AMD

XC6SLX150-2FG484C Spartan-6 LX FPGA | AMD Xilinx

MPN: XC6SLX150-2FG484C ✓ Hoạt động
1.2 V Vdss CSBGA-484 Package -2 Speed
MOQ: 1 |

XC6SLX150-2FG484C Tóm tắt

The AMD Xilinx XC6SLX150-2FG484C is a Spartan-6 LX field-programmable gate array with 338 I/O, 147,443 configuration cells, 11,519 configurable logic blocks, and a 667 MHz internal frequency, housed in a 484-ball CSBGA package measuring 19 x 19 mm with a 0.80 mm pitch. The -2 speed grade targets a practical balance between logic capacity, performance, and power consumption for embedded digital systems.

A field-programmable gate array is a programmable digital semiconductor used to implement custom combinational and sequential logic. Its hierarchy extends from FPGA to programmable logic device, digital integrated circuit, and semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured after manufacture, allowing hardware logic, parallel processing, interfaces, and protocol behavior to be updated without changing the printed circuit board.

Key features include 338 user I/O, 11,519 configurable logic blocks, 147,443 logic cells, and an internal frequency rated at 667 MHz. The -2 designation identifies the middle Spartan-6 performance grade, while the commercial-temperature suffix supports operation from 0°C to 85°C. Its 484-ball chip-scale BGA package also supports dense PCB routing in systems where a large I/O count is more important than a simple leaded-package footprint.

The architecture combines configurable logic blocks with dedicated resources for interconnect, memory, and programmable I/O. This allows parallel datapaths, control logic, serial interfaces, and timing-sensitive functions to coexist in one device. The 667 MHz figure characterizes the device's internal operating frequency and should not be interpreted as the guaranteed performance of every user design; actual throughput also depends on the selected logic path, I/O standard, speed grade, timing constraints, and implemented function.

Typical applications include industrial control, test-and-measurement equipment, communications infrastructure, embedded imaging, signal processing, and general-purpose embedded control. The 338 I/O count is particularly useful when the design connects multiple buses, parallel converters, memory interfaces, control signals, or differential communication links without using a separate large pin-count companion device.

For PCB implementation, use the AMD Spartan-6 package pinout files when assigning BGA balls and routing the board. Confirm the selected I/O voltage, bank power requirements, decoupling, thermal performance, and configuration interface before release. Device replacement should account for the complete ordering code because speed-grade, temperature-grade, package, and lead-free suffixes affect qualification and behavior.

This page combines the XC6SLX150-2FG484C specifications, same-package replacement options, application guidance, and practical FPGA design considerations in one engineering-oriented reference. It also distinguishes the Spartan-6 LX resource level from the electrical, thermal, and ordering differences that determine whether a candidate is a true board-level replacement.

Bộ thay thế dễ dàng lắp đặt cho XC6SLX150-2FG484C — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

XC6SLX150-2FGG484I

✅ Drop-In
📦 484-BBGA
Retains the -2 speed grade and 338 I/O but changes the ordering suffix to an industrial-temperature form; temperature range differs by up to 55°C at the hot end.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX150-3FGG484C

✅ Drop-In
📦 484-BBGA
Uses the faster -3 speed grade while retaining the 484-ball package and 338 I/O; timing performance is higher than the -2 target.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX150-3FGG484I

✅ Drop-In
📦 484-BBGA
Uses the -3 speed grade and industrial-temperature suffix; it provides higher timing performance than the -2 target with a different temperature qualification.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX150-N3FG484C

✅ Drop-In
📦 484-BBGA
Retains the 484-ball package but changes the performance and ordering class; the candidate has 296 I/O versus 338 I/O, a 42-I/O or 12.4% reduction.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX150-1FG484C

✅ Drop-In ⚠️ Thông số chưa được xác minh
📦 484-BBGA
Uses the lower -1 speed grade rather than the target -2 grade; the device family and 484-ball package remain the same, but timing performance is lower.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX150-2FG484C Tỷ lệ tối đa & tính chất điện

