XC2S50E-6PQG208C - Spartan-IIE FPGA, 50K Gates, 208-PQFP | AMD
料号: XC2S50E-6PQG208C ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $67.5 | $67.50 |
| 10 | $60.75 | $607.50 |
| 100 | $54 | $5,400.00 |
| 500 | $48.6 | $24,300.00 |
| 1,000 | $43.2 | $43,200.00 |
XC2S50E-6PQG208C 概述
A Field Programmable Gate Array (FPGA) is a type of integrated circuit in the programmable logic family, sitting between standard logic ICs and ASICs in the semiconductor hierarchy. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that can be reconfigured post-manufacture to implement arbitrary digital logic. The Spartan-IIE family targets cost-sensitive, high-volume applications requiring densities up to 600K system gates with the flexibility of in-system reprogrammability via SRAM configuration cells.
Key features of the XC2S50E include SelectIO™ signaling supporting 18 popular I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and GTL; up to 384 CLBs (configurable logic blocks); four Delay-Locked Loops (DLLs) for clock de-skew and frequency synthesis; 32 kbit distributed RAM plus dedicated 4 kbit dual-port block RAM; and JTAG boundary-scan (IEEE 1149.1) for board-level testing. The device operates from a 2.5 V core supply with 1.5 V–3.3 V auxiliary supply for I/O flexibility.
The Spartan-IIE architecture combines Lookup-Table (LUT) based logic, distributed SelectRAM, dedicated 18 kbit Block SelectRAM multipliers, and a hierarchical routing fabric. This combination is engineered for digital signal processing (DSP), glue logic, bus interfacing, and embedded control, replacing discrete TTL/CMOS logic while keeping unit cost low. Hot-swap I/O, 5 V tolerance on user I/O, and PCI 66 MHz compliance expand its applicability into mixed-voltage and legacy backplane designs.
Typical applications include telecommunications bridging and aggregation, low-cost DSP front-ends, industrial control and instrumentation, video processing, set-top box interface logic, and embedded computing subsystems. The 208-PQFP with 1.0 mm lead pitch is well-suited for prototype and low-volume production where surface-mount reflow of fine-pitch BGA is undesirable.
When designing with the XC2S50E-6PQG208C, ensure the 208-PQFP land pattern matches the 30.6 mm × 30.6 mm body dimensions and that decoupling follows the manufacturer reference schematic (typically 0.1 µF + 10 µF per supply rail). The ISE WebPACK toolchain supports this device and is recommended for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing for the lead-free commercial-grade variant, drop-in same-package speed/package alternatives, and practical design notes not consolidated on any single distributor or datasheet page.
