XC6SLX150-2FG484C Spartan-6 LX FPGA | AMD Xilinx
Référence : XC6SLX150-2FG484C ✓ ActifXC6SLX150-2FG484C Présentation
A field-programmable gate array is a programmable digital semiconductor used to implement custom combinational and sequential logic. Its hierarchy extends from FPGA to programmable logic device, digital integrated circuit, and semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured after manufacture, allowing hardware logic, parallel processing, interfaces, and protocol behavior to be updated without changing the printed circuit board.
Key features include 338 user I/O, 11,519 configurable logic blocks, 147,443 logic cells, and an internal frequency rated at 667 MHz. The -2 designation identifies the middle Spartan-6 performance grade, while the commercial-temperature suffix supports operation from 0°C to 85°C. Its 484-ball chip-scale BGA package also supports dense PCB routing in systems where a large I/O count is more important than a simple leaded-package footprint.
The architecture combines configurable logic blocks with dedicated resources for interconnect, memory, and programmable I/O. This allows parallel datapaths, control logic, serial interfaces, and timing-sensitive functions to coexist in one device. The 667 MHz figure characterizes the device's internal operating frequency and should not be interpreted as the guaranteed performance of every user design; actual throughput also depends on the selected logic path, I/O standard, speed grade, timing constraints, and implemented function.
Typical applications include industrial control, test-and-measurement equipment, communications infrastructure, embedded imaging, signal processing, and general-purpose embedded control. The 338 I/O count is particularly useful when the design connects multiple buses, parallel converters, memory interfaces, control signals, or differential communication links without using a separate large pin-count companion device.
For PCB implementation, use the AMD Spartan-6 package pinout files when assigning BGA balls and routing the board. Confirm the selected I/O voltage, bank power requirements, decoupling, thermal performance, and configuration interface before release. Device replacement should account for the complete ordering code because speed-grade, temperature-grade, package, and lead-free suffixes affect qualification and behavior.
This page combines the XC6SLX150-2FG484C specifications, same-package replacement options, application guidance, and practical FPGA design considerations in one engineering-oriented reference. It also distinguishes the Spartan-6 LX resource level from the electrical, thermal, and ordering differences that determine whether a candidate is a true board-level replacement.
Alternatives de remplacement direct pour XC6SLX150-2FG484C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
XC6SLX150-2FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150-3FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150-3FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150-N3FG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150-1FG484C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC6SLX150-2FG484C Valeurs maximales et caractéristiques électriques
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Device Designation | XC6SLX150 |
| Speed Grade | -2 |
| Number of I/O | 338 I/O |
| Nombre de broches | 484 pins |
| Logic Cells | 147,443 cells |
| Configurable Logic Blocks | 11,519 CLBs |
| Internal Frequency | 667 MHz |
| Température de fonctionnement | 0°C to 85°C |
| Package Type | CSBGA-484 |
| Package Dimensions | 19 x 19 mm |
| Package Pitch | 0.80 mm |
| Technology | CMOS |
| Nominal Core Voltage | 1.2 V |
| Statut RoHS | Compliant |
| Lead-Free Status | Lead free |
| Type de montage | Surface-mount BGA |
Guide de configuration des broches du XC6SLX150-2FG484C 0.80 mm
Configuration des broches du XC6SLX150-2FG484C (boîtier 0.80 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX150-2FG484C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX150-2FG484C convient pour 6 applications: Industrial Control and Automation, Test and Measurement Equipment, Communications and Protocol Processing, Embedded Signal Processing, Video and Imaging Control, Security and Access Control.
Industrial Control and Automation
The XC6SLX150-2FG484C fits industrial controllers that combine parallel machine I/O with programmable timing and control logic. Its 338 user I/O can connect encoders, limit switches, sensor interfaces, actuator drivers, and operator displays without requiring numerous external interface components. The 11,519 configurable logic blocks and 147,443 logic cells allow state machines, motion-control datapaths, communications, and diagnostics to be consolidated into one FPGA. Use the 0°C to 85°C grade for commercial industrial equipment and validate the complete enclosure temperature. The -2 speed grade should be selected only after the critical control and bus paths close successfully against the device timing limits.
Recommandé
Test and Measurement Equipment
The XC6SLX150-2FG484C is useful in parallel data-acquisition and automated test systems where acquisition logic, timing generation, pattern processing, and communications must operate concurrently. Its 338 I/O provide substantial connectivity for probes, instrument buses, trigger signals, and status controls, while 11,519 CLBs support configurable measurement pipelines. The 667 MHz internal-frequency rating gives designers a basis for high-speed synchronous logic, but actual acquisition rate remains limited by I/O performance, pin standards, external memory, and timing closure. For instrumentation, place the FPGA close to connector and input circuitry, control edge-sensitive signals carefully, and keep analog and digital return paths separated.
Recommandé
Communications and Protocol Processing
The XC6SLX150-2FG484C can consolidate parallel protocol engines, packet buffering, clock-domain crossing, and supervisory logic into one Spartan-6 LX device. Its 338 I/O are valuable for multiple byte-wide buses, serial transceiver interfaces, status LEDs, and synchronization signals, while the programmable architecture permits multiple protocol paths to run concurrently. Designers can instantiate appropriate clocking and I/O resources without relying on a hardwired protocol controller. Timing analysis must cover input-output budgets, transceiver launch and capture windows, board skew, and the selected -2 speed grade. For production equipment, validate the configuration interface and implement a secure startup sequence to prevent unintended I/O states.
