XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD
Référence : XC6SLX25-2FG484C ✓ ActifXC6SLX25-2FG484C Présentation
A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnects, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where it sits above fixed-function logic devices and provides parallel hardware implementation for control, signal processing, communications, and interface functions. Its value comes from combining substantial configurable logic density with reusable intellectual property cores, allowing one package to replace multiple conventional logic components.
The Spartan-6 LX family provides 24,051 logic cells for this device, 266 I/O, and 45 nm CMOS fabrication. The -2 designation identifies its performance grade, while the 484-ball package supports dense board routing through an array of solder-ball connections. The device is identified as lead-free and RoHS compliant in the supplied component data. These characteristics make it relevant to industrial control, communications, instrumentation, embedded signal processing, and general-purpose prototyping systems.
At the architecture level, the Spartan-6 LX FPGA combines configurable logic blocks with dedicated block RAM and programmable I/O resources. This mixed architecture allows parallel datapaths and state machines to be implemented without relying on a processor for every control function. The supplied data identifies a 500 MHz internal frequency, while actual interface and system timing remain dependent on the selected I/O standards, clocking implementation, board-level routing, external memory interface, and the selected design tools.
Typical uses include industrial automation controllers, serial and parallel protocol bridges, data-acquisition front ends, communications equipment, and embedded DSP functions. Its 266 I/O count is particularly useful when a design must connect multiple buses, capture parallel sensor data, or bridge legacy peripheral logic to a modern system. The 484-ball FBGA also reduces board area compared with a large leaded package, but it demands careful escape routing and assembly control.
A primary design consideration is package and PCB complexity. Unlike a fine-pitch QFP, the 484-ball FBGA is not visually inspectable after assembly and requires appropriate land patterns, via-in-pad or escape-routing rules, X-ray inspection capability, and controlled solder-assembly profiles. Designers should also confirm power sequencing, decoupling, clock integrity, and I/O voltage compatibility against the complete AMD device documentation before layout release.
This page consolidates the verified device identity, package information, commercial listing, and cross-reference findings into an engineering-focused product record. It also distinguishes true package-compatible Spartan-6 options from unrelated FPGA families, helping procurement and hardware teams assess interchangeability without assuming that equivalent logic density guarantees interchangeable pinout, timing, or qualification.
Alternatives de remplacement direct pour XC6SLX25-2FG484C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX25-2FG484C (même facteur de forme et même empreinte) — différant par Operating Temperature, Device Type, Lead-Free Status, Logic Cells, Speed Grade.
XC6SLX25-2FGG484I
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Voir la fiche technique →XC6SLX25-2FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-2FG484I
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Voir la fiche technique →XC6SLX25-3FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-3FG484I
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Voir la fiche technique →XC6SLX25-2FG484C Valeurs maximales et caractéristiques électriques
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Number of I/O | 266 I/O |
| Internal Frequency | 500 MHz |
| Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -2 |
| Package Type | 484-pin FBGA |
| Number of Package Balls | 484 balls |
| Terminal Type | Ball |
| Package Shape | Square |
| Température de fonctionnement | 0°C to 85°C |
| Lead-Free Status | Lead-free |
| Statut RoHS | RoHS compliant |
| Type de montage | Surface mount |
Guide de configuration des broches du XC6SLX25-2FG484C square
Configuration des broches du XC6SLX25-2FG484C (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX25-2FG484C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX25-2FG484C convient pour 6 applications: Industrial Automation Controllers, Data-Acquisition and Signal Conditioning, Communications Protocol Bridges, Embedded DSP and Real-Time Processing, Instrumentation and Test Equipment, High-Density Digital Interface Consolidation.
Industrial Automation Controllers
The XC6SLX25-2FG484C fits commercial-temperature industrial automation controllers that require deterministic parallel logic and numerous external interfaces. Its 24,051 logic cells can implement multiple control state machines, interlocks, counters, and communication adapters, while 266 I/O provide ample connections for sensors, actuators, field buses, and status indicators. The 500 MHz internal frequency supports clocked control logic, and the 1.2 V core supply allows a modern FPGA power architecture. Because the supplied operating range is 0°C to 85°C, use the industrial-temperature alternative when enclosure temperatures exceed that range. In either case, verify timing, I/O standards, and power sequencing against the complete AMD documentation.
Recommandé
Data-Acquisition and Signal Conditioning
The XC6SLX25-2FG484C is suitable for parallel data-acquisition front ends where sensors, counters, or converters require synchronized digital processing. With 24,051 logic cells and 266 I/O, the FPGA can combine capture control, filtering, thresholding, and data formatting without forcing a processor to handle every cycle. Its 500 MHz internal frequency provides a capable clocking domain for pipelined datapaths, while the 484-ball FBGA limits board footprint compared with a large leaded package. Designers should treat the stated frequency as a device figure rather than a guaranteed end-to-end sample rate; achievable performance also depends on I/O timing, clock jitter, board routing, memory interfaces, and the selected clocking resources.