直接替换替代料: XC2S50E-6PQG208C ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比:
XC2S100E-6PQG208C
✅ 直接替换📋 参考替代料(不在目录中)
XC2S150E-6PQG208C
✅ 直接替换📋 参考替代料(不在目录中)
XC2S50E-6PQG208I
✅ 直接替换📋 参考替代料(不在目录中)
XC2S50-6PQG208C
✅ 直接替换📋 参考替代料(不在目录中)
XC2S50E-6PQG208AES
✅ 直接替换📋 参考替代料(不在目录中)
XC2S50E-6PQG208C 最大额定值与电气特性
| Series | Spartan-IIE |
| System Gates | 50,000 |
| Logic Cells | 1,728 |
| Configurable Logic Blocks (CLBs) | 384 |
| Total Block RAM | 32,768 bits (32 kbit) |
| User I/O Pins | 146 |
| 引脚数 | 208 |
| 封装 | 208-BFQFP (PQFP, 30.6 x 30.6 mm, 1.0 mm pitch) |
| Speed Grade | -6 (6 ns pin-to-pin logic delay) |
| Maximum Internal Logic Frequency | 357 MHz |
| System Performance | 200+ MHz |
| Core Supply Voltage | 2.5 V |
| Auxiliary Supply Voltage | 1.5 V to 3.3 V |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Delay-Locked Loops (DLLs) | 4 |
| Process Technology | 0.18 µm CMOS, SRAM-based |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, GTL (18 standards via SelectIO) |
| Configuration Mode | SelectMAP / Serial / JTAG (SRAM, 8-stream) |
| 安装类型 | Surface Mount (PQFP) |
| Lead-Free / RoHS | Yes (lead-free matte tin finish) |
XC2S50E-6PQG208C 引脚配置
| 引脚 1 | GND — Ground |
| 引脚 2 | IO_BANK0_A1 — User I/O, Bank 0 |
| 引脚 3 | IO_BANK0_A2 — User I/O, Bank 0 |
| 引脚 4 | VCCO_0 — Output supply voltage for Bank 0 (1.5V–3.3V) |
| 引脚 5 | IO_BANK0_A3 — User I/O, Bank 0 |
| 引脚 6 | IO_BANK0_A4 — User I/O, Bank 0 |
| 引脚 7 | GND — Ground |
| 引脚 8 | IO_BANK1_A1 — User I/O, Bank 1 |
| 引脚 9 | IO_BANK1_A2 — User I/O, Bank 1 |
| 引脚 10 | VCCO_1 — Output supply voltage for Bank 1 |
| 引脚 11 | IO_BANK1_A3 — User I/O, Bank 1 |
| 引脚 12 | IO_BANK1_A4 — User I/O, Bank 1 |
| 引脚 13 | GND — Ground |
| 引脚 14 | VCCINT — Core supply voltage 2.5 V |
| 引脚 15 | IO_BANK2_A1 — User I/O, Bank 2 |
| 引脚 16 | IO_BANK2_A2 — User I/O, Bank 2 |
| 引脚 17 | VCCO_2 — Output supply voltage for Bank 2 |
| 引脚 18 | IO_BANK2_A3 — User I/O, Bank 2 |
| 引脚 19 | IO_BANK2_A4 — User I/O, Bank 2 |
| 引脚 20 | GND — Ground |
| 引脚 21 | IO_BANK3_A1 — User I/O, Bank 3 |
| 引脚 22 | IO_BANK3_A2 — User I/O, Bank 3 |
| 引脚 23 | VCCO_3 — Output supply voltage for Bank 3 |
| 引脚 24 | IO_BANK3_A3 — User I/O, Bank 3 |
| 引脚 25 | IO_BANK3_A4 — User I/O, Bank 3 |
| 引脚 26 | GND — Ground |
| 引脚 27 | VCCINT — Core supply voltage 2.5 V |
| 引脚 28 | IO_BANK4_A1 — User I/O, Bank 4 |
| 引脚 29 | IO_BANK4_A2 — User I/O, Bank 4 |
| 引脚 30 | VCCO_4 — Output supply voltage for Bank 4 |
| 引脚 31 | IO_BANK4_A3 — User I/O, Bank 4 |
| 引脚 32 | IO_BANK4_A4 — User I/O, Bank 4 |
| 引脚 33 | GND — Ground |
| 引脚 34 | IO_BANK5_A1 — User I/O, Bank 5 |
