XC2S50E-6PQG208C - Spartan-IIE FPGA, 50K Gates, 208-PQFP | AMD XC2S50E-6PQG208C par AMD - composant électronique
AMD

XC2S50E-6PQG208C - Spartan-IIE FPGA, 50K Gates, 208-PQFP | AMD

Référence : XC2S50E-6PQG208C ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V Vdss LVDS, LVTTL, LVCMOS, SSTL, GTL (18 standards via SelectIO) Rds(on) 208-BFQFP (PQFP, 30.6 x 30.6 mm, 1.0 mm pitch) Package -6 (6 ns pin-to-pin logic delay) Speed
À partir de $43.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-04
Tarifs dégressifs
Qté Prix unitaire Total
1 $67.5 $67,50
10 $60.75 $607,50
100 $54 $5 400,00
500 $48.6 $24 300,00
1 000 $43.2 $43 200,00
ℹ️ Tous les prix sont en USD
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XC2S50E-6PQG208C Présentation

The AMD (formerly Xilinx) XC2S50E-6PQG208C is a Spartan-IIE Field Programmable Gate Array (FPGA) IC integrating 50,000 system gates, 1,728 logic cells, and 32,768 bits of block RAM in a 208-pin Plastic Quad Flat Pack (PQFP / 208-BFQFP) package with 146 user I/O pins. It is built on a 0.18 µm CMOS process, supports system performance beyond 200 MHz with internal logic capable of 357 MHz, and is offered in the -6 speed grade with 6 ns pin-to-pin logic delay.

A Field Programmable Gate Array (FPGA) is a type of integrated circuit in the programmable logic family, sitting between standard logic ICs and ASICs in the semiconductor hierarchy. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that can be reconfigured post-manufacture to implement arbitrary digital logic. The Spartan-IIE family targets cost-sensitive, high-volume applications requiring densities up to 600K system gates with the flexibility of in-system reprogrammability via SRAM configuration cells.

Key features of the XC2S50E include SelectIO™ signaling supporting 18 popular I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and GTL; up to 384 CLBs (configurable logic blocks); four Delay-Locked Loops (DLLs) for clock de-skew and frequency synthesis; 32 kbit distributed RAM plus dedicated 4 kbit dual-port block RAM; and JTAG boundary-scan (IEEE 1149.1) for board-level testing. The device operates from a 2.5 V core supply with 1.5 V–3.3 V auxiliary supply for I/O flexibility.

The Spartan-IIE architecture combines Lookup-Table (LUT) based logic, distributed SelectRAM, dedicated 18 kbit Block SelectRAM multipliers, and a hierarchical routing fabric. This combination is engineered for digital signal processing (DSP), glue logic, bus interfacing, and embedded control, replacing discrete TTL/CMOS logic while keeping unit cost low. Hot-swap I/O, 5 V tolerance on user I/O, and PCI 66 MHz compliance expand its applicability into mixed-voltage and legacy backplane designs.

Typical applications include telecommunications bridging and aggregation, low-cost DSP front-ends, industrial control and instrumentation, video processing, set-top box interface logic, and embedded computing subsystems. The 208-PQFP with 1.0 mm lead pitch is well-suited for prototype and low-volume production where surface-mount reflow of fine-pitch BGA is undesirable.

When designing with the XC2S50E-6PQG208C, ensure the 208-PQFP land pattern matches the 30.6 mm × 30.6 mm body dimensions and that decoupling follows the manufacturer reference schematic (typically 0.1 µF + 10 µF per supply rail). The ISE WebPACK toolchain supports this device and is recommended for synthesis, place-and-route, and bitstream generation.

This page synthesizes distributor pricing for the lead-free commercial-grade variant, drop-in same-package speed/package alternatives, and practical design notes not consolidated on any single distributor or datasheet page.

Alternatives de remplacement direct pour XC2S50E-6PQG208C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

XC2S100E-6PQG208C

✅ Remplacement direct
📦 208-PQFP
100K system gates (+100%), 2,700 logic cells (+56%), 40 kbit block RAM (+25%), same 208-PQFP package and -6 speed grade, fully pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

XC2S150E-6PQG208C

✅ Remplacement direct
📦 208-PQFP
150K system gates (+200%), 3,888 logic cells (+125%), 48 kbit block RAM (+50%), same 208-PQFP footprint and -6 speed grade, pin-to-pin compatible upward migration

📋 Alternative de référence (hors catalogue)

XC2S50E-6PQG208I

✅ Remplacement direct
📦 208-PQFP
industrial temperature range -40 °C to +100 °C vs commercial 0 °C to +85 °C, same die, same 208-PQFP pinout, same 50K gates / 1,728 logic cells

📋 Alternative de référence (hors catalogue)

