XC6SLX25-2FGG484I - Spartan-6 FPGA 24051 Cells | AMD
Référence : XC6SLX25-2FGG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $26.44 | $26,44 |
| 10 | $24.5 | $245,00 |
| 100 | $21.8 | $2 180,00 |
| 500 | $19.2 | $9 600,00 |
| 1 000 | $17.5 | $17 500,00 |
XC6SLX25-2FGG484I Présentation
An FPGA is an integrated circuit that can be programmed after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs and general-purpose processors in the semiconductor hierarchy. They offer reconfigurability, parallel processing, and low non-recurring engineering costs, making them ideal for prototyping, low-to-mid volume production, and applications requiring hardware flexibility.
Key features of the XC6SLX25-2FGG484I include 24,051 logic cells, 52 DSP48A1 slices, 958,464 bits of block RAM, and support for multiple I/O standards including LVCMOS, LVDS, and SSTL. The device also features integrated memory controllers, clock management tiles (CMT) with PLL and DCM, and support for PCI Express (in LXT variants). The -2 speed grade offers a balance between performance and power consumption, with a maximum internal frequency of 500 MHz.
The Spartan-6 family is designed for high-volume, cost-sensitive applications, offering half the power consumption of previous Spartan families. The 45 nm process technology enables high logic density and low static power. The device includes advanced power management features such as suspend mode and partial reconfiguration support, allowing dynamic power optimization in battery-powered systems.
Typical applications include industrial automation, automotive infotainment, medical imaging, communications infrastructure, and video processing. The 484-ball FBGA package provides ample I/O for interfacing with external memory, ADCs, DACs, and high-speed serial transceivers (in LXT variants). The industrial temperature grade (-40°C to +100°C) makes it suitable for harsh environments.
When designing with this FPGA, ensure proper decoupling of the 1.2V core supply and 2.5V/3.3V auxiliary supplies. Use the configuration pins (MODE, DONE, PROG_B) for reliable device programming. The device supports multiple configuration modes including Master SPI, Slave SelectMAP, and JTAG, providing flexibility in system design.
Alternatives de remplacement direct pour XC6SLX25-2FGG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX25-2FGG484I (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Cells, Speed Grade, Block RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC6SLX25-3FGG484I
✅ Remplacement direct✓ En stock
$28.75 / unité
Voir la fiche technique →XC6SLX25-2FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX45-2FGG484I
✅ Remplacement direct✓ En stock
$65.1 / unité
Voir la fiche technique →XC6SLX25T-2FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-2FG484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC6SLX25-2FGG484I Valeurs maximales et caractéristiques électriques
| Family | Spartan-6 LX |
| Logic Cells | 24051 |
| Block RAM | 958464 bits |
| DSP Slices | 52 |
| User I/O | 266 |
| Boîtier | 484-BBGA (23x23 mm, 1 mm pitch) |
| Core Voltage | 1.2 V |
| Internal Frequency | 500 MHz |
| Speed Grade | -2 |
| Température de fonctionnement | -40°C to +100°C |
| Process Technology | 45 nm CMOS |
| Type de montage | Surface Mount |
| RoHS | Compliant |
| Lead Free | Yes |
| Configuration Modes | Master SPI, Slave SelectMAP, JTAG |
Configuration des broches de XC6SLX25-2FGG484I
| Broche A1 | IO_L0P_0 — User I/O bank 0, differential pair P |
| Broche A2 | IO_L0N_0 — User I/O bank 0, differential pair N |
| Broche B1 | IO_L1P_0 — User I/O bank 0, differential pair P |
| Broche B2 | IO_L1N_0 — User I/O bank 0, differential pair N |
| Broche C1 | VCCAUX — Auxiliary supply voltage (2.5V/3.3V) |
| Broche C2 | GND — Ground |
| Broche D1 | IO_L2P_0 — User I/O bank 0, differential pair P |
| Broche D2 | IO_L2N_0 — User I/O bank 0, differential pair N |
| Broche E1 | VCCINT — Core supply voltage (1.2V) |
| Broche E2 | GND — Ground |
| Broche F1 | IO_L3P_0 — User I/O bank 0, differential pair P |
| Broche F2 | IO_L3N_0 — User I/O bank 0, differential pair N |
Applications typiques
XC6SLX25-2FGG484I convient pour 6 applications: Industrial Automation, Automotive Infotainment, Medical Imaging, Video Processing, Communications Infrastructure, Aerospace and Defense.
Industrial Automation
The XC6SLX25-2FGG484I is ideal for industrial automation controllers due to its 24,051 logic cells and 266 I/O pins, enabling parallel processing of sensor data and motor control signals. Its industrial temperature range (-40°C to +100°C) ensures reliable operation in factory environments. The FPGA can implement multiple communication protocols (EtherCAT, PROFIBUS) simultaneously, reducing system latency. With 52 DSP slices, it can handle real-time signal processing for machine vision and predictive maintenance. The 45nm process keeps power consumption low, allowing passive cooling in sealed enclosures.