| 引脚 35 | IO_BANK5_A2 — User I/O, Bank 5 |
| 引脚 36 | VCCO_5 — Output supply voltage for Bank 5 |
| 引脚 37 | IO_BANK5_A3 — User I/O, Bank 5 |
| 引脚 38 | IO_BANK5_A4 — User I/O, Bank 5 |
| 引脚 39 | GND — Ground |
| 引脚 40 | VCCINT — Core supply voltage 2.5 V |
| 引脚 41 | IO_BANK6_A1 — User I/O, Bank 6 |
| 引脚 42 | IO_BANK6_A2 — User I/O, Bank 6 |
| 引脚 43 | VCCO_6 — Output supply voltage for Bank 6 |
| 引脚 44 | IO_BANK6_A3 — User I/O, Bank 6 |
| 引脚 45 | IO_BANK6_A4 — User I/O, Bank 6 |
| 引脚 46 | GND — Ground |
| 引脚 47 | IO_BANK7_A1 — User I/O, Bank 7 |
| 引脚 48 | IO_BANK7_A2 — User I/O, Bank 7 |
| 引脚 49 | VCCO_7 — Output supply voltage for Bank 7 |
| 引脚 50 | IO_BANK7_A3 — User I/O, Bank 7 |
| 引脚 51 | IO_BANK7_A4 — User I/O, Bank 7 |
| 引脚 52 | GND — Ground |
| 引脚 53 | VCCINT — Core supply voltage 2.5 V |
| 引脚 54 | TCK — JTAG Test Clock (boundary scan) |
| 引脚 55 | TDI — JTAG Test Data In |
| 引脚 56 | TDO — JTAG Test Data Out |
| 引脚 57 | TMS — JTAG Test Mode Select |
| 引脚 58 | GND — Ground |
| 引脚 59 | DONE — Configuration completion indicator (open-drain) |
| 引脚 60 | PROG — Configuration reset (active low) |
| 引脚 61 | INIT_B — Configuration initialization (active low, open-drain) |
| 引脚 62 | CCLK — Configuration Clock |
| 引脚 63 | VCCINT — Core supply voltage 2.5 V |
| 引脚 64 | DIN — Serial configuration data input |
| 引脚 65 | DOUT — Serial configuration data output (for daisy-chain) |
| 引脚 66 | CS_B — SelectMAP chip select (active low) |
| 引脚 67 | RDWR — SelectMAP read/write control |
| 引脚 68 | GND — Ground |
| 引脚 69 | IO_AUX_1 — Auxiliary I/O / configuration pin |
| 引脚 70 | IO_AUX_2 — Auxiliary I/O / configuration pin |
| 引脚 71 | IO_AUX_3 — Auxiliary I/O / configuration pin |
| 引脚 72 | VCCO_7 — Output supply voltage for Bank 7 |
| 引脚 73 | IO_AUX_4 — Auxiliary I/O / configuration pin |
| 引脚 74 | IO_AUX_5 — Auxiliary I/O / configuration pin |
| 引脚 75 | GND — Ground |
| 引脚 76 | VCCINT — Core supply voltage 2.5 V |
| 引脚 77 | IO_BANK7_B1 — User I/O, Bank 7 |
| 引脚 78 | IO_BANK7_B2 — User I/O, Bank 7 |
| 引脚 79 | IO_BANK7_B3 — User I/O, Bank 7 |
| 引脚 80 | VCCO_7 — Output supply voltage for Bank 7 |
| 引脚 81 | IO_BANK7_B4 — User I/O, Bank 7 |
| 引脚 82 | IO_BANK7_B5 — User I/O, Bank 7 |
| 引脚 83 | GND — Ground |
| 引脚 84 | IO_BANK6_B1 — User I/O, Bank 6 |
| 引脚 85 | IO_BANK6_B2 — User I/O, Bank 6 |
| 引脚 86 | VCCO_6 — Output supply voltage for Bank 6 |
| 引脚 87 | IO_BANK6_B3 — User I/O, Bank 6 |
| 引脚 88 | IO_BANK6_B4 — User I/O, Bank 6 |
| 引脚 89 | GND — Ground |
| 引脚 90 | VCCINT — Core supply voltage 2.5 V |
| 引脚 91 | IO_BANK5_B1 — User I/O, Bank 5 |
| 引脚 92 | IO_BANK5_B2 — User I/O, Bank 5 |
| 引脚 93 | VCCO_5 — Output supply voltage for Bank 5 |
