TMS320F28379SPTPS - 200MHz C28x Delfino MCU 1MB Flash | TI
Référence : TMS320F28379SPTPS ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.42 | $38,42 |
| 10 | $34.58 | $345,80 |
| 100 | $30.74 | $3 074,00 |
| 500 | $27.91 | $13 955,00 |
| 1 000 | $25.1 | $25 100,00 |
TMS320F28379SPTPS Présentation
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, peripherals and I/O into one package. The C2000 Delfino family specifically targets real-time control: motor drives, digital power converters, solar inverters and industrial servo loops. The 2837xS generation adds a CLA - an independent 32-bit floating-point coprocessor that offloads time-critical control loops from the main CPU, allowing closed-loop PWM, ADC sampling and feedback math to execute deterministically without CPU intervention.
Key specifications include a 16-bit ADC subsystem with up to 3.5 MSPS aggregate throughput, three 12-bit DAC outputs, enhanced pulse-width modulator (ePWM) channels with high-resolution capability, configurable logic blocks (CLB), an external memory interface (EMIF), USB 2.0 (full-speed OTG), CAN, SPI, I2C, UART, McBSP and a 16-channel sigma-delta filter module. Functional-safety features include lockstep CPU options, ECC on flash/SRAM and a safety documentation package aligned with IEC 61508 SIL 3 and ISO 26262 ASIL-D system-level goals.
The architecture combines a Harvard-bus C28x core with the parallel CLA, both supporting IEEE-754 single-precision float. Tightly-coupled memory (TCM) and a multi-layer bus matrix give deterministic interrupt latency critical for field-oriented control (FOC) loops and digital power compensation. The configurable logic block (CLB) augments this with user-programmable glue logic that previously required external CPLDs.
Typical applications include industrial servo drives, AC induction and PMSM motor controllers, solar PV inverters, telecom rectifier modules, HEV/EV traction inverters, on-board chargers, digital power factor correction and welding power supplies. The 176-HLQFP footprint is also a common choice for power-conversion DSPs in 1U/2U telecom bricks.
When designing with this part, plan decoupling for the 1.2 V core rail: at least 10 µF bulk plus 0.1 µF per VDD pair, placed within 5 mm of the balls. Route the analog and digital ground domains separately and join them at a single point under the exposed pad. The HLQFP exposed pad must be soldered to a continuous copper plane of at least 1 square inch to keep junction temperature below 105 °C at full 200 MHz CPU + 200 MHz CLA load.
Alternatives de remplacement direct pour TMS320F28379SPTPS — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TMS320F28379SPTPS (même facteur de forme et même empreinte) — différant par Package, ADC, Flash Memory, Functional Safety, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TMS320F28379SPTPT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28379DPTPS
✅ Remplacement direct✓ En stock
$11.8 / unité
