XC3S400-4TQ144C - 400K Gate Spartan-3 FPGA | AMD
Référence : XC3S400-4TQ144C ✗ Fin de vieXC3S400-4TQ144C Présentation
An FPGA is a programmable logic device within the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function ASIC, an FPGA combines configurable logic, programmable routing, dedicated input/output resources, and embedded memory blocks on one device. This lets engineers revise digital architectures through configuration files instead of redesigning and fabricating custom silicon, making FPGAs useful for prototypes, industrial controllers, communication systems, and embedded signal-processing equipment.
The Spartan-3 architecture provides 8,064 logic cells for implementing sequential and combinational functions. The device also includes 97 I/Os and 294,912 bits of block RAM, according to the DigiKey listing. A 1.2 V core operating voltage suits modern low-voltage digital designs, while the TQFP-144 package provides 144 leads for external power, configuration, clock, and user-interface connections.
The part belongs to the Spartan-3 family, which combines programmable logic with dedicated multipliers, block RAM, and clock-management resources. Those blocks allow designers to implement parallel data paths, packet-processing pipelines, control logic, and memory-intensive functions without relying on external discrete logic. The commercial-temperature C-grade designation supports product designs operating from 0 °C to 85 °C when all specified electrical and environmental limits are observed.
Typical uses include industrial automation, communication equipment, embedded control, test and measurement, video and image processing, and general-purpose digital prototyping. The 97 available I/Os are particularly useful for parallel buses, counters, status signals, memory interfaces, and communication links. Designers should account for configuration startup behavior, clocking, decoupling, and I/O-standard requirements when planning the surrounding PCB.
For a new board, place all supply pins and their associated decoupling capacitors according to the manufacturer layout guidance, keep sensitive clock and configuration routing away from noisy digital nets, and validate every interface voltage against the selected I/O standard. Existing XC3S400 TQFP-144 designs should compare device speed grade, temperature grade, package drawing, configuration interface, and supply requirements before selecting a replacement.
This page consolidates verified distributor information, same-family drop-in alternatives, commercial availability data, and practical migration guidance. It is intended to accelerate component identification and sourcing without presenting unverified package details or unsupported cross-brand substitutions as drop-in replacements.
Alternatives de remplacement direct pour XC3S400-4TQ144C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S400-4TQ144C (même facteur de forme et même empreinte) — différant par Device Type, System Gates, Operating Temperature, Performance Grade, Temperature Grade.
XC3S400-5TQ144C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC3S400-4TQG144C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S400-5TQG144C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S400-4TQ144I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC3S400-4TQG144I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S400-4TQ144C Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 400,000 |
| Logic Cells | 8,064 |
| Block RAM | 294,912 bit |
| User I/Os | 97 |
| Core Supply Voltage | 1.2 V |
| Performance Grade | -4 |
| Temperature Grade | Commercial (C) |
| Température de fonctionnement | 0 °C to 85 °C |
| Boîtier | 144-pin TQFP |
| Package Body Size | 20 mm × 20 mm |
| Technology | 90 nm |
| Adaptive Logic Modules | 3,584 |
| Type de montage | Surface mount |
| Statut RoHS | Compliant |
| Lead-Free Status | Lead-free |
Guide de configuration des broches du XC3S400-4TQ144C 20 mm × 20 mm
Configuration des broches du XC3S400-4TQ144C (boîtier 20 mm × 20 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S400-4TQ144C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S400-4TQ144C convient pour 6 applications: Industrial Automation Controller, Communication and Packet Processing, Embedded Signal Processing, Test and Measurement Equipment, Video and Image Processing, Digital Product Prototyping.
Industrial Automation Controller
The XC3S400-4TQ144C fits industrial automation because its 8,064 logic cells can implement sequencing, state-machine, and supervisory-control logic while 97 I/Os connect sensors, actuators, and status indicators. Its 1.2 V core and -4 speed grade suit low-voltage digital subsystems requiring predictable timing. Engineers can implement parallel control paths, diagnostics, and communication-interface logic in one programmable device, reducing the need for separate glue logic. The commercial 0 °C to 85 °C range suits equipment whose internal ambient remains within that range. Before deployment, verify timing for the slowest required state transition, provide regulated and decoupled core power, constrain every external interface to a supported I/O standard, and validate the assembled controller against the system’s EMC and environmental requirements.
Recommandé
Communication and Packet Processing
The XC3S400-4TQ144C is appropriate for communication front ends that combine framing, filtering, packet-buffer management, and supervisory logic. Its 400,000 system gates and 8,064 logic cells provide substantial parallel-processing capacity, while 294,912 bits of block RAM can support small packet queues or line buffers. The 97 I/Os can carry byte-wide data buses, transmit and receive control signals, clocks, and status. A practical implementation would use dedicated clock distribution, synchronous interfaces where required, and registered boundaries to constrain timing. Because actual I/O standards and internal block capabilities require confirmation in the manufacturer documentation, the board should not be released until the selected interface voltages, clock topology, and timing constraints have been checked against the device data sheet.
