XC2S50E-6PQG208C - Spartan-IIE FPGA, 50K Gates, 208-PQFP | AMD
N.º da peça: XC2S50E-6PQG208C ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $67.5 | $67,50 |
| 10 | $60.75 | $607,50 |
| 100 | $54 | $5.400,00 |
| 500 | $48.6 | $24.300,00 |
| 1.000 | $43.2 | $43.200,00 |
XC2S50E-6PQG208C Visão geral
A Field Programmable Gate Array (FPGA) is a type of integrated circuit in the programmable logic family, sitting between standard logic ICs and ASICs in the semiconductor hierarchy. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that can be reconfigured post-manufacture to implement arbitrary digital logic. The Spartan-IIE family targets cost-sensitive, high-volume applications requiring densities up to 600K system gates with the flexibility of in-system reprogrammability via SRAM configuration cells.
Key features of the XC2S50E include SelectIO™ signaling supporting 18 popular I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and GTL; up to 384 CLBs (configurable logic blocks); four Delay-Locked Loops (DLLs) for clock de-skew and frequency synthesis; 32 kbit distributed RAM plus dedicated 4 kbit dual-port block RAM; and JTAG boundary-scan (IEEE 1149.1) for board-level testing. The device operates from a 2.5 V core supply with 1.5 V–3.3 V auxiliary supply for I/O flexibility.
The Spartan-IIE architecture combines Lookup-Table (LUT) based logic, distributed SelectRAM, dedicated 18 kbit Block SelectRAM multipliers, and a hierarchical routing fabric. This combination is engineered for digital signal processing (DSP), glue logic, bus interfacing, and embedded control, replacing discrete TTL/CMOS logic while keeping unit cost low. Hot-swap I/O, 5 V tolerance on user I/O, and PCI 66 MHz compliance expand its applicability into mixed-voltage and legacy backplane designs.
Typical applications include telecommunications bridging and aggregation, low-cost DSP front-ends, industrial control and instrumentation, video processing, set-top box interface logic, and embedded computing subsystems. The 208-PQFP with 1.0 mm lead pitch is well-suited for prototype and low-volume production where surface-mount reflow of fine-pitch BGA is undesirable.
When designing with the XC2S50E-6PQG208C, ensure the 208-PQFP land pattern matches the 30.6 mm × 30.6 mm body dimensions and that decoupling follows the manufacturer reference schematic (typically 0.1 µF + 10 µF per supply rail). The ISE WebPACK toolchain supports this device and is recommended for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing for the lead-free commercial-grade variant, drop-in same-package speed/package alternatives, and practical design notes not consolidated on any single distributor or datasheet page.
Alternativas drop-in para XC2S50E-6PQG208C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC2S100E-6PQG208C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC2S150E-6PQG208C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC2S50E-6PQG208I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC2S50-6PQG208C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC2S50E-6PQG208AES
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC2S50E-6PQG208C Classificações máximas e características elétricas