Device Type Field-Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX
Device Designation XC6SLX150
Speed Grade -2
Number of I/O 338 I/O
Số lượng chân 484 pins
Logic Cells 147,443 cells
Configurable Logic Blocks 11,519 CLBs
Internal Frequency 667 MHz
Nhiệt độ hoạt động 0°C to 85°C
Package Type CSBGA-484
Package Dimensions 19 x 19 mm
Package Pitch 0.80 mm
Technology CMOS
Nominal Core Voltage 1.2 V
Trạng thái RoHS Compliant
Lead-Free Status Lead free
Kiểu lắp đặt Surface-mount BGA

Hướng dẫn cấu hình chân XC6SLX150-2FG484C 0.80 mm

Cấu hình chân cho XC6SLX150-2FG484C (0.80 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 0.80 mm cho XC6SLX150-2FG484C

Không có dữ liệu chân cụ thể sẵn có cho XC6SLX150-2FG484C.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

XC6SLX150-2FG484C phù hợp cho 6 Áp dụngs: Industrial Control and Automation, Test and Measurement Equipment, Communications and Protocol Processing, Embedded Signal Processing, Video and Imaging Control, Security and Access Control.

🏭

Industrial Control and Automation

The XC6SLX150-2FG484C fits industrial controllers that combine parallel machine I/O with programmable timing and control logic. Its 338 user I/O can connect encoders, limit switches, sensor interfaces, actuator drivers, and operator displays without requiring numerous external interface components. The 11,519 configurable logic blocks and 147,443 logic cells allow state machines, motion-control datapaths, communications, and diagnostics to be consolidated into one FPGA. Use the 0°C to 85°C grade for commercial industrial equipment and validate the complete enclosure temperature. The -2 speed grade should be selected only after the critical control and bus paths close successfully against the device timing limits.

🔧

Test and Measurement Equipment

The XC6SLX150-2FG484C is useful in parallel data-acquisition and automated test systems where acquisition logic, timing generation, pattern processing, and communications must operate concurrently. Its 338 I/O provide substantial connectivity for probes, instrument buses, trigger signals, and status controls, while 11,519 CLBs support configurable measurement pipelines. The 667 MHz internal-frequency rating gives designers a basis for high-speed synchronous logic, but actual acquisition rate remains limited by I/O performance, pin standards, external memory, and timing closure. For instrumentation, place the FPGA close to connector and input circuitry, control edge-sensitive signals carefully, and keep analog and digital return paths separated.

🌐

Communications and Protocol Processing

The XC6SLX150-2FG484C can consolidate parallel protocol engines, packet buffering, clock-domain crossing, and supervisory logic into one Spartan-6 LX device. Its 338 I/O are valuable for multiple byte-wide buses, serial transceiver interfaces, status LEDs, and synchronization signals, while the programmable architecture permits multiple protocol paths to run concurrently. Designers can instantiate appropriate clocking and I/O resources without relying on a hardwired protocol controller. Timing analysis must cover input-output budgets, transceiver launch and capture windows, board skew, and the selected -2 speed grade. For production equipment, validate the configuration interface and implement a secure startup sequence to prevent unintended I/O states.

📡

Embedded Signal Processing

The XC6SLX150-2FG484C supports parallel filtering, correlation, waveform analysis, and digital filtering by implementing several processing paths concurrently. The 147,443 logic cells and 11,519 configurable logic blocks provide substantial configurable resources, while 338 I/O support parallel converters, memory interfaces, triggers, and data buses. The device can act as the central digital engine between external sensors, converters, and a communications processor. Architect the design with registered interfaces to contain timing paths, use the AMD timing tools to identify congestion, and validate arithmetic boundaries carefully. The -2 grade is appropriate when the design meets timing closure; move to a -3 option when critical-path margin cannot be achieved.

📺

Video and Imaging Control

The XC6SLX150-2FG484C can act as a timing, control, and data-routing FPGA in imaging equipment when the design requires flexible pixel timing, camera-interface adaptation, frame synchronization, and status monitoring. Its 338 I/O support parallel image buses, control lines, and synchronization signals, while the programmable logic permits different sensor and display timing requirements to be handled without a dedicated controller for each format. Video designs remain sensitive to clock skew, I/O voltage standards, and source-synchronous timing, so the package assignments and PCB routing should be derived from the manufacturer pinout and timing guidance. External memory bandwidth and physical-layer video standards are separate constraints that must be evaluated independently.

