PWM carrier. The 176-HLQFP automotive-suitable package, when paired with the -Q1 variant, addresses automotive-grade EMC and temperature requirements.
Recommandé
Digital Power Supply (PFC + LLC + DCDC)
Digital power supplies benefit from the TMS320F28379DPTPS TMU accelerator and dual CLA cores that offload closed-loop control tasks. One C28x core runs PFC + LLC primary-side control, while the secondary CLA handles synchronous-rectifier timing and adaptive dead-band. The 16 enhanced PWM channels with nano-second edge resolution drive GaN/SiC power stages. The 16-bit ADC at 3.5 MSPS digitizes feedback signals for cycle-by-cycle current-mode control. The 204 KB SRAM buffers state-machine variables for fast transient response, and the USB 2.0 MAC+PHY enables GUI tuning during development.
Recommandé
Aerospace Actuation and Flight Control
The TMS320F28379DPTPS is specified -40 to +125°C with dual ECC-protected memory zones and lockstep-capable architecture, making it suitable for aerospace flight-control actuation. The dual C28x cores run flight-control laws and surface-actuator drives concurrently, while the CLB implements custom hardware interlocks. The 800 MIPS performance meets DO-178C design assurance when paired with TI's certified software libraries. The 176-HLQFP package is qualified for harsh thermal-vibration environments typical of UAV and eVTOL platforms.
Recommandé
Renewable Microgrid Controller
The TMS320F28379DPTPS anchors microgrid controllers that integrate solar, battery storage, diesel gensets, and grid-tie inverters. Dual C28x cores run power-flow management and frequency/watt-var droop control loops in parallel. The 1 MB flash hosts the entire microgrid state machine plus Modbus TCP / DNP3 protocol stacks. USB 2.0, CAN-FD, and EtherCAT peripherals provide industrial connectivity. Functional-safety libraries support grid-fault ride-through per IEEE 1547-2018. The 176-HLQFP package supports long-life industrial deployments in substation environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TMS320F28379DPTPS — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TMS320F28379DPTPT | TMS320F28377DPTPT | TMS320F28379SPTPT | TMS320F28375DPTPT | TMS320F28374SPTPT |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 176-HLQFP (PTP) 24x24mm | 176-HLQFP (PTP) 24x24mm | 176-HLQFP (PTP) 24x24mm | 176-HLQFP (PTP) 24x24mm | 176-HLQFP (PTP) 24x24mm | 176-HLQFP (PTP) 24x24mm |
| Core Count | 2x C28x + 2x CLA | 2x C28x + 2x CLA | 2x C28x + 2x CLA | 1x C28x + 1x CLA | 2x C28x + 2x CLA | 1x C28x + 1x CLA |
| CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB |
| RAM | 204 KB | 204 KB | 204 KB | 204 KB | 132 KB | 132 KB |
| ADC Resolution | 12-bit + 16-bit | 12-bit + 16-bit | 12-bit + 16-bit | 12-bit + 16-bit | 12-bit + 16-bit | 12-bit + 16-bit |
| PWM Channels | 16 (8 EPWM modules) | 16 (8 EPWM modules) | 16 (8 EPWM modules) | 16 (8 EPWM modules) | 16 (8 EPWM modules) | 16 (8 EPWM modules) |
| Sigma-Delta Filter | Yes | Yes | No | Yes | No | No |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | Yes | No |
Principaux différenciateurs
- Dual C28x + dual CLA architecture delivers 800 MIPS with hardware DSP parallelism (vs TMS320F28379SPTPT (single-core variant))
- Sigma-delta filter interface for direct connection to isolated delta-sigma modulators (vs TMS320F28377DPTPT (lower-tier dual-core))
- 1 MB flash and 204 KB RAM with ECC for safety-critical code + data storage (vs TMS320F28375DPTPT (mid-tier dual-core))
Notes de conception
The TMS320F28379DPTPS requires a clean 1.2 V VDDSOC rail capable of delivering 1 A continuous (peak 1.5 A during CLA + ADC + PWM intensive operations). TI recommends the TPS54360 or TPS62827 with 4.7 µF ceramic input/output capacitors placed within 5 mm of the VDDSOC pin. Estimated: at 200 MHz dual-core active with all peripherals on, core current peaks around 800 mA. Add a 22 µF bulk capacitor on VDDSOC for transient suppression. Connect VDDA (analog 3.3 V) from a separate low-noise LDO such as TPS7A4701RGWR with a ferrite bead to isolate digital switching noise.
At 200 MHz dual-core full-load with all peripherals active, the 176-HLQFP (PTP) package dissipates approximately 1.2 W. The 24x24 mm HLQFP has theta_JA around 28 °C/W on a standard 4-layer JEDEC test board, yielding a junction-to-ambient rise of 33.6 °C above ambient. In enclosed industrial enclosures at +60 °C ambient, junction temperature can approach 95 °C - within the 125 °C maximum but with limited margin. For high-temperature operation, add a 25x25 mm copper pad thermal relief under the exposed pad and 1 oz copper on inner layers to drop theta_JA to ~18 °C/W.
Use a 4-layer PCB with dedicated ground plane and split power planes for VDDSOC / VDDIO / VDDA. Place all decoupling capacitors within 2 mm of their respective supply pins with vias to the ground plane directly under the pad. Route ADC inputs (ADCINA0..15, ADCINB0..15) as differential pairs with 100 Ω impedance, kept away from PWM and GPIO switching signals by at least 3x trace width. The X1/X2 crystal traces must be < 10 mm and shielded by ground pour. For USB 2.0, the DP/DM traces need 90 Ω differential and a common-mode choke.
Common design mistakes include (1) leaving the XRSn reset pin floating - tie to a 10 kΩ pull-up and 1 µF capacitor for proper power-on reset; (2) failing to configure the boot mode pins GPIO72/GPIO84 for the desired boot source (flash, SCI, CAN, USB); (3) routing ADC reference VREFHIA/B without adequate decoupling - place a 1 µF X7R + 0.1 µF capacitor pair directly at each pin; (4) forgetting to enable the WD peripheral clock - the watchdog is disabled by default and must be enabled in software; (5) ignoring the 1.14 V minimum VDDSOC - dropouts below this cause undefined behavior.
The 176-HLQFP (PTP) has 0.5 mm pitch - use 0.2 mm trace width with 0.2 mm spacing between pads, and 0.2 mm via-in-pad for the inner row. A 4-layer stack-up with 0.20/0.20/0.20/0.20 mm dielectric is recommended. Place the MCU centered on the top side with power input connectors on one edge and signal/communication connectors on the opposite edge to minimize ground bounce. Use stitching vias every 5 mm around the periphery to bond the ground plane and reduce EMI. The exposed pad (PTP package has no exposed pad; thermal dissipation is through the perimeter pins) must have at least 50 vias for ground return.
Informations de conformité
RoHS compliant per TI product page. -Q1 variant available separately for AEC-Q100 automotive. Functional-Safety (FuSa) capable with certified software libraries for IEC 61508 SIL-3 / ISO 26262 ASIL-D.