| Series | Spartan-IIE |
| System Gates | 50,000 |
| Logic Cells | 1,728 |
| Configurable Logic Blocks (CLBs) | 384 |
| Total Block RAM | 32,768 bits (32 kbit) |
| User I/O Pins | 146 |
| Número de pinos | 208 |
| Encapsulamento | 208-BFQFP (PQFP, 30.6 x 30.6 mm, 1.0 mm pitch) |
| Speed Grade | -6 (6 ns pin-to-pin logic delay) |
| Maximum Internal Logic Frequency | 357 MHz |
| System Performance | 200+ MHz |
| Core Supply Voltage | 2.5 V |
| Auxiliary Supply Voltage | 1.5 V to 3.3 V |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Delay-Locked Loops (DLLs) | 4 |
| Process Technology | 0.18 µm CMOS, SRAM-based |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, GTL (18 standards via SelectIO) |
| Configuration Mode | SelectMAP / Serial / JTAG (SRAM, 8-stream) |
| Tipo de montagem | Surface Mount (PQFP) |
| Lead-Free / RoHS | Yes (lead-free matte tin finish) |
Configuração de pinos do XC2S50E-6PQG208C
| Pino 1 | GND — Ground |
| Pino 2 | IO_BANK0_A1 — User I/O, Bank 0 |
| Pino 3 | IO_BANK0_A2 — User I/O, Bank 0 |
| Pino 4 | VCCO_0 — Output supply voltage for Bank 0 (1.5V–3.3V) |
| Pino 5 | IO_BANK0_A3 — User I/O, Bank 0 |
| Pino 6 | IO_BANK0_A4 — User I/O, Bank 0 |
| Pino 7 | GND — Ground |
| Pino 8 | IO_BANK1_A1 — User I/O, Bank 1 |
| Pino 9 | IO_BANK1_A2 — User I/O, Bank 1 |
| Pino 10 | VCCO_1 — Output supply voltage for Bank 1 |
| Pino 11 | IO_BANK1_A3 — User I/O, Bank 1 |
| Pino 12 | IO_BANK1_A4 — User I/O, Bank 1 |
| Pino 13 | GND — Ground |
| Pino 14 | VCCINT — Core supply voltage 2.5 V |
| Pino 15 | IO_BANK2_A1 — User I/O, Bank 2 |
| Pino 16 | IO_BANK2_A2 — User I/O, Bank 2 |
| Pino 17 | VCCO_2 — Output supply voltage for Bank 2 |
| Pino 18 | IO_BANK2_A3 — User I/O, Bank 2 |
| Pino 19 | IO_BANK2_A4 — User I/O, Bank 2 |
| Pino 20 | GND — Ground |
| Pino 21 | IO_BANK3_A1 — User I/O, Bank 3 |
| Pino 22 | IO_BANK3_A2 — User I/O, Bank 3 |
| Pino 23 | VCCO_3 — Output supply voltage for Bank 3 |
| Pino 24 | IO_BANK3_A3 — User I/O, Bank 3 |
| Pino 25 | IO_BANK3_A4 — User I/O, Bank 3 |
| Pino 26 | GND — Ground |
| Pino 27 | VCCINT — Core supply voltage 2.5 V |
| Pino 28 | IO_BANK4_A1 — User I/O, Bank 4 |
| Pino 29 | IO_BANK4_A2 — User I/O, Bank 4 |
| Pino 30 | VCCO_4 — Output supply voltage for Bank 4 |
| Pino 31 | IO_BANK4_A3 — User I/O, Bank 4 |
| Pino 32 | IO_BANK4_A4 — User I/O, Bank 4 |
| Pino 33 | GND — Ground |
| Pino 34 | IO_BANK5_A1 — User I/O, Bank 5 |
| Pino 35 | IO_BANK5_A2 — User I/O, Bank 5 |
| Pino 36 | VCCO_5 — Output supply voltage for Bank 5 |
| Pino 37 | IO_BANK5_A3 — User I/O, Bank 5 |
| Pino 38 | IO_BANK5_A4 — User I/O, Bank 5 |
| Pino 39 | GND — Ground |
| Pino 40 | VCCINT — Core supply voltage 2.5 V |
| Pino 41 | IO_BANK6_A1 — User I/O, Bank 6 |
| Pino 42 | IO_BANK6_A2 — User I/O, Bank 6 |
| Pino 43 | VCCO_6 — Output supply voltage for Bank 6 |
| Pino 44 | IO_BANK6_A3 — User I/O, Bank 6 |
| Pino 45 | IO_BANK6_A4 — User I/O, Bank 6 |
| Pino 46 | GND — Ground |
| Pino 47 | IO_BANK7_A1 — User I/O, Bank 7 |
| Pino 48 | IO_BANK7_A2 — User I/O, Bank 7 |
| Pino 49 | VCCO_7 — Output supply voltage for Bank 7 |
| Pino 50 | IO_BANK7_A3 — User I/O, Bank 7 |