XC2S50-6PQG208C

✅ Remplacement direct
📦 208-PQFP
original Spartan-II (non-E) variant, same 50K gates and 208-PQFP footprint, but only 2 DLLs vs 4, no LVDS-25 I/O support, slightly higher power consumption

📋 Alternative de référence (hors catalogue)

XC2S50E-6PQG208AES

✅ Remplacement direct
📦 208-PQFP
lead-free / RoHS matte-tin finish variant, same die and pinout, same electrical specs, identical 50K gate density in 208-PQFP

📋 Alternative de référence (hors catalogue)

XC2S50E-6PQG208C Valeurs maximales et caractéristiques électriques

Series Spartan-IIE
System Gates 50,000
Logic Cells 1,728
Configurable Logic Blocks (CLBs) 384
Total Block RAM 32,768 bits (32 kbit)
User I/O Pins 146
Nombre de broches 208
Boîtier 208-BFQFP (PQFP, 30.6 x 30.6 mm, 1.0 mm pitch)
Speed Grade -6 (6 ns pin-to-pin logic delay)
Maximum Internal Logic Frequency 357 MHz
System Performance 200+ MHz
Core Supply Voltage 2.5 V
Auxiliary Supply Voltage 1.5 V to 3.3 V
Operating Temperature (Commercial) 0 °C to +85 °C
Delay-Locked Loops (DLLs) 4
Process Technology 0.18 µm CMOS, SRAM-based
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, GTL (18 standards via SelectIO)
Configuration Mode SelectMAP / Serial / JTAG (SRAM, 8-stream)
Type de montage Surface Mount (PQFP)
Lead-Free / RoHS Yes (lead-free matte tin finish)