Voir la fiche technique →TMS320F28379SPZPS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28377SPTPS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28376DPTPS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28379SPTPSR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TMS320F28379SPTPS Valeurs maximales et caractéristiques électriques
| Series | C2000™ C28x Delfino™, Functional Safety (FuSa) |
| Core Processor | C28x (32-bit) |
| Co-Processor | CLA (Control Law Accelerator), 32-bit float |
| Coprocessors | FPU (single-precision IEEE-754), TMU |
| Operating Frequency | 200 MHz |
| MIPS | 400 MIPS (200 CPU + 200 CLA) |
| Program Memory | 1 MB (512K x 16) flash with ECC |
| SRAM | 164 KB |
| ADC | 16-bit, up to 3.5 MSPS |
| DAC | 3 x 12-bit |
| Tension d'alimentation | 1.2 V core / 3.3 V I/O |
| PWM Channels | ePWM with high-resolution extension |
| Communication Interfaces | USB 2.0 FS OTG, CAN, SPI, I2C, UART, McBSP |
| External Memory Interface | EMIF (async + SDRAM) |
| Boîtier | 176-HLQFP (24x24 mm) with exposed pad |
| Température de fonctionnement | -40 °C to +125 °C |
| Functional Safety | FuSa documentation, IEC 61508 / ISO 26262 support |
Configuration des broches de TMS320F28379SPTPS
| Broche 1 | VDD — 1.2 V core supply |
| Broche 2 | VSS — Ground |
| Broche 3 | GPIO0 — General-purpose I/O / EPWM1A |
| Broche 4 | GPIO1 — General-purpose I/O / EPWM1B |
| Broche 5 | GPIO2 — General-purpose I/O / EPWM2A |
| Broche 6 | GPIO3 — General-purpose I/O / EPWM2B |
| Broche 7 | GPIO4 — General-purpose I/O / EPWM3A |
| Broche 8 | GPIO5 — General-purpose I/O / EPWM3B |
| Broche 9 | GPIO6 — General-purpose I/O / EPWM4A |
| Broche 10 | GPIO7 — General-purpose I/O / EPWM4B |
| Broche 11 | GPIO8 — General-purpose I/O / EPWM5A |
| Broche 12 | GPIO9 — General-purpose I/O / EPWM5B |
| Broche 13 | GPIO10 — General-purpose I/O / EPWM6A |
| Broche 14 | GPIO11 — General-purpose I/O / EPWM6B |
| Broche 15 | GPIO12 — General-purpose I/O / TZ1 |
| Broche 16 | GPIO13 — General-purpose I/O / TZ2 |
| Broche 17 | GPIO14 — General-purpose I/O / TZ3 |
| Broche 18 | GPIO15 — General-purpose I/O / TZ4 (also XRS during reset) |
| Broche 19 | VDDIO — 3.3 V I/O supply |
| Broche 20 | VSS — Ground |
| Broche 21 | GPIO16 — General-purpose I/O / SPISIMOA |
| Broche 22 | GPIO17 — General-purpose I/O / SPISOMIA |
| Broche 23 | GPIO18 — General-purpose I/O / SPICLKA |
| Broche 24 | GPIO19 — General-purpose I/O / SPISTEA |
| Broche 25 | GPIO20 — General-purpose I/O / EQEP1A |
| Broche 26 | GPIO21 — General-purpose I/O / EQEP1B |
| Broche 27 | GPIO22 — General-purpose I/O / EQEP1I |
| Broche 28 | GPIO23 — General-purpose I/O / EQEP1S |
| Broche 29 | GPIO24 — General-purpose I/O / ECAP1 |
| Broche 30 | GPIO25 — General-purpose I/O / ECAP2 |
| Broche 31 | GPIO26 — General-purpose I/O / ECAP3 |
| Broche 32 | GPIO27 — General-purpose I/O / ECAP4 |
| Broche 33 | GPIO28 — General-purpose I/O / SCIRXDA |
| Broche 34 | GPIO29 — General-purpose I/O / SCITXDA |
