XC6SLX16-2FT256I - Spartan-6 LX FPGA, 14K LCs, 256-BGA | AMD
Référence : XC6SLX16-2FT256I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $92.5 | $92,50 |
| 10 | $87.2 | $872,00 |
| 100 | $78.45 | $7 845,00 |
| 500 | $70.1 | $35 050,00 |
| 1 000 | $63.85 | $63 850,00 |
XC6SLX16-2FT256I Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, and clock management tiles (CMTs). FPGAs occupy a position between general-purpose microcontrollers (software-defined behavior, sequential execution) and application-specific integrated circuits (ASICs, fixed function, highest performance per watt). The Spartan-6 family specifically targets cost-sensitive, high-volume applications where ASIC NRE costs are prohibitive but microcontroller performance is insufficient.
Key features of the XC6SLX16-2FT256I include 2,278 Kbits total block RAM, 32 DSP48A1 slices for fixed-point and signal-processing arithmetic, four clock management tiles (CMTs) with digital clock managers (DCMs) and phase-locked loops (PLLs), and integrated SelectIO technology supporting single-ended and differential I/O standards up to 1080 Mbps. The device is fabricated on a 45 nm CMOS process and operates from a 1.2 V core supply with separate I/O bank voltages from 1.2 V to 3.3 V.
Architecturally, the Spartan-6 LX family uses a 6-input LUT-based logic fabric with dedicated carry chains, distributed SRL16/SRL32 shift-register primitives, and a 16-bit block RAM/FIFO controller per BRAM tile. The 256-ball FTBGA package provides 186 effective user I/O after accounting for power, ground, configuration, and dedicated JTAG pins.
Typical applications include industrial motor control, video processing pipelines, low-cost software-defined radio, LED video wall controllers, and embedded vision pre-processing. The 256-BGA package suits designs requiring dense I/O and moderate thermal dissipation.
When designing with this device, ensure proper decoupling with 100 nF ceramic capacitors at every supply pin and a 4.7-10 uF bulk capacitor near the core rail. Configuration can be sourced from SPI flash, JTAG, or BPI parallel memory; the dedicated DONE and INIT_B pins must be monitored for proper startup sequencing.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour XC6SLX16-2FT256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX16-2FT256I (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Configuration Modes, DSP48A1 Slices, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC6SLX16-3FT256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX16-2FTG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-2FT256I
✅ Remplacement direct✓ En stock
$58.1 / unité
Voir la fiche technique →XC6SLX9-2FT256I
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →XC6SLX45-2FT256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX16-2FT256I Valeurs maximales et caractéristiques électriques
| Series | Spartan-6 LX |
| Device Type | FPGA |
| Logic Cells | 14,579 |
| Block RAM | 589,824 bits (576 Kbits) |
| Total Block RAM (Kbits) | 2,278 |
| User I/O Count | 186 |
| Number of I/O Banks | 4 |
| DSP48A1 Slices | 32 |
| Clock Management Tiles (CMTs) | 4 |
| Process Technology | 45 nm CMOS |
| Core Voltage | 1.2 V |
| I/O Voltage Range | 1.2 V to 3.3 V |
| Speed Grade | -2 |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Boîtier | 256-ball FTBGA, 17 mm x 17 mm, 1.0 mm pitch |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Yes / Compliant |
| Configuration Modes | SPI, BPI, JTAG, Slave SelectMAP |
Guide de configuration des broches du XC6SLX16-2FT256I 256-ball ftbga, 17 mm x 17 mm, 1.0 mm pitch
Configuration des broches du XC6SLX16-2FT256I (boîtier 256-ball ftbga, 17 mm x 17 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX16-2FT256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX16-2FT256I convient pour 6 applications: Industrial Motor Control, Video Processing Pipelines, Software-Defined Radio (SDR), LED Video Wall Controllers, Embedded Vision Pre-Processing, Portable Test and Measurement.
Industrial Motor Control
The XC6SLX16-2FT256I's 32 DSP48A1 slices deliver 32 GMACs of fixed-point arithmetic ideal for field-oriented control (FOC) loops on three-phase AC induction and PMSM motors. The 32 DSP slices handle Park/Clarke transforms, PI controllers, and SVM modulators in parallel, while 186 user I/O accommodate encoder feedback (QEP), gate-driver PWM outputs (up to 32 channels), and CAN/RS-485 interfaces. The industrial -40C to +100C temperature range meets IEC 61800 industrial drive specifications for factory-floor deployment.
Recommandé
Video Processing Pipelines
The XC6SLX16-2FT256I's 576 Kbits block RAM buffers scan-line video data while 32 DSP48A1 slices perform real-time image-processing operations such as color-space conversion (RGB to YCbCr), gamma correction, and edge detection. SelectIO supports HDMI/DVI single-ended and LVDS differential inputs up to 1080 Mbps, sufficient for 720p60 and 1080p30 video streams. The 256-BGA package dissipates up to 2-3 W typical, suitable for fanless embedded video appliances.
Recommandé
Software-Defined Radio (SDR)
The XC6SLX16-2FT256I is widely used in low-cost SDR platforms because its 32 DSP48A1 slices can implement FFTs, channelizers, and digital down-conversion in real time for narrowband signals up to several MHz of bandwidth. Four CMTs (DCMs + PLLs) provide clean local oscillators for ADC/DAC sample clocks. 186 user I/O easily interface to dual-channel 14-16 bit ADCs/DACs, while 576 Kbits block RAM captures 1024-point FFT bins at full precision.