Recommandé
Communications Protocol Bridges
The XC6SLX25-2FG484C can serve as a communications bridge where legacy serial, parallel, or memory-mapped interfaces must be translated into a modern data path. Its 24,051 logic cells support protocol state machines, FIFO control, CRC generation, clock-domain crossing, and packet buffering, while 266 I/O allow simultaneous connections to multiple peripherals. The 500 MHz internal frequency supports efficient parallel implementation of serial transceivers and bus controllers. A practical design should allocate dedicated clocking resources, constrain interface timing, and verify that selected I/O standards meet voltage and slew requirements. Because the package is a dense 484-ball FBGA, differential and high-speed nets require disciplined stack-up planning and controlled escape routing.
Recommandé
Embedded DSP and Real-Time Processing
The XC6SLX25-2FG484C fits embedded DSP and real-time processing systems that benefit from parallel hardware execution. Filters, correlation functions, waveform generation, and fixed-point algorithms can be mapped across the FPGA's 24,051 logic cells and dedicated memory resources, reducing dependence on sequential processor execution. The 500 MHz internal frequency allows deeply pipelined implementations, although actual throughput and latency depend on resource sharing, clocking, memory bandwidth, and I/O organization. For audio, measurement, or control products, designers should compare fixed-point resource cost against a dedicated DSP and confirm the thermal effect of the chosen implementation. The commercial -2 device is appropriate where ambient temperature remains within 0°C to 85°C.
Recommandé
Instrumentation and Test Equipment
The XC6SLX25-2FG484C is appropriate for instrumentation and test equipment requiring flexible timing, dense acquisition, and reconfigurable logic. Its 24,051 cells can support pattern generation, measurement sequencing, trigger logic, and communication formatting, while 266 I/O offer broad connectivity to front-end circuits and test fixtures. The 500 MHz internal frequency is useful for pipelined digital measurements, but users must not infer a guaranteed bandwidth without considering clock uncertainty, I/O standards, and routing. The 484-ball FBGA improves density but complicates inspection and repair, so the board should include adequate escape routing, test access, and assembly-process support. Commercial operation from 0°C to 85°C applies unless a wider environmental range is specified.
Recommandé
High-Density Digital Interface Consolidation
The XC6SLX25-2FG484C can consolidate multiple digital interfaces into a compact programmable-logic solution. With 266 I/O and 24,051 logic cells, it can bridge parallel buses, latch legacy signals, implement asynchronous FIFOs, and connect external memory while preserving design flexibility through field reconfiguration. The 1.2 V core supply supports contemporary multi-rail FPGA power planning, but auxiliary I/O and configuration voltages must be checked separately. The 484-ball FBGA minimizes footprint yet demands manufacturing discipline, including controlled pad geometry, escape vias, solder-mask design, and assembly inspection. Engineers should also evaluate whether a smaller Spartan-6 package could meet the design, because the 484-ball option trades board density for more demanding layout and assembly requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX25-2FG484C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX25-2FGG484I | XC6SLX25-2FGG484C | XC6SLX25-2FG484I | XC6SLX25-3FGG484C | XC6SLX25-3FG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-pin FBGA | 484-BBGA - same package | 484-BBGA - same package | 484-BBGA - same package | 484-BBGA - same package | 484-BBGA - same package |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Number of I/O | 266 I/O | 266 I/O | 266 I/O | 266 I/O | 266 I/O | 266 I/O |
| Internal Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Speed Grade | -2 | -2 | -2 | -2 | -3 | -3 |
| Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Commercial-temperature -2 configuration (vs XC6SLX25-2FGG484I)
- Exact 484-ball package continuity (vs XC6SLX25-2FGG484C)
- Balanced -2 speed grade for general-purpose designs (vs XC6SLX25-3FGG484C)
Notes de conception
Use the AMD package drawing and ASCII pinout file for the exact 484-ball land pattern. The fine-pitch FBGA requires deliberate escape routing, and ball assignments must not be inferred from another Spartan-6 package. Reserve space for decoupling near the 1.2 V core supply and confirm the multilayer stack-up, via geometry, solder-mask definition, and pad-to-via connections with the board fabricator before releasing artwork.
Plan the FPGA supply as a coordinated multi-rail system rather than treating the 1.2 V core requirement as the complete power specification. Follow the manufacturer guidance for core and I/O rail sequencing, current capacity, startup behavior, and decoupling. Because the supplied excerpts do not provide complete current ratings or rail tables, those values must be taken from the full AMD datasheet before capacitors, regulators, and power limits are selected.
Do not treat a same-package Spartan-6 LX ordering-code variant as an automatic drop-in replacement. Speed grade, temperature range, device identifier, and configuration handling can differ, and the target's 484-ball package is not interchangeable with smaller Spartan-6 packages. Revalidate the bitstream, pin constraints, timing, power, and assembly footprint before approving XC6SLX25-2FGG484I, XC6SLX25-2FGG484C, or any -3-grade option.
The 484-ball FBGA conducts heat through its solder balls and package construction, so PCB thermal performance materially influences junction temperature and long-term reliability. Use the manufacturer's power and thermal data to estimate activity-dependent dissipation, provide uninterrupted thermal vias under the device where the package design permits, and minimize thermal coupling from nearby heat sources. The 0°C to 85°C specification is an ambient operating rating, not permission to exceed the device's internal thermal limits.
Informations de conformité
The supplied technical listings identify the device as lead-free and RoHS compliant. REACH, halogen-free status, conflict-minerals status, and automotive qualification were not provided.