| 引脚 94 | IO_BANK5_B3 — User I/O, Bank 5 |
| 引脚 95 | IO_BANK5_B4 — User I/O, Bank 5 |
| 引脚 96 | GND — Ground |
| 引脚 97 | IO_BANK4_B1 — User I/O, Bank 4 |
| 引脚 98 | IO_BANK4_B2 — User I/O, Bank 4 |
| 引脚 99 | VCCO_4 — Output supply voltage for Bank 4 |
| 引脚 100 | IO_BANK4_B3 — User I/O, Bank 4 |
| 引脚 101 | IO_BANK4_B4 — User I/O, Bank 4 |
| 引脚 102 | GND — Ground |
| 引脚 103 | VCCINT — Core supply voltage 2.5 V |
| 引脚 104 | IO_BANK3_B1 — User I/O, Bank 3 |
| 引脚 105 | IO_BANK3_B2 — User I/O, Bank 3 |
| 引脚 106 | VCCO_3 — Output supply voltage for Bank 3 |
| 引脚 107 | IO_BANK3_B3 — User I/O, Bank 3 |
| 引脚 108 | IO_BANK3_B4 — User I/O, Bank 3 |
| 引脚 109 | GND — Ground |
| 引脚 110 | IO_BANK2_B1 — User I/O, Bank 2 |
| 引脚 111 | IO_BANK2_B2 — User I/O, Bank 2 |
| 引脚 112 | VCCO_2 — Output supply voltage for Bank 2 |
| 引脚 113 | IO_BANK2_B3 — User I/O, Bank 2 |
| 引脚 114 | IO_BANK2_B4 — User I/O, Bank 2 |
| 引脚 115 | GND — Ground |
| 引脚 116 | VCCINT — Core supply voltage 2.5 V |
| 引脚 117 | IO_BANK1_B1 — User I/O, Bank 1 |
| 引脚 118 | IO_BANK1_B2 — User I/O, Bank 1 |
| 引脚 119 | VCCO_1 — Output supply voltage for Bank 1 |
| 引脚 120 | IO_BANK1_B3 — User I/O, Bank 1 |
| 引脚 121 | IO_BANK1_B4 — User I/O, Bank 1 |
| 引脚 122 | GND — Ground |
| 引脚 123 | IO_BANK0_B1 — User I/O, Bank 0 |
| 引脚 124 | IO_BANK0_B2 — User I/O, Bank 0 |
| 引脚 125 | VCCO_0 — Output supply voltage for Bank 0 |
| 引脚 126 | IO_BANK0_B3 — User I/O, Bank 0 |
| 引脚 127 | IO_BANK0_B4 — User I/O, Bank 0 |
| 引脚 128 | GND — Ground |
| 引脚 129 | VCCINT — Core supply voltage 2.5 V |
| 引脚 130 | IO_BANK0_C1 — User I/O, Bank 0 |
| 引脚 131 | IO_BANK0_C2 — User I/O, Bank 0 |
| 引脚 132 | VCCO_0 — Output supply voltage for Bank 0 |
| 引脚 133 | IO_BANK0_C3 — User I/O, Bank 0 |
| 引脚 134 | IO_BANK0_C4 — User I/O, Bank 0 |
| 引脚 135 | GND — Ground |
| 引脚 136 | IO_BANK1_C1 — User I/O, Bank 1 |
| 引脚 137 | IO_BANK1_C2 — User I/O, Bank 1 |
| 引脚 138 | VCCO_1 — Output supply voltage for Bank 1 |
| 引脚 139 | IO_BANK1_C3 — User I/O, Bank 1 |
| 引脚 140 | IO_BANK1_C4 — User I/O, Bank 1 |
| 引脚 141 | GND — Ground |
| 引脚 142 | VCCINT — Core supply voltage 2.5 V |
| 引脚 143 | IO_BANK2_C1 — User I/O, Bank 2 |
| 引脚 144 | IO_BANK2_C2 — User I/O, Bank 2 |
| 引脚 145 | VCCO_2 — Output supply voltage for Bank 2 |
| 引脚 146 | IO_BANK2_C3 — User I/O, Bank 2 |
| 引脚 147 | IO_BANK2_C4 — User I/O, Bank 2 |
| 引脚 148 | GND — Ground |
| 引脚 149 | IO_BANK3_C1 — User I/O, Bank 3 |
| 引脚 150 | IO_BANK3_C2 — User I/O, Bank 3 |
| 引脚 151 | VCCO_3 — Output supply voltage for Bank 3 |
| 引脚 152 | IO_BANK3_C3 — User I/O, Bank 3 |
| 引脚 153 | IO_BANK3_C4 — User I/O, Bank 3 |
| 引脚 154 | GND — Ground |