| Broche 35 | GPIO30 — General-purpose I/O / CANRXA |
| Broche 36 | GPIO31 — General-purpose I/O / CANTXA |
| Broche 37 | VDD — 1.2 V core supply |
| Broche 38 | VSS — Ground |
| Broche 39 | GPIO32 — General-purpose I/O / SDAA |
| Broche 40 | GPIO33 — General-purpose I/O / SCLA |
| Broche 41 | GPIO34 — General-purpose I/O / EPWM7A |
| Broche 42 | GPIO35 — General-purpose I/O / EPWM7B |
| Broche 43 | GPIO36 — General-purpose I/O / EPWM8A |
| Broche 44 | GPIO37 — General-purpose I/O / EPWM8B |
| Broche 45 | GPIO38 — General-purpose I/O / EPWM9A |
| Broche 46 | GPIO39 — General-purpose I/O / EPWM9B |
| Broche 47 | GPIO40 — General-purpose I/O / EPWM10A |
| Broche 48 | GPIO41 — General-purpose I/O / EPWM10B |
| Broche 49 | GPIO42 — General-purpose I/O / EPWM11A |
| Broche 50 | GPIO43 — General-purpose I/O / EPWM11B |
| Broche 51 | GPIO44 — General-purpose I/O / MDRA |
| Broche 52 | GPIO45 — General-purpose I/O / MDOA |
| Broche 53 | GPIO46 — General-purpose I/O / MDRA / EMIF-related |
| Broche 54 | GPIO47 — General-purpose I/O / MDOA |
| Broche 55 | GPIO48 — General-purpose I/O / EMIF-CSn[0] |
| Broche 56 | GPIO49 — General-purpose I/O / EMIF-CSn[1] |
| Broche 57 | GPIO50 — General-purpose I/O / EMIF-CSn[2] |
| Broche 58 | GPIO51 — General-purpose I/O / EMIF-R/W |
| Broche 59 | GPIO52 — General-purpose I/O / EQEP2A |
| Broche 60 | GPIO53 — General-purpose I/O / EQEP2B |
| Broche 61 | GPIO54 — General-purpose I/O / SPISIMOB |
| Broche 62 | GPIO55 — General-purpose I/O / SPISOMIB |
| Broche 63 | GPIO56 — General-purpose I/O / SPICLKB |
| Broche 64 | GPIO57 — General-purpose I/O / SPISTEB |
| Broche 65 | VDD — 1.2 V core supply |
| Broche 66 | VSS — Ground |
| Broche 67 | GPIO58 — General-purpose I/O / EQEP2I |
| Broche 68 | GPIO59 — General-purpose I/O / EQEP2S |
| Broche 69 | GPIO60 — General-purpose I/O / ECAP5 |
| Broche 70 | GPIO61 — General-purpose I/O / ECAP6 |
| Broche 71 | GPIO62 — General-purpose I/O / SCIRXDB |
| Broche 72 | GPIO63 — General-purpose I/O / SCITXDB |
| Broche 73 | GPIO64 — General-purpose I/O / EMIF-A[0] |
| Broche 74 | GPIO65 — General-purpose I/O / EMIF-A[1] |
| Broche 75 | GPIO66 — General-purpose I/O / EMIF-A[2] |
| Broche 76 | GPIO67 — General-purpose I/O / EMIF-A[3] |
| Broche 77 | GPIO68 — General-purpose I/O / EMIF-A[4] |
| Broche 78 | GPIO69 — General-purpose I/O / EMIF-A[5] |
| Broche 79 | GPIO70 — General-purpose I/O / EMIF-A[6] |
| Broche 80 | GPIO71 — General-purpose I/O / EMIF-A[7] |
| Broche 81 | GPIO72 — General-purpose I/O / CANRXB |
| Broche 82 | GPIO73 — General-purpose I/O / CANTXB |
| Broche 83 | GPIO74 — General-purpose I/O / MCBSP-CLKX |
| Broche 84 | GPIO75 — General-purpose I/O / MCBSP-FSX |
| Broche 85 | GPIO76 — General-purpose I/O / MCBSP-DX |
| Broche 86 | GPIO77 — General-purpose I/O / MCBSP-DR |
| Broche 87 | GPIO78 — General-purpose I/O / EQEP3A |
| Broche 88 | GPIO79 — General-purpose I/O / EQEP3B |
| Broche 89 | GPIO80 — General-purpose I/O / EQEP3I |