Recommandé
Embedded Signal Processing
The XC6SLX150-2FG484C supports parallel filtering, correlation, waveform analysis, and digital filtering by implementing several processing paths concurrently. The 147,443 logic cells and 11,519 configurable logic blocks provide substantial configurable resources, while 338 I/O support parallel converters, memory interfaces, triggers, and data buses. The device can act as the central digital engine between external sensors, converters, and a communications processor. Architect the design with registered interfaces to contain timing paths, use the AMD timing tools to identify congestion, and validate arithmetic boundaries carefully. The -2 grade is appropriate when the design meets timing closure; move to a -3 option when critical-path margin cannot be achieved.
Recommandé
Video and Imaging Control
The XC6SLX150-2FG484C can act as a timing, control, and data-routing FPGA in imaging equipment when the design requires flexible pixel timing, camera-interface adaptation, frame synchronization, and status monitoring. Its 338 I/O support parallel image buses, control lines, and synchronization signals, while the programmable logic permits different sensor and display timing requirements to be handled without a dedicated controller for each format. Video designs remain sensitive to clock skew, I/O voltage standards, and source-synchronous timing, so the package assignments and PCB routing should be derived from the manufacturer pinout and timing guidance. External memory bandwidth and physical-layer video standards are separate constraints that must be evaluated independently.
Recommandé
Security and Access Control
The XC6SLX150-2FG484C can implement parallel cryptographic processing, event logging, credential-handling logic, and communication supervision within a security appliance or access-control terminal. Its 11,519 CLBs allow multiple independent processing blocks to operate in parallel, while 338 I/O support readers, network interfaces, status indicators, and supervisory inputs. Implement sensitive interfaces with controlled defaults and prevent configuration or debug access from becoming an unintended entry path. Consider the device's commercial 0°C to 85°C temperature range against the deployment environment and use a qualified part when the end application requires wider temperature operation. Timing closure and interface security should both be verified before production release.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX150-2FG484C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Select XC6SLX150-2FGG484I when the package and ball map match but an industrial-temperature ordering option is preferable. Select XC6SLX150-3FGG484C or XC6SLX150-3FGG484I when higher timing performance is required; the -3 grade can provide more margin for demanding clocks and interfaces. XC6SLX150-N3FG484C should be considered only after checking its 296-I/O count, which is 42 fewer than the target, and its different ordering class. XC6SLX150-1FG484C is a lower-performance -1 alternative, not a preferred choice when timing margin is limited. Every replacement decision must include package drawing, ball map, temperature grade, configuration method, and timing review.
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX150-2FGG484I | XC6SLX150-3FGG484C | XC6SLX150-3FGG484I | XC6SLX150-N3FG484C | XC6SLX150-1FG484C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -2 | -3 | -3 | N3 | -1 |
Principaux différenciateurs
- Balanced -2 speed class for designs that do not require -3 timing margin (vs XC6SLX150-3FGG484C)
- Commercial-temperature ordering option (vs XC6SLX150-2FGG484I)
- Full 338-I/O interface on the target (vs XC6SLX150-N3FG484C)
- High-density programmable resource configuration (vs XC6SLX150-1FG484C)
Notes de conception
Use the AMD Spartan-6 package device pinout files as the authority for all 484 BGA-ball assignments. The target has 338 user I/O, so do not infer the pin map from a generic 484-BGA drawing or from the package pin count alone. Place decoupling capacitors close to the associated power balls, preserve ground-plane continuity beneath the device, and follow the recommended escape-routing pattern. Check the final board stack-up and via arrangement against the BGA design guidance, especially when combining this device with high-speed converters, memories, or source-synchronous interfaces.
Evaluate thermal performance with the final switching activity, core voltage, I/O loading, copper area, airflow, and enclosure temperature. The 19 x 19 mm CSBGA removes heat through a dense array of balls and the PCB, making plane connectivity and thermal-via placement essential. Do not assume that a nominal 667 MHz internal frequency represents the operating condition of the final design; clocks may be lower and utilization may vary. Run the AMD thermal analysis workflow with realistic power data and verify that junction-temperature margin is maintained at the highest ambient temperature and worst-case supply condition.
Create constraints for every external clock and data interface based on the selected bank voltage, I/O standard, board topology, and -2 speed-grade timing limits. Use registered interfaces where practical to create clean timing boundaries and reduce combinational routing. Source-synchronous buses require length matching, while asynchronous inputs require synchronizers to prevent metastability. Check setup and hold margins at the pins, not only the internal register-to-register paths, and treat connector and converter timing as part of the end-to-end interface budget.
Do not treat every XC6SLX150 suffix as an automatic drop-in alternative. The speed grade, C or I temperature suffix, FGG or FG package form, lead-free declaration, and ordering status can affect qualification or board compatibility. A replacement also requires identical power balls, configuration pins, user I/O assignments, and package geometry. When evaluating XC6SLX150-2FGG484I, XC6SLX150-3FGG484C, or another candidate, compare the complete AMD ordering information and package pinout before committing it to a production board.
Design the power rails around the FPGA's required core and I/O voltages rather than treating the 1.2 V core value as the only supply requirement. Separate clean core supply distribution from sensitive I/O and analog-adjacent circuitry where the architecture permits, and follow the manufacturer guidance for bypass capacitors and supply sequencing. Confirm startup behavior, ramp limits, configuration-supply requirements, and rail tolerances in the selected design configuration. Use load-switch or sequencing control only after verifying that the selected power architecture satisfies the device's startup and operating requirements.
Informations de conformité
The lead-free and RoHS-compliant status applies to the ordering form identified as XC6SLX150-2FGG484C in the associated listing. Other listings associate the closely related FG484C spelling with non-compliant or lead-containing construction, so the complete ordering code must be checked before production release.