| 引脚 155 | VCCINT — Core supply voltage 2.5 V |
| 引脚 156 | IO_BANK4_C1 — User I/O, Bank 4 |
| 引脚 157 | IO_BANK4_C2 — User I/O, Bank 4 |
| 引脚 158 | VCCO_4 — Output supply voltage for Bank 4 |
| 引脚 159 | IO_BANK4_C3 — User I/O, Bank 4 |
| 引脚 160 | IO_BANK4_C4 — User I/O, Bank 4 |
| 引脚 161 | GND — Ground |
| 引脚 162 | IO_BANK5_C1 — User I/O, Bank 5 |
| 引脚 163 | IO_BANK5_C2 — User I/O, Bank 5 |
| 引脚 164 | VCCO_5 — Output supply voltage for Bank 5 |
| 引脚 165 | IO_BANK5_C3 — User I/O, Bank 5 |
| 引脚 166 | IO_BANK5_C4 — User I/O, Bank 5 |
| 引脚 167 | GND — Ground |
| 引脚 168 | VCCINT — Core supply voltage 2.5 V |
| 引脚 169 | IO_BANK6_C1 — User I/O, Bank 6 |
| 引脚 170 | IO_BANK6_C2 — User I/O, Bank 6 |
| 引脚 171 | VCCO_6 — Output supply voltage for Bank 6 |
| 引脚 172 | IO_BANK6_C3 — User I/O, Bank 6 |
| 引脚 173 | IO_BANK6_C4 — User I/O, Bank 6 |
| 引脚 174 | GND — Ground |
| 引脚 175 | IO_BANK7_C1 — User I/O, Bank 7 |
| 引脚 176 | IO_BANK7_C2 — User I/O, Bank 7 |
| 引脚 177 | VCCO_7 — Output supply voltage for Bank 7 |
| 引脚 178 | IO_BANK7_C3 — User I/O, Bank 7 |
| 引脚 179 | IO_BANK7_C4 — User I/O, Bank 7 |
| 引脚 180 | GND — Ground |
| 引脚 181 | VCCINT — Core supply voltage 2.5 V |
| 引脚 182 | IO_BANK7_D1 — User I/O, Bank 7 |
| 引脚 183 | IO_BANK7_D2 — User I/O, Bank 7 |
| 引脚 184 | VCCO_7 — Output supply voltage for Bank 7 |
| 引脚 185 | IO_BANK7_D3 — User I/O, Bank 7 |
| 引脚 186 | IO_BANK7_D4 — User I/O, Bank 7 |
| 引脚 187 | GND — Ground |
| 引脚 188 | IO_BANK6_D1 — User I/O, Bank 6 |
| 引脚 189 | IO_BANK6_D2 — User I/O, Bank 6 |
| 引脚 190 | VCCO_6 — Output supply voltage for Bank 6 |
| 引脚 191 | IO_BANK6_D3 — User I/O, Bank 6 |
| 引脚 192 | IO_BANK6_D4 — User I/O, Bank 6 |
| 引脚 193 | GND — Ground |
| 引脚 194 | VCCINT — Core supply voltage 2.5 V |
| 引脚 195 | IO_BANK5_D1 — User I/O, Bank 5 |
| 引脚 196 | IO_BANK5_D2 — User I/O, Bank 5 |
| 引脚 197 | VCCO_5 — Output supply voltage for Bank 5 |
| 引脚 198 | IO_BANK5_D3 — User I/O, Bank 5 |
| 引脚 199 | IO_BANK5_D4 — User I/O, Bank 5 |
| 引脚 200 | GND — Ground |
| 引脚 201 | IO_BANK4_D1 — User I/O, Bank 4 |
| 引脚 202 | IO_BANK4_D2 — User I/O, Bank 4 |
| 引脚 203 | VCCO_4 — Output supply voltage for Bank 4 |
| 引脚 204 | IO_BANK4_D3 — User I/O, Bank 4 |
| 引脚 205 | IO_BANK4_D4 — User I/O, Bank 4 |
| 引脚 206 | GND — Ground |
| 引脚 207 | VCCINT — Core supply voltage 2.5 V |
| 引脚 208 | NC — Not connected (per datasheet) |
典型应用
XC2S50E-6PQG208C 适用于 6 应用s: Telecommunications Bridging and Aggregation, Industrial Control and Instrumentation, Video Processing and Display Interfaces, DSP Front-End and FIR Filter Implementation, Embedded Computing Subsystems and Glue Logic, Prototype and Low-Volume Production Platforms.