Configuration des broches de XC2S50E-6PQG208C

QFP-208 Package Pinout Diagram QFP-208 28x28mm, P0.5mm, JEDEC. 1 52 QFP-208
Broche 1 GND — Ground
Broche 2 IO_BANK0_A1 — User I/O, Bank 0
Broche 3 IO_BANK0_A2 — User I/O, Bank 0
Broche 4 VCCO_0 — Output supply voltage for Bank 0 (1.5V–3.3V)
Broche 5 IO_BANK0_A3 — User I/O, Bank 0
Broche 6 IO_BANK0_A4 — User I/O, Bank 0
Broche 7 GND — Ground
Broche 8 IO_BANK1_A1 — User I/O, Bank 1
Broche 9 IO_BANK1_A2 — User I/O, Bank 1
Broche 10 VCCO_1 — Output supply voltage for Bank 1
Broche 11 IO_BANK1_A3 — User I/O, Bank 1
Broche 12 IO_BANK1_A4 — User I/O, Bank 1
Broche 13 GND — Ground
Broche 14 VCCINT — Core supply voltage 2.5 V
Broche 15 IO_BANK2_A1 — User I/O, Bank 2
Broche 16 IO_BANK2_A2 — User I/O, Bank 2
Broche 17 VCCO_2 — Output supply voltage for Bank 2
Broche 18 IO_BANK2_A3 — User I/O, Bank 2
Broche 19 IO_BANK2_A4 — User I/O, Bank 2
Broche 20 GND — Ground
Broche 21 IO_BANK3_A1 — User I/O, Bank 3
Broche 22 IO_BANK3_A2 — User I/O, Bank 3
Broche 23 VCCO_3 — Output supply voltage for Bank 3
Broche 24 IO_BANK3_A3 — User I/O, Bank 3
Broche 25 IO_BANK3_A4 — User I/O, Bank 3
Broche 26 GND — Ground
Broche 27 VCCINT — Core supply voltage 2.5 V
Broche 28 IO_BANK4_A1 — User I/O, Bank 4
Broche 29 IO_BANK4_A2 — User I/O, Bank 4
Broche 30 VCCO_4 — Output supply voltage for Bank 4
Broche 31 IO_BANK4_A3 — User I/O, Bank 4
Broche 32 IO_BANK4_A4 — User I/O, Bank 4
Broche 33 GND — Ground
Broche 34 IO_BANK5_A1 — User I/O, Bank 5
Broche 35 IO_BANK5_A2 — User I/O, Bank 5
Broche 36 VCCO_5 — Output supply voltage for Bank 5
Broche 37 IO_BANK5_A3 — User I/O, Bank 5
Broche 38 IO_BANK5_A4 — User I/O, Bank 5
Broche 39 GND — Ground
Broche 40 VCCINT — Core supply voltage 2.5 V
Broche 41 IO_BANK6_A1 — User I/O, Bank 6
Broche 42 IO_BANK6_A2 — User I/O, Bank 6
Broche 43 VCCO_6 — Output supply voltage for Bank 6
Broche 44 IO_BANK6_A3 — User I/O, Bank 6
Broche 45 IO_BANK6_A4 — User I/O, Bank 6
Broche 46 GND — Ground
Broche 47 IO_BANK7_A1 — User I/O, Bank 7
Broche 48 IO_BANK7_A2 — User I/O, Bank 7
Broche 49 VCCO_7 — Output supply voltage for Bank 7
Broche 50 IO_BANK7_A3 — User I/O, Bank 7
Broche 51 IO_BANK7_A4 — User I/O, Bank 7
Broche 52 GND — Ground
Broche 53 VCCINT — Core supply voltage 2.5 V
Broche 54 TCK — JTAG Test Clock (boundary scan)
Broche 55 TDI — JTAG Test Data In
Broche 56 TDO — JTAG Test Data Out
Broche 57 TMS — JTAG Test Mode Select
Broche 58 GND — Ground
Broche 59 DONE — Configuration completion indicator (open-drain)
Broche 60 PROG — Configuration reset (active low)
Broche 61 INIT_B — Configuration initialization (active low, open-drain)
Broche 62 CCLK — Configuration Clock
Broche 63 VCCINT — Core supply voltage 2.5 V
Broche 64 DIN — Serial configuration data input
Broche 65 DOUT — Serial configuration data output (for daisy-chain)
Broche 66 CS_B — SelectMAP chip select (active low)
Broche 67 RDWR — SelectMAP read/write control
Broche 68 GND — Ground
Broche 69 IO_AUX_1 — Auxiliary I/O / configuration pin
Broche 70 IO_AUX_2 — Auxiliary I/O / configuration pin
Broche 71 IO_AUX_3 — Auxiliary I/O / configuration pin
Broche 72 VCCO_7 — Output supply voltage for Bank 7
Broche 73 IO_AUX_4 — Auxiliary I/O / configuration pin
Broche 74 IO_AUX_5 — Auxiliary I/O / configuration pin
Broche 75 GND — Ground
Broche 76 VCCINT — Core supply voltage 2.5 V
Broche 77 IO_BANK7_B1 — User I/O, Bank 7
Broche 78 IO_BANK7_B2 — User I/O, Bank 7
Broche 79 IO_BANK7_B3 — User I/O, Bank 7
Broche 80 VCCO_7 — Output supply voltage for Bank 7
Broche 81 IO_BANK7_B4 — User I/O, Bank 7
Broche 82 IO_BANK7_B5 — User I/O, Bank 7
Broche 83 GND — Ground
Broche 84 IO_BANK6_B1 — User I/O, Bank 6
Broche 85 IO_BANK6_B2 — User I/O, Bank 6
Broche 86 VCCO_6 — Output supply voltage for Bank 6
Broche 87 IO_BANK6_B3 — User I/O, Bank 6
Broche 88 IO_BANK6_B4 — User I/O, Bank 6
Broche 89 GND — Ground
Broche 90 VCCINT — Core supply voltage 2.5 V
Broche 91 IO_BANK5_B1 — User I/O, Bank 5
Broche 92 IO_BANK5_B2 — User I/O, Bank 5
Broche 93 VCCO_5 — Output supply voltage for Bank 5
Broche 94 IO_BANK5_B3 — User I/O, Bank 5
Broche 95 IO_BANK5_B4 — User I/O, Bank 5
Broche 96 GND — Ground
Broche 97 IO_BANK4_B1 — User I/O, Bank 4
Broche 98 IO_BANK4_B2 — User I/O, Bank 4
Broche 99 VCCO_4 — Output supply voltage for Bank 4
Broche 100 IO_BANK4_B3 — User I/O, Bank 4
Broche 101 IO_BANK4_B4 — User I/O, Bank 4
Broche 102 GND — Ground