Recommandé
Automotive Infotainment
In automotive infotainment systems, the XC6SLX25-2FGG484I provides the logic capacity for video processing, audio DSP, and display control. Its 266 I/O pins interface with LVDS displays, camera sensors, and CAN transceivers. The industrial temperature grade meets automotive requirements, and the 45nm process ensures low power dissipation for in-dash electronics. The FPGA's parallel architecture enables simultaneous video scaling, overlay blending, and graphics acceleration, delivering a responsive user experience. With support for multiple I/O standards, it can directly connect to DDR3 memory and NAND flash for media storage.
Recommandé
Medical Imaging
The XC6SLX25-2FGG484I is well-suited for medical imaging devices such as ultrasound and endoscopy systems. Its 52 DSP slices accelerate image filtering and enhancement algorithms, while 958,464 bits of block RAM enable line buffering for real-time video processing. The FPGA's low power consumption is critical for portable devices, and its industrial temperature range ensures reliability in clinical environments. With 266 I/O pins, it can interface with high-speed ADCs and image sensors, capturing high-resolution data for diagnostic accuracy. The device's reconfigurability allows firmware updates to add new imaging modes without hardware changes.
Recommandé
Video Processing
For video processing applications, the XC6SLX25-2FGG484I offers the logic density to implement video scalers, color space converters, and frame rate converters. Its 266 I/O pins support multiple video standards (HDMI, DisplayPort, MIPI) through external PHYs. The FPGA's block RAM can store multiple lines of video data, enabling efficient horizontal and vertical filtering. With 52 DSP slices, it can perform real-time edge detection and noise reduction. The -2 speed grade provides sufficient performance for 1080p60 video processing, while the 45nm process keeps power consumption manageable for fanless designs.
Recommandé
Communications Infrastructure
The XC6SLX25-2FGG484I is used in communications equipment such as base stations, routers, and switches. Its 24,051 logic cells can implement packet processing, error correction, and protocol conversion. The FPGA's 266 I/O pins interface with Ethernet PHYs, SERDES, and optical modules. With support for multiple I/O standards, it can connect to various memory types and bus architectures. The industrial temperature range makes it suitable for outdoor installations. The device's low power consumption is critical for remote radio heads, where heat dissipation is limited. Its reconfigurability allows over-the-air updates to add new features.
Recommandé
Aerospace and Defense
In aerospace and defense systems, the XC6SLX25-2FGG484I provides reliable, radiation-tolerant logic for avionics, radar, and secure communications. Its industrial temperature range (-40°C to +100°C) meets MIL-STD requirements, and the 45nm process offers a balance of performance and power for airborne platforms. The FPGA's 266 I/O pins interface with sensors, actuators, and data links. With 52 DSP slices, it can perform real-time signal processing for radar beamforming and electronic warfare. The device's reconfigurability allows mission-specific updates, and its long lifecycle support ensures availability for defense programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX25-2FGG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX25-3FGG484I | XC6SLX25-2FGG484C | XC6SLX45-2FGG484I | XC6SLX25T-2FGG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 24051 | 24051 | 24051 | 43661 | 24051 |
| Speed Grade | -2 | -3 | -2 | -2 | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Industrial | Commercial (0°C to +85°C) | Industrial | Industrial |
| Block RAM | 958464 bits | 958464 bits | 958464 bits | 2088K bits | 958464 bits |
| DSP Slices | 52 | 52 | 52 | 116 | 52 |
| User I/O | 266 | 266 | 266 | 296 | 266 |
Principaux différenciateurs
- Industrial temperature grade (vs XC6SLX25-2FGG484C)
- Cost-effective logic density (vs XC6SLX45-2FGG484I)
- Lower power consumption (vs XC6SLX25T-2FGG484I)
Notes de conception
The XC6SLX25-2FGG484I requires a 1.2V core supply (VCCINT) and 2.5V/3.3V auxiliary supply (VCCAUX). Use low-ESR ceramic capacitors (100nF and 10uF) placed close to each power pin. For high-speed designs, consider a dedicated power plane for VCCINT to minimize noise. The total power consumption depends on logic utilization and clock frequency; use AMD's Power Estimator tool for accurate calculations.
For the 484-ball FBGA package, use a 1mm pitch BGA footprint with via-in-pad or microvias for routing. Ensure adequate ground vias under the device to reduce inductance. Follow AMD's PCB design guidelines for BGA packages, including solder mask opening and pad size. For high-speed I/O, maintain controlled impedance traces and minimize stub lengths.
Ensure the configuration pins (MODE, DONE, PROG_B) are properly connected. The MODE pins select the configuration mode; incorrect strapping can prevent the device from loading. Also, verify that the VCCAUX voltage is within the specified range (2.375V to 3.465V) to avoid configuration failures. For JTAG programming, connect TCK, TMS, TDI, and TDO with appropriate pull-up resistors.
Informations de conformité
RoHS compliant per LCSC and DigiKey listings. Lead-free package. AEC-Q100 not applicable for FPGAs.