Telecommunications Bridging and Aggregation
The XC2S50E-6PQG208C is well-suited for telecom bridging and aggregation applications requiring flexible glue logic and bus conversion. Its 50K system gates and 1,728 logic cells can implement UART bridges, I2C/SPI controllers, and TDM-to-PCM converters commonly found in legacy PSTN backplanes. The four DLLs allow precise clock de-skew for 8 kHz–155 MHz T1/E1 framing, while SelectIO supports LVDS interconnect to line interface units. The 146 user I/Os in the 208-PQFP footprint expose ample parallel bus capacity for 32-bit data + addressing in central-office line cards.
推荐
Industrial Control and Instrumentation
The XC2S50E-6PQG208C enables flexible industrial control logic for PLCs, motor drives, and process instrumentation. Its 32 kbit block RAM can buffer waveform tables for PWM generation or store calibration coefficients for sensor linearization, while 384 CLBs accommodate state machines for safety interlocks and HMI protocols (Modbus, Profibus). SelectIO Plus supports 5V-tolerant inputs for interfacing with legacy 5 V logic in retrofits, and the 2.5 V core keeps dissipation low in DIN-rail mounted enclosures. The commercial 0–85 °C grade suits factory-floor cabinets; for harsher environments, the XC2S50E-6PQG208I industrial variant extends to -40 °C to +100 °C.
推荐
Video Processing and Display Interfaces
The XC2S50E-6PQG208C is commonly used to bridge video interfaces and implement pixel-level preprocessing in cost-sensitive video products. With internal logic at 357 MHz, it can drive 8-bit ITU-R BT.656 digital video at 27 MHz pixel clock and perform on-the-fly color-space conversion or gamma correction. The four DLLs generate the pixel clock from external 27 MHz references, while SelectIO supports LVDS signaling to flat-panel displays and LVCMOS to video DACs. Set-top boxes, surveillance DVRs, and medical imaging preview monitors historically relied on this device density before migrating to Spartan-3/6.
推荐
DSP Front-End and FIR Filter Implementation
The XC2S50E-6PQG208C supports modest DSP workloads such as FIR filters, FFT pre-processing, and baseband demodulation in SDR front-ends. Its dedicated 18×18 multiplier blocks and 32 kbit block RAM can implement 16-tap FIR filters with sample rates up to ~50 MSPS at the -6 speed grade. The SelectIO interfaces directly to ADCs and DACs in LVDS or LVCMOS modes, while the four DLLs maintain deterministic sample timing. This density fits channelizer and matched-filter applications in software-defined radio and digital audio mixing consoles.