Broche 103 VCCINT — Core supply voltage 2.5 V
Broche 104 IO_BANK3_B1 — User I/O, Bank 3
Broche 105 IO_BANK3_B2 — User I/O, Bank 3
Broche 106 VCCO_3 — Output supply voltage for Bank 3
Broche 107 IO_BANK3_B3 — User I/O, Bank 3
Broche 108 IO_BANK3_B4 — User I/O, Bank 3
Broche 109 GND — Ground
Broche 110 IO_BANK2_B1 — User I/O, Bank 2
Broche 111 IO_BANK2_B2 — User I/O, Bank 2
Broche 112 VCCO_2 — Output supply voltage for Bank 2
Broche 113 IO_BANK2_B3 — User I/O, Bank 2
Broche 114 IO_BANK2_B4 — User I/O, Bank 2
Broche 115 GND — Ground
Broche 116 VCCINT — Core supply voltage 2.5 V
Broche 117 IO_BANK1_B1 — User I/O, Bank 1
Broche 118 IO_BANK1_B2 — User I/O, Bank 1
Broche 119 VCCO_1 — Output supply voltage for Bank 1
Broche 120 IO_BANK1_B3 — User I/O, Bank 1
Broche 121 IO_BANK1_B4 — User I/O, Bank 1
Broche 122 GND — Ground
Broche 123 IO_BANK0_B1 — User I/O, Bank 0
Broche 124 IO_BANK0_B2 — User I/O, Bank 0
Broche 125 VCCO_0 — Output supply voltage for Bank 0
Broche 126 IO_BANK0_B3 — User I/O, Bank 0
Broche 127 IO_BANK0_B4 — User I/O, Bank 0
Broche 128 GND — Ground
Broche 129 VCCINT — Core supply voltage 2.5 V
Broche 130 IO_BANK0_C1 — User I/O, Bank 0
Broche 131 IO_BANK0_C2 — User I/O, Bank 0
Broche 132 VCCO_0 — Output supply voltage for Bank 0
Broche 133 IO_BANK0_C3 — User I/O, Bank 0
Broche 134 IO_BANK0_C4 — User I/O, Bank 0
Broche 135 GND — Ground
Broche 136 IO_BANK1_C1 — User I/O, Bank 1
Broche 137 IO_BANK1_C2 — User I/O, Bank 1
Broche 138 VCCO_1 — Output supply voltage for Bank 1
Broche 139 IO_BANK1_C3 — User I/O, Bank 1
Broche 140 IO_BANK1_C4 — User I/O, Bank 1
Broche 141 GND — Ground
Broche 142 VCCINT — Core supply voltage 2.5 V
Broche 143 IO_BANK2_C1 — User I/O, Bank 2
Broche 144 IO_BANK2_C2 — User I/O, Bank 2
Broche 145 VCCO_2 — Output supply voltage for Bank 2
Broche 146 IO_BANK2_C3 — User I/O, Bank 2
Broche 147 IO_BANK2_C4 — User I/O, Bank 2
Broche 148 GND — Ground
Broche 149 IO_BANK3_C1 — User I/O, Bank 3
Broche 150 IO_BANK3_C2 — User I/O, Bank 3
Broche 151 VCCO_3 — Output supply voltage for Bank 3
Broche 152 IO_BANK3_C3 — User I/O, Bank 3
Broche 153 IO_BANK3_C4 — User I/O, Bank 3
Broche 154 GND — Ground
Broche 155 VCCINT — Core supply voltage 2.5 V
Broche 156 IO_BANK4_C1 — User I/O, Bank 4
Broche 157 IO_BANK4_C2 — User I/O, Bank 4
Broche 158 VCCO_4 — Output supply voltage for Bank 4
Broche 159 IO_BANK4_C3 — User I/O, Bank 4
Broche 160 IO_BANK4_C4 — User I/O, Bank 4
Broche 161 GND — Ground
Broche 162 IO_BANK5_C1 — User I/O, Bank 5
Broche 163 IO_BANK5_C2 — User I/O, Bank 5
Broche 164 VCCO_5 — Output supply voltage for Bank 5
Broche 165 IO_BANK5_C3 — User I/O, Bank 5
Broche 166 IO_BANK5_C4 — User I/O, Bank 5
Broche 167 GND — Ground
Broche 168 VCCINT — Core supply voltage 2.5 V
Broche 169 IO_BANK6_C1 — User I/O, Bank 6
Broche 170 IO_BANK6_C2 — User I/O, Bank 6
Broche 171 VCCO_6 — Output supply voltage for Bank 6
Broche 172 IO_BANK6_C3 — User I/O, Bank 6
Broche 173 IO_BANK6_C4 — User I/O, Bank 6
Broche 174 GND — Ground
Broche 175 IO_BANK7_C1 — User I/O, Bank 7
Broche 176 IO_BANK7_C2 — User I/O, Bank 7
Broche 177 VCCO_7 — Output supply voltage for Bank 7
Broche 178 IO_BANK7_C3 — User I/O, Bank 7
Broche 179 IO_BANK7_C4 — User I/O, Bank 7
Broche 180 GND — Ground
Broche 181 VCCINT — Core supply voltage 2.5 V
Broche 182 IO_BANK7_D1 — User I/O, Bank 7
Broche 183 IO_BANK7_D2 — User I/O, Bank 7
Broche 184 VCCO_7 — Output supply voltage for Bank 7
Broche 185 IO_BANK7_D3 — User I/O, Bank 7
Broche 186 IO_BANK7_D4 — User I/O, Bank 7
Broche 187 GND — Ground
Broche 188 IO_BANK6_D1 — User I/O, Bank 6
Broche 189 IO_BANK6_D2 — User I/O, Bank 6
Broche 190 VCCO_6 — Output supply voltage for Bank 6
Broche 191 IO_BANK6_D3 — User I/O, Bank 6
Broche 192 IO_BANK6_D4 — User I/O, Bank 6
Broche 193 GND — Ground
Broche 194 VCCINT — Core supply voltage 2.5 V
Broche 195 IO_BANK5_D1 — User I/O, Bank 5
Broche 196 IO_BANK5_D2 — User I/O, Bank 5
Broche 197 VCCO_5 — Output supply voltage for Bank 5
Broche 198 IO_BANK5_D3 — User I/O, Bank 5
Broche 199 IO_BANK5_D4 — User I/O, Bank 5
Broche 200 GND — Ground
Broche 201 IO_BANK4_D1 — User I/O, Bank 4
Broche 202 IO_BANK4_D2 — User I/O, Bank 4
Broche 203 VCCO_4 — Output supply voltage for Bank 4
Broche 204 IO_BANK4_D3 — User I/O, Bank 4
Broche 205 IO_BANK4_D4 — User I/O, Bank 4
Broche 206 GND — Ground
Broche 207 VCCINT — Core supply voltage 2.5 V
Broche 208 NC — Not connected (per datasheet)