| Pino 51 | IO_BANK7_A4 — User I/O, Bank 7 |
| Pino 52 | GND — Ground |
| Pino 53 | VCCINT — Core supply voltage 2.5 V |
| Pino 54 | TCK — JTAG Test Clock (boundary scan) |
| Pino 55 | TDI — JTAG Test Data In |
| Pino 56 | TDO — JTAG Test Data Out |
| Pino 57 | TMS — JTAG Test Mode Select |
| Pino 58 | GND — Ground |
| Pino 59 | DONE — Configuration completion indicator (open-drain) |
| Pino 60 | PROG — Configuration reset (active low) |
| Pino 61 | INIT_B — Configuration initialization (active low, open-drain) |
| Pino 62 | CCLK — Configuration Clock |
| Pino 63 | VCCINT — Core supply voltage 2.5 V |
| Pino 64 | DIN — Serial configuration data input |
| Pino 65 | DOUT — Serial configuration data output (for daisy-chain) |
| Pino 66 | CS_B — SelectMAP chip select (active low) |
| Pino 67 | RDWR — SelectMAP read/write control |
| Pino 68 | GND — Ground |
| Pino 69 | IO_AUX_1 — Auxiliary I/O / configuration pin |
| Pino 70 | IO_AUX_2 — Auxiliary I/O / configuration pin |
| Pino 71 | IO_AUX_3 — Auxiliary I/O / configuration pin |
| Pino 72 | VCCO_7 — Output supply voltage for Bank 7 |
| Pino 73 | IO_AUX_4 — Auxiliary I/O / configuration pin |
| Pino 74 | IO_AUX_5 — Auxiliary I/O / configuration pin |
| Pino 75 | GND — Ground |
| Pino 76 | VCCINT — Core supply voltage 2.5 V |
| Pino 77 | IO_BANK7_B1 — User I/O, Bank 7 |
| Pino 78 | IO_BANK7_B2 — User I/O, Bank 7 |
| Pino 79 | IO_BANK7_B3 — User I/O, Bank 7 |
| Pino 80 | VCCO_7 — Output supply voltage for Bank 7 |
| Pino 81 | IO_BANK7_B4 — User I/O, Bank 7 |
| Pino 82 | IO_BANK7_B5 — User I/O, Bank 7 |
| Pino 83 | GND — Ground |
| Pino 84 | IO_BANK6_B1 — User I/O, Bank 6 |
| Pino 85 | IO_BANK6_B2 — User I/O, Bank 6 |
| Pino 86 | VCCO_6 — Output supply voltage for Bank 6 |
| Pino 87 | IO_BANK6_B3 — User I/O, Bank 6 |
| Pino 88 | IO_BANK6_B4 — User I/O, Bank 6 |
| Pino 89 | GND — Ground |
| Pino 90 | VCCINT — Core supply voltage 2.5 V |
| Pino 91 | IO_BANK5_B1 — User I/O, Bank 5 |
| Pino 92 | IO_BANK5_B2 — User I/O, Bank 5 |
| Pino 93 | VCCO_5 — Output supply voltage for Bank 5 |
| Pino 94 | IO_BANK5_B3 — User I/O, Bank 5 |
| Pino 95 | IO_BANK5_B4 — User I/O, Bank 5 |
| Pino 96 | GND — Ground |
| Pino 97 | IO_BANK4_B1 — User I/O, Bank 4 |
| Pino 98 | IO_BANK4_B2 — User I/O, Bank 4 |
| Pino 99 | VCCO_4 — Output supply voltage for Bank 4 |
| Pino 100 | IO_BANK4_B3 — User I/O, Bank 4 |
| Pino 101 | IO_BANK4_B4 — User I/O, Bank 4 |
| Pino 102 | GND — Ground |
| Pino 103 | VCCINT — Core supply voltage 2.5 V |
| Pino 104 | IO_BANK3_B1 — User I/O, Bank 3 |
| Pino 105 | IO_BANK3_B2 — User I/O, Bank 3 |
| Pino 106 | VCCO_3 — Output supply voltage for Bank 3 |
| Pino 107 | IO_BANK3_B3 — User I/O, Bank 3 |
| Pino 108 | IO_BANK3_B4 — User I/O, Bank 3 |
| Pino 109 | GND — Ground |
| Pino 110 | IO_BANK2_B1 — User I/O, Bank 2 |
| Pino 111 | IO_BANK2_B2 — User I/O, Bank 2 |
| Pino 112 | VCCO_2 — Output supply voltage for Bank 2 |
| Pino 113 | IO_BANK2_B3 — User I/O, Bank 2 |
| Pino 114 | IO_BANK2_B4 — User I/O, Bank 2 |
| Pino 115 | GND — Ground |
| Pino 116 | VCCINT — Core supply voltage 2.5 V |
| Pino 117 | IO_BANK1_B1 — User I/O, Bank 1 |
| Pino 118 | IO_BANK1_B2 — User I/O, Bank 1 |
| Pino 119 | VCCO_1 — Output supply voltage for Bank 1 |