| Broche 90 | GPIO81 — General-purpose I/O / EQEP3S |
| Broche 91 | GPIO82 — General-purpose I/O / ECAP7 |
| Broche 92 | GPIO83 — General-purpose I/O / ECAP8 |
| Broche 93 | GPIO84 — General-purpose I/O / McBSP-CLKX |
| Broche 94 | GPIO85 — General-purpose I/O / McBSP-FSX |
| Broche 95 | VDDIO — 3.3 V I/O supply |
| Broche 96 | VSS — Ground |
| Broche 97 | GPIO86 — General-purpose I/O / EMIF-A[8] |
| Broche 98 | GPIO87 — General-purpose I/O / EMIF-A[9] |
| Broche 99 | GPIO88 — General-purpose I/O / EMIF-A[10] |
| Broche 100 | GPIO89 — General-purpose I/O / EMIF-A[11] |
| Broche 101 | GPIO90 — General-purpose I/O / EMIF-A[12] |
| Broche 102 | GPIO91 — General-purpose I/O / EMIF-A[13] |
| Broche 103 | GPIO92 — General-purpose I/O / EMIF-A[14] |
| Broche 104 | GPIO93 — General-purpose I/O / EMIF-A[15] |
| Broche 105 | GPIO94 — General-purpose I/O / EMIF-BA0 |
| Broche 106 | GPIO95 — General-purpose I/O / EMIF-BA1 |
| Broche 107 | GPIO96 — General-purpose I/O / EMIF-D[0] |
| Broche 108 | GPIO97 — General-purpose I/O / EMIF-D[1] |
| Broche 109 | GPIO98 — General-purpose I/O / EMIF-D[2] |
| Broche 110 | GPIO99 — General-purpose I/O / EMIF-D[3] |
| Broche 111 | GPIO100 — General-purpose I/O / EMIF-D[4] |
| Broche 112 | GPIO101 — General-purpose I/O / EMIF-D[5] |
| Broche 113 | GPIO102 — General-purpose I/O / EMIF-D[6] |
| Broche 114 | GPIO103 — General-purpose I/O / EMIF-D[7] |
| Broche 115 | VDD — 1.2 V core supply |
| Broche 116 | VSS — Ground |
| Broche 117 | GPIO104 — General-purpose I/O / EMIF-D[8] |
| Broche 118 | GPIO105 — General-purpose I/O / EMIF-D[9] |
| Broche 119 | GPIO106 — General-purpose I/O / EMIF-D[10] |
| Broche 120 | GPIO107 — General-purpose I/O / EMIF-D[11] |
| Broche 121 | GPIO108 — General-purpose I/O / EMIF-D[12] |
| Broche 122 | GPIO109 — General-purpose I/O / EMIF-D[13] |
| Broche 123 | GPIO110 — General-purpose I/O / EMIF-D[14] |
| Broche 124 | GPIO111 — General-purpose I/O / EMIF-D[15] |
| Broche 125 | GPIO112 — General-purpose I/O / EMIF-CAS |
| Broche 126 | GPIO113 — General-purpose I/O / EMIF-RAS |
| Broche 127 | GPIO114 — General-purpose I/O / EMIF-DQMH |
| Broche 128 | GPIO115 — General-purpose I/O / EMIF-DQML |
| Broche 129 | GPIO116 — General-purpose I/O / USB0PFLT |
| Broche 130 | GPIO117 — General-purpose I/O / USB0PEXT |
| Broche 131 | GPIO118 — General-purpose I/O / USB0ID |
| Broche 132 | GPIO119 — General-purpose I/O / USB0VBUS |
| Broche 133 | GPIO120 — General-purpose I/O / USB0DM |
| Broche 134 | GPIO121 — General-purpose I/O / USB0DP |
| Broche 135 | VDDIO — 3.3 V I/O supply |
| Broche 136 | VSS — Ground |
| Broche 137 | GPIO122 — General-purpose I/O / SD-CSn |
| Broche 138 | GPIO123 — General-purpose I/O / SD-CK |
| Broche 139 | GPIO124 — General-purpose I/O / SD-DI |
| Broche 140 | GPIO125 — General-purpose I/O / SD-DO |
| Broche 141 | GPIO126 — General-purpose I/O / McBSP-CLKR |
| Broche 142 | GPIO127 — General-purpose I/O / McBSP-FSR |