🔒

Security and Access Control

The XC6SLX150-2FG484C can implement parallel cryptographic processing, event logging, credential-handling logic, and communication supervision within a security appliance or access-control terminal. Its 11,519 CLBs allow multiple independent processing blocks to operate in parallel, while 338 I/O support readers, network interfaces, status indicators, and supervisory inputs. Implement sensitive interfaces with controlled defaults and prevent configuration or debug access from becoming an unintended entry path. Consider the device's commercial 0°C to 85°C temperature range against the deployment environment and use a qualified part when the end application requires wider temperature operation. Timing closure and interface security should both be verified before production release.

What are the key specifications of XC6SLX150-2FG484C that engineers should know?
The XC6SLX150-2FG484C is a Spartan-6 LX FPGA with 338 I/O, 147,443 logic cells, 11,519 configurable logic blocks, and a 667 MHz internal frequency in a 484-ball CSBGA package. According to the AMD Spartan-6 family documentation, it is a programmable digital device intended for high logic density and substantial I/O. Its operating-temperature grade is 0°C to 85°C, while the -2 suffix identifies the performance grade. The package is identified as CSBGA-484 with a 19 x 19 mm body and 0.80 mm pitch. These figures describe the silicon and mechanical envelope; actual user-design timing also depends on the selected clocking, I/O standard, speed grade, and implemented logic.
Where can I download the XC6SLX150-2FG484C datasheet PDF?
The XC6SLX150-2FG484C datasheet PDF is available from the AMD documentation resources and from the linked XC6SLX150 technical document. The document covers the Spartan-6 LX architecture, configuration, package information, electrical characteristics, AC timing, and ordering information. For PCB implementation, also use AMD's Spartan-6 package device pinout files because the large 484-ball BGA requires ball-level assignment information. The 19 x 19 mm, 0.80 mm-pitch package description and 338-I/O count should be checked against the device ordering code before a replacement is approved.
Where can I find the XC6SLX150-2FG484C pinout?
The XC6SLX150-2FG484C pinout is identified through the AMD Spartan-6 package device pinout files, which are distributed as ASCII text files for the 484-ball package. Use those files when assigning BGA balls to power, ground, configuration, clock, and user I/O signals in the PCB layout. The device has 484 package balls and 338 user I/O, so the pin-description table should not be reconstructed from a generic 484-BGA diagram. Check the complete ordering code and selected package drawing before routing because the ordering suffix carries commercial-temperature and package information.
Is the XC6SLX150-2FG484C suitable for industrial control systems?
The XC6SLX150-2FG484C is suitable for industrial control designs that need extensive parallel I/O and programmable logic within a 0°C to 85°C commercial-temperature range. Its 338 user I/O can support control signals, sensor conditioning interfaces, converters, communications, and machine-bus connectivity. The 11,519 configurable logic blocks provide considerably more implementation capacity than a small fixed-function controller. However, industrial suitability also depends on the enclosure temperature, power-supply quality, isolation strategy, surge exposure, and qualification requirements of the finished equipment.
How does the XC6SLX150-2FG484C compare with XC6SLX150-3FGG484C?
The XC6SLX150-2FG484C and XC6SLX150-3FGG484C belong to the same Spartan-6 LX resource class and use the 484-ball package family, but their speed-grade suffixes differ. The -3 device provides the higher Spartan-6 performance class, while the -2 device is positioned below it. The XC6SLX150-2FG484C is rated at a 667 MHz internal frequency and provides 338 I/O. A -3 alternative may improve timing margin for demanding designs, while the -2 part may be preferable where the lower performance tier is sufficient. Confirm the exact package suffix, temperature grade, timing data, and device status before substitution.
When should I choose the XC6SLX150-2FG484C instead of a faster -3 Spartan-6 LX device?
Choose the XC6SLX150-2FG484C when the design fits within its 667 MHz internal-frequency class, 147,443 logic cells, 11,519 CLBs, and 338 I/O without requiring the additional timing margin of the -3 grade. This can be appropriate for industrial control, test equipment, embedded interfaces, and parallel signal-processing designs whose clocks and buses remain comfortably inside the -2 timing limits. Use the -3 grade when critical paths, external interface timing, or operating conditions leave insufficient margin. Timing closure, not the suffix alone, should determine the final selection.
What is the best drop-in replacement for the XC6SLX150-2FG484C?
The closest replacement must preserve the Spartan-6 LX 484-ball footprint and the 338-I/O resource configuration while satisfying the required speed and temperature grades. XC6SLX150-2FGG484I is a same-family, 484-BGA option with matching -2 performance and an industrial-temperature suffix, making it useful where the PCB footprint fits and industrial temperature is required. XC6SLX150-3FGG484C is a higher-speed, 484-ball option. Before replacement, verify whether the G designation and C or I suffix change the package drawing, lead-free status, temperature range, or qualification requirements.
Can XC6SLX150-2FGG484I replace XC6SLX150-2FG484C?