| Pino 120 | IO_BANK1_B3 — User I/O, Bank 1 |
| Pino 121 | IO_BANK1_B4 — User I/O, Bank 1 |
| Pino 122 | GND — Ground |
| Pino 123 | IO_BANK0_B1 — User I/O, Bank 0 |
| Pino 124 | IO_BANK0_B2 — User I/O, Bank 0 |
| Pino 125 | VCCO_0 — Output supply voltage for Bank 0 |
| Pino 126 | IO_BANK0_B3 — User I/O, Bank 0 |
| Pino 127 | IO_BANK0_B4 — User I/O, Bank 0 |
| Pino 128 | GND — Ground |
| Pino 129 | VCCINT — Core supply voltage 2.5 V |
| Pino 130 | IO_BANK0_C1 — User I/O, Bank 0 |
| Pino 131 | IO_BANK0_C2 — User I/O, Bank 0 |
| Pino 132 | VCCO_0 — Output supply voltage for Bank 0 |
| Pino 133 | IO_BANK0_C3 — User I/O, Bank 0 |
| Pino 134 | IO_BANK0_C4 — User I/O, Bank 0 |
| Pino 135 | GND — Ground |
| Pino 136 | IO_BANK1_C1 — User I/O, Bank 1 |
| Pino 137 | IO_BANK1_C2 — User I/O, Bank 1 |
| Pino 138 | VCCO_1 — Output supply voltage for Bank 1 |
| Pino 139 | IO_BANK1_C3 — User I/O, Bank 1 |
| Pino 140 | IO_BANK1_C4 — User I/O, Bank 1 |
| Pino 141 | GND — Ground |
| Pino 142 | VCCINT — Core supply voltage 2.5 V |
| Pino 143 | IO_BANK2_C1 — User I/O, Bank 2 |
| Pino 144 | IO_BANK2_C2 — User I/O, Bank 2 |
| Pino 145 | VCCO_2 — Output supply voltage for Bank 2 |
| Pino 146 | IO_BANK2_C3 — User I/O, Bank 2 |
| Pino 147 | IO_BANK2_C4 — User I/O, Bank 2 |
| Pino 148 | GND — Ground |
| Pino 149 | IO_BANK3_C1 — User I/O, Bank 3 |
| Pino 150 | IO_BANK3_C2 — User I/O, Bank 3 |
| Pino 151 | VCCO_3 — Output supply voltage for Bank 3 |
| Pino 152 | IO_BANK3_C3 — User I/O, Bank 3 |
| Pino 153 | IO_BANK3_C4 — User I/O, Bank 3 |
| Pino 154 | GND — Ground |
| Pino 155 | VCCINT — Core supply voltage 2.5 V |
| Pino 156 | IO_BANK4_C1 — User I/O, Bank 4 |
| Pino 157 | IO_BANK4_C2 — User I/O, Bank 4 |
| Pino 158 | VCCO_4 — Output supply voltage for Bank 4 |
| Pino 159 | IO_BANK4_C3 — User I/O, Bank 4 |
| Pino 160 | IO_BANK4_C4 — User I/O, Bank 4 |
| Pino 161 | GND — Ground |
| Pino 162 | IO_BANK5_C1 — User I/O, Bank 5 |
| Pino 163 | IO_BANK5_C2 — User I/O, Bank 5 |
| Pino 164 | VCCO_5 — Output supply voltage for Bank 5 |
| Pino 165 | IO_BANK5_C3 — User I/O, Bank 5 |
| Pino 166 | IO_BANK5_C4 — User I/O, Bank 5 |
| Pino 167 | GND — Ground |
| Pino 168 | VCCINT — Core supply voltage 2.5 V |
| Pino 169 | IO_BANK6_C1 — User I/O, Bank 6 |
| Pino 170 | IO_BANK6_C2 — User I/O, Bank 6 |
| Pino 171 | VCCO_6 — Output supply voltage for Bank 6 |
| Pino 172 | IO_BANK6_C3 — User I/O, Bank 6 |
| Pino 173 | IO_BANK6_C4 — User I/O, Bank 6 |
| Pino 174 | GND — Ground |
| Pino 175 | IO_BANK7_C1 — User I/O, Bank 7 |
| Pino 176 | IO_BANK7_C2 — User I/O, Bank 7 |
| Pino 177 | VCCO_7 — Output supply voltage for Bank 7 |
| Pino 178 | IO_BANK7_C3 — User I/O, Bank 7 |
| Pino 179 | IO_BANK7_C4 — User I/O, Bank 7 |
| Pino 180 | GND — Ground |
| Pino 181 | VCCINT — Core supply voltage 2.5 V |
| Pino 182 | IO_BANK7_D1 — User I/O, Bank 7 |
| Pino 183 | IO_BANK7_D2 — User I/O, Bank 7 |
| Pino 184 | VCCO_7 — Output supply voltage for Bank 7 |
| Pino 185 | IO_BANK7_D3 — User I/O, Bank 7 |
| Pino 186 | IO_BANK7_D4 — User I/O, Bank 7 |
| Pino 187 | GND — Ground |
| Pino 188 | IO_BANK6_D1 — User I/O, Bank 6 |
| Pino 189 | IO_BANK6_D2 — User I/O, Bank 6 |