| Broche 143 | XRS — Device reset (active low) |
| Broche 144 | VDDIO — 3.3 V I/O supply |
| Broche 145 | VSS — Ground |
| Broche 146 | GPIO128 — General-purpose I/O / SPIA-CLK alternate |
| Broche 147 | GPIO129 — General-purpose I/O / SPIA-SIMO alternate |
| Broche 148 | GPIO130 — General-purpose I/O / SPIA-SOMI alternate |
| Broche 149 | GPIO131 — General-purpose I/O / SPIA-STE alternate |
| Broche 150 | GPIO132 — General-purpose I/O / I2C-SDA |
| Broche 151 | GPIO133 — General-purpose I/O / I2C-SCL |
| Broche 152 | GPIO134 — General-purpose I/O / ECAP9 |
| Broche 153 | GPIO135 — General-purpose I/O / ECAP10 |
| Broche 154 | VDD — 1.2 V core supply |
| Broche 155 | VSS — Ground |
| Broche 156 | GPIO136 — General-purpose I/O / ECAP11 |
| Broche 157 | GPIO137 — General-purpose I/O / ECAP12 |
| Broche 158 | GPIO138 — General-purpose I/O / ECAP13 |
| Broche 159 | GPIO139 — General-purpose I/O / ECAP14 |
| Broche 160 | GPIO140 — General-purpose I/O / SCIRXDC |
| Broche 161 | GPIO141 — General-purpose I/O / SCITXDC |
| Broche 162 | GPIO142 — General-purpose I/O / I2C-SDA1 |
| Broche 163 | GPIO143 — General-purpose I/O / I2C-SCL1 |
| Broche 164 | VDDIO — 3.3 V I/O supply |
| Broche 165 | VSS — Ground |
| Broche 166 | GPIO144 — General-purpose I/O / ECAP15 |
| Broche 167 | GPIO145 — General-purpose I/O / TZ5 |
| Broche 168 | GPIO146 — General-purpose I/O / TZ6 |
| Broche 169 | GPIO147 — General-purpose I/O / TZ7 |
| Broche 170 | GPIO148 — General-purpose I/O / TZ8 |
| Broche 171 | GPIO149 — General-purpose I/O / McBSP-CLKR1 |
| Broche 172 | GPIO150 — General-purpose I/O / McBSP-FSR1 |
| Broche 173 | GPIO151 — General-purpose I/O / McBSP-DR1 |
| Broche 174 | GPIO152 — General-purpose I/O / McBSP-DX1 |
| Broche 175 | GPIO153 — General-purpose I/O / XCLKOUT |
| Broche 176 | EP — Exposed thermal pad - solder to ground plane |
Applications typiques
TMS320F28379SPTPS convient pour 7 applications: Industrial Servo Drives and PMSM Motor Control, Solar Photovoltaic Inverters and DC/DC Converters, On-Board Chargers (OBC) for EV/HEV, Telecom Rectifier and Digital Power Conversion, Industrial Welding and Plasma Power Supplies, Medical Imaging and Diagnostic Equipment, Aviation and Aerospace Power Conversion.
Industrial Servo Drives and PMSM Motor Control
The TMS320F28379SPTPS is purpose-built for high-performance PMSM and AC induction motor control. Its 200 MHz C28x CPU plus 200 MHz CLA coprocessor execute field-oriented control (FOC) loops in parallel, achieving sub-microsecond torque-loop bandwidth. The 16-bit ADC at 3.5 MSPS captures phase currents with sufficient resolution for high-speed FOC, while the high-resolution ePWM module generates switching frequencies beyond 200 kHz for low-EMI, high-efficiency inverters. Compared with a Cortex-M4F MCU, the 28379S offers dedicated motor-control peripherals and a CLA that runs deterministic control math without CPU contention, making it a top choice for industrial servo, robotics and CNC machines.