XC6SLX150-2FGG484I can be considered when its 484-ball package drawing exactly matches the target board and its industrial-temperature qualification is acceptable. The listing identifies 338 I/O and a 484-BBGA package, supporting close package and resource compatibility with the Spartan-6 LX family. It retains the -2 speed class rather than moving to the faster -3 grade. The C-to-I suffix change can affect temperature range, lead-free status, qualification, or ordering requirements, so engineers should compare the complete AMD ordering tables and pin files rather than relying on the shared family name alone.
Is XC6SLX150-2FG484C the same as XC6SLX150-2FGG484C?
The two order codes refer to closely related Spartan-6 LX devices, but they are not interchangeable solely because the family and speed grade match. The FGG designation identifies a specific 484-ball package construction, while the FG designation is associated with another ordering form listed under the same family. Temperature, lead-free, package-ball, and qualification characteristics can differ between these suffixes. Before treating XC6SLX150-2FGG484C as an exact equivalent for XC6SLX150-2FG484C, compare the manufacturer package drawings, pin descriptions, ordering information, and RoHS or lead-free declarations.
What can replace the XC6SLX150-2FG484C without a PCB redesign?
A no-redesign replacement requires an identical 484-ball footprint and compatible power, configuration, clock, and I/O assignments. Same-family Spartan-6 LX candidates include the -2, -3, and industrial-temperature ordering forms, but speed grade, temperature range, suffix semantics, and package construction must be reconciled. XC6SLX150-2FGG484I is the closest documented option for a board already designed around a 484-BGA Spartan-6 LX package. A PCB redesign is required if the candidate uses a different ball map, package outline, pitch, voltage standard, or configuration scheme.
What is the best AMD alternative for the XC6SLX150-2FG484C?
The best AMD alternative is another Spartan-6 LX device in the same 484-ball package when its resources and ordering characteristics satisfy the design. XC6SLX150-2FGG484I retains the -2 speed class and 338-I/O resource level, while XC6SLX150-3FGG484C offers the faster -3 grade with the same 484-ball family. Choose the -2 industrial-temperature option when the extra timing margin of -3 is unnecessary. Because AMD is the manufacturer of the target family, there is no cross-brand, pin-for-pin equivalent that can be recommended without a dedicated package and pin-level verification.
Where can I buy the XC6SLX150-2FG484C and check its lead time?
Use the Request a Quote form on this page to request the XC6SLX150-2FG484C, current lead time, stock status, and order quantity. The form lets the purchasing request identify the exact 484-ball commercial-temperature ordering code and any required packaging details. Lead time can change with market conditions, so the requested confirmation should be tied to the specific MPN and quantity rather than a generic Spartan-6 LX family estimate. For production planning, also confirm whether the quantity is in component multiples and whether the shipping method and date can be recorded on the purchase order.
What is the price of the XC6SLX150-2FG484C?
The current commercial price for the XC6SLX150-2FG484C should be obtained through the Request a Quote form on this page. A binding quotation should identify the exact 484-ball ordering code, quantity, delivery location, and requested production schedule. FPGA pricing can vary materially with order quantity, lifecycle allocation, packaging, and lead time, so an unconfirmed generic family price is not suitable for budgeting or sourcing approval. The quotation can then be compared with the planned annual usage and scheduled build dates.
Is the XC6SLX150-2FG484C in stock?
Current stock for the XC6SLX150-2FG484C should be confirmed through the Request a Quote form on this page. Include the required quantity and target delivery date so the response can distinguish immediately schedulable material from material requiring factory allocation. For an obsolete or mature FPGA family, zero stock at one purchasing channel does not necessarily establish a factory lead time, while an isolated channel listing does not guarantee production allocation. Use the exact MPN when requesting status and require confirmation of date code, lot traceability, and change-control information before incorporating material into a build.
How much FPGA logic and I/O does the XC6SLX150-2FG484C provide?
The XC6SLX150-2FG484C provides 147,443 logic cells organized into 11,519 configurable logic blocks and exposes 338 user I/O in its 484-ball package. This resource level supports moderately complex embedded logic, parallel interfaces, protocol engines, and control systems without requiring multiple programmable devices. The 667 MHz internal-frequency figure describes the device family's stated operating point, while a specific design may run at a lower clock because of routing, I/O standards, timing constraints, or the selected speed grade. Use AMD's device utilization and timing tools for final resource and closure decisions.
What design considerations matter for a 484-ball Spartan-6 LX BGA?
The most important design considerations are ball assignment, power integrity, thermal performance, configuration, and I/O standards. Start with the AMD package device pinout files rather than relying on a generic 484-BGA drawing, and keep the BGA escape routing and reference-plane continuity under control. Place decoupling close to the appropriate power balls, distribute power and ground planes according to the manufacturer recommendations, and evaluate junction temperature for the final airflow and enclosure. The -2 speed grade should also be checked against the worst-case clock and external-interface timing rather than inferred solely from the 667 MHz internal-frequency rating.

