XC6SLX25-2FGG484I - Spartan-6 FPGA 24051 Cells | AMD
MPN: XC6SLX25-2FGG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $26.44 | $26.44 |
| 10 | $24.5 | $245.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $19.2 | $9,600.00 |
| 1,000 | $17.5 | $17,500.00 |
Drop-in alternatives for XC6SLX25-2FGG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC6SLX25-3FGG484I
β Drop-Inβ In Stock
$28.75 / Unit
View Datasheet βXC6SLX25-2FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX45-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX25T-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX25-2FG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX25-2FGG484I Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LX |
| Logic Cells | 24051 |
| Block RAM | 958464 bits |
| DSP Slices | 52 |
| User I/O | 266 |
| Package | 484-BBGA (23x23 mm, 1 mm pitch) |
| Core Voltage | 1.2 V |
| Internal Frequency | 500 MHz |
| Speed Grade | -2 |
| Operating Temperature | -40Β°C to +100Β°C |
| Process Technology | 45 nm CMOS |
| Mounting Type | Surface Mount |
| RoHS | Compliant |
| Lead Free | Yes |
| Configuration Modes | Master SPI, Slave SelectMAP, JTAG |
XC6SLX25-2FGG484I Pin Configuration
| Pin A1 | IO_L0P_0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L0N_0 β User I/O bank 0, differential pair N |
| Pin B1 | IO_L1P_0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L1N_0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCAUX β Auxiliary supply voltage (2.5V/3.3V) |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L2P_0 β User I/O bank 0, differential pair P |
| Pin D2 | IO_L2N_0 β User I/O bank 0, differential pair N |
| Pin E1 | VCCINT β Core supply voltage (1.2V) |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L3P_0 β User I/O bank 0, differential pair P |
| Pin F2 | IO_L3N_0 β User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC6SLX25-2FGG484I is suitable for 6 applications: Industrial Automation, Automotive Infotainment, Medical Imaging, Video Processing, Communications Infrastructure, Aerospace and Defense.
Industrial Automation
The XC6SLX25-2FGG484I is ideal for industrial automation controllers due to its 24,051 logic cells and 266 I/O pins, enabling parallel processing of sensor data and motor control signals. Its industrial temperature range (-40Β°C to +100Β°C) ensures reliable operation in factory environments. The FPGA can implement multiple communication protocols (EtherCAT, PROFIBUS) simultaneously, reducing system latency. With 52 DSP slices, it can handle real-time signal processing for machine vision and predictive maintenance. The 45nm process keeps power consumption low, allowing passive cooling in sealed enclosures.
Recommended
Automotive Infotainment
In automotive infotainment systems, the XC6SLX25-2FGG484I provides the logic capacity for video processing, audio DSP, and display control. Its 266 I/O pins interface with LVDS displays, camera sensors, and CAN transceivers. The industrial temperature grade meets automotive requirements, and the 45nm process ensures low power dissipation for in-dash electronics. The FPGA's parallel architecture enables simultaneous video scaling, overlay blending, and graphics acceleration, delivering a responsive user experience. With support for multiple I/O standards, it can directly connect to DDR3 memory and NAND flash for media storage.
Recommended
Medical Imaging
The XC6SLX25-2FGG484I is well-suited for medical imaging devices such as ultrasound and endoscopy systems. Its 52 DSP slices accelerate image filtering and enhancement algorithms, while 958,464 bits of block RAM enable line buffering for real-time video processing. The FPGA's low power consumption is critical for portable devices, and its industrial temperature range ensures reliability in clinical environments. With 266 I/O pins, it can interface with high-speed ADCs and image sensors, capturing high-resolution data for diagnostic accuracy. The device's reconfigurability allows firmware updates to add new imaging modes without hardware changes.
Recommended
Video Processing
For video processing applications, the XC6SLX25-2FGG484I offers the logic density to implement video scalers, color space converters, and frame rate converters. Its 266 I/O pins support multiple video standards (HDMI, DisplayPort, MIPI) through external PHYs. The FPGA's block RAM can store multiple lines of video data, enabling efficient horizontal and vertical filtering. With 52 DSP slices, it can perform real-time edge detection and noise reduction. The -2 speed grade provides sufficient performance for 1080p60 video processing, while the 45nm process keeps power consumption manageable for fanless designs.
Recommended
Communications Infrastructure
The XC6SLX25-2FGG484I is used in communications equipment such as base stations, routers, and switches. Its 24,051 logic cells can implement packet processing, error correction, and protocol conversion. The FPGA's 266 I/O pins interface with Ethernet PHYs, SERDES, and optical modules. With support for multiple I/O standards, it can connect to various memory types and bus architectures. The industrial temperature range makes it suitable for outdoor installations. The device's low power consumption is critical for remote radio heads, where heat dissipation is limited. Its reconfigurability allows over-the-air updates to add new features.
Recommended
Aerospace and Defense
In aerospace and defense systems, the XC6SLX25-2FGG484I provides reliable, radiation-tolerant logic for avionics, radar, and secure communications. Its industrial temperature range (-40Β°C to +100Β°C) meets MIL-STD requirements, and the 45nm process offers a balance of performance and power for airborne platforms. The FPGA's 266 I/O pins interface with sensors, actuators, and data links. With 52 DSP slices, it can perform real-time signal processing for radar beamforming and electronic warfare. The device's reconfigurability allows mission-specific updates, and its long lifecycle support ensures availability for defense programs.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX25-2FGG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX25-3FGG484I | XC6SLX25-2FGG484C | XC6SLX45-2FGG484I | XC6SLX25T-2FGG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 24051 | 24051 | 24051 | 43661 | 24051 |
| Speed Grade | -2 | -3 | -2 | -2 | -2 |
| Temperature Grade | Industrial (-40Β°C to +100Β°C) | Industrial | Commercial (0Β°C to +85Β°C) | Industrial | Industrial |
| Block RAM | 958464 bits | 958464 bits | 958464 bits | 2088K bits | 958464 bits |
| DSP Slices | 52 | 52 | 52 | 116 | 52 |
| User I/O | 266 | 266 | 266 | 296 | 266 |
Key Differentiators
- Industrial temperature grade (vs XC6SLX25-2FGG484C)
- Cost-effective logic density (vs XC6SLX45-2FGG484I)
- Lower power consumption (vs XC6SLX25T-2FGG484I)
Design Notes
The XC6SLX25-2FGG484I requires a 1.2V core supply (VCCINT) and 2.5V/3.3V auxiliary supply (VCCAUX). Use low-ESR ceramic capacitors (100nF and 10uF) placed close to each power pin. For high-speed designs, consider a dedicated power plane for VCCINT to minimize noise. The total power consumption depends on logic utilization and clock frequency; use AMD's Power Estimator tool for accurate calculations.
For the 484-ball FBGA package, use a 1mm pitch BGA footprint with via-in-pad or microvias for routing. Ensure adequate ground vias under the device to reduce inductance. Follow AMD's PCB design guidelines for BGA packages, including solder mask opening and pad size. For high-speed I/O, maintain controlled impedance traces and minimize stub lengths.
Ensure the configuration pins (MODE, DONE, PROG_B) are properly connected. The MODE pins select the configuration mode; incorrect strapping can prevent the device from loading. Also, verify that the VCCAUX voltage is within the specified range (2.375V to 3.465V) to avoid configuration failures. For JTAG programming, connect TCK, TMS, TDI, and TDO with appropriate pull-up resistors.
Compliance Information
RoHS compliant per LCSC and DigiKey listings. Lead-free package. AEC-Q100 not applicable for FPGAs.