Recommandé
Embedded Signal Processing
The XC3S400-4TQ144C can implement parallel digital signal-processing pipelines where throughput and configurable logic matter more than a fixed processor instruction set. The Spartan-3 logic and memory resources support filters, counters, correlation functions, and control logic that run concurrently, while 97 I/Os provide connections to converters, memory devices, and synchronization circuits. Using the -4 grade is appropriate when the original timing budget was established around that performance class. The implementation should include registered pipeline stages, controlled clock distribution, and source-synchronous or otherwise verified interfaces where high-speed data is involved. Engineers must confirm multiplier, block-RAM, and I/O performance directly from the manufacturer documentation and run post-route timing analysis rather than assuming advertised system-gate count determines final clock frequency.
Recommandé
Test and Measurement Equipment
The XC3S400-4TQ144C is suitable for programmable test and measurement equipment requiring adaptable acquisition, timing, and control logic. Its 8,064 logic cells can coordinate instruments, execute sequencing routines, and supervise data paths, while 97 I/Os support digital stimulus, trigger, status, and inter-instrument connections. The 294,912 bits of block RAM can be divided into buffers or working storage for measurement data. Designers should isolate sensitive analog and reference circuitry from high-current digital switching, use controlled clock distribution, and terminate inputs according to their selected I/O standard. For production instrumentation, the complete timing closure, power-integrity, and environmental validation must be completed at the board level because the verified distributor information does not provide detailed analog-interface or internal-clock specifications.
Recommandé
Video and Image Processing
The XC3S400-4TQ144C can support parallel video or image-processing functions such as timing generation, pixel routing, line and frame counters, and control interfaces. The 400,000-system-gate Spartan-3 architecture provides enough configurable logic for multiple pipeline stages, while 97 I/Os accommodate parallel pixel buses, synchronization signals, and configuration controls. The -4 speed grade may suit designs whose timing margins were originally verified around this class. Implementation should use dedicated clock inputs or properly constrained clock buffers, registered I/O boundaries where required, and PCB routing that minimizes skew between related signals. Video timing, I/O voltage compatibility, and achievable pixel-clock rate must be established through pin-specific timing analysis and the manufacturer’s I/O guidance before layout release.
Recommandé
Digital Product Prototyping
The XC3S400-4TQ144C is useful for digital prototypes because programmable logic permits architecture changes without a silicon respin. Its 8,064 logic cells support control logic, state machines, data paths, and reusable interface blocks, while 97 I/Os provide substantial connectivity for breadboards or evaluation boards. Engineers can prototype sensor acquisition, custom peripheral behavior, or communication framing and later move the design to a production implementation with less redesign risk. The TQFP-144 package is large enough for prototype-level access but still requires careful fanout on dense boards. For a reliable prototype, use a manufacturer-recommended power and decoupling network, establish clock and configuration behavior early, and keep external connectors away from sensitive timing paths. Final timing and electrical validation should use the exact -4 device rather than relying on a generic Spartan-3 model.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S400-4TQ144C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S400-5TQ144C | XC3S400-4TQG144C | XC3S400-5TQG144C | XC3S400-4TQ144I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 144-pin TQFP | 144-pin TQFP | 144-pin TQFP | 144-pin TQFP | 144-pin TQFP |
| Device Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Speed Grade | -4 | -5 | -4 | -5 | -4 |
Principaux différenciateurs
- Original -4 commercial-grade ordering option (vs XC3S400-5TQ144C)
- Direct same-package migration (vs XC3S400-4TQG144C)
- Broader environmental migration within the same family (vs XC3S400-4TQ144I)
Notes de conception
The verified core supply is 1.2 V, but auxiliary and I/O supply requirements must be taken from the manufacturer pin and power-connection guidance. Place the required decoupling capacitance adjacent to the appropriate supply pins, keep return paths short, and separate sensitive analog or reference supplies from digital switching currents. Verify supply sequencing and voltage tolerances against the selected device and board-level power source before fabrication.
Use the manufacturer TQFP-144 package drawing for land pattern, pin numbering, and orientation. A complete public pin list was not included in the supplied evidence, so do not infer pin functions from the package outline. Check the configuration pins, clock inputs, grounds, and I/O assignments against the current datasheet before routing, and preserve the package pin-1 orientation marks during assembly.
Route clocks as controlled or dedicated clock signals and constrain them in the timing tool. Avoid routing high-speed buses beneath or parallel to clocks unless the board stack-up and reference-plane design have been analyzed. For external data interfaces, use matched-length techniques where required, provide series termination when appropriate, and validate setup and hold timing with the exact -4 speed grade rather than a generic family timing model.
Do not substitute a -5 speed device, a different temperature suffix, or a variant with a different package-ordering code without reviewing its ordering and qualification implications. The -5 grade can change timing and power behavior, while an I-grade device changes the environmental envelope. Third-party search results in the supplied data incorrectly describe the target with an FBGA-1156 package, so the 144-pin TQFP designation must be confirmed against the manufacturer documentation and the physical device marking.
Informations de conformité
RoHS and lead-free status are supported by the verified product comparison records. No verified automotive qualification, REACH declaration, halogen-free declaration, or conflict-minerals statement was supplied.