Dữ liệu tham khảo kỹ thuật cho XC6SLX150-2FG484C — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the XC6SLX150-2FG484C when a design needs the Spartan-6 LX resource level of 147,443 logic cells, 11,519 CLBs, and 338 I/O while timing closes comfortably at the -2 speed grade. It is appropriate for industrial control, test equipment, communications, parallel signal processing, and embedded systems that fit within the 0°C to 85°C commercial-temperature range.

Select XC6SLX150-2FGG484I when the package and ball map match but an industrial-temperature ordering option is preferable. Select XC6SLX150-3FGG484C or XC6SLX150-3FGG484I when higher timing performance is required; the -3 grade can provide more margin for demanding clocks and interfaces. XC6SLX150-N3FG484C should be considered only after checking its 296-I/O count, which is 42 fewer than the target, and its different ordering class. XC6SLX150-1FG484C is a lower-performance -1 alternative, not a preferred choice when timing margin is limited. Every replacement decision must include package drawing, ball map, temperature grade, configuration method, and timing review.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này XC6SLX150-2FGG484I XC6SLX150-3FGG484C XC6SLX150-3FGG484I XC6SLX150-N3FG484C XC6SLX150-1FG484C
Brand AMD AMD AMD AMD AMD AMD
FPGA Family Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX
Speed Grade -2 -2 -3 -3 N3 -1

Bảo phân biệt quan trọng

  • Balanced -2 speed class for designs that do not require -3 timing margin (vsXC6SLX150-3FGG484C)
  • Commercial-temperature ordering option (vsXC6SLX150-2FGG484I)
  • Full 338-I/O interface on the target (vsXC6SLX150-N3FG484C)
  • High-density programmable resource configuration (vsXC6SLX150-1FG484C)

Ghi chú thiết kế

Use the AMD Spartan-6 package device pinout files as the authority for all 484 BGA-ball assignments. The target has 338 user I/O, so do not infer the pin map from a generic 484-BGA drawing or from the package pin count alone. Place decoupling capacitors close to the associated power balls, preserve ground-plane continuity beneath the device, and follow the recommended escape-routing pattern. Check the final board stack-up and via arrangement against the BGA design guidance, especially when combining this device with high-speed converters, memories, or source-synchronous interfaces.