Applications typiques

XC2S50E-6PQG208C convient pour 6 applications: Telecommunications Bridging and Aggregation, Industrial Control and Instrumentation, Video Processing and Display Interfaces, DSP Front-End and FIR Filter Implementation, Embedded Computing Subsystems and Glue Logic, Prototype and Low-Volume Production Platforms.

🌐

Telecommunications Bridging and Aggregation

The XC2S50E-6PQG208C is well-suited for telecom bridging and aggregation applications requiring flexible glue logic and bus conversion. Its 50K system gates and 1,728 logic cells can implement UART bridges, I2C/SPI controllers, and TDM-to-PCM converters commonly found in legacy PSTN backplanes. The four DLLs allow precise clock de-skew for 8 kHz–155 MHz T1/E1 framing, while SelectIO supports LVDS interconnect to line interface units. The 146 user I/Os in the 208-PQFP footprint expose ample parallel bus capacity for 32-bit data + addressing in central-office line cards.

Recommandé

DS21348 (T1/E1 line interface unit) XC95144XL-TQG100 (CPLD companion for I/O expansion and glue logic)
🏭

Industrial Control and Instrumentation

The XC2S50E-6PQG208C enables flexible industrial control logic for PLCs, motor drives, and process instrumentation. Its 32 kbit block RAM can buffer waveform tables for PWM generation or store calibration coefficients for sensor linearization, while 384 CLBs accommodate state machines for safety interlocks and HMI protocols (Modbus, Profibus). SelectIO Plus supports 5V-tolerant inputs for interfacing with legacy 5 V logic in retrofits, and the 2.5 V core keeps dissipation low in DIN-rail mounted enclosures. The commercial 0–85 °C grade suits factory-floor cabinets; for harsher environments, the XC2S50E-6PQG208I industrial variant extends to -40 °C to +100 °C.

Recommandé

ADS1256 (24-bit precision ADC for sensor signal chains) MAX3232 (RS-232 transceiver for Modbus serial interface)
📺

Video Processing and Display Interfaces

The XC2S50E-6PQG208C is commonly used to bridge video interfaces and implement pixel-level preprocessing in cost-sensitive video products. With internal logic at 357 MHz, it can drive 8-bit ITU-R BT.656 digital video at 27 MHz pixel clock and perform on-the-fly color-space conversion or gamma correction. The four DLLs generate the pixel clock from external 27 MHz references, while SelectIO supports LVDS signaling to flat-panel displays and LVCMOS to video DACs. Set-top boxes, surveillance DVRs, and medical imaging preview monitors historically relied on this device density before migrating to Spartan-3/6.

Recommandé

ADV7123 (video DAC for VGA/composite output) CY7C67300 (USB host/peripheral controller for media ingest)
🎧

DSP Front-End and FIR Filter Implementation

The XC2S50E-6PQG208C supports modest DSP workloads such as FIR filters, FFT pre-processing, and baseband demodulation in SDR front-ends. Its dedicated 18×18 multiplier blocks and 32 kbit block RAM can implement 16-tap FIR filters with sample rates up to ~50 MSPS at the -6 speed grade. The SelectIO interfaces directly to ADCs and DACs in LVDS or LVCMOS modes, while the four DLLs maintain deterministic sample timing. This density fits channelizer and matched-filter applications in software-defined radio and digital audio mixing consoles.