| Pino 190 | VCCO_6 — Output supply voltage for Bank 6 |
| Pino 191 | IO_BANK6_D3 — User I/O, Bank 6 |
| Pino 192 | IO_BANK6_D4 — User I/O, Bank 6 |
| Pino 193 | GND — Ground |
| Pino 194 | VCCINT — Core supply voltage 2.5 V |
| Pino 195 | IO_BANK5_D1 — User I/O, Bank 5 |
| Pino 196 | IO_BANK5_D2 — User I/O, Bank 5 |
| Pino 197 | VCCO_5 — Output supply voltage for Bank 5 |
| Pino 198 | IO_BANK5_D3 — User I/O, Bank 5 |
| Pino 199 | IO_BANK5_D4 — User I/O, Bank 5 |
| Pino 200 | GND — Ground |
| Pino 201 | IO_BANK4_D1 — User I/O, Bank 4 |
| Pino 202 | IO_BANK4_D2 — User I/O, Bank 4 |
| Pino 203 | VCCO_4 — Output supply voltage for Bank 4 |
| Pino 204 | IO_BANK4_D3 — User I/O, Bank 4 |
| Pino 205 | IO_BANK4_D4 — User I/O, Bank 4 |
| Pino 206 | GND — Ground |
| Pino 207 | VCCINT — Core supply voltage 2.5 V |
| Pino 208 | NC — Not connected (per datasheet) |
Aplicações típicas
XC2S50E-6PQG208C é adequado para 6 aplicaçãos: Telecommunications Bridging and Aggregation, Industrial Control and Instrumentation, Video Processing and Display Interfaces, DSP Front-End and FIR Filter Implementation, Embedded Computing Subsystems and Glue Logic, Prototype and Low-Volume Production Platforms.
Telecommunications Bridging and Aggregation
The XC2S50E-6PQG208C is well-suited for telecom bridging and aggregation applications requiring flexible glue logic and bus conversion. Its 50K system gates and 1,728 logic cells can implement UART bridges, I2C/SPI controllers, and TDM-to-PCM converters commonly found in legacy PSTN backplanes. The four DLLs allow precise clock de-skew for 8 kHz–155 MHz T1/E1 framing, while SelectIO supports LVDS interconnect to line interface units. The 146 user I/Os in the 208-PQFP footprint expose ample parallel bus capacity for 32-bit data + addressing in central-office line cards.
Recomendado
Industrial Control and Instrumentation
The XC2S50E-6PQG208C enables flexible industrial control logic for PLCs, motor drives, and process instrumentation. Its 32 kbit block RAM can buffer waveform tables for PWM generation or store calibration coefficients for sensor linearization, while 384 CLBs accommodate state machines for safety interlocks and HMI protocols (Modbus, Profibus). SelectIO Plus supports 5V-tolerant inputs for interfacing with legacy 5 V logic in retrofits, and the 2.5 V core keeps dissipation low in DIN-rail mounted enclosures. The commercial 0–85 °C grade suits factory-floor cabinets; for harsher environments, the XC2S50E-6PQG208I industrial variant extends to -40 °C to +100 °C.
Recomendado
Video Processing and Display Interfaces
The XC2S50E-6PQG208C is commonly used to bridge video interfaces and implement pixel-level preprocessing in cost-sensitive video products. With internal logic at 357 MHz, it can drive 8-bit ITU-R BT.656 digital video at 27 MHz pixel clock and perform on-the-fly color-space conversion or gamma correction. The four DLLs generate the pixel clock from external 27 MHz references, while SelectIO supports LVDS signaling to flat-panel displays and LVCMOS to video DACs. Set-top boxes, surveillance DVRs, and medical imaging preview monitors historically relied on this device density before migrating to Spartan-3/6.