Evaluate thermal performance with the final switching activity, core voltage, I/O loading, copper area, airflow, and enclosure temperature. The 19 x 19 mm CSBGA removes heat through a dense array of balls and the PCB, making plane connectivity and thermal-via placement essential. Do not assume that a nominal 667 MHz internal frequency represents the operating condition of the final design; clocks may be lower and utilization may vary. Run the AMD thermal analysis workflow with realistic power data and verify that junction-temperature margin is maintained at the highest ambient temperature and worst-case supply condition.

Create constraints for every external clock and data interface based on the selected bank voltage, I/O standard, board topology, and -2 speed-grade timing limits. Use registered interfaces where practical to create clean timing boundaries and reduce combinational routing. Source-synchronous buses require length matching, while asynchronous inputs require synchronizers to prevent metastability. Check setup and hold margins at the pins, not only the internal register-to-register paths, and treat connector and converter timing as part of the end-to-end interface budget.

Do not treat every XC6SLX150 suffix as an automatic drop-in alternative. The speed grade, C or I temperature suffix, FGG or FG package form, lead-free declaration, and ordering status can affect qualification or board compatibility. A replacement also requires identical power balls, configuration pins, user I/O assignments, and package geometry. When evaluating XC6SLX150-2FGG484I, XC6SLX150-3FGG484C, or another candidate, compare the complete AMD ordering information and package pinout before committing it to a production board.

Design the power rails around the FPGA's required core and I/O voltages rather than treating the 1.2 V core value as the only supply requirement. Separate clean core supply distribution from sensitive I/O and analog-adjacent circuitry where the architecture permits, and follow the manufacturer guidance for bypass capacitors and supply sequencing. Confirm startup behavior, ramp limits, configuration-supply requirements, and rail tolerances in the selected design configuration. Use load-switch or sequencing control only after verifying that the selected power architecture satisfies the device's startup and operating requirements.

Thông tin tuân thủ

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Unknown

The lead-free and RoHS-compliant status applies to the ordering form identified as XC6SLX150-2FGG484C in the associated listing. Other listings associate the closely related FG484C spelling with non-compliant or lead-containing construction, so the complete ordering code must be checked before production release.

Dữ liệu được xác minh vào: 2026-11-03 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

xc6slx150 2csg484i xc6slx150 2fgg484i xc6slx150 3fgg484c xc6slx150 3fgg484i xc6slx150 fpga xc6slx150 3csg484i XC6SLX150-2FG484C datasheet XC6SLX150-2FG484C datasheet pdf XC6SLX150-2FG484C pinout XC6SLX150-2FG484C equivalent XC6SLX150-2FG484C replacement AMD XC6SLX150-2FG484C XC6SLX150-2FG484C price XC6SLX150-2FG484C stock

Các bộ phận và thuật ngữ liên quan

AMD AMD Xilinx XC6SLX150-2FG484C XC6SLX150-2FGG484I XC6SLX150-3FGG484C XC6SLX150-3FGG484I XC6SLX150-N3FG484C XC6SLX150-1FG484C Spartan-6 LX field-programmable gate array FPGA programmable logic device digital integrated circuit semiconductor configurable logic block CLB logic cell 338 user I/O 667 MHz internal frequency 484-ball CSBGA chip-scale ball grid array surface mount BGA industrial control test and measurement signal processing RoHS REACH AEC-Q100 lead-free
Báo giá nhanh RFQ
Hãy điền đầy đủ thông tin — đội ngũ bán hàng của chúng tôi sẽ phản hồi trong vòng 24 giờ
Mã sản phẩm Nhà sản xuất Kiểu đóng gói QTY Giá mục tiêu Phụ
✓
Báo giá đã gửi!

Chúng tôi sẽ trả lời email của bạn trong vòng 24 giờ

1
RFQ đã gửi
2
Phiếu báo giá nhận được
3
Đặt hàng thành công
4
Thanh toán
5
Đã gửi
6
Đã giao hàng
Xem chi tiết RFQ