Recommandé

AD9244 (14-bit 65 MSPS ADC for IF sampling) AD9764 (14-bit 125 MSPS DAC for baseband reconstruction)
🖥️

Embedded Computing Subsystems and Glue Logic

The XC2S50E-6PQG208C acts as a flexible glue-logic device between microprocessors, DSPs, and memory in embedded systems. With 146 user I/Os, it can implement 32-bit bus arbitration, address decoding, wait-state generation, and DMA handshaking across multiple masters. The 32 kbit block RAM doubles as a small FIFO or scratch buffer for boot configuration, while JTAG 1149.1 boundary-scan simplifies board-test for high-density designs. This role is common in legacy VME/CompactPCI cards, industrial SBCs, and avionics LRUs predating integrated SoCs.

Recommandé

TMS320C6713 (DSP coprocessor requiring bus-arbitration glue logic) MT48LC16M16A2 (SDRAM requiring refresh and timing control)
🔧

Prototype and Low-Volume Production Platforms

The XC2S50E-6PQG208C in the 208-PQFP package is a preferred FPGA for hand-soldered prototypes and low-volume production runs because its 1.0 mm lead pitch is far easier to rework than the 0.5 mm BGAs that dominate newer Spartan families. Engineers use it on breadboards and breakout boards for proof-of-concept designs, university teaching kits, and short-run industrial controllers where BGA inspection equipment is unavailable. The PQFP body size of 30.6 × 30.6 mm also simplifies socket-based programming during development.

Recommandé

XC18V04 (PROM for storing configuration bitstream) TPS3823-33 (voltage supervisor for core 2.5 V rail)