Recommandé
Solar Photovoltaic Inverters and DC/DC Converters
In PV inverter and bidirectional DC/DC converter designs, the TMS320F28379SPTPS performs MPPT, inverter modulation and grid-synchronization control. Its FPU handles fast trigonometric math for SVPWM, while the TMU accelerates sin/cos/atan calculations used in PLL and grid-current shaping. The EMIF allows external SDRAM buffering of grid-waveform data, and the 12-bit DACs drive analog setpoints or reference signals. Engineers pick this MCU over generic ARM parts because the integrated CLA removes CPU bottlenecks when running MPPT, PLL and current loop concurrently at 16-32 kHz switching frequencies.
Recommandé
On-Board Chargers (OBC) for EV/HEV
The TMS320F28379SPTPS powers digital-control onboard chargers and traction inverter controllers for electric vehicles. Its functional-safety package (IEC 61508 / ISO 26262 alignment, ECC on flash and SRAM, dual-zone watchdog) supports ASIL-D system-level designs when paired with a safety companion MCU. The 1 MB flash holds OBC state machines, PFC algorithms and LLC or DAB control code, while the CLA offloads the high-frequency current loop. Compared with smaller C2000 parts, the 28379S provides the memory headroom for advanced charging profiles such as ISO 15118 and V2G negotiation stacks.
Recommandé
Telecom Rectifier and Digital Power Conversion
In 48 V telecom rectifier and intermediate-bus converter modules, the TMS320F28379SPTPS drives digital PFC and LLC resonant topologies. The ePWM high-resolution module produces phase-shifted PWM with picosecond-edge placement, which improves LLC efficiency and reduces circulating current. USB 2.0 OTG enables firmware updates in the field, while the EMIF allows external NVM to log PMBus telemetry. Versus a fixed-function PFC controller, this MCU lets designers add adaptive dead-time optimization, dynamic efficiency scaling and digital soft-start without external logic.
Recommandé
Industrial Welding and Plasma Power Supplies
Welding inverters and plasma-cut power supplies demand tightly-regulated arc current and fast dynamic response, both delivered by the TMS320F28379SPTPS. The CLA handles the arc-current loop while the CPU runs the user-interface, current-shaping profile and protection logic. The 16-bit ADC measures arc voltage and current at high sample rates, and the CLB implements custom comparator logic for arc-detection. This MCU is preferred over slower Cortex-M parts because its deterministic interrupt latency and high-resolution PWM enable arc stability at low current setpoints.
Recommandé
Medical Imaging and Diagnostic Equipment
In medical imaging front-ends (ultrasound beamformers, MRI gradient controllers) and laboratory diagnostic instruments, the TMS320F28379SPTPS provides DSP-class performance with the safety documentation required by IEC 60601 / IEC 61508. Its 200 MHz CPU plus CLA deliver deterministic signal-processing throughput, and the 1 MB flash allows firmware-resident calibration tables. The 12-bit DACs and 16-bit ADCs interface directly with transducer analog front-ends, eliminating external DSP chips. Compared with generic MCUs, the 28379S offers functional-safety collateral that reduces system-level certification cost.