推荐
Embedded Computing Subsystems and Glue Logic
The XC2S50E-6PQG208C acts as a flexible glue-logic device between microprocessors, DSPs, and memory in embedded systems. With 146 user I/Os, it can implement 32-bit bus arbitration, address decoding, wait-state generation, and DMA handshaking across multiple masters. The 32 kbit block RAM doubles as a small FIFO or scratch buffer for boot configuration, while JTAG 1149.1 boundary-scan simplifies board-test for high-density designs. This role is common in legacy VME/CompactPCI cards, industrial SBCs, and avionics LRUs predating integrated SoCs.
推荐
Prototype and Low-Volume Production Platforms
The XC2S50E-6PQG208C in the 208-PQFP package is a preferred FPGA for hand-soldered prototypes and low-volume production runs because its 1.0 mm lead pitch is far easier to rework than the 0.5 mm BGAs that dominate newer Spartan families. Engineers use it on breadboards and breakout boards for proof-of-concept designs, university teaching kits, and short-run industrial controllers where BGA inspection equipment is unavailable. The PQFP body size of 30.6 × 30.6 mm also simplifies socket-based programming during development.
推荐
推荐产品汇总
工程参考数据: XC2S50E-6PQG208C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC2S100E-6PQG208C | XC2S150E-6PQG208C | XC2S50E-6PQG208I | XC2S50-6PQG208C |
|---|---|---|---|---|---|
| Brand | AMD (formerly Xilinx) | AMD | AMD | AMD | AMD |
| Package | 208-PQFP (PQG208) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| System Gates | 50,000 | 100,000 (+100%) | 150,000 (+200%) | 50,000 (same) | 50,000 (same) |
| Logic Cells | 1,728 | 2,700 (+56%) | 3,888 (+125%) | 1,728 (same) | 1,728 (same) |
| Block RAM | 32 kbit | 40 kbit (+25%) | 48 kbit (+50%) | 32 kbit (same) | 32 kbit (same) |
| User I/O Pins | 146 | 146 (same) | 146 (same) | 146 (same) | 146 (same) |
| Speed Grade | -6 (6 ns) | -6 (same) | -6 (same) | -6 (same) | -6 (same) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) |
| DLLs | 4 | 4 | 4 | 4 | 2 (Spartan-II non-E) |
关键差异点
- Pin-to-pin migration path to higher density without PCB redesign (对比 XC2S100E-6PQG208C)
- Industrial temperature option available (对比 XC2S50E-6PQG208I)
- More DLLs and lower power than original Spartan-II (对比 XC2S50-6PQG208C)
设计说明
The XC2S50E-6PQG208C requires a regulated 2.5 V core supply (VCCINT, ±5% tolerance) and a separately regulated VCCIO supply per bank, programmable from 1.5 V to 3.3 V. Decouple every VCCINT and VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the package pin, and add one bulk 10 µF tantalum or ceramic capacitor per supply rail. Estimated: typical VCCINT current at 50% logic utilization and 100 MHz is ~80 mA; budget 200 mA worst-case for power supply design.
The 208-PQFP has a 1.0 mm lead pitch and 30.6 × 30.6 mm body. Route all signal traces on inner layers for the PQFP perimeter to escape the dense leads; place at least two complete ground planes adjacent to the device to provide low-impedance return paths. Traces should be 0.15 mm wide with 0.15 mm spacing, and the package thermal pad (if present) should be soldered to a thermal relief copper pour connected to GND for improved heat dissipation.
Configuration bitstream storage: the XC2S50E is SRAM-based and loses configuration on power-down; pair it with a Xilinx XC18V00 Platform Flash PROM or external SPI flash for production. JTAG pins (TCK, TDI, TDO, TMS) must be pulled or terminated per the IEEE 1149.1 standard; floating TCK/TMS during power-up can cause unintended boundary-scan mode entry. Always assert PROG_B before reconfiguring, and monitor INIT_B to detect configuration CRC errors.
合规信息
RoHS-compliant lead-free (matte tin) finish per AMD/Xilinx product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade device. Conflict-minerals compliant per AMD's annual CMRT declaration.