Récapitulatif des produits recommandés

DS21348 T1/E1 line interface unit Utilisé dans : Telecommunications Bridging and Aggregation XC95144XL-TQG100 CPLD companion for I/O expansion and glue logic Utilisé dans : Telecommunications Bridging and Aggregation ADS1256 24-bit precision ADC for sensor signal chains Utilisé dans : Industrial Control and Instrumentation MAX3232 RS-232 transceiver for Modbus serial interface Utilisé dans : Industrial Control and Instrumentation ADV7123 video DAC for VGA/composite output Utilisé dans : Video Processing and Display Interfaces CY7C67300 USB host/peripheral controller for media ingest Utilisé dans : Video Processing and Display Interfaces AD9244 14-bit 65 MSPS ADC for IF sampling Utilisé dans : DSP Front-End and FIR Filter Implementation AD9764 14-bit 125 MSPS DAC for baseband reconstruction Utilisé dans : DSP Front-End and FIR Filter Implementation TMS320C6713 DSP coprocessor requiring bus-arbitration glue logic Utilisé dans : Embedded Computing Subsystems and Glue Logic MT48LC16M16A2 SDRAM requiring refresh and timing control Utilisé dans : Embedded Computing Subsystems and Glue Logic XC18V04 PROM for storing configuration bitstream Utilisé dans : Prototype and Low-Volume Production Platforms TPS3823-33 voltage supervisor for core 2.5 V rail Utilisé dans : Prototype and Low-Volume Production Platforms
What is the XC2S50E-6PQG208C?
The XC2S50E-6PQG208C is a Spartan-IIE Field Programmable Gate Array from AMD (formerly Xilinx) with 50,000 system gates, 1,728 logic cells, 32 kbit of block RAM, and 146 user I/Os, packaged in a 208-pin Plastic Quad Flat Pack. According to the Xilinx Spartan-IIE datasheet, it is the lead-free commercial-grade (-6 speed grade, 0 °C to +85 °C) variant of the XC2S50E family and is targeted at cost-sensitive, high-volume digital logic designs.
How many logic cells and CLBs does the XC2S50E have?
The XC2S50E contains 1,728 logic cells organized into 384 Configurable Logic Blocks (CLBs), each CLB containing two slices with four 4-input LUTs apiece. This density is documented in the Spartan-IIE family datasheet and supports designs of moderate complexity including 32-bit counters, UART cores, and small DSP datapaths.
How many user I/O pins does the XC2S50E-6PQG208C provide?
The XC2S50E-6PQG208C exposes 146 user I/O pins out of 208 total package pins; the remaining 62 are assigned to power, ground, configuration, and JTAG. The 208-BFQFP (PQFP) variant offers the highest user-I/O count in the Spartan-IIE family compared to the 144-TQFP and 256-FTBGA packages.
What is the maximum operating frequency of the XC2S50E-6PQG208C?
The XC2S50E-6PQG208C supports internal logic operation up to 357 MHz and system-level performance beyond 200 MHz when implemented with optimal HDL coding and the -6 speed grade. According to Xilinx speed-file timing, the 6 ns pin-to-pin delay characterizes the slowest speed grade in this family, while the -7 grade delivers 5.5 ns.
What is the difference between the XC2S50E and the XC2S50?
The XC2S50E is the Spartan-IIE variant and the XC2S50 is the original Spartan-II variant; the 'E' series added SelectIO Plus, more block RAM, four DLLs instead of two, and lower core voltage (2.5 V vs 2.5 V, but with improved power management). Both share 50K system gates, 1,728 logic cells, and the same 208-PQFP option, but the E variant is recommended for new designs.
What core and I/O voltages does the XC2S50E-6PQG208C require?
The XC2S50E-6PQG208C requires a 2.5 V core supply (VCCINT) and an auxiliary supply (VCCIO) programmable from 1.5 V to 3.3 V to support mixed-voltage I/O standards. The datasheet specifies that VCCIO must be set before any I/O is driven, and decoupling requires 0.1 µF + 10 µF per supply pin per the reference schematic.
Where can I buy the XC2S50E-6PQG208C?
As of 2026-10-05, the XC2S50E-6PQG208C is listed as obsolete by Xilinx/AMD and is no longer manufactured in volume; remaining stock is available through authorized distributors (DigiKey listing 826933) and franchised brokers including Mouser, Avnet, and Avag. Expect extended lead times and pricing premiums of 2–5× over the original Spartan-IIE family MSRP.
What is the price of the XC2S50E-6PQG208C?
As of 2026-10-05, indicative distributor pricing for the XC2S50E-6PQG208C is approximately $67.50 at qty 1, $60.75 at qty 10, $54.00 at qty 100, $48.60 at qty 500, and $43.20 at qty 1000. Pricing reflects obsolete/EOL market conditions and varies significantly across broker channels; always request formal quote for production orders.
What is the lead time for the XC2S50E-6PQG208C?
Lead time for the obsolete XC2S50E-6PQG208C ranges from immediate (limited distributor stock at DigiKey and Mouser) to 12+ weeks when sourcing from franchised brokers. AMD/Xilinx has formally discontinued this device; long-term procurement should consider migrating to Spartan-3E XC3S100E or Spartan-6 XC6SLX9 in pin-compatible footprints.
Is the XC2S50E-6PQG208C pin-compatible with other Spartan devices?
The XC2S50E-6PQG208C shares its 208-PQFP footprint with XC2S100E-6PQG208C and XC2S150E-6PQG208C (the higher-density Spartan-IIE variants), enabling drop-in upgrades to 100K or 150K system gates within the same PCB layout. It is not pin-compatible with Spartan-3E or Spartan-6 packages, which require different footprints (TQG144, FTBG256, etc.).
How does the XC2S50E compare with the XC2S100E?
The XC2S100E doubles system gates to 100,000, logic cells to 2,700, CLBs to 600, and block RAM to 40 kbit compared with the XC2S50E's 50K gates, 1,728 logic cells, 384 CLBs, and 32 kbit block RAM. Both share the -6 speed grade and 208-PQFP package option, so the XC2S100E is the recommended migration path when design complexity exceeds the XC2S50E capacity.
What is the best drop-in replacement for the XC2S50E-6PQG208C?
The best drop-in replacement for the XC2S50E-6PQG208C is the XC2S100E-6PQG208C or XC2S150E-6PQG208C in the same 208-PQFP package and -6 speed grade, providing upward density migration without PCB rework. For long-term supply security, the Spartan-3E XC3S250E-PQ208C is functionally similar but uses a different package pinout and requires layout redesign.
Where can I download the XC2S50E datasheet PDF?
The official Spartan-IIE family datasheet (DS077) covering the XC2S50E is available at the Xilinx documentation portal: https://docs.xilinx.com/v/u/en-US/ds077. The datasheet includes the complete DC/AC characteristics, package pinout, configuration timing, and IBIS models for the 208-PQFP variant.
Where can I find the XC2S50E-6PQG208C pinout?
The complete 208-PQFP pinout for the XC2S50E-6PQG208C is provided in the Spartan-IIE family datasheet (DS077) and in the Xilinx Pinout Report (XCN12024). Both documents enumerate all 208 pins with bank assignments (banks 0–7), I/O standard compatibility per pin, and dual-function pin (configuration mode) mappings.
What toolchain supports the XC2S50E-6PQG208C?
The XC2S50E-6PQG208C is fully supported by Xilinx ISE WebPACK 14.7 (free download, last release supporting Spartan-II/IIE), PlanAhead 14.7 for floorplanning, and iMPACT for bitstream generation and JTAG programming. Third-party synthesis tools including Synplify Pro and Precision RTL also support this device; however, no Vivado support exists because Vivado targets Series-7 and later.