Recommandé
LED Video Wall Controllers
The XC6SLX16-2FT256I's high I/O count (186 pins) drives large arrays of constant-current LED drivers with multi-million-color refresh at low latency. Its block RAM buffers display frames while the DSP slices perform brightness correction, gamma mapping, and per-pixel color space conversion. According to AMD application notes, the LX16 logic capacity supports controllers for up to 16 parallel HUB75 panels at 1/32 scan, ideal for indoor commercial signage.
Recommandé
Embedded Vision Pre-Processing
The XC6SLX16-2FT256I handles front-end image pre-processing tasks like Bayer demosaicing, lens distortion correction, and histogram equalization offloading these tasks from the host CPU. Its 32 DSP slices run Sobel/Canny edge detectors at VGA resolution (640x480) at 60 fps with margin. According to AMD Xilinx, the LX16 balances logic, block RAM, and DSP resources needed for the Smart Vision pipeline reference design.
Recommandé
Portable Test and Measurement
The XC6SLX16-2FT256I serves as a reconfigurable DSP/control core in portable oscilloscopes, logic analyzers, and protocol testers where its 32 DSP slices implement FIR/IIR filters and FFT-based spectrum analysis. Industrial temperature rating and 1.2 V core supply keep power consumption under 1.5 W typical, extending battery runtime. The FT256 package's 1.0 mm ball pitch supports standard JEDEC PCB fabrication rules for cost-sensitive production.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX16-2FT256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX16-3FT256I | XC6SLX16-2FTG256I | XC6SLX25-2FT256I | XC6SLX9-2FT256I | XC6SLX45-2FT256I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 256-FTBGA | 256-FTBGA - same | 256-FTBGA - same | 256-FTBGA - same | 256-FTBGA - same | 256-FTBGA - same |
| Logic Cells | 14,579 | 14,579 | 14,579 | 24,051 | 9,152 | 43,661 |
| Block RAM (Kbits) | 576 | 576 | 576 | 936 | 576 | 2,088 |
| DSP48A1 Slices | 32 | 32 | 32 | 38 | 16 | 58 |
| User I/O | 186 | 186 | 186 | 186 | 186 | 186 |
| Speed Grade | -2 | -3 (faster) | -2 | -2 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
Principaux différenciateurs
- Highest logic density per dollar in the 256-FTBGA Spartan-6 LX tier (vs XC6SLX9-2FT256I)
- Spartan-6 LX FT256 family compatibility for design migration (vs XC6SLX45-2FT256I)
- Industrial temperature coverage at -2 speed grade (vs XC6SLX16-2FTG256I)
Notes de conception
The XC6SLX16-2FT256I requires a 1.2 V core supply with +/-5% tolerance and a maximum quiescent current of approximately 1.5 A at full utilization. Decoupling: place a 100 nF 0402 ceramic capacitor within 5 mm of every Vccint/Vccaux pin, plus a 4.7-10 uF bulk tantalum or ceramic on each supply rail. The auxiliary supply (Vccaux) at 2.5 V or 3.3 V must come up before or simultaneously with Vccint to prevent I/O latch-up. Estimated: at typical 30% utilization and 100 MHz, total core current is approximately 400 mA.
Estimated: at full 100% utilization with all DSP slices at 250 MHz, the XC6SLX16-2FT256I dissipates approximately 1.5-2.0 W. The FT256 package has a typical junction-to-ambient thermal resistance (theta_JA) of approximately 18 C/W on a 4-layer JEDEC test board with thermal vias under the exposed die paddle. For continuous full-load operation, copper pours on all inner layers plus thermal via arrays beneath the BGA die-paddle region are recommended. No external heatsink is normally required for industrial-temperature operation up to 70C ambient.
The 256-ball FTBGA uses 1.0 mm ball pitch and requires PCB fabrication with at minimum 0.4 mm via-pad and 0.2 mm trace/spacing rules. Per AMD Spartan-6 PCB design guide, use a 4-6 layer stack-up with continuous GND planes on layers 2 and 5 to provide a low-impedance return path for high-speed SelectIO signals. Solder paste stencil apertures should be 0.45 mm diameter with 0.075 mm thickness for reliable BGA reflow profiles following JEDEC J-STD-020 (peak 245-260C).
SelectIO pairs (LVDS_25, LVDS, DIFF_SSTL) must be length-matched within 10 mils (0.25 mm) on the PCB to maintain differential skew below the FPGA's 150 ps setup margin at 1080 Mbps. Source-synchronous interfaces (DDR2, DDR3) require matched-length fly-by routing with proper termination. Per AMD Spartan-6 SelectIO user guide UG381, single-ended 3.3 V I/O is not 5 V tolerant - external level shifters are needed for legacy 5 V peripherals.
Three common pitfalls: (1) Missing the DONE pull-up resistor - DONE must have a 4.7 kohm pull-up to 3.3 V or configuration may fail intermittently. (2) Using the wrong MODE pins - JTAG chain conflicts with MultiPROBE if TMS/TCK are shared with user I/O. (3) Skipping bitstream encryption for production - the XC6SLX16 supports AES-256 bitstream encryption with the internal battery-backed key, essential for IP protection. Per AMD Spartan-6 configuration user guide UG380, always validate with a readback CRC check in production test.
Informations de conformité
RoHS and lead-free compliant per AMD product page; AEC-Q100 not applicable (this is an FPGA, not an automotive-qualified ASIC); REACH compliance confirmed by distributor data.