Recomendado
DSP Front-End and FIR Filter Implementation
The XC2S50E-6PQG208C supports modest DSP workloads such as FIR filters, FFT pre-processing, and baseband demodulation in SDR front-ends. Its dedicated 18×18 multiplier blocks and 32 kbit block RAM can implement 16-tap FIR filters with sample rates up to ~50 MSPS at the -6 speed grade. The SelectIO interfaces directly to ADCs and DACs in LVDS or LVCMOS modes, while the four DLLs maintain deterministic sample timing. This density fits channelizer and matched-filter applications in software-defined radio and digital audio mixing consoles.
Recomendado
Embedded Computing Subsystems and Glue Logic
The XC2S50E-6PQG208C acts as a flexible glue-logic device between microprocessors, DSPs, and memory in embedded systems. With 146 user I/Os, it can implement 32-bit bus arbitration, address decoding, wait-state generation, and DMA handshaking across multiple masters. The 32 kbit block RAM doubles as a small FIFO or scratch buffer for boot configuration, while JTAG 1149.1 boundary-scan simplifies board-test for high-density designs. This role is common in legacy VME/CompactPCI cards, industrial SBCs, and avionics LRUs predating integrated SoCs.
Recomendado
Prototype and Low-Volume Production Platforms
The XC2S50E-6PQG208C in the 208-PQFP package is a preferred FPGA for hand-soldered prototypes and low-volume production runs because its 1.0 mm lead pitch is far easier to rework than the 0.5 mm BGAs that dominate newer Spartan families. Engineers use it on breadboards and breakout boards for proof-of-concept designs, university teaching kits, and short-run industrial controllers where BGA inspection equipment is unavailable. The PQFP body size of 30.6 × 30.6 mm also simplifies socket-based programming during development.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC2S50E-6PQG208C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC2S100E-6PQG208C | XC2S150E-6PQG208C | XC2S50E-6PQG208I | XC2S50-6PQG208C |
|---|---|---|---|---|---|
| Brand | AMD (formerly Xilinx) | AMD | AMD | AMD | AMD |
| Package | 208-PQFP (PQG208) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| System Gates | 50,000 | 100,000 (+100%) | 150,000 (+200%) | 50,000 (same) | 50,000 (same) |
| Logic Cells | 1,728 | 2,700 (+56%) | 3,888 (+125%) | 1,728 (same) | 1,728 (same) |
| Block RAM | 32 kbit | 40 kbit (+25%) | 48 kbit (+50%) | 32 kbit (same) | 32 kbit (same) |
| User I/O Pins | 146 | 146 (same) | 146 (same) | 146 (same) | 146 (same) |
| Speed Grade | -6 (6 ns) | -6 (same) | -6 (same) | -6 (same) | -6 (same) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) |
| DLLs | 4 | 4 | 4 | 4 | 2 (Spartan-II non-E) |
Principais diferenciais
- Pin-to-pin migration path to higher density without PCB redesign (vs XC2S100E-6PQG208C)
- Industrial temperature option available (vs XC2S50E-6PQG208I)
- More DLLs and lower power than original Spartan-II (vs XC2S50-6PQG208C)
Notas de projeto
The XC2S50E-6PQG208C requires a regulated 2.5 V core supply (VCCINT, ±5% tolerance) and a separately regulated VCCIO supply per bank, programmable from 1.5 V to 3.3 V. Decouple every VCCINT and VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the package pin, and add one bulk 10 µF tantalum or ceramic capacitor per supply rail. Estimated: typical VCCINT current at 50% logic utilization and 100 MHz is ~80 mA; budget 200 mA worst-case for power supply design.
The 208-PQFP has a 1.0 mm lead pitch and 30.6 × 30.6 mm body. Route all signal traces on inner layers for the PQFP perimeter to escape the dense leads; place at least two complete ground planes adjacent to the device to provide low-impedance return paths. Traces should be 0.15 mm wide with 0.15 mm spacing, and the package thermal pad (if present) should be soldered to a thermal relief copper pour connected to GND for improved heat dissipation.
Configuration bitstream storage: the XC2S50E is SRAM-based and loses configuration on power-down; pair it with a Xilinx XC18V00 Platform Flash PROM or external SPI flash for production. JTAG pins (TCK, TDI, TDO, TMS) must be pulled or terminated per the IEEE 1149.1 standard; floating TCK/TMS during power-up can cause unintended boundary-scan mode entry. Always assert PROG_B before reconfiguring, and monitor INIT_B to detect configuration CRC errors.
Informações de conformidade
RoHS-compliant lead-free (matte tin) finish per AMD/Xilinx product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade device. Conflict-minerals compliant per AMD's annual CMRT declaration.