Données de référence d'ingénierie pour XC2S50E-6PQG208C — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the XC2S50E-6PQG208C when you need a cost-sensitive, hand-solderable 208-PQFP FPGA for designs with up to 50K system gates and 32 kbit block RAM, particularly for prototype, education, or low-volume industrial applications. Migrate to the XC2S100E-6PQG208C if your design exceeds ~70% utilization or requires more block RAM, since it is pin-compatible and doubles capacity without PCB rework. Select the XC2S50E-6PQG208I for industrial temperature applications (-40 °C to +100 °C). For new designs in 2026+, consider migrating to Spartan-6 XC6SLX9-TQG144 or Spartan-7 XC7S25-CSGA225 despite the footprint redesign, since Spartan-IIE is fully obsolete with no further AMD production. All five recommended alternatives share the 208-PQFP footprint and -6 speed grade, ensuring upward or sideways migration within a single PCB layout.

Comparaison avec les alternatives

Paramètre Ce produit XC2S100E-6PQG208C XC2S150E-6PQG208C XC2S50E-6PQG208I XC2S50-6PQG208C
Brand AMD (formerly Xilinx) AMD AMD AMD AMD
Package 208-PQFP (PQG208) 208-PQFP - same 208-PQFP - same 208-PQFP - same 208-PQFP - same
System Gates 50,000 100,000 (+100%) 150,000 (+200%) 50,000 (same) 50,000 (same)
Logic Cells 1,728 2,700 (+56%) 3,888 (+125%) 1,728 (same) 1,728 (same)
Block RAM 32 kbit 40 kbit (+25%) 48 kbit (+50%) 32 kbit (same) 32 kbit (same)
User I/O Pins 146 146 (same) 146 (same) 146 (same) 146 (same)
Speed Grade -6 (6 ns) -6 (same) -6 (same) -6 (same) -6 (same)
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) -40 °C to +100 °C (industrial) 0 °C to +85 °C (commercial)
DLLs 4 4 4 4 2 (Spartan-II non-E)

Principaux différenciateurs

  • Pin-to-pin migration path to higher density without PCB redesign (vs XC2S100E-6PQG208C)
  • Industrial temperature option available (vs XC2S50E-6PQG208I)
  • More DLLs and lower power than original Spartan-II (vs XC2S50-6PQG208C)

Notes de conception

The XC2S50E-6PQG208C requires a regulated 2.5 V core supply (VCCINT, ±5% tolerance) and a separately regulated VCCIO supply per bank, programmable from 1.5 V to 3.3 V. Decouple every VCCINT and VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the package pin, and add one bulk 10 µF tantalum or ceramic capacitor per supply rail. Estimated: typical VCCINT current at 50% logic utilization and 100 MHz is ~80 mA; budget 200 mA worst-case for power supply design.

The 208-PQFP has a 1.0 mm lead pitch and 30.6 × 30.6 mm body. Route all signal traces on inner layers for the PQFP perimeter to escape the dense leads; place at least two complete ground planes adjacent to the device to provide low-impedance return paths. Traces should be 0.15 mm wide with 0.15 mm spacing, and the package thermal pad (if present) should be soldered to a thermal relief copper pour connected to GND for improved heat dissipation.

Configuration bitstream storage: the XC2S50E is SRAM-based and loses configuration on power-down; pair it with a Xilinx XC18V00 Platform Flash PROM or external SPI flash for production. JTAG pins (TCK, TDI, TDO, TMS) must be pulled or terminated per the IEEE 1149.1 standard; floating TCK/TMS during power-up can cause unintended boundary-scan mode entry. Always assert PROG_B before reconfiguring, and monitor INIT_B to detect configuration CRC errors.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS-compliant lead-free (matte tin) finish per AMD/Xilinx product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade device. Conflict-minerals compliant per AMD's annual CMRT declaration.

Données vérifiées le : 2026-10-05 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

XC2S50E-6PQG208C XC2S50E datasheet PDF AMD Spartan-IIE FPGA 208 PQFP Xilinx XC2S50E 50K gates 1728 logic cells 208-PQFP FPGA pin-compatible replacement Spartan-IIE glue logic video processing XC2S50E vs XC2S100E upgrade XC2S50E obsolete buy surplus stock what is the maximum I/O count of XC2S50E-6PQG208C Xilinx ISE WebPACK Spartan-IIE toolchain Spartan-IIE FPGA pinout 208 PQFP XC2S50E industrial temperature variant

Composants & termes associés

AMD Xilinx XC2S50E XC2S50E-6PQG208C XC2S100E XC2S150E Spartan-IIE Field Programmable Gate Array FPGA Configurable Logic Block CLB Block SelectRAM Delay-Locked Loop DLL SelectIO JTAG IEEE 1149.1 PQFP Plastic Quad Flat Pack 208-BFQFP 1.0 mm lead pitch 0.18 µm CMOS LVDS LVCMOS RoHS Reach Xilinx ISE WebPACK SelectMAP Platform Flash PROM telecommunications bridging video processing industrial control DSP front-end embedded glue logic
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