Recommandé
Aviation and Aerospace Power Conversion
The TMS320F28379SPTPS appears in aviation and aerospace power-electronics modules, including 28 V DC-to-DC converters for avionics, electric-actuation motor controllers and flight-control actuators. Its -40 °C to +125 °C operating range covers aerospace thermal environments, and the functional-safety package supports DO-178C and DO-254 hardware development when paired with documented software processes. The 1 MB flash accommodates DO-178C firmware with margin, while the CLA enables parallel execution of control and health-monitoring loops on a single MCU, reducing board area and weight.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TMS320F28379SPTPS — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TMS320F28379SPTPT | TMS320F28379DPTPS | TMS320F28379SPZPS | TMS320F28377SPTPS | TMS320F28376DPTPS |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 176-HLQFP (24x24) | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same |
| Core | C28x 32-bit + CLA | C28x 32-bit + CLA | C28x 32-bit dual-core + CLA | C28x 32-bit + CLA | C28x 32-bit + CLA | C28x 32-bit dual-core + CLA |
| Operating Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB (-50%) |
| SRAM | 164 KB | 164 KB | 164 KB | 164 KB | 164 KB | 102 KB |
| Functional Safety | FuSa single-core | FuSa single-core | Dual-core lockstep | FuSa single-core | FuSa single-core | Dual-core lockstep |
| ADC | 16-bit, 3.5 MSPS | 16-bit, 3.5 MSPS | 16-bit, 3.5 MSPS | 16-bit, 3.5 MSPS | 16-bit, 3.0 MSPS | 16-bit, 3.0 MSPS |
| CLB (Configurable Logic Block) | Yes | Yes | Yes | Yes | Reduced | Reduced |
| Approx. Unit Price (qty 1) | $38.42 | $38.42 (same) | $48-52 (est.) | $38.42 (same) | $30-34 (est.) | $42-46 (est.) |
Principaux différenciateurs
- Dual-processor architecture with independent CLA coprocessor (vs TMS320F28376DPTPS)
- 1 MB ECC flash vs reduced flash on lower-tier C2000s (vs TMS320F28376DPTPS)
- Configurable Logic Block (CLB) on-chip (vs TMS320F28377SPTPS)
Notes de conception
The TMS320F28379SPTPS requires a 1.2 V core rail and a 3.3 V I/O rail. Per TI's TMS320F2837xS datasheet, decouple each VDD pin with a 0.1 µF ceramic placed within 5 mm of the lead, and add a single 10 µF bulk ceramic on each rail. Power-up sequencing: 3.3 V must ramp before or simultaneously with 1.2 V; failure to do so risks ESD-diode latch-up. Use a power-supply supervisor (e.g. TPS3823) to hold the XRS reset pin low until both rails reach regulation.
Estimated: at 200 MHz CPU + 200 MHz CLA with 1.2 V core draw of roughly 350 mA active, internal dissipation is about 0.42 W. The 176-HLQFP with exposed pad has θJA ≈ 18 °C/W on a JEDEC 4-layer board with a 9-thermal-via array under the EP. Junction temperature rise is therefore roughly 7.6 °C above ambient, comfortably within the -40 °C to +125 °C operating range. Solder the exposed pad to a continuous copper plane of at least 1 square inch with ≥9 thermal vias to a bottom-side heat-spreader for reliable operation in enclosed industrial enclosures.
Route the analog ADC inputs and the digital GPIO traces on separate layers to minimize digital-to-analog coupling. TI's Hardware Design Guide for F2837xS recommends a 4-layer stack-up with the top layer dedicated to MCU routing and a dedicated ground layer directly underneath. Keep the 16 MHz crystal traces within 5 mm of the X1/X2 pins, surrounded by a ground guard ring. The EMIF bus to external SDRAM should be length-matched within ±50 mil across D[0:15], address and control lines; otherwise double-data-rate read/write strobes can fail timing margins.
Avoid using the GPIO pins in their default boot-mode configuration without consulting the GPIO mux table - several pins default to JTAG or EMIF functions and will not behave as plain GPIO on reset. Always read the Boot-ROM configuration in the datasheet to ensure the GPIO you intend to use is not held by the boot-mode pull-ups. A second common pitfall is omitting the boot-mode pull-down on the TRST pin; this can cause JTAG to enter an undefined state and lock up the debug port. Add a 2.2 kΩ pull-down on TRST if JTAG is unused in production.
Informations de conformité
Functional-safety documentation aligned with IEC 61508 and ISO 26262 available from TI per the C2000 Safety Package; AEC-Q100 is not applicable as this is an industrial-grade MCU. Halogen-free per TI's product environmental compliance report.
